IND108XW

IND108XW Hornet: Non-Isolated DC-DC Voltage Regulator Modules 24Vdc input; 3Vdc to 18Vdc output; 108W Max Power Vout+ Vin+ VIN SYNC MODULE Applications ✓ ✓ ✓ VOUT SENSE Cin Industrial Equipment Control Boards Test Equipment Co ON/OFF GND Electrical Features Mechanical Features • • • 24V Input voltage with ±20% Tolerance Output voltage programmable from 3Vdc to 18Vdc via external resistor Remote On/Off for optional external control Fixed switching frequency Sync Capability Output overcurrent protection (non-latching) • • • • TRIM RTrim Small size: 33 mm x 13.46 mm x 10 mm (1.3 in x 0.53 in x 0.39 in) Operating range: -40°C to 105°C ambient Operating shock to 40G per Mil Std. 810G, Method 516.4 Procedure I Operating vibration per Mil Std. 810G, Method 514.5 Procedure I • • • Process and Safety • • Qualified for 1000h High Temperature Operating Bias, 1000h 85RH/85°C Temperature, Humidity and Bias, 700 cycle -40 to 125°C thermal cycling ANSI/UL* 62368-1 and CAN/CSA† C22.2 No. 62368-1 Recognized, DIN VDE‡ 0868-1/A11:2017 (EN62368-1:2014/A11:2017) ISO** 9001 and ISO 14001 certified manufacturing facilities Compliant to RoHS Directive 2011/65/EU and amended Directive (EU) 2015/863 Compliant to REACH Directive (EC) No 1907/2006 Compatible in a Pb-free or SnPb reflow environment. Suitable for aqueous clean. Suitable for conformal coating with dip and vapor deposition. Conformal coating can provide the protection to meet Salt Fog Test per IEC 60068-2-52 (Severity 3) and Mixed Gas Flow test per Telcordia GR-3108 Outdoor Levels. 3 year warranty • • • • • • • • Device Code Input Voltage Output Voltage Output Current (Max.) On/Off Logic Comcode IND108XW 19.2 – 28.8Vdc 3.0 – 18.0Vdc 12A(@3Vout) Negative 1600102907A Thermal Performance Full rated output with natural convection up to 70°C at 3.3Vout and up to 94°C at 18Vout.. Thermal curves for 3 voltages below. 13 13 11 11 7 6 18 Vout 5 5 Vout 9 7 Current (A) vs. Temp ( C) 4 7 NC 0.5m/s (100LFM) 28Vin 1m/s (200LFM) 5 Current (A) vs. Temp ( C) 9 3.3 Vout Current (A) vs. Temp ( C) 5 3 NC 0.5m/s (100LFM) 1m/s (200LFM) 1 3 3 55 65 May 13, 2021 75 85 95 105 NC 0.5m/s (100LFM) 2 1m/s (200LFM) 2m/s(400LFM) 2m/s(400LFM) Ruggedized (D) Part (105°C) 55 65 75 85 95 ©2017 General Electric Company. All rights reserved. 105 55 65 75 85 95 105 Page 1 Electrical Specifications Parameter Operating Input Voltage Input No Load Current (VIN = 28.0Vdc, IO = 0, module enabled) External Capacitance, Ceramic ESR ≥ 1 mΩ Device Symbol Min Typ Max Unit All VIN 19.2 24 28.8 Vdc VO,set = 3 Vdc IIN,No load 30 mA VO,set = 18Vdc IIN,No load 50 mA All ⎯ CO, max Efficiency 28VINDC, TA=25°C, Io as per Figure 2 η 100* μF 94(12V), 95.5(18V) % Switching Frequency All fsw ⎯ 308 ⎯ kHz Output Voltage (Over all line, load, and temperature conditions) All VO, set -2.5 ⎯ +2.5 % VO, set On/Off Logic High (MODULE OFF) Input High Voltage All VIH 1.8 ⎯ 36 Vdc On/ Off Logic Low (MODULE ON) Input Low Voltage All VIL -0.2 ― 0.3 Vdc *Additional External Capacitance possible using Tunable Loop Characteristic Curves The following figures provide typical characteristics for the IND108XW Hornet at 25oC. Output Ripple (m Vp-p) 80 3x22uF 70 4x22uF 60 50 40 30 20 10 0 2 4 6 8 10 12 14 16 18 Output Voltage(Volts) Figure 1. Output Ripple Voltage for various output voltages and external caps @28Vin. Additional Decoupling cap of 0.01uF used on input and output side Figure 2. Graph showing maximum output current capability at different output voltages. Use electrical profile in Figure 2 for determining baseline output current for a specific voltage. Then thermal curves. Trim Rtrim for a desired output voltage, should be as per the following table. The formula in the last column helps determine Rtrim for other voltages. Vo (V) 3.3 5.0 6 9 12 15 18 Rtrim (kΩ) 26.92 16.27 13.2 8.43 6.19 4.89 4.04  70  Rtrim =   k  (Vo − 0.7 ) Safety Considerations For safety agency approval, the power module must be installed in compliance with the spacing and separation requirements of the end-use safety agency standards listed on the first page of this document. For the converter output to be considered meeting the requirements of safety extra-low voltage (SELV) or ES1, the input must meet SELV/ES1 requirements. The power module has extra-low voltage (ELV) outputs when all inputs are ELV. The input to these units is to be provided with a fast-acting fuse with a maximum rating of 8A in the positive input lead. May 13, 2021 ©2017 General Electric Company. All rights reserved. Page 2 Tunable Loop The module is designed for 47uF capacitor on its output. For applications where more than 47uF capacitors would be used on the output, an additional Resistor (Rtune) and Capacitor (Ctune) would be required in the circuit schematic to compensate for the additional capacitance. The placement is between the Sense+ pin and Trim pin as per figure below: The recommended values for Rtune and Ctune for different amounts of external capacitance are as per the table below: Vo = 5V Co RTUNE Figure. 3. Circuit diagram showing connection of RTUNE and CTUNE to tune the control loop of the module CTUNE 5x 6x 22F 22F 8x 22F 10 x 22F 300Ω 240Ω 240Ω RTUNE 300Ω 300Ω 300Ω 220Ω 3.9nF CTUNE 560pF 820pF 1200pF 1800pF 300Ω 1800pF 2200pF 3300pF Vo = 12V Co 5x 6x 8x 10 x 22F 22F 22F 22F Synchronization (SYNC) MODULE SYNC + ─ GND Figure 4. External source connections to synchronize switching frequency of the module. The regulator switching frequency can be synchronized to a signal with an external frequency within a specified range. Synchronization can be done by using the external signal applied to the SYNC pin of the module as shown in Fig. 4, with the converter being synchronized by the rising edge of the external signal. The Electrical Specifications table specifies the requirements of the external SYNC signal. If the SYNC pin is not used, the module should free run at the default switching frequency. If synchronization is not being used, connect the SYNC pin to GND. Recommended Pad Layout Dimensions are in millimeters and (inches). Tolerances: x.x mm  0.5 mm (x.xx in.  0.02 in.) [unless otherwise indicated] x.xx mm  0.25 mm (x.xxx in  0.010 in.) Connect SYNC to GND if not being used May 13, 2021 ©2017 General Electric Company. All rights reserved. Page 3 Nozzle Recommendations 300 Per J-STD-020 Rev. D Bottom Side / First Side Assembly This module is not recommended for assembly on the bottom side of a customer board. If such an assembly is attempted, components may fall off the module during the second reflow process Lead Free Soldering Peak Temp 260°C 250 Reflow Temp (°C) The minimum recommended inside nozzle diameter for reliable operation is 3mm. The maximum nozzle outer diameter, which will safely fit within the allowable component spacing, is 7 mm. 200 * Min. Time Above 235°C 15 Seconds Cooling Zone 150 Heating Zone 1°C/Second *Time Above 217°C 60 Seconds 100 50 0 The modules are lead-free (Pb-free) and RoHS compliant and fully compatible in a Pb-free soldering process. Failure to observe the instructions below may result in the failure of or cause damage to the modules and can adversely affect long-term reliability MSL Rating The modules have a MSL rating of 2a. Pb-free Reflow Profile Power Systems will comply with J-STD-020 Rev. D (Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices) for both Pb-free solder profiles and MSL classification procedures. The suggested Pb-free solder paste is Sn/Ag/Cu (SAC). The following profile is the recommended linear reflow profile using Sn/Ag/Cu solder. Soldering outside of the recommended profile requires testing to verify results and performance. Reflow Time (Seconds) Storage and Handling J-STD-033 Rev. A (Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices) is recommended. Moisture barrier bags (MBB) with desiccant are required for MSL ratings of 2 or greater. These sealed packages should not be broken until time of use. Once the original package is broken, the floor life of the product at conditions of  30°C and 60% relative humidity varies according to the MSL rating (see J-STD-033A). The shelf life for dry packed SMT packages will be a minimum of 12 months from the bag seal date, when stored at the following conditions: < 40° C, < 90% relative humidity. Post Solder Cleaning and Drying Considerations Post solder cleaning is usually the final circuit-board assembly process prior to electrical board testing. The result of inadequate cleaning and drying can affect both the reliability of a power module and the testability of the finished circuit-board assembly Contact Us For more information, call us at USA/Canada: +1 888 546 3243, or +1 972 244 9288 Asia-Pacific: +86-21-53899666 Europe, Middle-East and Africa: +49.89.878067-280 Go.ABB/Industrial GE Critical Power reserves the right to make changes to the product(s) or information contained herein without notice, and no liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or information. May 13, 2021 ©2017 General Electric Company. All International rights reserved. Version 1.4