GE
Data Sheet
20A Analog MicroDLynxTM: Non-Isolated DC-DC Power Modules
3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 20A Output Current
Features
RoHS Compliant
Applications
▪
Distributed power architectures
▪
Intermediate bus voltage applications
▪
Telecommunications equipment
▪
Servers and storage applications
▪
Networking equipment
▪
Industrial equipment
Vin+
VIN
PGOOD
Compliant to RoHS EU Directive 2011/65/EU (Z versions)
▪
Compliant to RoHS EU Directive 2011/65/EU under
exemption 7b (Lead solder exemption). Exemption 7b will
expire after June 1, 2016 at which time this produc twill
no longer be RoHS compliant (non-Z versions)
▪
Compliant to IPC-9592 (September 2008), Category 2,
Class II
▪
DOSA based
▪
Wide Input voltage range (3Vdc-14.4Vdc)
▪
Output voltage programmable from 0.6Vdc to 5.5Vdc via
external resistor
▪
Tunable LoopTM to optimize dynamic output voltage
response
▪
Flexible output voltage sequencing EZ-SEQUENCE
▪
Power Good signal
▪
Fixed switching frequency with capability of external
synchronization
▪
Output over current protection (non-latching)
▪
Over temperature protection
▪
Remote On/Off
▪
Ability to sink and source current
▪
Cost efficient open frame design
▪
Small size: 20.32 mm x 11.43 mm x 8.5 mm (0.8 in x 0.45 in
x 0.334 in)
▪
Wide operating temperature range [-40°C to 105°C
(Ruggedized: -D), 85°C(Regular)]
Vout+
VOUT
VS+
MODULE
▪
RTUNE
▪
SEQ
CTUNE
TRIM
Cin
Co
RTrim
▪
UL* 60950-1 2nd Ed. Recognized, CSA† C22.2 No. 60950-107 Certified, and VDE‡ (EN60950-1 2nd Ed.) Licensed
ISO** 9001 and ISO 14001 certified manufacturing
facilities
ON/OFF
GND
SIG_GND
SYNC GND VS-
Description
The 20A Analog MicroDLynxTM power modules are non-isolated dc-dc converters that can deliver up to 20A of output current.
These modules operate over a wide range of input voltage (V IN = 3Vdc-14.4Vdc) and provide a precisely regulated output voltage
from 0.6Vdc to 5.5Vdc, programmable via an external resistor. Features include remote On/Off, adjustable output voltage, over
current and over temperature protection. The module also includes the Tunable Loop TM feature that allows the user to optimize the
dynamic response of the converter to match the load with reduced amount of output capacitance leading to savings on cost and
PWB area.
* UL is a registered trademark of Underwriters Laboratories, Inc.
†
CSA is a registered trademark of Canadian Standards Association.
VDE is a trademark of Verband Deutscher Elektrotechniker e.V.
** ISO is a registered trademark of the International Organization of Standards
‡
July 23, 2019
©2017 General Electric Company. All rights reserved.
Page 1
GE
Data Sheet
20A Analog MicroDLynxTM: Non-Isolated DC-DC Power Modules
3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 20A Output Current
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings
only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations
sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliability.
Parameter
Input Voltage
Device
Symbol
Min
Max
Unit
All
VIN
-0.3
15
V
Continuous
SEQ, SYNC, VS+
All
7
V
Operating Ambient Temperature
All
TA
-40
85
°C
All
Tstg
-55
125
°C
(see Thermal Considerations section)
Storage Temperature
Electrical Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions.
Parameter
Device
Symbol
Min
Typ
Max
Unit
Operating Input Voltage
All
VIN
3
⎯
14.4
Vdc
Maximum Input Current
All
IIN,max
19
Adc
(VIN=3V to 14V, IO=IO, max )
VO,set = 0.6
Vdc
VO,set =
5Vdc
Input No Load Current
(VIN = 12Vdc, IO = 0, module enabled)
Input Stand-by Current
(VIN = 12Vdc, module disabled)
Inrush Transient
Input Reflected Ripple Current, peak-to-peak
(5Hz to 20MHz, 1μH source impedance; VIN =0 to 14V, IO= IOmax ;
See Test Configurations)
Input Ripple Rejection (120Hz)
July 23, 2019
IIN,No load
69
mA
IIN,No load
134
mA
All
IIN,stand-by
16.4
mA
All
I2t
1
A2s
All
50
mAp-p
All
-64
dB
©2017 General Electric Company. All rights reserved.
Page 2
GE
Data Sheet
20A Analog MicroDLynxTM: Non-Isolated DC-DC Power Modules
3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 20A Output Current
Electrical Specifications (continued)
Parameter
Output Voltage Set-point (with 0.1% tolerance for external
resistor used to set output voltage)
Output Voltage (Over all operating input voltage, resistive
load, and temperature conditions until end of life)
Adjustment Range (selected by an external resistor)
(Some output voltages may not be possible depending on the
input voltage – see Feature Descriptions Section)
Remote Sense Range
Device
Symbol
Min
All
VO, set
-1.0
All
VO, set
-3.0
All
VO
0.6
Typ
⎯
All
Max
Unit
+1.0
% VO, set
+3.0
% VO, set
5.5
Vdc
0.5
Vdc
Output Regulation (for VO ≥ 2.5Vdc)
Line (VIN=VIN, min to VIN, max)
All
⎯
+0.4
% VO, set
Load (IO=IO, min to IO, max)
All
⎯
10
mV
Line (VIN=VIN, min to VIN, max)
All
⎯
5
mV
Load (IO=IO, min to IO, max)
All
⎯
10
mV
Temperature (Tref=TA, min to TA, max)
All
⎯
0.4
% VO, set
50
100
mVpk-pk
20
38
mVrms
Output Regulation (for VO < 2.5Vdc)
Output Ripple and Noise on nominal output
(VIN=VIN, nom and IO=IO, min to IO, max Co = 0.1μF // 22 μF ceramic
capacitors)
Peak-to-Peak (5Hz to 20MHz bandwidth)
RMS (5Hz to 20MHz bandwidth)
⎯
All
All
External Capacitance1
Without the Tunable LoopTM
All
CO, max
2x47
⎯
2x47
μF
ESR ≥ 0.15 mΩ
All
CO, max
2x47
⎯
1000
μF
ESR ≥ 10 mΩ
⎯
10000
μF
20
Adc
ESR ≥ 1 mΩ
With the Tunable
LoopTM
All
CO, max
2x47
Output Current (in either sink or source mode)
Output Current Limit Inception (Hiccup Mode)
(current limit does not operate in sink mode)
All
Io
0
All
IO, lim
130
% Io,max
Output Short-Circuit Current
All
IO, s/c
1.4
Arms
VO,set = 0.6Vdc
η
79.2
%
VIN= 12Vdc, TA=25°C
VO, set = 1.2Vdc
η
87.1
%
IO=IO, max , VO= VO,set
VO,set = 1.8Vdc
η
90.4
%
VO,set = 2.5Vdc
η
92.6
%
VO,set = 3.3Vdc
η
93.8
%
(VO≤250mV) ( Hiccup Mode )
Efficiency
Switching Frequency
VO,set = 5.0Vdc
η
All
fsw
95.2
⎯
500
%
⎯
kHz
1 External
capacitors may require using the new Tunable LoopTM feature to ensure that the module is stable as well as getting the best
transient response. See the Tunable LoopTM section for details.
