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TAPE Attachment Method
Part Number: 371824B00032
(Vis Number: 028133)
This part is in stock and available for immediate delivery:
Contact your local sales rep BGA Surface Tape Type Heat Sink Finish Part Class Metal T405 Black Anodize A
Features and Benefits
• Configurations are available for a wide range of BGA package sizes • Tape mounted versions eliminate the need for mounting holes in the PC Board • These Heat Sinks can be used with either plastic or metal/ceramic BGA Packages depending on tape used • These Heat Sinks are compatible with Ther-a-grip tapes
Width Length Height
Fin Thickness Fin Thickness # of fins # of fins Base Thickness Across Width Across Length across width across length
35mm 35mm 7mm
0.97mm
1.14mm
2.03mm
11
11
Mechanical Outline Drawing
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2/25/2003
Standard Products Found
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Unless otherwise shown, tolerances are ±0.38(±.015)
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2/25/2003
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Thermal Performance
*θn **θf 31.9 9.67
*Natural convection thermal resistance is based on a 75 °C heat sink temperature rise. **Forced convection thermal resistance based on an entering 1.0 m/s (200 lfm) airflow. Due to various heat dissipation paths within a BGA device, please test the heat sink in your application.
This data sheet represents only one of a broad range of products we make to cool electronics. Our representatives can help you configure a complete cooling solution for your individual applications.
Visit us at www.aavidthermalloy.com • info@aavid.com • ©2002 Aavid Thermalloy, LLC
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2/25/2003
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