Data Sheet
June 2, 2014
FLT007A0Z/FLT007A0-SRZ Input Filter Modules
75Vdc Input Voltage Maximum; 7A Output Current Maximum
Features
Compliant to RoHS EU Directive 2011/65/EU (Z
versions)
Compatible in a Pb-free or SnPb reflow environment
(Z versions)
Surface Mount and Through hole versions
Common-mode and Differential-mode filtering
Small size and low profile
25.4 mm x 25.4 mm x 12.2 mm
(1 x 1 x 0.48 in)
Applications
Distributed power architectures
Intermediate bus voltage applications
Telecommunications equipment
Wireless Base stations
Enterprise Networks
Industrial equipment
Options
Surface Mount Interconnect (-SR)
Same footprint as FLTR75V5 module
Cost efficient open frame design
Wide operating temperature range (-40°C to +85°C)
Meets the voltage isolation requirements for
ETSI 300-132-2 and complies with and is licensed
for Basic Insulation rating per EN60950-1
UL* 60950-1 Recognized, CSA C22.2 No. 60950-1‡
03 Certified, and VDE 0805:2001-12 (EN60950-1)
Licensed
CE mark meets 73/23/EEC and 93/68/EEC
§
directives
ISO** 9001 and ISO 14001 certified manufacturing
facilities
†
Description
The FLT007A0Z,FLT007A0-SRZ filter module is designed to operate over an input voltage range up to 75Vdc at
output currents up to 7A in an ambient temperature of -40ºC to 85ºC. The filter module is optimized for use with
dc/dc converter modules, to significantly reduce the conducted differential and common-mode noise returned to the
power source. This filter module enables designers to meet the requirements of EMI standards CISPR 22
(EN55022) and FCC Class B by insertion in-line between the power source and the dc/dc converter module. These
modules are designed and manufactured to be either surface mounted (-SR version) or through hole mounted on
PCBs.
* UL is a registered trademark of Underwriters Laboratories, Inc.
†
CSA is a registered trademark of Canadian Standards Association.
VDE is a trademark of Verband Deutscher Elektrotechniker e.V.
** ISO is a registered trademark of the International Organization of Standards
‡
Document No:DS05-028 ver 1.27
PDF name: FLT007A0Z.pdf
Data Sheet
June 2, 2014
FLT007A0Z/FLT007A0-SRZ Input Filter Modules
75Vdc Input Voltage Maximum, 7A Output Current Maximum
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are
absolute stress ratings only, functional operation of the device is not implied at these or any other conditions in
excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for
extended periods can adversely affect the device reliability.
Parameter
Device
Symbol
Min
Max
Unit
All
All
VIN
0
100
Vdc
TA
-40
85
°C
Storage Temperature
I/O to Ground Isolation (100% Factory Tested)
All
Tstg
-55
125
°C
All
1500
Vdc
Input Voltage
Continuous
Operating Ambient Temperature
(see Thermal Considerations section)
Electrical Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature
conditions.
Parameter
Device
Symbol
Min
Typ
Max
Unit
All
VIN
0
24/48
75
Vdc
(VIN= 0 to ViN,max)
All
Imax
7
Adc
Resistance per leg
All
R
25
m:
Operating Input Voltage
Maximum Input-to-Output Current
CAUTION: This power module is not internally fused. An input line fuse must always be used.
This power module can be used in a wide variety of applications, ranging from simple standalone operation to an
integrated part of sophisticated power architecture. To preserve maximum flexibility, internal fusing is not included,
however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies
require a fast-acting fuse with a maximum rating of 10 A (see Safety Considerations section). Based on the
information provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a
lower rating can be used. Refer to the fuse manufacturer’s data sheet for further information.
