3M™ Chip Carrier Sockets
Surfacemount
8400 Series
• Accepts chip carriers conforming to JEDEC outline
MO-047 for square and MO-052 for rectangular
• High temperature insulator compatible with IR reflow
and wave soldering
• Compatible with automated loading equipment
• Open top design allows unrestricted air flow
• Molded slots for ease of device extraction
• Available with optional PCB locating posts
• RoHS Compliant. See the Regulatory Information
Appendix (RIA) in the "RoHS Compliance" section
of www.3Mconnector.com for compliance
information (RIA E1 and C1 apply)
Date Modified: September 14, 2011
Physical
TS-2147-B
Sheet 1 of 2
Insulation
Material: Glass Filled Polyphenylene Sulfide (PPS)
Flammability: UL 94V-0
Color: Black
Contact
Material: Copper Alloy
Plating
Underplating: 50 µ" [ 1.27 μm ] Nickel - Overall
Wiping Area: 160 μ", [ 4.06 μm ] Matte Tin
Electrical
Contact Resistance: 15 mΩ
Insulation Resistance: >103 MΩ minimum
Capacitance:
很抱歉,暂时无法提供与“8428-21B1-RK-TR”相匹配的价格&库存,您可以联系我们找货
免费人工找货- 国内价格 香港价格
- 450+12.70821450+1.57679
- 900+12.34519900+1.53174
- 1350+10.892831350+1.35154
- 2250+10.529722250+1.30649
- 3150+10.166633150+1.26144
- 国内价格 香港价格
- 1+19.584351+2.42995
- 10+17.0674010+2.11765
- 25+16.3397725+2.02737
- 50+15.9765850+1.98231
- 100+15.24968100+1.89212