C0619E-FULL-18U-12X18

3M Electronic Solutions Division Electrical Performance, Miniaturization and EMI Advantages of Very High Capacitance Density Laminates in PCBs and IC Packaging Presented at PCB West 2011, September 29, 2011, Santa Clara, CA © 2013 3M. All Rights Reserved. 3M Electronic Solutions Division Food Safety Division Agenda  Background on Embedded Capacitance  Electrical Performance/EMI Data  Capacitor Elimination Metrics  PCB Fabrication Compatibility  Cost Considerations  Summary 2 © 2013 3M. All Rights Reserved. 3M Electronic Solutions Division Food Safety Division Background on Ultra-Thin Embedded Capacitance Materials 3 © 2013 3M. All Rights Reserved. 3M Electronic Solutions Division Food Safety Division Ultra-Thin Embedded Capacitance Material Product Description Sheets of Cu-clad laminate Thin, high Dk dielectric Ideal for high frequency decoupling Eliminates discrete capacitors Dampens plane resonances Uses Cu Foil, 1 oz. (1.4 mil) Cu Foil, 1 oz. (1.4 mil) Power-ground innerlayer (distributed capacitance) for rigid and flex PWBs and IC packages Singulated (discrete-like) capacitors for decoupling, filtering and other functions in rigid and flex PWBs and IC packages 4 © 2013 3M. All Rights Reserved. 3M Electronic Solutions Division Food Safety Division Ultra-Thin Embedded Capacitance Technology Electrode (Cu) Dielectric (k) Thickness (t) (um) Electrode (Cu) Capacitance/Area = 0.885 k/t (nF/cm2)  Capacitance per unit area (C/A) is proportional to dielectric constant k and inversely proportional to t  Maximize C/A by decreasing thickness (t) and increasing dielectric constant (k) 5 © 2013 3M. All Rights Reserved. 3M Electronic Solutions Division Food Safety Division Why Embedded Capacitance? 1. Performance - Faster charge delivery - Effective noise dampening - Reduced power bus noise Surface Mount Cap Active Device 2. Space Embedded Capacitor - SMT caps and vias eliminated 3. EMI - Power bus noise is a leading cause of EMI 4. Cost - Board size reduction - Reduced assembly costs 5. Reliability 6 - Elimination of solder joints/vias © 2013 3M. All Rights Reserved. Cost Discrete Embedded Complexity 3M Electronic Solutions Division Food Safety Division 3M™ Embedded Capacitance Material (ECM) Applications Miniaturization Performance Component Reduction Telecom Routers, Base Stations, Switches Computer High-end servers, Supercomputers, Storage Test & Measurement Automated Test Equipment Military / Aerospace Aircraft & Missile Avionics, Satellites Chip Packaging Processors, Memory Modules Consumer Electronics Mobile Handheld Devices, Video, MEMS Microphones 7 © 2013 3M. All Rights Reserved. Very high C/A needed in these applications due to space constraints 3M Electronic Solutions Division Food Safety Division High C/A Needed IC Packaging  Embedded Distributed Capacitance in high-speed digital IC package for high-end server 40 µm vias 280 µm Embedded Capacitance Core (8 µm dielectric and 17 µm copper) Eight Layer Package (42.5 mm X 42.5 mm) with 10 nF/in2 ECM in middle 8 © 2013 3M. All Rights Reserved. 3M Electronic Solutions Division Food Safety Division High C/A Needed in MEMS Module Early design with 2 SMT caps (lid removed) 9 © 2013 3M. All Rights Reserved. Later design with 3M™ Embedded Capacitance Material (ECM) replacing SMT caps 3M Electronic Solutions Division Food Safety Division Electrical Performance Data in High-Speed Digital Boards 10 © 2013 3M. All Rights Reserved. 3M Electronic Solutions Division Food Safety Division The Need for Electrical Performance  High-speed digital electronics require low impedance power distribution, driven by trends in silicon ― Lower voltages ― Higher frequencies ― Higher currents Voltage Current = Impedance  Very high C/A ECM is a very simple and effective way to lower the impedance of the power distribution system, even on small boards, modules and chip packages ― Lowers voltage ripple ― Dampens board resonances ― Reduces EMI ― Eliminates decoupling capacitors 11 © 2013 3M. All Rights Reserved. 3M Electronic Solutions Division Food Safety Division Key Factors for High Frequency Decoupling Noise Generated Self Impedance Lower the amount of noise generated Ability to deliver required charge quickly Capacitance Density Inductance Dk Dielectric Thickness Dielectric Thickness Noise Dampened Total Loss Dampen the noise that is generated Ability to dispel noise Dk Performance is driven by dielectric thickness and dielectric constant; thinner dielectrics and higher dielectric constants mean higher loss, higher capacitance and lower inductance. 12 © 2013 3M. All Rights Reserved. 3M Electronic Solutions Division Food Safety Division Total Loss vs. Frequency (3M™ Embedded Capacitance Material (ECM) D.F. vs. Frequency Power-Ground Cores: Desire high loss at HF 0.16 0.14 0.12 D.F. 0.1 Dielectric Loss 0.08 Copper Loss 0.06 Total Loss 0.04 0.02 0 3 4 5 6 7 8 9 9.3 Log Frequency 13 Cu losses dominates at frequencies >150 MHz © 2013 3M. All Rights Reserved. 3M Electronic Solutions Division Food Safety Division 3M™ Embedded Capacitance Material (ECM) Key Properties C0614 C1012 C2006 6.4 nF/in2 (1.0 nF/cm2) 10 nF/in2 (1.55 nF/cm2) 20 nF/in2 (2.3-6.2 nF/cm2) 16 22 22 0.55 mil (14 µm) 0.47 mil (12 µm) 0.24 mil (6 µm) Dielectric loss @ 1GHz 0.03 0.03 0.03 Resin system Epoxy, ceramic filler Epoxy, ceramic filler Epoxy, ceramic filler TCC Meets X7R Meets X7R Meets X7R Dielectric Strength ~3300 V/mil (130 V/um) ~3000 V/mil (118 V/um) ~3000 V/mil (118 V/um) Breakdown >100V >100V >50V Copper Thickness 1.4 mil (35 µm) 1.4 mil (35 µm) 0.7 mil (17 µm) 1.4 mil (35 µm) Capacitance per Area Dk Dielectric Thickness 14 © 2013 3M. All Rights Reserved. 3M Electronic Solutions Division Food Safety Division Power Bus Noise Reduction  Reduce the dielectric thickness of the laminate between the power and ground planes ― If >1.5 mils, 10 dB reduction per decade ― If