LINEAGE POWER
2
Data Sheet
June 2, 2014
FLT007A0Z/FLT007A0-SRZ Input Filter Modules
75Vdc Input Voltage Maximum, 7A Output Current Maximum
Insertion Loss Tables
Parameter
Device
Symbol
Min
Typ
Max
Unit
Common-mode Insertion Loss
50: circuit, 500kHz
All
44
50
dB
50: circuit, 1MHz
All
54
60
dB
50: circuit, 10MHz
All
44
50
dB
50: circuit, 500kHz
All
44
50
dB
50: circuit, 1MHz
All
60
66
dB
50: circuit, 10MHz
All
40
46
dB
Differential-mode Insertion Loss
General Specifications
Parameter
Min
Calculated MTBF (VIN= VIN, nom, IO= 0.8IO, max, TA=40°C)
Telecordia SR 332 Issue 1: Method 1, case 3
Weight
LINEAGE POWER
Typ
Max
22,576,100
7.8 (0.275)
Unit
Hours
g (oz.)
3
Data Sheet
June 2, 2014
FLT007A0Z/FLT007A0-SRZ Input Filter Modules
75Vdc Input Voltage Maximum, 7A Output Current Maximum
Characteristic Curves
The following figures provide typical characteristics for the FLT007A0Z/FLT007A0-SRZ Module.
0
INSERTION LOSS (dB)
-10
-20
-30
IN PUT
-40
N ame = 4
5
1
8
4
N ame = 4
5
1
8
4
OUTPUT
-50
-60
-70
GROU ND
-80
0.01
0.1
1
10
100
FREQUENCY (MHz)
Figure 1. Typical Common-Mode Insertion Loss in a
: circuit.
50:
Figure 4. Internal Schematic
0
-10
INSERTION LOSS (dB)
-20
-30
-40
-50
-60
-70
-80
-90
-100
0.01
0.1
1
10
100
FREQUENCY (MHz)
Figure 2. Typical Differential-Mode Insertion Loss in a
50: circuit.
OUTPUT CURRENT, Io (A)
8
7
6
2m/s (400LFM)
1m/s (200LFM)
5
0.5m/s (100LFM)
NC
4
20
30
40
50
60
70
80
90
AMBIENT TEMPERATURE, TA OC
Figure 3. Derating Output Current versus Local
Ambient Temperature and Airflow.
LINEAGE POWER
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Data Sheet
June 2, 2014
FLT007A0Z/FLT007A0-SRZ Input Filter Modules
75Vdc Input Voltage Maximum, 7A Output Current Maximum
Application Guidelines
Conducted noise on the input power lines can occur
as either differential-mode or common-mode noise
currents. Differential-mode noise is measured
between the two input lines, and is found mostly at
the low frequency end of the spectrum. This noise
shows up as noise at the fundamental switching
frequency and its harmonics. Common-mode noise is
measured between the input lines and ground and is
mostly broadband noise above 10 MHz. The highfrequency nature of common-mode noise is mostly
due to the high-speed switching transitions of power
train components. Either or both types of noise may
be covered in a specification, as well as a
combination of the two.
Differential-mode noise is best attenuated using a
filter composed of line-to-line capacitors (X caps) and
series inductance, provided by either a discrete
inductor or the leakage inductance of a commonmode choke. In addition to the differential filtering
provided by the filter module, it is recommended that
an electrolytic capacitor be located at the converter
side of the filter to provide additional attenuation of
low-frequency differential noise and to provide a low
source impedance for the converter, preventing input
filter oscillations and load transient induced input
voltage dips.
Open-frame DC/DC converter modules and the older
metal-cased DC/DC converter modules require
slightly different filtering arrangements. The
FLT007A0Z series of modules are optimized for the
newer open-frame series of modules, but can also be
used with older metal-case modules. The main
differences in filtering recommendations between the
two types of modules are in common-mode filtering,
as explained below.
Filtering Open-Frame DC/DC
Converter Modules
For filtering open-frame DC/DC converter modules,
the recommended circuit is shown in Fig. 5. In
addition to the input electrolytic filter capacitor C1
(recommended value is a minimum of 100uF and
approximately 1uF/W at power levels above 100W),
common-mode filtering capacitors C2 and C3 should
be connected between the input and outputs as
shown. Suitable values for common-mode capacitors
C2 and C3 are in the range between 1000pF to 0.1PF
are usually indicated in the DC/DC converter data
sheet. These capacitors need to be rated for the
isolation voltage desired between the input and output
sides of the DC/DC converter module. The
recommended power layout of the modules showing
where the two common-mode capacitors are to be
placed is shown in Fig. 6.
