AP25G45GEM
Pb Free Plating Product
Advanced Power Electronics Corp.
▼ High Input Impedance ▼ High Pick Current Capability ▼ 4.5V Gate Drive ▼ Strobe Flash Applications
C C C C
N-CHANNEL INSULATED GATE BIPOLAR TRANSISTOR
VCE ICP
450V 150A C
G E
G E
SO-8
E E
Absolute Maximum Ratings
Symbol VCE VGE IGEP ICP PD@TC=25℃1 TSTG TJ Parameter Collector-Emitter Voltage Gate-Emitter Voltage Pulsed Gate-Emitter Voltage Pulsed Collector Current Maximum Power Dissipation Storage Temperature Range Operating Junction Temperature Range Rating 450 ±6 ±8 150 2.5 -55 to 150 -55 to 150 Units V V V A W ℃ ℃
Electrical Characteristics@Tj=25oC(unless otherwise specified)
Symbol IGES ICES VCE(sat) VGE(th) Qg Qge Qgc td(on) tr td(off) tf Cies Coes Cres RthJA
1
Parameter Gate-Emitter Leakage Current
Collector-Emitter Leakage Current (Tj=25℃)
Test Conditions VGE=± 6V, VCE=0V VCE=450V, VGE=0V
VGE=4.5V, ICP=150A (Pulsed)
Min. 0.35 -
Typ. 6 64.5 7 30 11.5 24.5 150 3.3 2227 200 79 -
Max. 10 10 8 1.2 50
Units uA uA V V nC nC nC ns ns ns µs pF pF pF ℃/W
Collector-Emitter Saturation Voltage
Gate Threshold Voltage Total Gate Charge Gate-Emitter Charge Gate-Collector Charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance
VCE=VGE, IC=250uA IC=50A VCE=360V VGE=4.5V VCC=225V IC=50A RG=25Ω VGE=10V VGE=0V VCE=25V f=1.0MHz
Thermal Resistance Junction-Ambient
Notes:
1.Surface mounted on 1 in2 copper pad of FR4 board ; 125℃/W when mounted on Min. copper pad. Data and specifications subject to change without notice
200411031
AP25G45GEM
180 140
160
T A =25 C
o
140
5.0V 4.5V 4.0V IC , Collector Current (A)
120
T A =150 C
o
5.0V 4.5V 4.0V
IC , Collector Current (A)
100
120
100
3.0V
80
3.0V
80
60
60
2.0V
40 20
40
2.0V
20
VG=1.0V
0 0 2 4 6 8 10 0 2 4 6 8
VG=1.0V
10 12
0
V CE , Collector-Emitter Voltage (V)
V CE , Collector-Emitter Voltage (V)
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
160
10
V CE =4.5V IC , Collector Current(A)
120
V GE =4.5V VCE(sat),Saturation Voltage(V)
8
I C =130A
80
25 ℃ 70 ℃ 125 ℃ T A =150 ℃
6
I C =100A
4
40
I C =50A
2
0
0
0
1
2
3
4
5
6
0
20
40
60
80
100
120
140
160
V GE , Cate-Emitter Voltage (V)
Junction Temperature ( o C)
Fig 3. Collector Current v.s. Gate-Emitter Voltage
1.5
Fig 4. Collector- Emitter Saturation Voltage v.s. Junction Temperature
200
1.2
ICP, Peak Collector Current (A)
160
VGE(th) (V)
0.9
120
0.6
80
0.3
40
0 -50 0 50 100 150
0 0 1 2 3 4 5 6 7
Junction Temperature ( C )
o
V GE , Gate-to-Emitter Voltage (V)
Fig 5. Gate Threshold Voltage
Fig 6. Minimum Gate Drive Area
v.s. Junction Temperature
AP25G45GEM
10000
f=1.0MHz
12
VGE , Gate -Emitter Voltage (V)
10
Cies Capacitance (pF)
1000
I CP =50A V CC =360V
8
6
Coes
100
4
Cres
2
10
0 1 5 9 13 17 21 25 29 0 30 60 90 120 150
V CE , Collector-Emitter Voltage (V)
Q G , Gate Charge (nC)
Fig 7. Typical Capacitance Characterisitics
Fig 8. Gate Charge Waveform
VCE
RC
TO THE OSCILLOSCOPE
90%
CV CE RG G 225 V
E
+
10% VGE
V GE
-
5V
td(on) tr
td(off) tf
Fig 9. Switching Time Test Circuit
Fig 10. Switching Time Waveform
VCE
C G TO THE OSCILLOSCOPE
Flasher
Vtrig CM + _ VCM
300V V GE
RG IGBT VG
E
+
-
1~3mA I G
IC
VCM = 300V CM =100uF
ICP = 150A VG =5V
Fig 11. Gate Charge Test Circuit
Fig 12. Application Test Circuit
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