IND080

IND080 Hornet: Non-Isolated DC-DC Voltage Regulator Modules 12Vdc input; 0.8Vdc to 2Vdc output; 80W Max Power Vin+ VIN PGOOD Vout+ VOUT VS+ MODULE Applications ✓ ✓ ✓ TRIM Cin SEQ Industrial Equipment Control Boards Test Equipment SHARE ON/OFF GND Features •Electrical 12V Input voltage with ±20% Tolerance • Output voltage programmable from 0.8Vdc to 2Vdc via external resistor • Remote On/Off for optional external control • Power Good signal for external monitoring • Fixed switching frequency • Output overcurrent protection (non-latching) • Share and Sequence available for advanced loads Co RTrim SIG_GND SYNC GND VS- Mechanical Features • • • • Small size: 33.02 mm x 13.46 mm x 10.9 mm (1.3 in x 0.53 in x 0.429 in) Operating range: -40°C to 105°C ambient Operating shock to 40G per Mil Std. 810G, Method 516.4 Procedure I Operating vibration per Mil Std. 810G, Method 514.5 Procedure I Process and Safety • • Qualified for 1000h High Temperature Operating Bias, 1000h 85RH/85°C Temperature, Humidity and Bias, 700 cycle -40 to 125°C thermal cycling ANSI/UL* 62368-1 and CAN/CSA† C22.2 No. 62368-1 Recognized, DIN VDE‡ 0868-1/A11:2017 (EN62368-1:2014/A11:2017) ISO** 9001 and ISO 14001 certified manufacturing facilities Compliant to RoHS Directive 2011/65/EU and amended Directive (EU) 2015/863 Compliant to REACH Directive (EC) No 1907/2006 Compatible in a Pb-free or SnPb reflow environment. Suitable for aqueous clean. Suitable for conformal coating with dip and vapor deposition. Conformal coating can provide the protection to meet Salt Fog Test per IEC 60068-2-52 (Severity 3) and Mixed Gas Flow test per Telcordia GR-3108 Outdoor Levels. 3 year warranty • • • • • • • • Device Code Input Voltage Output Voltage Output Current (Max.) On/Off Logic Comcode IND080 9.6 – 14.4Vdc 0.6 – 2.0Vdc 40A Negative 1600102901A Thermal Performance Full rated output with natural convection up to 63°C at 1.2Vout and up to 60°C at 1.8Vout. Thermal curves for 1.2V, and 1.8Vout below. 45 45 40 40 35 35 30 0.5m/s (100LFM) 30 1m/s (200LFM) 25 20 NC NC 1.2Vout 1m/s (200LFM) 1.5m/s 20 1.5m/s (300LFM) 2m/s (400LFM) 15 Current (A) vs. Temp ( C) 2m/s (400LFM) 15 0.5m/s (100LFM) 25 10 1.8 Vout Current (A) vs. Temp ( C) 5 10 45 55 May 13, 2021 65 75 85 95 105 45 55 65 75 85 95 ©2017 General Electric Company. All rights reserved. 105 Page 1 Electrical Specifications Parameter Device Symbol Min Typ Max Unit All VIN 9.6 12 14.4 Vdc VO,set = 2Vdc IIN,No load Operating Input Voltage Input No Load Current (VIN = 12.0Vdc, IO = 0, module enabled) External Capacitance, Ceramic ESR ≥ 1 mΩ All CO, max Efficiency 12VINDC, TA=25°C, I=12A, Vo=1.2 to 5Vdc η 104 mA 6x47 6x47* ⎯ 82.8(1.2V), 88.2(1.8V), 91.6(3.3V), 93.9(5V) 600 ⎯ ⎯ μF % Switching Frequency All fsw kHz Output Voltage (Over all line, load, and temperature conditions) All VO, set -3.0 ⎯ +3.0 % VO, set On/Off Logic High (MODULE OFF) Input High Voltage All VIH 2 ⎯ 14.4 Vdc On/ Off Logic Low (MODULE ON) Input Low Voltage All VIL -0.2 ― 0.4 Vdc PGOOD (Power Good) Signal Interface Open Drain, Vsupply  5VDC Overvoltage threshold for PGOOD ON All 103 108 113 %VO, set Overvoltage threshold for PGOOD OFF All 105 110 115 %VO, set Undervoltage threshold for PGOOD ON All 87 92 97 %VO, set Undervoltage threshold for PGOOD OFF All 85 90 95 %VO, set Pulldown resistance of PGOOD pin All 50  Sink current capability into PGOOD pin All 5 mA 480 kHz Frequency Synchronization (SYNC) Synchronization Frequency Range All All 350 High-Level Input Voltage All VIH Low-Level Input Voltage Input Current, SYNC Minimum Pulse Width, SYNC All All All VIL ISYNC tSYNC 2.0 V 100 V nA ns Maximum SYNC rise time All tSYNC_SH 100 ns 0.4 100 *Additional External Capacitance possible using Tunable Loop Characteristic Curves The following figures provide typical characteristics for the IND080 Hornet at 25oC. 40 6x47uF Ext Cap Ripple (m Vp-p) 8x47uF Ext Cap 30 10x47uF Ext Cap 20 10 0 0.8 1 1.2 1.4 1.6 1.8 2 Output Voltage(Volts) Figure 1. Output Ripple Voltage(20MHz BW) for various output voltages and external caps @12Vin. Additional Decoupling cap of 0.1uF used on input and output side Figure 2. Typical Start-up using Input Voltage (Vin=12V, Vout = Vout, max, Iout = Iout, max) Trim Without an external resistor between Trim and GND pins, the output of the module will be 0.6Vdc. Rtrim for a desired output voltage, should be as per the following table. The formula in the last column helps determine Rtrim for other voltages. Vo (V) 0.9 1.2 1.5 1.8 Rtrim (kΩ) 40 20 13.3 10 May 13, 2021  12  Rtrim =   k  (Vo − 0.6) ©2017 General Electric Company. All rights reserved. Page 2 Safety Considerations For safety agency approval, the power module must be installed in compliance with the spacing and separation requirements of the end-use safety agency standards listed on the first page of this document. For the converter output to be considered meeting the requirements of safety extra-low voltage (SELV) or ES1, the input must meet SELV/ES1 requirements. The power module has extra-low voltage (ELV) outputs when all inputs are ELV. The input to these units is to be provided with a fast-acting fuse with a maximum rating of 30A, 100V (for example, Littlefuse 456 series) in the positive input lead. Tunable Loop The module is designed for 1x47uF capacitor on its output. For applications where more than 1x47uF capacitors would be used on the output, an additional Resistor (Rtune) and Capacitor (Ctune) would be required in the circuit schematic to compensate for the additional capacitance. The placement is between the Sense+ pin and Trim pin as per figure below: The recommended values for Rtune and Ctune for different amounts of external capacitance are as per the table below: VOUT VS+ RTune MODULE CO Co RTUNE CTune T RIM CTUNE RTr im 6x47F 8x47F 10x47F 12x47F 20x47F 330Ω 330Ω 330Ω 330Ω 200Ω 330pF 820pF 1200pF 1500pF 3300pF SIG_GND GND Figure 3. Circuit diagram showing connection of RTUNE and CTUNE to tune the control loop of the module PowerGood (PG) This is an open-drain output to indicate that the output voltage is within the regulation limits of the module. The PGOOD signal will be de-asserted to a low state if any condition such as overtemperature, overcurrent or loss of regulation occurs that would result in the output voltage going ±10% outside the setpoint value. The default value of PGOOD ON thresholds are set at ±8% of the nominal Vset value, and PGOOD OFF thresholds are set at ±10% of the nominal Vset. For example, if the nominal voltage (Vset) is set at 1.0V, then the PGOOD ON thresholds will be active anytime the output voltage is between 0.92V and 1.08V, and PGOOD OFF thresholds are active at 0.90V and 1.10V respectively. If not used, leave unconnected. Synchronization (SYNC) MODULE SYNC + ─ GND Figure 4. External source connections to synchronize switching frequency of the module. May 13, 2021 The module switching frequency can be synchronized to a signal with an external frequency within a specified range. Synchronization can be done by using the external signal applied to the SYNC pin of the module as shown in Fig. 4, with the converter being synchronized by the rising edge of the external signal. The Electrical Specifications table specifies the requirements of the external SYNC signal. If the SYNC pin is not used, the module should free run at the default switching frequency. If synchronization is not being used, connect the SYNC pin to GND. ©2017 General Electric Company. All rights reserved. Page 3 Recommended Pad Layout Dimensions are in millimeters and (inches). Tolerances: x.x mm  0.5 mm (x.xx in.  0.02 in.) [unless otherwise indicated] x.xx mm  0.25 mm (x.xxx in  0.010 in.) SHARE must be left open if not being used May 13, 2021 NC NC NC NC Leave open if not used *SYNC must be connected to SIG_GND if not being used NC ©2017 General Electric Company. All rights reserved. Page 4 be digitally turned ON as that does not ensure that all modules being paralleled turn on at the same time. Active Load Sharing (Share Function) For additional power requirements, the Mega DLynxTM power module is also equipped with paralleling capability. Up to five modules can be configured in parallel, with active load sharing. To implement paralleling, the following conditions must be satisfied. • All modules connected in parallel must be frequency synchronized where they are switching at the same frequency. This is done by using the SYNC function of the module and connecting to an external frequency source. Modules can be interleaved to reduce input ripple/filtering requirements. • The share pins of all units in parallel must be connected together. The path of these connections should be as direct as possible. • The remote sense connections to all modules should be made that to the same points for the output, i.e. all VS+ and VS- terminals for all modules are connected to the power bus at the same points. • For converters operating in parallel, tunable loop components “RTUNE” and “CTUNE” must be selected to meet the required transient specification. For providing better noise immunity, we recommend that RTUNE value to be greater than 300Ω. Some special considerations apply for design of converters in parallel operation: • • When sizing the number of modules required for parallel operation, take note of the fact that current sharing has some tolerance. In addition, under transient conditions such as a dynamic load change and during startup, all converter output currents will not be equal. To allow for such variation and avoid the likelihood of a converter shutting off due to a current overload, the total capacity of the paralleled system should be no more than 90% of the sum of the individual converters. As an example, for a system of four modules in parallel, the total current drawn should be less that 90% of (3 x 40A), i.e. less than 108 A. All modules should be turned ON and OFF together. This is so that all modules come up at the same time