3M™ Chip Carrier Sockets
Surfacemount
8400 Series
• Accepts chip carriers conforming to JEDEC outline
MO-047 for square and MO-052 for rectangular
• High temperature insulator compatible with IR reflow
and wave soldering
• Compatible with automated loading equipment
• Open top design allows unrestricted air flow
• Molded slots for ease of device extraction
• Available with optional PCB locating posts
• RoHS Compliant. See the Regulatory Information
Appendix (RIA) in the "RoHS Compliance" section
of www.3Mconnector.com for compliance
information (RIA E1 and C1 apply)
Date Modified: September 14, 2011
Physical
TS-2147-B
Sheet 1 of 2
Insulation
Material: Glass Filled Polyphenylene Sulfide (PPS)
Flammability: UL 94V-0
Color: Black
Contact
Material: Copper Alloy
Plating
Underplating: 50 µ" [ 1.27 μm ] Nickel - Overall
Wiping Area: 160 μ", [ 4.06 μm ] Matte Tin
Electrical
Contact Resistance: 15 mΩ
Insulation Resistance: >103 MΩ minimum
Capacitance:
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免费人工找货- 国内价格 香港价格
- 450+12.76827450+1.65177
- 900+12.15903900+1.57296
- 1350+11.816261350+1.52862
- 国内价格 香港价格
- 1+20.581001+2.66247
- 10+17.9386910+2.32065
- 25+17.1735525+2.22166
- 50+16.7920550+2.17231
- 100+16.02808100+2.07348
- 国内价格 香港价格
- 1+19.694541+2.54779
- 10+16.7104510+2.16176
- 25+15.6616425+2.02608
- 50+14.9108150+1.92895
- 100+14.19886100+1.83684
- 国内价格
- 1+19.85040
- 10+16.92360
- 30+15.18480