July 23, 2019
©2017 General Electric Company. All rights reserved.
Page 3
GE
Data Sheet
20A Analog MicroDLynxTM: Non-Isolated DC-DC Power Modules
3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 20A Output Current
Electrical Specifications (continued)
Parameter
Device
Frequency Synchronization
Symbol
Min
Typ
Max
Unit
600
kHz
All
Synchronization Frequency Range
All
425
High-Level Input Voltage
All
VIH
Low-Level Input Voltage
All
VIL
Input Current, SYNC
All
ISYNC
Minimum Pulse Width, SYNC
All
tSYNC
100
ns
Maximum SYNC rise time
All
tSYNC_SH
100
ns
2.0
V
0.4
V
100
nA
General Specifications
Parameter
Calculated MTBF (IO=0.8IO, max, TA=40°C) Telecordia Issue 2
Method 1 Case 3
Device
Min
All
⎯
Weight
Typ
15,45
5,614
4.54
(0.16)
Max
Unit
Hours
⎯
g (oz.)
Feature Specifications
Unless otherwise indicated, specifications apply overall operating input voltage, resistive load, and temperature conditions. See
Feature Descriptions for additional information.
Parameter
Device
Symbol
Min
Typ
Max
Unit
On/Off Signal Interface
(VIN=VIN, min to VIN, max ; open collector or equivalent,
Signal referenced to GND)
Device code with suffix “4” – Positive Logic (See Ordering
Information)
Logic High (Module ON)
Input High Current
All
IIH
⎯
1
mA
Input High Voltage
All
VIH
2
⎯
VIN,max
V
All
IIL
⎯
⎯
1
mA
All
VIL
-0.2
⎯
0.6
V
Input High Current
All
IIH
―
―
1
mA
Input High Voltage
All
VIH
2
―
VIN, max
Vdc
Input low Current
All
IIL
―
―
10
μA
Input Low Voltage
All
VIL
-0.2
―
0.6
Vdc
Logic Low (Module OFF)
Input Low Current
Input Low Voltage
Device Code with no suffix – Negative Logic (See Ordering
Information)
(On/OFF pin is open collector/drain logic input with
external pull-up resistor; signal referenced to GND)
Logic High (Module OFF)
Logic Low (Module ON)
July 23, 2019
©2017 General Electric Company. All rights reserved.
Page 4
GE
Data Sheet
20A Analog MicroDLynxTM: Non-Isolated DC-DC Power Modules
3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 20A Output Current
Feature Specifications (cont.)
Parameter
Device
Symbol
Min
Typ
Max
Units
All
Tdelay
―
1.2
―
msec
All
Tdelay
―
0.8
―
msec
All
Trise
―
2.7
―
msec
3.0
% VO, set
Turn-On Delay and Rise Times
(VIN=VIN, nom, IO=IO, max , VO to within ±1% of steady state)
Case 1: On/Off input is enabled and then input power is
applied (delay from instant at which VIN = VIN, min until Vo =
10% of Vo, set)
Case 2: Input power is applied for at least one second and
then the On/Off input is enabled (delay from instant at
which Von/Off is enabled until Vo = 10% of Vo, set)
Output voltage Rise time (time for Vo to rise from
10% of Vo, set to 90% of Vo, set)
Output voltage overshoot (TA = 25oC
VIN= VIN, min to VIN, max,IO = IO, min to IO, max)
With or without maximum external capacitance
Over Temperature Protection
(See Thermal Considerations section)
Tracking Accuracy
(Power-Up: 2V/ms)
(Power-Down: 2V/ms)
All
Tref
120
°C
All
VSEQ –Vo
100
mV
All
VSEQ –Vo
100
mV
3.25
Vdc
(VIN, min to VIN, max; IO, min to IO, max VSEQ < Vo)
Input Undervoltage Lockout
Turn-on Threshold
All
Turn-off Threshold
All
Hysteresis
All
Resolution of Adjustable Input Under Voltage Threshold
All
2.6
Vdc
0.25
Vdc
500
mV
PGOOD (Power Good)
Signal Interface Open Drain, Vsupply 5VDC
Overvoltage threshold for PGOOD ON
All
108
%VO, set
Overvoltage threshold for PGOOD OFF
All
110
%VO, set
Undervoltage threshold for PGOOD ON
All
92
%VO, set
Undervoltage threshold for PGOOD OFF
All
90
Pulldown resistance of PGOOD pin
All
50
Sink current capability into PGOOD pin
All
5
mA
%VO, set
* Over temperature Warning – Warning may not activate before alarm and unit may shutdown before warning
July 23, 2019
©2017 General Electric Company. All rights reserved.
Page 5
GE
Data Sheet
20A Analog MicroDLynxTM: Non-Isolated DC-DC Power Modules
3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 20A Output Current
Characteristic Curves
The following figures provide typical characteristics for the 20A Analog MicroDLynxTM at 0.6Vo and 25oC.
90
22
85
18
OUTPUT CURRENT, Io (A)
EFFICIENCY, (%)
80
Vin=3.3V
75
70
Vin=14V
Vin=12V
65
60
55
50
NC
1m/s
10
(200LFM)
6
1.5m/s
(300LFM)
5
10
15
20
55
OUTPUT CURRENT, IO (A)
65
OUTPUT VOLTAGE
VO (V) (10mV/div)
IO (A) (10Adiv)
INPUT VOLTAGE
VIN (V) (5V/div)
VO (V) (200mV/div)
VON/OFF (V) (5V/div)
105
Figure 4. Transient Response to Dynamic Load Change from
50% to 100% at 12Vin, Cout= 1x47uF +11x330uF CTune=47nF,
RTune=178 ohms
OUTPUT VOLTAGE
ON/OFF VOLTAGE
95
TIME, t (20s /div)
Figure 3. Typical output ripple and noise (CO=2x47μF
ceramic, VIN = 12V, Io = Io,max, ).
VO (V) (200mV/div)
85
Figure 2. Derating Output Current versus Ambient
Temperature and Airflow.
TIME, t (1s/div)
TIME, t (2ms/div)
TIME, t (2ms/div)
Figure 5. Typical Start-up Using On/Off Voltage (Io = Io,max).
