588THERMO

Technical Data March 2015 3M™ Thermal Bonding Film 588 Product Description 3M™ Thermal Bonding Film 588 is a high strength, flexible, nitrile phenolic based thermosetting adhesive film. It can be heat or solvent activated for bonding. It can also be lightly crosslinked using a post heat exposure. 3M TBF 588 must be stored at or below 4°C (40°F) for maximum storage life. Key Features •  Flexible • Heat crosslinkable option • Heat or solvent activation • Can be die-cut Typical Physical Properties Note: T he following technical information and data should be considered representative or typical only and should not be used for specification purposes. Product 3M™ Thermal Bonding Film 588 Base Resin Nitrile phenolic Adhesive Thickness 6 mil (0.15 mm) Tack None Color Yellow Construction 6 mil adhesive 5 mil polyolefin liner Before Crosslinking After Crosslinking 2,300 2,700 Tensile (psi) Elongation (%) 250 35 Modulus (psi) 6,700 21,800 2 Lb. Dead Load Overlap Shear Heat Resistance 85°C (180°F) >149°C (300°F) • Tensile and elongation conducted on Sintech 5/GL at 0.2"/minute speed. ASTM D638. • 2 lb. dead load overlap shear conducted in oven environment (reference ASTM D4502-85). 3M™ Thermal Bonding Film 588 Application Equipment Suggestions Note: Appropriate application equipment can enhance bonding film performance. We suggest the following equipment for the user’s evaluation in light of the user’s particular purpose and method of application. The type of application equipment used to bond 3M™ Thermal Bonding Film 588 will depend on the application involved and on the type of equipment available to the user. Thin films and flexible substrates can be bonded using a heated roll laminator where heat and pressure can be varied to suit the application. Larger, thicker substrates can be bonded using a heated static press or, in some cases, an autoclave. For applications where a shaped adhesive is to be transferred to a flat or three-dimensional part, a hot shoe or thermode method may be appropriate. It is recommended that whatever method of bonding is chosen by the user, the optimum bonding conditions should be predetermined with substrates specific to user’s application. Directions For Use – Heat Activation To make a bond using 3M TBF 588, remove the liner and place the adhesive film between the two substrates. The bond is then made through heat and pressure using a heated press, a hot roll laminator, a hot shoe thermode method or similar equipment. Alternatively, the adhesive can be first tacked (lightly bonded) to one of the substrates using low heat, the liner can then be removed and second substrate placed to the exposed adhesive surface, and a bond made using heat and pressure. Suggested TACKING Conditions 38°C to 49°C (100°F to 120°F) bondline temperature 2-5 seconds dwell time 5-20 psi pressure For optimum bonding, the heat, pressure and dwell time for using 3M TBF 588 will depend upon the type and thickness of the substrates being bonded together. A suggested starting point, however, is to use the bonding conditions described below. Suggested BEGINNING Bonding Conditions 107°C to 149°C (225°F to 300°F) bondline temperature 2-5 seconds dwell time 15-20 psi pressure (2) 3M™ Thermal Bonding Film 588 Directions For Use – Heat Activation (continued) One approach to establishing the correct/optimum bonding conditions for a user’s application is to evaluate a series of bonding temperatures, for example 93, 107, 121, 135 and 149°C (200, 225, 250, 275 and 300°F). Time and pressure will be dictated by the thickness of the substrate and the type of substrate being bonded. Thicker substrates and surfaces that may be more difficult to bond will require longer times, higher pressures and higher temperatures. If voids are experienced in the bondline, they can be minimized by increasing pressure. Once the bond is made, the bondline should be allowed to cool somewhat before stress is applied to the bond. Generally, cooling the bondline below 66°C (150°F) is adequate to allow the bonded parts to be unfixtured/unclamped and handled. For reference, the following table shows typical bond strengths for bonds made at various temperatures. Such data can be used to evaluate optimum bondline temperatures. It is important to note that this table is valid only for the specific substrates shown. Varying temperature, pressure, or substrates can affect bond strengths. User should develop a similar table with substrates specific to user’s application. Note: Temperatures shown are bondline temperatures and not heat block or roll settings! 