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TC-281037ML

TC-281037ML

  • 厂商:

    3M

  • 封装:

    -

  • 描述:

    THERMCONDADHTC-281037ML

  • 数据手册
  • 价格&库存
TC-281037ML 数据手册
Technical Data | July 2018 3M™ Thermally Conductive Epoxy Adhesive TC-2810 Product Description 3M™ Thermally Conductive Epoxy Adhesive TC-2810 is a thermally conductive, 2-part epoxy using high performance filler for good thermal conductivity with high adhesion. Key Features • • • • • • • • High adhesive strength Slight tack allows pre-assembly Good surface wet out Low viscosity for potting applications Good gap filling Thin bonding line Good thermal conductivity (0.8-1.4 W/m-K) Low chloride (Cl) ion content and outgassing Typical Uncured Properties Note: The following technical information and data should be considered representative or typical only and should not be used for specification purposes. 3M™ Thermally Conductive Epoxy Adhesive TC-2810 Property Value *Viscosity Base Accelerator Mixed 40,000-90,000 cps 11,000-21,000 cps 40,000-80,000 cps Base Resin Base Epoxy Amine Accelerator Filler Mix Ratio (B:A) Worklife Ceramic Volume 24% by weight 2:1 100-120 minutes at 23°C (72°F) New Weight (lb/gal) Base Accelerator Mixed 10.58 10.28 10.37 *Viscosity is measured using 40 mm, 2° cone, at 10 S-1. Applications • • • • LED Assembly Thermal fixing battery cell and thermal management for EV/HEV battery Potting applications General gap filling Application Techniques and Product Use For bonding rigid to rigid parts, it is suggested that the bond line thickness and edge fill be designed to optimize: 1. Bond Strength 2. Thermal Resistance A typical suggested bond line is in the 3-7 mil (0.076- 0.018mm) thickness range For improved thermal performance (lower thermal resistance), a thinner bond line is suggested. A thinner bond line can reduce the bond strength so each application needs to be tested to find correct balance between thermal and mechanical properties. Bond Line Thickness vs Thermal Resistance vs Bond Strength A “fillet” at the edge of a bond line is suggested to increase bond strength. The fillets are formed as the epoxy squeezes out past the side edges. Fillets can add strength to the assembly. 3M™ Thermal Conductive Epoxy TC-2810 is supplied in dual syringe plastic duo-pak cartridges as part of the 3M™ Scotch-Weld™ EPX™ Plus II Applicator. The duo-pak cartridges are supplied in 37ml or 50 ml configuration. To use the cartridge simply insert the duo-pak cartridge into the EPX Plus II Applicator and start the plunger into the cylinders using light pressure on the trigger. Next, remove the duo-pak cartridge cap and expel and discard a small amount of adhesive to be sure both sides of the duo-pak cartridge are flowing evenly and freely (ie: no voids, “plugs of adhesive”, dis-continuity in flow, etc.) Once even side to side and uniform flow from both sides of the duo-pak is confirmed, attach the 3M™ Scotch-Weld™ EPX™ Mixing Nozzle to the duo-pak cartridge to ensure proper and uniform missing of the Part A and Part B and begin dispensing the adhesive. Partially used cartridges must follow the above use instructions to ensure consistent product performance. Complete and uniform mixing as noted above of the two components is required to obtain consistent product performance. 3M™ Scotch-Weld™ EPX™ Plus II Applicator and 3M™ Scotch-Weld™ EPX™ Mixing Nozzle Use only 3M™ EPX™ Plus II Applicator and Mix Nozzles to ensure optimum product performance. Typical Cured Physical Properties and Performance Characteristics Note: The following technical information and data should be considered representative or typical only and should not be used for specification purposes. Final product specifications and testing methods will be outlined in the products Certificate of Analysis (COA) that is shipped with the commercialized product once it is approved by 3M for general commercialization and development work is completed. 3M™ Thermally Conductive Epoxy Adhesive TC-2810 Property Method* Color Glass Transition Temperature Thermal Coefficient of Expansion ASTM 1356 ASTM E831 Thermal Conductivity Volume Resistivity Dielectric Breakdown Voltage Dielectric Constant Total Outgassing ASTM D5470 ASTM D257 ASTM D149 ASTM 150 ASTM 5116 Siloxane Outgassing Extractable Chloride ASTM 5116 ASTM D7994 *Methods listed as ASTM are tested in accordance with the ASTM method noted *Disclaimer if applicable to chart above Value Cream See Chart on page 3 85 X 10 -6/K (below Tg) 240 X10 -6/K (above Tg) 0.80-1.4 W/m-K 1.5 x 1014 ohm-cm 44.0 kV/mm (1119 Volts/mil) 4.1
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