LINEAGE POWER
C2
VI(+)
VI(+)
FILTER
MODU LE
VO(+)
DC/DC
CONVERTER
MOD ULE
C1
VI(- )
VI(-)
VO(-)
CHASSIS GROUND
C3
Figure 5. Schematic diagram showing
recommended connection of the FLT007A0Z
filter module with open-frame DC/DC converter
modules.
C2
VO+ PLANE
VIN+
VI+
VIN+
Input
F
FLT007A0
MODULE
GND
VIN
VIN
CHASSIS
GROUND
VO+
VO+
VO
C1
DC/DC
CONVERTER
Load
VO
VI
VO PLANE
C3
Figure 6. Diagram showing recommended
layout of the FLT007A0Z filter module with
open-frame DC/DC converter modules.
Filtering Metal-Case DC/DC Converter
Modules
For metal-case DC/DC converter modules with a case
pin, a different filtering arrangement and layout is
recommended. Figure 7 shows the schematic
diagram of the recommended circuit. The main
difference with open-frame module is the use of an
isolated shield plane located underneath the module
which is connected through capacitors C2 through C5
to the input and output connections of the module.
The shield plane along with the case of the module
serves as a Faraday shield helping reduce EMI. The
corresponding layout for metal-case modules is
shown in Fig. 8.
5
Data Sheet
June 2, 2014
FLT007A0Z/FLT007A0-SRZ Input Filter Modules
75Vdc Input Voltage Maximum, 7A Output Current Maximum
Level [dBμV]
80
VI(+)
VI(+)
FILTER
MODU LE
C1
VI(- )
70
VO(+)
DC/DC
CONVERTER
MOD ULE
VI(-)
60
50
40
VO(-)
CASE
CHASSIS GROUND
C2
C3
30
C4
C5
20
10
0
150k
SHIELD PLANE
Figure 7. . Schematic diagram showing
recommended connection of the FLT007A0Z
filter module with metal-cased DC/DC converter
modules.
VI+
VIN+
Input
30M
Figure 9. Experimental results showing
conducted EMI measured using a FLT007A0Z
module with a QBE025A0B1 DC/DC converter.
VO+
VO+
F
FLT007A0
MODULE
GND
VIN
1M
2M
3M 4M5M 7M 10M
Frequency [Hz]
C4
C2
VIN+
300k 500k
VO
VIN
CHASSIS
GROUND
C1
DC/DC
CONVERTER
Load
CASE
VI
C3
SHIELD
PLANE
VO
C5
Figure 8. Diagram showing recommended
layout of the FLT007A0Z filter module with
metal-case DC/DC converter modules.
Example Data Showing Results using
the FLT007A0Z Modules
Figure 9 shows example results obtained using a
QBE025A0B1 DC/DC converter module with the
FLT007A0Z filter module. The QBE025A0B1 module
is operated at an input voltage of 43.2V and output
loading corresponding to an input current of 6.2A, a
level close to the 7A capability of the FLT007A0Z filter
module. A 10nF ceramic capacitor was connected
between Vin(-) and Vo(-) and a 4700pF ceramic
capacitor between Vin(+) and Vo(+). The results show
that the filter module is capable of meeting EN55022
Class B limits with sufficient margin.
LINEAGE POWER
6
Data Sheet
June 2, 2014
FLT007A0Z/FLT007A0-SRZ Input Filter Modules
75Vdc Input Voltage Maximum, 7A Output Current Maximum
Thermal Considerations
Power modules operate in a variety of thermal
environments; however, sufficient cooling should
always be provided to help ensure reliable operation.
Considerations include ambient temperature, airflow,
module power dissipation, and the need for increased
reliability. A reduction in the operating temperature of
the module will result in an increase in reliability. The
thermal data presented here is based on physical
measurements taken in a wind tunnel. The test setup is shown in Fig. 10. Note that the airflow is parallel
to the long axis of the module as shown in Fig. 10.
25.4_
(1.0)
Wind Tunnel
Figure 11. Tref Temperature measurement
location.
PWBs
Power Module
76.2_
(3.0)
x
12.7_
(0.50)
Probe Location
for measuring
airflow and
ambient
temperature
Air
flow
Figure 10. Thermal Test Set-up.
