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Solder Anchor Attachment Method
Part Number: 374924B60024
(Vis Number: 037814)
This part is in stock and available for immediate delivery:
Contact your local sales rep BGA Surface Interface Heat Sink Finish Part Class All T766 Black Anodize A
Features and Benefits
• New unique wire clip design allows for complete reworkability after assembly • Configurations are available for a wide range of BGA package sizes in any thickness up to 3.0mm • Minimal PC Board real estate is required for mounting • Solder Anchors provide the most rugged mounting in the industry • Each Heat Sink utilizes a phase change pad as the interface for optimal performance Solder anchors are sold separately Part Number Do57 2 Solder anchors must be soldered to the PCB Prior to attaching the heat sink clip. Fin Thickness Fin Thickness # of fins # of fins Base Thickness Across Width Across Length across width across length
Width Length Height
40mm 40mm 10mm
0.9mm
0.89mm
1.5mm
16
17
Mechanical Outline Drawing
Unless otherwise shown, tolerances are ±0.38(±.015)
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2/25/2003
Standard Products Found
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Recommended PCB Hole Pattern
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Thermal Performance
*θn **θf 20.3 6.46
*Natural convection thermal resistance is based on a 75 °C heat sink temperature rise. **Forced convection thermal resistance based on an entering 1.0 m/s (200 lfm) airflow. Due to various heat dissipation paths within a BGA device, please test the heat sink in your application.
This data sheet represents only one of a broad range of products we make to cool electronics. Our representatives can help you configure a complete cooling solution for your individual applications.
Visit us at www.aavidthermalloy.com • info@aavid.com • ©2002 Aavid Thermalloy, LLC
http://www.aavidthermalloy.com/bin/bga_disp_print.pl?partnum=037814&attach=&size=...
2/25/2003
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