July 23, 2019
75
AMBIENT TEMPERATURE, TA OC
OUTPUT CURRENT,
VO (V) (10mV/div)
Figure 1. Converter Efficiency versus Output Current.
OUTPUT VOLTAGE
2m/s
(400LFM)
2
0
OUTPUT VOLTAGE
0.5m/s
(100LFM)
14
Figure 6. Typical Start-up Using Input Voltage (VIN = 12V, Io =
Io,max).
©2017 General Electric Company. All rights reserved.
Page 6
GE
Data Sheet
20A Analog MicroDLynxTM: Non-Isolated DC-DC Power Modules
3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 20A Output Current
Characteristic Curves
The following figures provide typical characteristics for the 20A Analogl MicroDLynxTM at 1.2Vo and 25oC.
22
95
90
85
18
EFFICIENCY, (%)
80
OUTPUT CURRENT, Io (A)
Vin=3.3V
Vin=14V
75
Vin=12V
70
65
60
55
50
14
0.5m/s
(100LFM)
10
1.5m/s
(300LFM)
6
5
10
15
20
1m/s
(200LFM)
55
OUTPUT CURRENT, IO (A)
65
OUTPUT VOLTAGE
VO (V) (20mV/div)
IO (A) (10Adiv)
INPUT VOLTAGE
VIN (V) (5V/div)
VO (V) (500mV/div)
VON/OFF (V) (5V/div)
105
Figure 10. Transient Response to Dynamic Load Change from
50% to 100% at 12Vin, Cout= 1x47uF +5x330uF, CTune=10nF
& RTune=178 ohms
OUTPUT VOLTAGE
ON/OFF VOLTAGE
95
TIME, t (20s /div)
Figure 9. Typical output ripple and noise (CO=2x47μF
ceramic, VIN = 12V, Io = Io,max, ).
VO (V) (500mV/div)
85
Figure 8. Derating Output Current versus Ambient
Temperature and Airflow.
TIME, t (1s/div)
TIME, t (2ms/div)
TIME, t (2ms/div)
Figure 1. Typical Start-up Using On/Off Voltage (Io = Io,max).
July 23, 2019
75
AMBIENT TEMPERATURE, TA OC
OUTPUT CURRENT,
VO (V) (20mV/div)
Figure 7. Converter Efficiency versus Output Current.
OUTPUT VOLTAGE
2m/s
(400LFM)
2
0
OUTPUT VOLTAGE
NC
Figure 12. Typical Start-up Using Input Voltage (VIN = 12V, Io =
Io,max).
©2017 General Electric Company. All rights reserved.
Page 7
GE
Data Sheet
20A Analog MicroDLynxTM: Non-Isolated DC-DC Power Modules
3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 20A Output Current
Characteristic Curves
The following figures provide typical characteristics for the 20A Analog MicroDLynxTM at 1.8Vo and 25oC.
95
22
18
90
85
OUTPUT CURRENT, Io (A)
EFFICIENCY, (%)
Vin=3.3V
Vin=14V
Vin=12V
80
75
0.5m/s
(100LFM)
10
0
5
10
15
20
1.5m/s
(300LFM)
6
2m/s
(400LFM)
55
OUTPUT CURRENT, IO (A)
65
OUTPUT VOLTAGE
VO (V) (20mV/div)
IO (A) (10Adiv)
INPUT VOLTAGE
VIN (V) (5V/div)
VO (V) (500mV/div)
VON/OFF (V) (5V/div)
105
Figure 16. Transient Response to Dynamic Load Change from
50% to 100% at 12Vin, Cout= 2x47uF +3x330uF,
CTune=5600pF & RTune=220 ohms
OUTPUT VOLTAGE
ON/OFF VOLTAGE
95
T A OC
TIME, t (20s /div)
Figure 15. Typical output ripple and noise (CO=2X47μF
ceramic, VIN = 12V, Io = Io,max, ).
VO (V) (500mV/div)
85
Figure 14. Derating Output Current versus Ambient
Temperature and Airflow.
TIME, t (1s/div)
TIME, t (2ms/div)
TIME, t (2ms/div)
Figure 17. Typical Start-up Using On/Off Voltage (Io = Io,max).
July 23, 2019
75
AMBIENT TEMPERATURE,
OUTPUT CURRENT,
VO (V) (20mV/div)
Figure 13. Converter Efficiency versus Output Current.
OUTPUT VOLTAGE
1m/s
(200LFM)
2
70
OUTPUT VOLTAGE
NC
14
Figure 18. Typical Start-up Using Input Voltage (VIN = 12V, Io =
Io,max).
©2017 General Electric Company. All rights reserved.
Page 8
GE
Data Sheet
20A Analog MicroDLynxTM: Non-Isolated DC-DC Power Modules
3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 20A Output Current
Characteristic Curves
The following figures provide typical characteristics for the 20A Analog MicroDLynxTM at 2.5Vo and 25oC.
100
22
Vin=12V
95
OUTPUT CURRENT, Io (A)
18
EFFICIENCY, (%)
90
Vin=4.5V
85
Vin=14V
80
75
0
5
10
15
20
10
1.5m/s
(300LFM)
6
2m/s
(400LFM)
55
OUTPUT CURRENT, IO (A)
65
OUTPUT VOLTAGE
VO (V) (20mV/div)
IO (A) (10Adiv)
INPUT VOLTAGE
VIN (V) (5V/div)
VO (V) (1V/div)
VON/OFF (V) (5V/div)
105
Figure 22. Transient Response to Dynamic Load Change from
50% to 100% at 12Vin, Cout= 2x47uF +2x330uF,
CTune=3300pF & RTune=220 ohms
OUTPUT VOLTAGE
ON/OFF VOLTAGE
95
T A OC
TIME, t (20s /div)
Figure 21. Typical output ripple and noise (CO=2x47μF
ceramic, VIN = 12V, Io = Io,max, ).
VO (V) (1V/div)
85
Figure 20. Derating Output Current versus Ambient
Temperature and Airflow.
TIME, t (1s/div)
TIME, t (2ms/div)
TIME, t (2ms/div)
Figure 23. Typical Start-up Using On/Off Voltage (Io = Io,max).
July 23, 2019
75
AMBIENT TEMPERATURE,
OUTPUT CURRENT,
VO (V) (20mV/div)
Figure 19. Converter Efficiency versus Output Current.
OUTPUT VOLTAGE
0.5m/s
(100LFM)
1m/s
(200LFM)
2
70
OUTPUT VOLTAGE
NC
14
Figure 24. Typical Start-up Using Input Voltage (VIN = 12V, Io =
Io,max).
©2017 General Electric Company. All rights reserved.
Page 9
GE
Data Sheet
20A Analog MicroDLynxTM: Non-Isolated DC-DC Power Modules
3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 20A Output Current
Characteristic Curves
The following figures provide typical characteristics for the 20A Analog MicroDLynxTM at 3.3Vo and 25oC.
100
22
Vin=12V
95
OUTPUT CURRENT, Io (A)
18
EFFICIENCY, (%)
90
Vin=14V
85
Vin=4.5V
80
75
70
0.5m/s
(100LFM)
1m/s
(200LFM)
1.5m/s
(300LFM)
14
10
6
2m/s
(400LFM)
2
0
5
10
15
20
55
OUTPUT CURRENT, IO (A)
65
75
85
95
AMBIENT TEMPERATURE, TA OC
OUTPUT VOLTAGE
VO (V) (50mV/div)
IO (A) (10Adiv)
TIME, t (1s/div)
TIME, t (20s /div)
INPUT VOLTAGE
VIN (V) (5V/div)
VO (V) (1V/div)
VON/OFF (V) (5V/div)
VO (V) (1V/div)
Figure 28 Transient Response to Dynamic Load Change from
50% to 100% at 12Vin, Cout= 5x47uF +1x330uF,
CTune=2200pF & RTune=220 ohms
OUTPUT VOLTAGE
ON/OFF VOLTAGE
OUTPUT VOLTAGE
Figure 27. Typical output ripple and noise (CO=2x47μF
ceramic, VIN = 12V, Io = Io,max, ).
TIME, t (2ms/div)
TIME, t (2ms/div)
Figure 29. Typical Start-up Using On/Off Voltage (Io = Io,max).
July 23, 2019
105
Figure 26. Derating Output Current versus Ambient
Temperature and Airflow.
OUTPUT CURRENT,
VO (V) (50mV/div)
Figure 25. Converter Efficiency versus Output Current.
OUTPUT VOLTAGE
NC
Figure 30. Typical Start-up Using Input Voltage (VIN = 12V, Io =
Io,max).
©2017 General Electric Company. All rights reserved.
Page 10
GE
Data Sheet
20A Analog MicroDLynxTM: Non-Isolated DC-DC Power Modules
3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 20A Output Current
Characteristic Curves
The following figures provide typical characteristics for the 20A Analog MicroDLynxTM at 5Vo and 25oC.
100
22
Vin=12V
95
OUTPUT CURRENT, Io (A)
18
EFFICIENCY, (%)
90
Vin=7V
Vin=14V
85
80
75
0.5m/s
(100LFM) 1m/s
(200LFM)
1.5m/s
(300LFM)
14
10
2m/s
(400LFM)
6
2
70
0
5
10
15
20
55
OUTPUT CURRENT, IO (A)
65
105
OUTPUT VOLTAGE
VO (V) (50mV/div)
IO (A) (10Adiv)
INPUT VOLTAGE
VIN (V) (5V/div)
VO (V) (2V/div)
Figure 34. Transient Response to Dynamic Load Change from
50% to 100% at 12Vin, Cout= 8x47uF, CTune=1500pF &
RTune=220 ohms
OUTPUT VOLTAGE
ON/OFF VOLTAGE
VON/OFF (V) (5V/div)
VO (V) (2V/div)
95
T A OC
TIME, t (20s /div)
Figure 33. Typical output ripple and noise (CO=2x47μF
ceramic, VIN = 12V, Io = Io,max, ).
OUTPUT VOLTAGE
85
Figure 32. Derating Output Current versus Ambient
Temperature and Airflow.
TIME, t (1s/div)
TIME, t (2ms/div)
TIME, t (2ms/div)
Figure 35. Typical Start-up Using On/Off Voltage (Io = Io,max).
July 23, 2019
75
AMBIENT TEMPERATURE,
OUTPUT CURRENT,
VO (V) (50mV/div)
Figure 31. Converter Efficiency versus Output Current.
OUTPUT VOLTAGE
NC
Figure 36. Typical Start-up Using Input Voltage (VIN = 12V, Io =
Io,max).
©2017 General Electric Company. All rights reserved.
Page 11
GE
Data Sheet
20A Analog MicroDLynxTM: Non-Isolated DC-DC Power Modules
3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 20A Output Current
70
Input Filtering
60
The 20A Analog MicroDLynxTM module should be
connected to a low ac-impedance source. A highly
inductive source can affect the stability of the module. An
input capacitance must be placed directly adjacent to the
input pin of the module, to minimize input ripple voltage
and ensure module stability.
To minimize input voltage ripple, ceramic capacitors are
recommended at the input of the module. Figure 37 shows
the input ripple voltage for various output voltages at 20A
of load current with 2x22 µF or 3x22 µF ceramic capacitors
and an input of 12V.
50
Ripple (mVp-p)
Design Considerations
2x47uF Ext Cap
4x47uF Ext Cap
6x47uF Ext Cap
8x47uF Ext Cap
40
30
20
10
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
Output Voltage(Volts)
Input Ripple Voltage (mVp-p)
450
400
Figure 38. Output ripple voltage for various output
voltages with external 2x47 µF, 4x47 µF or 6x47 µF
ceramic capacitors at the output (20A load). Input voltage
is 12V.
2x22uF
350
3x22 uF
300
250
200
Safety Considerations
150
100
50
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
Output Voltage (Vdc)
Figure 37. Input ripple voltage for various output
voltages with 2x22 µF or 3x22 µF ceramic capacitors at
the input (20A load). Input voltage is 12V.
Output Filtering
These modules are designed for low output ripple voltage
and will meet the maximum output ripple specification with
0.1 µF ceramic and 2x47 µF ceramic capacitors at the output
of the module. However, additional output filtering may be
required by the system designer for a number of reasons.
First, there may be a need to further reduce the output ripple
and noise of the module. Second, the dynamic response
characteristics may need to be customized to a particular
load step change.
For safety agency approval the power module must be
installed in compliance with the spacing and separation
requirements of the end-use safety agency standards, i.e.,
UL 60950-1 2nd, CSA C22.2 No. 60950-1-07, DIN EN 609501:2006 + A11 (VDE0805 Teil 1 + A11):2009-11; EN 609501:2006 + A11:2009-03.
For the converter output to be considered meeting the
requirements of safety extra-low voltage (SELV), the input
must meet SELV requirements. The power module has
extra-low voltage (ELV) outputs when all inputs are ELV.
The UVT040A0X series were tested using an external
Littelfuse 456 series fast-acting fuse rated at 30 A, 100 Vdc
in the ungrounded input.
To reduce the output ripple and improve the dynamic
response to a step load change, additional capacitance at
the output can be used. Low ESR polymer and ceramic
capacitors are recommended to improve the dynamic
response of the module. Figure 38 provides output ripple
information for different external capacitance values at
various Vo and a full load current of 20A. For stable
operation of the module, limit the capacitance to less than
the maximum output capacitance as specified in the
electrical specification table. Optimal performance of the
module can be achieved by using the Tunable LoopTM feature
described later in this data sheet.
July 23, 2019
©2017 General Electric Company. All rights reserved.
Page 12
GE
Data Sheet
20A Analog MicroDLynxTM: Non-Isolated DC-DC Power Modules
3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 20A Output Current
Analog Feature Descriptions
Remote On/Off
Monotonic Start-up and Shutdown
The 20A Analog MicroDLynxTM power modules feature an
On/Off pin for remote On/Off operation. Two On/Off logic
options are available. In the Positive Logic On/Off option,
(device code suffix “4” – see Ordering Information), the
module turns ON during a logic High on the On/Off pin and
turns OFF during a logic Low. With the Negative Logic On/Off
option, (no device code suffix, see Ordering Information), the
module turns OFF during logic High and ON during logic Low.
The On/Off signal should be always referenced to ground. For
either On/Off logic option, leaving the On/Off pin
disconnected will turn the module ON when input voltage is
present.
The module has monotonic start-up and shutdown behavior
for any combination of rated input voltage, output current
and operating temperature range.
For negative logic On/Off modules, the circuit configuration is
shown in Fig. 40. The On/Off pin should be pulled high with an
external pull-up resistor (suggested value for the 3V to 14V
input range is 20Kohms). When transistor Q2 is in the OFF
state, the On/Off pin is pulled high, transistor Q3 is turned ON.
This turns Q6 ON, followed by Q5 turning ON which pulls the
internal ENABLE low and the module is OFF. To turn the
module ON, Q2 is turned ON pulling the On/Off pin low,
turning transistor Q3 OFF, which keeps Q6 and Q5 OFF
resulting in the PWM Enable pin going high.
Analog Output Voltage Programming
The output voltage of the module is programmable to any
voltage from 0.6dc to 5.5Vdc by connecting a resistor
between the Trim and SIG_GND pins of the module. Certain
restrictions apply on the output voltage set point depending
on the input voltage. These are shown in the Output Voltage
vs. Input Voltage Set Point Area plot in Fig. 41. The Upper
Limit curve shows that for output voltages lower than 1V,
the input voltage must be lower than the maximum of
14.4V. The Lower Limit curve shows that for output voltages
higher than 0.6V, the input voltage needs to be larger than
the minimum of 3V. .
16
14
12
Upper
10
8
6
4
Lower
2
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
6
Output Voltage (V)
3.3V
DLYNX MODULE
+VIN
The module can start into a prebiased output as long as the
prebias voltage is 0.5V less than the set output voltage.
Input Voltage (v)
For positive logic modules, the circuit configuration for using
the On/Off pin is shown in Figure 39. When the external
transistor Q2 is in the OFF state, the internal transistor Q7 is
turned ON, which turn Q3 OFF which keeps Q6 OFF and Q5
OFF. This allows the internal PWM #Enable signal to be pulled
up by the internal 3.3V, thus turning the module ON. When
transistor Q2 is turned ON, the On/Off pin is pulled low, which
turns Q7 OFF which turns Q3, Q6 and Q5 ON and the internal
PWM #Enable signal is pulled low and the module is OFF. A
suggested value for Rpullup is 20k.
Startup into Pre-biased Output
ENABLE
VIN
47K
470
20K
Rpullup
100pF
20K
Figure 41. Output Voltage vs. Input Voltage Set Point Area
plot showing limits where the output voltage can be set
for different input voltages.
Q6
4.7K
I
ON/OFF
Q3
20K
100K
20K
2K
20K
Q2
Q5
20K
Q7
+
20K
20K
V
ON/OFF
_
GND
VIN(+)
Figure 39. Circuit configuration for using positive On/Off
logic.
DLYNX MODULE
VO(+)
VS+
ON/OFF
LOAD
TRIM
3.3V
+VIN
ENABLE
Rpullup
470
100pF
I
ON/OFF
20K
Q6
SIG_GND
4.7K
Q3
+
Q2
Q5
100K
_
20K
20K
Caution – Do not connect SIG_GND to GND elsewhere in the
layout
GND
Figure 40. Circuit configuration for using negative On/Off
logic.
July 23, 2019
VS─
20K
2K
V
ON/OFF
Rtrim
47K
Figure 42. Circuit configuration for programming output
voltage using an external resistor.
©2017 General Electric Company. All rights reserved.
Page 13
GE
Data Sheet
20A Analog MicroDLynxTM: Non-Isolated DC-DC Power Modules
3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 20A Output Current
Without an external resistor between Trim and SIG_GND pins,
the output of the module will be 0.6Vdc. To calculate the
value of the trim resistor, Rtrim for a desired output voltage,
should be as per the following equation:
Vo
Rmargin-down
MODULE
12
Rtrim =
k
(Vo − 0.6)
Q2
Trim
Rtrim is the external resistor in kΩ
Rmargin-up
Vo is the desired output voltage.
Rtrim
Table 1 provides Rtrim values required for some common
output voltages.
Q1
SIG_GND
Table 1
VO, set (V)
0.6
0.9
1.0
1.2
1.5
1.8
2.5
3.3
5.0
Rtrim (KΩ)
Open
40
30
20
13.33
10
6.316
4.444
2.727
Figure 43. Circuit Configuration for margining Output
voltage.
Output Voltage Sequencing
The power module includes a sequencing feature, EZSEQUENCE that enables users to implement various types of
output voltage sequencing in their applications. This is
accomplished via an additional sequencing pin. When not
using the sequencing feature, leave it unconnected.
Remote Sense
The power module has a Remote Sense feature to minimize
the effects of distribution losses by regulating the voltage
between the sense pins (VS+ and VS-). The voltage drop
between the sense pins and the VOUT and GND pins of the
module should not exceed 0.5V.
Analog Voltage Margining
Output voltage margining can be implemented in the module
by connecting a resistor, Rmargin-up, from the Trim pin to the
ground pin for margining-up the output voltage and by
connecting a resistor, Rmargin-down, from the Trim pin to output
pin for margining-down. Figure 43 shows the circuit
configuration for output voltage margining. The POL
Programming Tool, available at www.GEpower.com under the
Downloads section, also calculates the values of Rmargin-up and
Rmargin-down for a specific output voltage and % margin. Please
consult your local GE technical representative for additional
details.
The voltage applied to the SEQ pin should be scaled down
by the same ratio as used to scale the output voltage down
to the reference voltage of the module. This is accomplished
by an external resistive divider connected across the
sequencing voltage before it is fed to the SEQ pin as shown
in Fig. 44. In addition, a small capacitor (suggested value
100pF) should be connected across the lower resistor R1.
For all DLynx modules, the minimum recommended delay
between the ON/OFF signal and the sequencing signal is
10ms to ensure that the module output is ramped up
according to the sequencing signal. This ensures that the
module soft-start routine is completed before the
sequencing signal is allowed to ramp up.
DLynx Module
V
SEQ
20K
SEQ
R1=Rtrim
100 pF
SIG_GND
Figure 44. Circuit showing connection of the sequencing
signal to the SEQ pin.
When the scaled down sequencing voltage is applied to the
SEQ pin, the output voltage tracks this voltage until the
output reaches the set-point voltage. The final value of the
sequencing voltage must be set higher than the set-point
voltage of the module. The output voltage follows the
sequencing voltage on a one-to-one basis. By connecting
July 23, 2019
©2017 General Electric Company. All rights reserved.
Page 14
GE
Data Sheet
20A Analog MicroDLynxTM: Non-Isolated DC-DC Power Modules
3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 20A Output Current
multiple modules together, multiple modules can track their
output voltages to the voltage applied on the SEQ pin.
To initiate simultaneous shutdown of the modules, the SEQ
pin voltage is lowered in a controlled manner. The output
voltage of the modules tracks the voltages below their setpoint voltages on a one-to-one basis. A valid input voltage
must be maintained until the tracking and output voltages
reach ground potential.
Overcurrent Protection
To provide protection in a fault (output overload) condition,
the unit is equipped with internal current-limiting circuitry
and can endure current limiting continuously. At the point of
current-limit inception, the unit enters hiccup mode. The unit
operates normally once the output current is brought back
into its specified range.
Synchronization
The module switching frequency can be synchronized to a
signal with an external frequency within a specified range.
Synchronization can be done by using the external signal
applied to the SYNC pin of the module as shown in Fig. 45,
with the converter being synchronized by the rising edge of
the external signal. The Electrical Specifications table
specifies the requirements of the external SYNC signal. If the
SYNC pin is not used, the module should free run at the
default switching frequency. If synchronization is not being
used, connect the SYNC pin to GND.
MODULE
SYNC
Overtemperature Protection
+
To provide protection in a fault condition, the unit is equipped
with a thermal shutdown circuit. The unit will shut down if the
overtemperature threshold of 120oC(typ) is exceeded at the
thermal reference point Tref .Once the unit goes into thermal
shutdown it will then wait to cool before attempting to
restart.
─
Input Undervoltage Lockout
At input voltages below the input undervoltage lockout limit,
the module operation is disabled. The module will begin to
operate at an input voltage above the undervoltage lockout
turn-on threshold.
GND
Figure 45. External source connections to synchronize
switching frequency of the module.
Dual Layout
Identical dimensions and pin layout of Analog and Digital
MicroDLynx modules permit migration from one to the other
without needing to change the layout. In both cases the trim
resistor is connected between trim and signal ground. The
output of the analog module cannot be trimmed down to
0.45V
Power Good
The module provides a Power Good (PGOOD) signal that is
implemented with an open-drain output to indicate that the
output voltage is within the regulation limits of the power
module. The PGOOD signal will be de-asserted to a low state
if any condition such as overtemperature, overcurrent or
loss of regulation occurs that would result in the output
voltage going ±10% outside the setpoint value. The PGOOD
terminal can be connected through a pullup resistor
(suggested value 100K) to a source of 5VDC or lower.
July 23, 2019
©2017 General Electric Company. All rights reserved.
Page 15
GE
Data Sheet
20A Analog MicroDLynxTM: Non-Isolated DC-DC Power Modules
3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 20A Output Current
Tunable LoopTM
The module has a feature that optimizes transient response
of the module called Tunable LoopTM.
External capacitors are usually added to the output of the
module for two reasons: to reduce output ripple and noise
(see Figure 38) and to reduce output voltage deviations from
the steady-state value in the presence of dynamic load
current changes. Adding external capacitance however
affects the voltage control loop of the module, typically
causing the loop to slow down with sluggish response.
Larger values of external capacitance could also cause the
module to become unstable.
The Tunable LoopTM allows the user to externally adjust the
voltage control loop to match the filter network connected to
the output of the module. The Tunable LoopTM is implemented
by connecting a series R-C between the VS+ and TRIM pins of
the module, as shown in Fig. 46. This R-C allows the user to
externally adjust the voltage loop feedback compensation of
the module.
different values of ceramic output capacitors up to 1000uF
that might be needed for an application to meet output ripple
and noise requirements. Selecting RTUNE and CTUNE according
to Table 3 will ensure stable operation of the module.
In applications with tight output voltage limits in the presence
of dynamic current loading, additional output capacitance
will be required. Table 3 lists recommended values of RTUNE
and CTUNE in order to meet 2% output voltage deviation limits
for some common output voltages in the presence of a 10A
to 20A step change (50% of full load), with an input voltage of
12V.
Please contact your GE technical representative to obtain
more details of this feature as well as for guidelines on how
to select the right value of external R-C to tune the module
for best transient performance and stable operation for other
output capacitance values.
Table 2. General recommended values of of RTUNE and
CTUNE for Vin=12V and various external ceramic capacitor
combinations.
Co
VOUT
VS+
2x47F
4x47F
6x47F
10x47F
20x47F
RTUNE
330
330
270
220
180
CTUNE
47pF
560pF
1200pF
2200pF
4700pF
RTune
MODULE
CO
CTune
TRIM
Vo
RTrim
SIG_GND
GND
Co
5V
3.3V
2.5V
1.8V
2x47F 2x47F
5x47F +
+
+
8x47F 1x330F
2x330F 3x330F
Polymer
Polymer Polymer
RTUNE
220
220
220
220
CTUNE 1500pF 2200pF 3300pF 5600pF
Figure. 46. Circuit diagram showing connection of RTUME
and CTUNE to tune the control loop of the module.
Recommended values of RTUNE and CTUNE for different output
capacitor combinations are given in Tables 2 and 3. Table 3
shows the recommended values of RTUNE and CTUNE for
July 23, 2019
Table 3. Recommended values of RTUNE and CTUNE to obtain
transient deviation of 2% of Vout for a 10A step load with
Vin=12V.
V
100mV
64mV
49mV
36mV
1.2V
0.6V
1x47F
1x47F
+
+
5x330F 11x330F
Polymer Polymer
180
180
10nF
47nF
24mV
12mV
Note: The capacitors used in the Tunable Loop tables are
47 μF/3 mΩ ESR ceramic and 330 μF/12 mΩ ESR polymer
capacitors.
©2017 General Electric Company. All rights reserved.
Page 16
GE
Data Sheet
20A Analog MicroDLynxTM: Non-Isolated DC-DC Power Modules
3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 20A Output Current
Thermal Considerations
Power modules operate in a variety of thermal environments;
however, sufficient cooling should always be provided to help
ensure reliable operation.
Considerations include ambient temperature, airflow, module
power dissipation, and the need for increased reliability. A
reduction in the operating temperature of the module will
result in an increase in reliability. The thermal data presented
here is based on physical measurements taken in a wind
tunnel. The test set-up is shown in Figure 48. The preferred
airflow direction for the module is in Figure 49.
The thermal reference points, Tref used in the specifications
are also shown in Figure 49. For reliable operation the
temperatures at these points should not exceed 130oC. The
output power of the module should not exceed the rated
power of the module (Vo,set x Io,max).
Please refer to the Application Note “Thermal
Characterization Process For Open-Frame Board-Mounted
Power Modules” for a detailed discussion of thermal
aspects including maximum device temperatures.
25.4_
(1.0)
Wind Tunnel
PWBs
Power Module
Figure 49. Preferred airflow direction and location of hotspot of the module (Tref).
76.2_
(3.0)
x
12.7_
(0.50)
Probe Location
for measuring
airflow and
ambient
temperature
Air
flow
Figure 48. Thermal Test Setup.
July 23, 2019
©2017 General Electric Company. All rights reserved.
Page 17
GE
Data Sheet
20A Analog MicroDLynxTM: Non-Isolated DC-DC Power Modules
3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 20A Output Current
Shock and Vibration
The ruggedized (-D version) of the modules are designed to
withstand elevated levels of shock and vibration to be able to
operate in harsh environments. The ruggedized modules
have been successfully tested to the following conditions:
Non operating random vibration:
Random vibration tests conducted at 25C, 10 to 2000Hz, for
30 minutes each level, starting from 30Grms (Z axis) and up to
50Grms (Z axis). The units were then subjected to two more
tests of 50Grms at 30 minutes each for a total of 90 minutes.
Operating shock to 40G per Mil Std. 810G, Method 516.4
Procedure I:
The modules were tested in opposing directions along each
of three orthogonal axes, with waveform and amplitude of
the shock impulse characteristics as follows:
All shocks were half sine pulses, 11 milliseconds (ms) in
duration in all 3 axes.
Units were tested to the Functional Shock Test of MIL-STD810, Method 516.4, Procedure I - Figure 516.4-4. A shock
magnitude of 40G was utilized. The operational units were
Frequency (Hz)
10
30
40
50
90
110
130
140
Frequency (Hz)
10
30
40
50
90
110
130
140
July 23, 2019
subjected to three shocks in each direction along three axes
for a total of eighteen shocks.
Operating vibration per Mil Std 810G, Method 514.5
Procedure I:
The ruggedized (-D version) modules are designed and
tested to vibration levels as outlined in MIL-STD-810G,
Method 514.5, and Procedure 1, using the Power Spectral
Density (PSD) profiles as shown in Table 7 and Table 8 for all
axes. Full compliance with performance specifications was
required during the performance test. No damage was
allowed to the module and full compliance to performance
specifications was required when the endurance
environment was removed. The module was tested per MILSTD-810, Method 514.5, Procedure I, for functional
(performance) and endurance random vibration using the
performance and endurance levels shown in Table 7 and
Table 8 for all axes. The performance test has been split,
with one half accomplished before the endurance test and
one half after the endurance test (in each axis). The duration
of the performance test was at least 16 minutes total per
axis and at least 120 minutes total per axis for the
endurance test. The endurance test period was 2 hours
minimum per axis.
Table 7: Performance Vibration Qualification - All Axes
PSD Level
PSD Level
Frequency (Hz)
Frequency (Hz)
(G2/Hz)
(G2/Hz)
1.14E-03
170
2.54E-03
690
5.96E-03
230
3.70E-03
800
9.53E-04
290
7.99E-04
890
2.08E-03
340
1.12E-02
1070
2.08E-03
370
1.12E-02
1240
7.05E-04
430
8.84E-04
1550
5.00E-03
490
1.54E-03
1780
8.20E-04
560
5.62E-04
2000
PSD Level
(G2/Hz)
1.03E-03
7.29E-03
1.00E-03
2.67E-03
1.08E-03
2.54E-03
2.88E-03
5.62E-04
Table 8: Endurance Vibration Qualification - All Axes
PSD Level
PSD Level
Frequency (Hz)
Frequency (Hz)
(G2/Hz)
(G2/Hz)
0.00803
170
0.01795
690
0.04216
230
0.02616
800
0.00674
290
0.00565
890
0.01468
340
0.07901
1070
0.01468
370
0.07901
1240
0.00498
430
0.00625
1550
0.03536
490
0.01086
1780
0.0058
560
0.00398
2000
PSD Level
(G2/Hz)
0.00727
0.05155
0.00709
0.01887
0.00764
0.01795
0.02035
0.00398
©2017 General Electric Company. All rights reserved.
Page 18
GE
Data Sheet
20A Analog MicroDLynxTM: Non-Isolated DC-DC Power Modules
3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 20A Output Current
Example Application Circuit
Requirements:
Vin:
Vout:
12V
1.8V
Iout:
15A max., worst case load transient is from 10A to 15A
Vout:
1.5% of Vout (27mV) for worst case load transient
Vin, ripple 1.5% of Vin (180mV, p-p)
Vin+
VIN
Vout+
VOUT
VS+
PGOOD
MODULE
RTUNE
SEQ
CTUNE
CI3
CI2
TRIM
CI1
CO1
CO2
CO3
RTrim
ON/OFF
SIG_GND
SYNC GND
GND
VS-
CI1
Decoupling cap - 1x0.047F/16V ceramic capacitor (e.g. Murata LLL185R71C473MA01)
CI2
3x22F/16V ceramic capacitor (e.g. Murata GRM32ER61C226KE20)
CI3
470F/16V bulk electrolytic
CO1
Decoupling cap - 1x0.047F/16V ceramic capacitor (e.g. Murata LLL185R71C473MA01)
CO2
N.A.
CO3
3 x 330F/6.3V Polymer (e.g. Sanyo Poscap)
CTune
RTune
4700pF ceramic capacitor (can be 1206, 0805 or 0603 size)
330 ohms SMT resistor (can be 1206, 0805 or 0603 size)
RTrim
10k SMT resistor (can be 1206, 0805 or 0603 size, recommended tolerance of 0.1%)
July 23, 2019
©2017 General Electric Company. All rights reserved.
Page 19
GE
Data Sheet
20A Analog MicroDLynxTM: Non-Isolated DC-DC Power Modules
3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 20A Output Current
Mechanical Outline
Dimensions are in millimeters and (inches).
Tolerances: x.x mm 0.5 mm (x.xx in. 0.02 in.) [unless otherwise indicated]
x.xx mm 0.25 mm (x.xxx in 0.010 in.)
NC
NC
NC
NC
1 If
July 23, 2019
NC
PIN
FUNCTION
PIN
FUNCTION
1
2
3
4
5
6
7
8
9
ON/OFF
VIN
SEQ
GND
TRIM
VOUT
VS+
VSPG
10
11
12
13
14
15
16
SYNC1
NC
NC
NC
SIG_GND
NC
NC
unused, connect to Ground.
©2017 General Electric Company. All rights reserved.
Page 20
GE
Data Sheet
20A Analog MicroDLynxTM: Non-Isolated DC-DC Power Modules
3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 20A Output Current
Recommended Pad Layout
Dimensions are in millimeters and (inches).
Tolerances: x.x mm 0.5 mm (x.xx in. 0.02 in.) [unless otherwise indicated]
x.xx mm 0.25 mm (x.xxx in 0.010 in.)
NC
NC
NC
NC
NC
2 If
July 23, 2019
PIN
FUNCTION
PIN
FUNCTION
1
2
3
4
5
6
7
8
9
ON/OFF
VIN
SEQ
GND
TRIM
VOUT
VS+
VSPG
10
11
12
13
14
15
16
SYNC2
NC
NC
NC
SIG_GND
NC
NC
unused, connect to Ground.
©2017 General Electric Company. All rights reserved.
Page 21
GE
Data Sheet
20A Analog MicroDLynxTM: Non-Isolated DC-DC Power Modules
3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 20A Output Current
Packaging Details
The 12V Analog MicroDLynxTM 20A modules are supplied in tape & reel as standard. Modules are shipped in quantities of 200
modules per reel.
All Dimensions are in millimeters and (in inches).
Reel Dimensions:
Outside Dimensions:
Inside Dimensions:
330.2 mm (13.00)
177.8 mm (7.00”)
Tape Width:
44.00 mm (1.732”)
July 23, 2019
©2017 General Electric Company. All rights reserved.
Page 22
GE
Data Sheet
20A Analog MicroDLynxTM: Non-Isolated DC-DC Power Modules
3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 20A Output Current
Surface Mount Information
Pick and Place
The 20A Analog MicroDLynxTM modules use an open frame
construction and are designed for a fully automated
assembly process. The modules are fitted with a label
designed to provide a large surface area for pick and place
operations. The label meets all the requirements for surface
mount processing, as well as safety standards, and is able to
withstand reflow temperatures of up to 300oC. The label also
carries product information such as product code, serial
number and the location of manufacture.
detailed in J-STD-033 Rev. A (Handling, Packing, Shipping and
Use of Moisture/Reflow Sensitive Surface Mount Devices).
Moisture barrier bags (MBB) with desiccant are required for
MSL ratings of 2 or greater. These sealed packages should
not be broken until time of use. Once the original package is
broken, the floor life of the product at conditions of 30°C
and 60% relative humidity varies according to the MSL rating
(see J-STD-033A). The shelf life for dry packed SMT packages
will be a minimum of 12 months from the bag seal date,
when stored at the following conditions: < 40° C, < 90%
relative humidity.
300
Per J-STD-020 Rev. C
Peak Temp 260°C
250
The module weight has been kept to a minimum by using
open frame construction. Variables such as nozzle size, tip
style, vacuum pressure and placement speed should be
considered to optimize this process. The minimum
recommended inside nozzle diameter for reliable operation is
3mm. The maximum nozzle outer diameter, which will safely
fit within the allowable component spacing, is 7 mm.
Reflow Temp (°C)
Nozzle Recommendations
200
* Min. Time Above 235°C
15 Seconds
150
Heating Zone
1°C/Second
Cooling
Zone
*Time Above 217°C
60 Seconds
100
50
0
Bottom Side / First Side Assembly
Reflow Time (Seconds)
Only the -D version of this module can be placed at the
bottom side of the customer board. No additional glue
or adhesive is required to hold the module during the
top side reflow process. Serial numbers with date codes
starting from 19xx20xxxxxx (19 – year, 20 - week) are
suitable for bottom side placement.
Lead Free Soldering
The modules are lead-free (Pb-free) and RoHS compliant and
fully compatible in a Pb-free soldering process. Failure to
observe the instructions below may result in the failure of or
cause damage to the modules and can adversely affect longterm reliability.
Figure 50. Recommended linear reflow profile using
Sn/Ag/Cu solder.
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The result
of inadequate cleaning and drying can affect both the
reliability of a power module and the testability of the
finished circuit-board assembly. For guidance on
appropriate soldering, cleaning and drying procedures, refer
to Board Mounted Power Modules: Soldering and Cleaning
Application Note (AN04-001).
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices) for both Pb-free solder
profiles and MSL classification procedures. This standard
provides a recommended forced-air-convection reflow profile
based on the volume and thickness of the package (table 42). The suggested Pb-free solder paste is Sn/Ag/Cu (SAC). For
questions regarding Land grid array(LGA) soldering, solder
volume; please contact GE for special manufacturing process
instructions. The recommended linear reflow profile using
Sn/Ag/Cu solder is shown in Fig. 50. Soldering outside of the
recommended profile requires testing to verify results and
performance.
MSL Rating
The 20A Analog MicroDLynxTM modules have a MSL rating of
2a.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount packages is
July 23, 2019
©2017 General Electric Company. All rights reserved.
Page 23
GE
Data Sheet
20A Analog MicroDLynxTM: Non-Isolated DC-DC Power Modules
3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 20A Output Current
Ordering Information
Please contact your GE Sales Representative for pricing, availability and optional features.
Table 9. Device Codes
Device Code
Input
Voltage Range
Output
Voltage
Output
Current
On/Off
Logic
Sequencing
Comcodes
UVT020A0X3-SRZ
3 – 14.4Vdc
0.6 – 5.5Vdc
20A
Negative
Yes
CC109159744
UVT020A0X3-SRDZ
3 – 14.4Vdc
0.6 – 5.5Vdc
20A
Negative
Yes
CC109168753
UVT020A0X43-SRZ
3 – 14.4Vdc
0.6 – 5.5Vdc
20A
Positive
Yes
CC109159752
-Z refers to RoHS compliant parts
Table 10. Coding Scheme
Package
Identifier
Family
U
P=Pico
U=Micro
M=Mega
G=Giga
V
D=Dlynx
Digital
V = DLynx
Analog.
Sequencing
Option
Output Output voltage On/Off logic Remot
current
e
Sense
T
T=with EZ
Sequence
X=without
sequencing
020A0
20A
Options
X
3
-SR
X=
4 = positive
3=
S=
programmable No entry = Remote Surface
output
negative
Sense Mount
R=
Tape &
Reel
-D
D = 105°C
operating
ambient,
40G
operating
shock as
per MIL Std
810G
ROHS
Compliance
Z
Z = ROHS6
Contact Us
For more information, call us at
USA/Canada:
+1 877 546 3243, or +1 972 244 9288
Asia-Pacific:
+86.021.54279977*808
Europe, Middle-East and Africa:
+49.89.878067-280
www.gecriticalpower.com
GE Critical Power reserves the right to make changes to the product(s) or information contained herein without notice, and no
liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s)
or information.
July 23, 2019
©2017 General Electric Company. All International rights reserved.
Version 1.7
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