The thermal reference point, Tref used in the
specifications is shown in Figure 11. For reliable
o
operation this temperature should not exceed 125 C.
The output power of the module should not exceed
the rated output current of the module.
Please refer to the Application Note “Thermal
Characterization Process For Open-Frame BoardMounted Power Modules” for a detailed discussion of
thermal aspects including maximum device
temperatures.
LINEAGE POWER
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Data Sheet
June 2, 2014
FLT007A0Z/FLT007A0-SRZ Input Filter Modules
75Vdc Input Voltage Maximum, 7A Output Current Maximum
Post solder Cleaning and Drying
Considerations
nozzle outer diameter, which will safely fit within the
allowable component spacing, is 8 mm max.
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Lineage Power Board
Mounted Power Modules: Soldering and Cleaning
Application Note.
Pick and
Place
Location
Through-Hole Lead-Free Soldering
Information
The RoHS-compliant through-hole products use the
SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed
through single or dual wave soldering machines. The
pins have an RoHS-compliant finish that is compatible
with both Pb and Pb-free wave soldering processes.
A maximum preheat rate of 3qC/s is suggested. The
wave preheat process should be such that the
temperature of the power module board is kept below
210qC. For Pb solder, the recommended pot
temperature is 260qC, while the Pb-free solder pot is
270qC max. Not all RoHS-compliant through-hole
products can be processed with paste-through-hole
Pb or Pb-free reflow process. If additional information
is needed, please consult with your Lineage Power
representative for more details.
Surface Mount Information
Pick and Place
The FLT007A0-SRZ SMT modules use an open
frame construction and are designed for a fully
automated assembly process. The modules are fitted
with a label designed to provide a large surface area
for pick and place operations. The label meets all the
requirements for surface mount processing, as well as
safety standards, and is able to withstand reflow
o
temperatures of up to 300 C. The label also carries
product information such as product code, serial
number and location of manufacture.
Figure 12. Pick and Place Location.
Tin Lead Soldering
The FLT007A0-SRZ power modules are lead free
modules and can be soldered either in a lead-free
solder process or in a conventional Tin/Lead (Sn/Pb)
process. It is recommended that the customer review
data sheets in order to customize the solder reflow
profile for each application board assembly. The
following instructions must be observed when
soldering these units. Failure to observe these
instructions may result in the failure of or cause
damage to the modules, and can adversely affect
long-term reliability.
In a conventional Tin/Lead (Sn/Pb) solder process
peak reflow temperatures are limited to less than
o
o
235 C. Typically, the eutectic solder melts at 183 C,
wets the land, and subsequently wicks the device
connection. Sufficient time must be allowed to fuse
the plating on the connection to ensure a reliable
solder joint. There are several types of SMT reflow
technologies currently used in the industry. These
surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR. For
reliable soldering the solder reflow profile should be
established by accurately measuring the modules CP
connector temperatures.
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Even so, these
modules have a relatively large mass when compared
to conventional SMT components. Variables such as
nozzle size, tip style, vacuum pressure and pick &
placement speed should be considered to optimize
this process. The minimum recommended nozzle
diameter for reliable operation is 5mm. The maximum
LINEAGE POWER
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Data Sheet
June 2, 2014
FLT007A0Z/FLT007A0-SRZ Input Filter Modules
75Vdc Input Voltage Maximum, 7A Output Current Maximum
Pb-free Reflow Profile
REFLOW TEMP (qC)
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for
both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
forced-air-convection reflow profile based on the
volume and thickness of the package (table 4-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).
The recommended linear reflow profile using
Sn/Ag/Cu solder is shown in Figure. 15.
MSL Rating
REFLOW TIME (S)
Figure 13. Reflow Profile for Tin/Lead (Sn/Pb)
process.
The FLT007A0-SRZ SMT modules have a MSL rating
of 1.
MAX TEMP SOLDER (qC)
Storage and Handling
o
Figure 14. Time Limit Curve Above 205 C Reflow
for Tin Lead (Sn/Pb) process.
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices). Moisture barrier
bags (MBB) with desiccant are required for MSL
ratings of 2 or greater. These sealed packages
should not be broken until time of use. Once the
original package is broken, the floor life of the product
at conditions of
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