C2006E-AUDIT-35U-18X24

3M™ Embedded Capacitance Material (ECM) Utilize a Proven Solution • A UL certified and RoHS2 compliant laminate with high capacitance Allows for Capacitor Removal density that can be embedded into PCBs and chip packages as either a IC power ground plane or a discrete capacitor • Consists of a very thin layer of ceramic-filled epoxy sandwiched between SMT-Capacitor PCB two layers of copper foil • Compatible with a large range of PCB material sets and with standard IC PCB fabrication and assembly processes, including lead-free • Halogen-free3 versions available along with a variety of panel sizes and 3M™ Embedded Capacitance Material (ECM) PCB copper thicknesses • In production in telecom, computer, test and measurement, military/ aerospace, medical and consumer electronics applications Reduces Power Bus Noise 0 Simplify Design while Amplifying Performance -90 • Dissipates heat better than thin FR-4 due to high thermal conductivity and low thermal impedance Enable Product Roadmaps Simplify board layout and routing • Reduce PCB size, thickness and weight • Add functionality on fixed form factors • Lower spreading inductance • Decrease need for EMC measures such as metal shells, tapes, etc. • Reduce interference from digital circuits to analog/RF circuits in mixed signal applications • Add PCB layers while maintaining similar PCB thickness • Reduce design spins by solving noise issues early in the design cycle • Improve PCB panel utilization • Improve assembly yields and board reliability due to fewer components Visit us at www.3Mcapacitance.com PCB with SMT Capacitor PCB with 2 mil FR-4 PCB with 3M™ Embedded Capacitance Material (ECM) Field Strength • Frequency 1440 1351 1262 993 Reduces EMI 1172 Frequency (MHz) 1083 904 815 725 636 546 10 457 -100 impedance Reduces EMI by decreasing resonance that causes EMI -70 -80 Improves power integrity by reducing power bus noise and PCB • -60 368 • PCB with 3M ECM -50 278 and vias 3M™ Embedded Capacitance Material (ECM) PCB with 3 mil FR-4 -40 189 all, capacitors equal to or below 0.1 µF and their associated solder joints -30 99.4 Increases usable board area by allowing for the removal of many, if not -20 Bus Noise (dbm) • 3 mil FR-4, No Low L Caps -10 3M™ Embedded Capacitance Material (ECM) Property Test Method Capacitance/Unit Area (1 kHz) Supplier Method C0614 C1012 C2006 6.4 nF/in (1.0 nF/cm2) 10.0 nF/in (1.6 nF/cm2) 20.0 nF/in2 (3.1 nF/cm2) 14 µm (0.55 mils) 12 µm (0.47 mils) 6 µm (0.24 mils) RA ED or RA RA 35 µm 35 µm (ED/RA) or 17 µm (ED) 35 µm RA 2 2 Dielectric Thickness Cross-section Copper Type Supplier Method Copper Thickness Cross-section Capacitance Tolerance Supplier Method +/- 10% +/- 10% +/- 10% Dielectric Constant (1 kHz) Supplier Method 16 22 22 0.005 0.010 0.010 Dissipation Factor (1 kHz) Supplier Method Temperature Coefficient of Capacitance (TCC) Supplier Method Dielectric Strength (Volts/Mil) ASTM D149 3300 3000 3000 HiPOT Voltage IPC-TM-650 2.5.7.2 100 V 100 V 50 V UL Flammability Rating UL 94 UL Relative Thermal Index (RTI) UL 796 130°C 90°C 4 90°C4 UL Solderability Limits UL 796 288°C/30 sec. 288°C/20 sec. 288°C/20 sec. Glass Transition Temperature Supplier Method (DSC) Moisture Absorption (wt %) ASTM D570 CTE (ppm/C) Supplier Method (TMA) Degradation Temperature IPC-TM-650 2.3.40 Peel Strength (pli) IPC-TM-650 2.4.9 modified Thermal Conductivity (W/m*K) ASTM F433 modified Halogen Content (ppm) BS EN 14582:2007 Meets X7R requirements 94 V-0 120°C 0.11 0.10 0.10 32 (x,y,z) 31 (x,y,z) 31 (x,y,z) 345°C 375°C 375°C 4.0 6.0 (ED)/4.0 (RA) 4.0 (RA) 0.5