90° Peel Strengths of Bonds made at Various Temperatures (2 and 20 sec. Dwell at Bondline Temperature) using 3M™ Thermal Bonding Film 588 Bondline Temperature FR-4 / Aluminum 2 sec. 20 sec. CRS / Aluminum 2 sec. 20 sec. 24°C (75°F)   6 piw   4 piw   1 piw 1 piw 35°C (95°F)   6 piw   4 piw   1 piw 1 piw 46°C (115°F)   6 piw   5 piw   2 piw 3 piw 57°C (135°F)   6 piw   6 piw   4 piw 3 piw 68°C (155°F)   8 piw   9 piw   4 piw 4 piw 79°C (175°F) 12 piw 12 piw   4 piw 5 piw 90°C (195°F) 14 piw 18 piw   6 piw 5 piw 101°C (215°F) 17 piw 20 piw   7 piw 6 piw 113°C (235°F) 22 piw 20 piw   7 piw 6 piw 124°C (255°F) 24 piw 20 piw   8 piw 7 piw 135°C (275°F) 25 piw 24 piw   8 piw 7 piw 146°C (295°F) 25 piw 24 piw 13 piw 7 piw 157°C (315°F) 26 piw 24 piw 13 piw 7 piw 168°C (335°F) 27 piw 26 piw 13 piw 7 piw 179°C (355°F) 26 piw 32 piw 15 piw 7 piw • Peel values given in piw (pounds per inch width). ASTM D1876. • Peel bonds were 1/2" wide using 4 mil etched aluminum bonded to either FR-4 printed circuit board substrate (alcohol wiped) or cold rolled steel (MEK wiped).* Bonds made on Sencorp device using 20 lbs. pressure. *Note: When using solvents, extinguish all ignition sources and follow the manufacturer’s precautions and directions for use. (3) 3M™ Thermal Bonding Film 588 Directions For Use – Solvent Activation There are advantages and disadvantages with heat and solvent activation. Under normal conditions, heat activation is the suggested method of bonding and will provide the greatest immediate adhesion strength. However, solvents such as MEK, toluene and/or acetone can also be used to activate bonding if user is working with substrates that are heat-sensitive or have irregular surface or shape.* The solvent may be applied to the film by brushing, wiping, spraying or dipping. It is important that the solvent be allowed sufficient activating time to solvate the adhesive and bring it to a tacky, pressure sensitive state (typically 10-30 seconds). Adhesive legs should appear during touch-testing before substrate is bonded. Bonding should occur before tackiness disappears. If film is too wet, substrate may slip from bonding position; if too dry, a good bond may not develop. When a solvent activation method is used, maximum adhesion strength will not be achieved immediately because it will be related to the drying time of solvent from the adhesive. If the bond undergoes natural drying in ambient temperatures, bond build-up may continue for 30 days until maximum adhesion is achieved. If the bond is exposed to constant low heat (~ 66°C/ 150°F) after initial solvent activation, maximum adhesion can often be reached within 24-30 hours. *Note: W  hen using solvents, extinguish all ignition sources and follow the manufacturer’s precautions and directions for use. Directions For Use – Crosslinking 3M™ Thermal Bonding Film 588 may also be slightly crosslinked to enhance adhesion performance. Crosslinking of this film can typically be achieved by heating the bondline at 177°C (350°F) for five minutes. Note: All reported data has not undergone crosslinking unless otherwise stated. (4) 3M™ Thermal Bonding Film 588 Typical Performance Characteristics Note: T he following technical information and data should be considered representative or typical only and should not be used for specification purposes. Adhesion to Various Substrates Using 3M™ Thermal Bonding Film 588 Overlap Shear (OLS) Test Substrate 90° Peel Aluminum (solvent wiped) 340 psi   6 piw Aluminum (etched) 880 psi 20 piw Aluminum (sanded, solvent wiped) 720 psi 17 piw Aluminum (scour pad abraded, solvent wiped) 650 psi 13 piw FR-4 (printed circuit board substrate) 920 psi 26 piw Phenolic Board 670 psi 18 piw Cold Rolled Steel 450 psi 10 piw Stainless Steel NT   7 piw ABS (acrylonitrile-butadiene-styrene) NT 20 piw Ultem 1000 (polyetherimide) NT 22 piw Soda Lime Glass NT 17 piw PVC (polyvinyl chloride) NT 23 piw Acrylic NT 12 piw Polypropylene NT