8444-11B1-RK-TP

3M™ Chip Carrier Sockets Low Profile, Four-Row, Through Hole 8400 Series • Accepts chip carriers conforming to JEDEC outline MO-047 for square and MO-052 for rectangular • Compatible with automated loading equipment • Open top design allows unrestricted air flow • Molded slots for ease of device extraction • Wave solder compatible. Not suitable for reflow soldering • RoHS Compliant. See the Regulatory Information Appendix (RIA) in the "RoHS Compliance" section of www.3Mconnector.com for compliance information (RIA E1 and C1 apply) Date Modified: September 14, 2011  Physical TS-2148-B Sheet 1 of 2 Insulation Material: Glass Filled Polyester (PBT) Flammability: UL 94V-0 Color: Black Contact Material: Copper Alloy Plating Underplating: 50 µ" [ 1.27 μm ] Nickel - Overall Wiping Area: 160 μ", [ 4.06 μm ] Matte Tin Electrical Contact Resistance: 15 mΩ Insulation Resistance: >103 MΩ minimum Capacitance: