2201P

Technical Data | August 2017 3M™ Electrically Conductive Thermosetting Film 2201P Product Description 3M™ Electrically Conductive Thermosetting Film (C-TSF) 2201P is a specialty conductive thermosetting film with excellent adhesion to many substrates, good grounding performance and modest thermal bonding process conditions. 3M C-TSF 2201P was also numbered EAS-2201P (Electronic Assembly Solution = EAS) in its developmental phase. Release Liner Conductive thermosetting resin Release liner Product Construction / Materials Descriptions Note: The following technical information and data should be considered representative or typical only and should not be used for specification purposes. 3M™ Electrically Conductive Thermosetting Film 2201P Property Value TSF Resin Thermoset Epoxy / Acrylic Hybrid Conductive Fillers Metallized (Ni/Cu/Ni) Polymeric (PET) Scrim Silver particles Approximate Thickness Nominal < 0.065mm Construction See diagram above Typical Physical Properties and Performance Characteristics Note: The following technical information and data should be considered representative or typical only and should not be used for specification purposes. Final product specifications and testing methods will be outlined in the product’s Certificate of Analysis (COA) that is provided once the product is approved by 3M for general commercialization and development work is completed. 3M™ Electrically Conductive Thermosetting Film 2201P Grounding & Bonding* Peel Adhesion Contact Resistance >50 oz/in (1420 g/in)* 50% RH). The product should not be exposed to temperatures above 25°C (77°F) and/or high humidity (>50% RH) during shipment, handling, converting or assembly. High temperatures will cure the epoxy prior to intended application use and degrade performance. High humidity environments can cause absorbed water in the film and can lead to moisture volatilization that can produce bubbles during heat bonding. The cumulative temperature/humidity exposure time shelf life of 3M C-TSF 2201P when exposed to temperatures between 4°C (39°F) and 25°C (77°F) and humidify