2286B

Heat Sinks by Product - radial fin Page 1 of 3 ---Useful Links--- 6 Products / BGA / Radial Fins Radial Fin Heat Sinks for Microprocessors Search by part # z z Check distributor part inventory z Bond-on heat sinks for leadless chip carriers and flat packs. Primarily designed for 68-position devices. The 2283 is ideally suited to limited board space applications with high air flow. Part Number: 2283BG Browse Heat sinks - By Device - 6 - By Product Line - 6 -Attachment Methods6 - Interface Materials - 6 - Accessories - Useful Links • Building a part # • Catalog Request • Directions • Find Distributor • Find Sales Associate • How to order? • MSDS Safety Sheets • Part # Cross Ref • Quote Request • RoHS Initiative • Sample Request 6 Part Number: 2286BG< 4/19/2010 Heat Sinks by Product - radial fin Page 2 of 3 Part Number: 2288BG Part Number: 2292BG Part Number: 2296BG http://www.aavidthermalloy.com/products/bga/radial.shtml 4/19/2010 Heat Sinks by Product - radial fin http://www.aavidthermalloy.com/products/bga/radial.shtml Page 3 of 3 4/19/2010