avoiding the problem of one converter sourcing current into the other leading to an overcurrent trip condition. To ensure that all modules come up simultaneously, the on/off pins of all paralleled converters should be tied together and the converters enabled and disabled using the on/off pin. Note that this means that converters in parallel cannot May 13, 2021 • If the Sequencing function is being used to start-up and shut down modules and the module is being held to 0V by the tracking signal then there may be small deviations on the module output. This is due to controller duty cycle limitations encountered in trying to hold the voltage down near 0V. • The share bus is not designed for redundant operation and the system will be non-functional upon failure of one of the units when multiple units are in parallel. In particular, if one of the converters shuts down during operation, the other converters may also shut down due to their outputs hitting current limit. In such a situation, unless a coordinated restart is ensured, the system may never properly restart since different converters will try to restart at different times causing an overload condition and subsequent shutdown. This situation can be avoided by having an external output voltage monitor circuit that detects a shutdown condition and forces all converters to shut down and restart together. When not using the active load share feature, share pins should be left unconnected. Output Voltage Sequencing The voltage applied to the SEQ pin should be scaled down by the same ratio as used to scale the output voltage down to the reference voltage of the module. Minimum recommended delay between the ON/OFF signal and the sequencing signal is 10ms to ensure that the module output is ramped up according to the sequencing signal. Final value of the sequencing voltage must be set higher than the set-point voltage of the module. The module’s output can track the SEQ pin signal with slopes of up to 0.5V/msec during power-up or power-down. Module V SEQ 20K SEQ R1=Rtrim 100 pF SIG_GND Figure 5. Circuit showing connection of the sequencing signal to the SEQ pin. ©2017 General Electric Company. All rights reserved. Page 5 Nozzle Recommendations Pb-free Reflow Profile The minimum recommended inside nozzle diameter for reliable operation is 3mm. The maximum nozzle outer diameter, which will safely fit within the allowable component spacing, is 7 mm. Power Systems will comply with J-STD-020 Rev. D (Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices) for both Pb-free solder profiles and MSL classification procedures. The suggested Pb-free solder paste is Sn/Ag/Cu (SAC). The following profile is the recommended linear reflow profile using Sn/Ag/Cu solder . Soldering outside of the recommended profile requires testing to verify results and performance. Bottom Side / First Side Assembly This module is not recommended for assembly on the bottom side of a customer board. If such an assembly is attempted, components may fall off the module during the second reflow process 300 Lead Free Soldering Per J-STD-020 Rev. D Peak Temp 260°C MSL Rating The modules have a MSL rating of 2a. Reflow Temp (°C) The modules are lead-free (Pb-free) and RoHS compliant and fully compatible in a Pb-free soldering process. Failure to observe the instructions below may result in the failure of or cause damage to the modules and can adversely affect long-term reliability 250 200 * Min. Time Above 235°C 15 Seconds Cooling Zone 150 Heating Zone 1°C/Second *Time Above 217°C 60 Seconds 100 50 0 Reflow Time (Seconds) Storage and Handling J-STD-033 Rev. A (Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices) is recommended. Moisture barrier bags (MBB) with desiccant are required for MSL ratings of 2 or greater. These sealed packages should not be broken until time of use. Once the original package is broken, the floor life of the product at conditions of  30°C and 60% relative humidity varies according to the MSL rating (see J-STD-033A). The shelf life for dry packed SMT packages will be a minimum of 12 months from the bag seal date, when stored at the following conditions: < 40° C, < 90% relative humidity. Post Solder Cleaning and Drying Considerations Post solder cleaning is usually the final circuit-board assembly process prior to electrical board testing. The result of inadequate cleaning and drying can affect both the reliability of a power module and the testability of the finished circuit-board assembly Contact Us For more information, call us at USA/Canada: +1 888 546 3243, or +1 972 244 9288 Asia-Pacific: +86-21-53899666 Europe, Middle-East and Africa: +49.89.878067-280 Go.ABB/Industrial GE Critical Power reserves the right to make changes to the product(s) or information contained herein without notice, and no liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or information. May 13, 2021 ©2017 General Electric Company. All International rights reserved. Version 1.4