3M™ Chip Carrier Sockets
Surfacemount
8400 Series
• Accepts chip carriers conforming to JEDEC outline
MO-047 for square and MO-052 for rectangular
• High temperature insulator compatible with IR reflow
and wave soldering
• Compatible with automated loading equipment
• Open top design allows unrestricted air flow
• Molded slots for ease of device extraction
• Available with optional PCB locating posts
• RoHS Compliant. See the Regulatory Information
Appendix (RIA) in the "RoHS Compliance" section
of www.3Mconnector.com for compliance
information (RIA E1 and C1 apply)
Date Modified: September 14, 2011
Physical
TS-2147-B
Sheet 1 of 2
Insulation
Material: Glass Filled Polyphenylene Sulfide (PPS)
Flammability: UL 94V-0
Color: Black
Contact
Material: Copper Alloy
Plating
Underplating: 50 µ" [ 1.27 μm ] Nickel - Overall
Wiping Area: 160 μ", [ 4.06 μm ] Matte Tin
Electrical
Contact Resistance: 15 mΩ
Insulation Resistance: >103 MΩ minimum
Capacitance:
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