C0619E-FULL-18U-18X24

Simulation and Design of Printed Circuit Boards Utilizing Novel Embedded Capacitance Material April 28, 2010 Yu Xuequan, Yanhang, Zhang Gezi, Wang Haisan Huawei Technologies CO., LTD. Shanghai, China Tony_yu@huawei.com 1 Yu Xuequan, Yan Hang, Zhang Gezi, Wang Haisan Simulation and Design of Printed Circuit Boards Utilizing Novel Embedded Capacitance Material Outline
Embedded Capacitance Material Introduction
Impedance Simulation Comparison for boards with ECM or FR-4 Power/Ground Core
Comparison of the power noise measurement
In Board Interference Analysis for ECM and FR4 Board
ECM Impact to Signal Integrity
Board Level EMC Performance Comparison – Simulation
Board Level EMC Performance Comparison – Test Result
The Application Prospect of the Embedded Capacitance Materials
Questions 2 Yu Xuequan, Yan Hang, Zhang Gezi, Wang Haisan Simulation and Design of Printed Circuit Boards Utilizing Novel Embedded Capacitance Material Embedded Capacitance Material Introduction



Planar sandwich structure ECM Higher capacitance density than thin core FR4 Higher decoupling bandwidth than discrete MLCC caps 3M C-PLY19 19um filled insulation >6nf/sq inch C/A Electrical parameters comparison FR4 plate capacitance vs ECM (3M C-PLY19) Schematic illustration of 3M C-PLY19 Frequency response comparison , MLCC vs ECM Schematic illustration of PCB plate capacitor 3 Yu Xuequan, Yan Hang, Zhang Gezi, Wang Haisan Simulation and Design of Printed Circuit Boards Utilizing Novel Embedded Capacitance Material Impedance Simulation Comparison for boards with ECM or FR-4 Power/Ground Core




Same board stack up and layout Only difference in Pwr/Gnd core material Impedance port set on same position in simulation Much lower impedance of ECM from 10MHz~6GHz than FR4 Much more resonance in FR4 curve, higher impedance and power noise FR-4 PCB 3M C-PLY19 PCB Sample board Stack up 4 Impedance Comparison Blue for ECM Red for thin core FR-4 plate capacitor Yu Xuequan, Yan Hang, Zhang Gezi, Wang Haisan Simulation and Design of Printed Circuit Boards Utilizing Novel Embedded Capacitance Material -20 3M C-PLY19 (0.75mil) FR4 (3.54mil) -40 dBm -60 -80 -100 -120 -140 -160 GHz Power ripple noise comparison in time domain



Power noise frequency spectrum comparison Power noise ripple of FR4 board is much higher than that of ECM board. ECM board shows superiority over FR4 on noise reduction in entire bandwidth 10MHz-4GHz. ECM board noise close to white noise of Spectrum Analyzer in higher frequency over 1.5GHz. Very promising for ECM to improve power supply quality, digital /analog interference in board & board level EMI. 5 Yu Xuequan, Yan Hang, Zhang Gezi, Wang Haisan Simulation and Design of Printed Circuit Boards Utilizing Novel Embedded Capacitance Material 3.95 3.7 3.83 3.57 3.44 3.32 3.19 3.06 2.94 2.81 2.68 2.55 2.3 2.43 2.17 2.04 1.92 1.79 1.66 1.54 1.41 1.28 1.15 0.9 1.03 0.77 0.65 0.52 0.39 0.26 0.14 0 0.01 Comparison of the power noise measurement In Board Interference Analysis for ECM and FR4 Board


Port set on same connectors position on FR4 / ECM board Transmission coefficient between same ports of ECM board is much lower than that of FR4 board ECM board minimized risk for interference from shared power distribution system within board FR-4 PCB 3M C-PLY19 PCB Transmission coefficient comparison Red for FR4, Port1,2 ,Blue for ECM, Port3,4 6 Yu Xuequan, Yan Hang, Zhang Gezi, Wang Haisan Simulation and Design of Printed Circuit Boards Utilizing Novel Embedded Capacitance Material In Board Interference Analysis for ECM and FR4 Board Simulation setup


power noise distribution on FR-4 board power noise distribution on ECM board Set noise source and noise probe on same position of FR4 / ECM board Same noise source input smaller noise distribution area and lower noise amplitude on power plane for ECM board 7 Yu Xuequan, Yan Hang, Zhang Gezi, Wang Haisan Simulation and Design of Printed Circuit Boards Utilizing Novel Embedded Capacitance Material In Board Interference Analysis for ECM and FR4 Board Simulation setup

8 Noise spectrum comparison on same probe position Same noise source and probe setup Superior noise spectrum of ECM board in all frequency range Yu Xuequan, Yan Hang, Zhang Gezi, Wang Haisan Simulation and Design of Printed Circuit Boards Utilizing Novel Embedded Capacitance Material ECM Impact to Signal Integrity 50MHz CLOCK


1255MHz CLOCK CIRCUIT AREA
SIGNAL PROBE 50MHz CLOCK CIRCUIT AREA
Same functional circuit on the board for FR4 and ECM board 50MHz & 125MHz clock on different zone but with same power 125M Clock as aggressor 50M clock as victim to see its signal wave and spectrum received 50M clock on ECM board less influenced by 125M clock with better jitter and duty cycle Comparison of the 50 MHz clock signal measured wave Comparison of the 50 MHz clock signal frequency spectrums on ECM and FR4 board 9 Yu Xuequan, Yan Hang, Zhang Gezi, Wang Haisan Simulation and Design of Printed Circuit Boards Utilizing Novel Embedded Capacitance Material Board Level EMC Performance Comparison -Simulation EMI simulation result (3 Meter field ) PCB FR4(3.54mil)
PCB 3M C-PLY19 (0.75mil) Free space field distribution 10 With same noise source excitation , free space field and 3 Meter field result of ECM board is lower than that of FR4 in all bandwidth simulated Yu Xuequan, Yan Hang, Zhang Gezi, Wang Haisan Simulation and Design of Printed Circuit Boards Utilizing Novel Embedded Capacitance Material Board Level EMC Performance Comparison – Test Result 70 3M C-PLY19 (0.75mil) FR4 (3.54mil) 60 dBuV/m 50 40 30 20 10 Frequency (MHz) Radiated Emission Test Result （30MHz - 2GHz ）

Radiated Emission Test in standard full wave darkwave for FR4/ECM board. Obvious better performance of ECM board from 30M to 2G ( only tested up to 2G) 11 Yu Xuequan, Yan Hang, Zhang Gezi, Wang Haisan Simulation and Design of Printed Circuit Boards Utilizing Novel Embedded Capacitance Material 1949 1878 1807 1735 1664 1593 1522 1451 1380 1309 1238 1167 1096 954 1025 883 812 741 670 598 527 456 385 314 243 172 30 Full Wave Darkroom 101 0 The Application Prospect of the Embedded Capacitance Materials Due to excellent performance of Embedded Capacitance Material in 1. 2. 3. SI , PI , EMC, it will be well suitable for application in: Digital/analog Interference Design with Digital/analog Mixed Board EMC Design of the Non-shielding Box-type Products with Plastics shell Power Integrity and Signal Integrity Design of the High Speed and High Density Board 12 Yu Xuequan, Yan Hang, Zhang Gezi, Wang Haisan Simulation and Design of Printed Circuit Boards Utilizing Novel Embedded Capacitance Material Questions 13 Yu Xuequan, Yan Hang, Zhang Gezi, Wang Haisan Simulation and Design of Printed Circuit Boards Utilizing Novel Embedded Capacitance Material