IND065BHV

IND065BHV Hornet: Non-Isolated DC-DC Voltage Regulator Modules 12Vdc input; 32Vdc to 54Vdc output; 65W Max Power Vin+ VIN Vout+ VOUT PGOOD MODULE Applications ✓ ✓ ✓ TRIM Cin Industrial Equipment Control Boards Test Equipment RTrim ON/OFF SIG_GND GND GND Electrical Features • 12V (±20%) Input voltage • • • • Co •Mechanical Small size:Features 27.9 mm x 11.4 mm x 8.5 mm (1.1 in x 0.45 in x 0.335 in) • Operating range: -40°C to 85°C ambient Output voltage programmable from 32Vdc to 54Vdc via external resistor Remote On/Off for optional external control Fixed switching frequency Output overcurrent protection (non-latching) Process and Safety • • • • • • • • • • Qualified for 1000h High Temperature Operating Bias, 1000h 85RH/85°C Temperature, Humidity and Bias, 700 cycle -40 to 125°C thermal cycling ANSI/UL* 62368-1 and CAN/CSA† C22.2 No. 62368-1 Recognized, DIN VDE‡ 0868-1/A11:2017 (EN62368-1:2014/A11:2017) ISO** 9001 and ISO 14001 certified manufacturing facilities Compliant to RoHS Directive 2011/65/EU and amended Directive (EU) 2015/863 Compliant to REACH Directive (EC) No 1907/2006 Compatible in a Pb-free or SnPb reflow environment. Suitable for aqueous clean. Suitable for conformal coating with dip and vapor deposition. Conformal coating can provide the protection to meet Salt Fog Test per IEC 60068-2-52 (Severity 3) and Mixed Gas Flow test per Telcordia GR-3108 Outdoor Levels. 3 year warranty Device Code Input Voltage Output Voltage Output Current (Max.) On/Off Logic Comcode IND065BHV 9.6 – 14.4Vdc 32 – 54Vdc 2A(@32V) Negative 1600102910A Thermal Performance Full rated output with natural convection up to 72°C at 32Vout and up to 49°C at 54Vout.. Thermal curves for 3 voltages below. 1.5 3.0 1.5 Current (A) vs. Ambient Temp. (°C) 2.5 Current (A) vs. Ambient Temp. (°C) NC 1.0 2.0 32Vout 0.5m/s (100LFM) 1.5 NC 0.5 0.5m/s (100LFM) 0.0 3.0m/s (600LFM) 0.0 0.0 60 May 13, 2021 65 70 75 54Vout Current (A) vs. Ambient Temp. (°C) 2.0m/s (400LFM) 55 1.0m/s (200LFM) 2.0m/s (400LFM) 0.5 3.0m/s (600LFM) 48Vout 0.5m/s (100LFM) 0.5 NC 2.0m/s (400LFM) 1.0m/s (200LFM) 1.0 1.0 1.0m/s (200LFM) 80 85 55 60 65 70 75 80 ©2017 General Electric Company. All rights reserved. 85 45 50 55 60 65 70 75 80 85 Page 1 Heat Transfer via Conduction The module can also be used in a sealed environment with cooling via conduction from the module’s top surface through a gap pad material to a cold wall, as shown below. The output current derating versus cold wall temperature, when using a thermal pad and a gap filler is shown below. Thermal pad: Bergquist P/N: GP2500S20 Gap filler: Bergquist P/N: GF2000 Figure 1. Output Current versus Cold Wall Temperature; VIN =12V. May 13, 2021 ©2017 General Electric Company. All rights reserved. Page 2 Electrical Specifications Parameter Device Symbol Min Typ Max Unit All VIN 9.6 12 14.4 Vdc VO,set = 32 Vdc IIN,No load 125 mA 190 mA 100* μF Operating Input Voltage Input No Load Current (VIN = 12.0Vdc, IO = 0, module enabled) VO,set = 54Vdc IIN,No load ⎯ External Capacitance, Ceramic ESR ≥ 1 mΩ All CO, max Output Current All Io Switching Frequency All fsw Output Voltage (Over all line, load, and temperature conditions) All VO, set On/Off Logic High (MODULE OFF) Input High Voltage All VIH 2.5 ⎯ 16 Vdc On/ Off Logic Low (MODULE ON) Input Low Voltage All VIL -0.2 ― 0.6 Vdc Efficiency 12VINDC, TA=25°C, I=12A, Vo=32 to 54Vdc 2.03(32V), 1.63(40V), 1.35(48V), 1.2(54V) η A 95(32V), 93.8(48V), 93.3(54V) ⎯ % ⎯ 260 kHz 3 % VO, set PGOOD (Power Good) Signal Interface Open Drain, Vsupply  5VDC Overvoltage threshold for PGOOD ON All 107.6 %VO, set Overvoltage threshold for PGOOD OFF All 112.8 %VO, set Undervoltage threshold for PGOOD ON All 92.2 %VO, set Undervoltage threshold for PGOOD OFF All 87.9 %VO, set Pulldown resistance of PGOOD pin All Sink current capability into PGOOD pin All  94 6 mA *Additional External Capacitance possible using Tunable Loop Characteristic Curves The following figures provide typical characteristics for the IND065BHV Hornet at 25oC. 15 Input Voltage (v) 14 Upper Boundary 13 12 11 10 Lower Boundary 9 32 34 36 38 40 42 44 46 48 50 52 54 Output Voltage (V) Figure 2. Output Ripple Voltage for various output voltages and external caps @12Vin. Additional Decoupling cap of 0.01uF used on input and output side. Figure 3. Output Voltage vs. Input Voltage Set point area showing limits where the output voltage can be set for different input voltages. Use Current (A) = 65 / Output Voltage (V) to determine baseline output current for a specific voltage. Then thermal curves. Interpolate data for intermediate output voltages Trim Rtrim for a desired output voltage, should be as per the following table. The formula in the last column helps determine Rtrim for other voltages. Vo (V) May 13, 2021 32 36 40 44 48 50 54 ©2017 General Electric Company. All rights reserved. Page 3 Rtrim (kΩ) 7.812 6.914 6.201 85.621 5.141 4.93 4.557  1.2  Rtrim =   x 200 .5k  (Vo − 1.2) Safety Considerations For safety agency approval, the power module must be installed in compliance with the spacing and separation requirements of the end-use safety agency standards listed on the first page of this document. For the converter output to be considered meeting the requirements of safety extra-low voltage (SELV) or ES1, the input must meet SELV/ES1 requirements. The power module has extra-low voltage (ELV) outputs when all inputs are ELV. The input to these units is to be provided with a 12A in the positive input lead. Tunable Loop The module is designed for 200uF capacitor on its output. For applications where more than 200uF capacitors would be used on the output, an additional Resistor (Rtune) and Capacitor (Ctune) would be required in the circuit schematic to compensate for the additional capacitance. The placement is between the Sense+ pin and Trim pin as per figure below: The recommended values for Rtune and Ctune for different amounts of external capacitance are as per the table below: VOUT RTUNE MODULE CTUNE Co RTUNE 100F 220uF 330F 390F 30.1kΩ 20.1kΩ 20.1kΩ 15kΩ CTUNE 10nF 22nF 33nF 68nF TRIM SGND RTrim Figure 4. Circuit diagram showing connection of RTUNE and CTUNE to tune the control loop of the module. PowerGood (PGOOD) This is an open-drain output to indicate that the output voltage is within the regulation limits of the module. The PGOOD signal will be de-asserted to a low state if any condition such as overtemperature, overcurrent or loss of regulation occurs that would result in the output voltage going ±10% outside the setpoint value. If not used, leave unconnected. Recommended Pad Layout Dimensions are in millimeters and (inches). Tolerances: x.x mm  0.5 mm (x.xx in.  0.02 in.) [unless otherwise indicated] x.xx mm  0.25 mm (x.xxx in  0.010 in.) May 13, 2021 ©2017 General Electric Company. All rights reserved. Page 4 Nozzle Recommendations 300 Per J-STD-020 Rev. D Peak Temp 260°C 250 Reflow Temp (°C) Stencil thickness of 6 mils minimum must be used for this product. The module weight has been kept to a minimum by using open frame construction. Variables such as nozzle size, tip style, vacuum pressure and placement speed should be considered to optimize this process. The minimum recommended inside nozzle diameter for reliable operation is 3mm. The maximum nozzle outer diameter, which will safely fit within the allowable component spacing, is 7 mm. 200 * Min. Time Above 235°C 15 Seconds Cooling Zone 150 Heating Zone 1°C/Second *Time Above 217°C 60 Seconds 100 50 Bottom Side / First Side Assembly This module is not recommended for assembly on the bottom side of a customer board. If such an assembly is attempted, components may fall off the module during the second reflow process Lead Free Soldering The modules are lead-free (Pb-free) and RoHS compliant and fully compatible in a Pb-free soldering process. Failure to observe the instructions below may result in the failure of or cause damage to the modules and can adversely affect long-term reliability MSL Rating The modules have a MSL rating of 2a. Pb-free Reflow Profile Power Systems will comply with J-STD-020 Rev. D (Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices) for both Pb-free solder profiles and MSL classification procedures. The suggested Pb-free solder paste is Sn/Ag/Cu (SAC). The following profile is the recommended linear reflow profile using Sn/Ag/Cu solder. Soldering outside of the recommended profile requires testing to verify results and performance. 0 Reflow Time (Seconds) Storage and Handling J-STD-033 Rev. A (Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices) is recommended. Moisture barrier bags (MBB) with desiccant are required for MSL ratings of 2 or greater. These sealed packages should not be broken until time of use. Once the original package is broken, the floor life of the product at conditions of  30°C and 60% relative humidity varies according to the MSL rating (see JSTD-033A). The shelf life for dry packed SMT packages will be a minimum of 12 months from the bag seal date, when stored at the following conditions: < 40° C, < 90% relative humidity. Post Solder Cleaning and Drying Considerations Post solder cleaning is usually the final circuit-board assembly process prior to electrical board testing. The result of inadequate cleaning and drying can affect both the reliability of a power module and the testability of the finished circuit-board assembly Contact Us For more information, call us at USA/Canada: +1 888 546 3243, or +1 972 244 9288 Asia-Pacific: +86-21-53899666 Europe, Middle-East and Africa: +49.89.878067-280 Go.ABB/Industrial GE Critical Power reserves the right to make changes to the product(s) or information contained herein without notice, and no liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or information. May 13, 2021 ©2017 General Electric Company. All International rights reserved. Version 1.6