GSSM04202R2M2AU

SPECIFICATION FOR APPROVAL REF : GSSM0420□□□□2□U ABC'S DWG NO. PROD. Shielded Smd Power Inductor NAME REV. 20201207-A PAGE 1 Ⅰ﹒Configuration and dimensions： A B 1R0 Marking D Inductance code F E C G H ( PCB Pattern ) Unit：mm A B C D E F G H 4.45 ±0.25 4.06 ±0.25 2.00 ±0.2 1.80 ±0.2 0.76 ±0.3 2.30 ref. 2.20 ref. 5.20 ref. Ⅱ﹒Description： a﹒Powder molding construction b﹒Magnetically shielded c﹒Wire：Polyester wire or equivalent d﹒Products comply with RoHS' requirements e﹒Halogen free Peak temp.：260℃ max. Max. peak temp. - 5℃：30sec. max. Max. time above 217℃ ：60sec.~150sec. max. Temperature Rising Area Preheat Area +4.0℃ / sec. max. 150 ~ 200℃ / 60 ~ 120sec. Reflow Area Peak Temperature: 260℃ 250 a﹒Storage temp.：-40℃ ----+125℃ b﹒Operating temp.：-40℃----+125℃ （ Temp. rise included ） 217℃ Temperature ( ℃ ) Ⅲ﹒General specification： Forced Cooling Area +3.0℃ / sec. max. -(1.0 ~ 5.0)℃ / sec. max. 60sec.~150sec. 200 60sec. max. 150 60sec.~120sec. 100 50 c﹒Resistance to solder heat：260℃.10 sec. 0 50 100 150 Time ( seconds ) AR-001C 200 250 SPECIFICATION FOR APPROVAL REF : NAME GSSM0420□□□□2□U ABC'S DWG NO. PROD. Shielded Smd Power Inductor REV. 20201207-A PAGE 2 Ⅳ﹒Electrical characteristics ： RDC ( mΩ ) Inductance ( μH ) Isat (A) typ. Irms (A) typ. max. typ. GSSM0420R10Y2AU 0.10 ± 30％ 35.00 14.00 4.0 3.2 GSSM0420R12Y2AU 0.12 ± 30％ 33.00 13.00 4.7 4.0 GSSM0420R15Y2AU 0.15 ± 30％ 31.00 14.00 5.0 4.2 GSSM0420R18Y2AU 0.18 ± 30％ 28.00 13.50 5.4 4.6 GSSM0420R22Y2AU 0.22 ± 30％ 24.00 13.00 7.3 6.6 GSSM0420R24Y2AU 0.24 ± 20％ 23.00 12.00 7.6 6.9 GSSM0420R33M2AU 0.33 ± 20％ 18.00 10.00 8.6 7.8 GSSM0420R36M2AU 0.36 ± 20％ 15.00 9.00 12.0 8.7 GSSM0420R47M2AU 0.47 ± 20％ 12.00 8.00 14.0 11.2 GSSM0420R50M2AU 0.50 ± 20％ 11.30 7.80 15.0 13.0 GSSM0420R56M2AU 0.56 ± 20％ 10.00 7.30 16.0 13.5 GSSM0420R60M2AU 0.60 ± 20％ 11.00 7.30 18.5 15.5 GSSM0420R68M2AU 0.68 ± 20％ 10.00 7.00 19.0 16.0 GSSM0420R82M2AU 0.82 ± 20％ 9.50 6.00 23.0 19.0 GSSM04201R0M2AU 1.00 ± 20％ 8.50 5.00 27.0 22.0 GSSM04201R2M2AU 1.20 ± 20％ 7.80 4.80 30.0 25.0 GSSM04201R5M2AU 1.50 ± 20％ 7.00 4.50 42.0 34.8 GSSM04201R8M2AU 1.80 ± 20％ 6.50 4.30 52.0 43.0 GSSM04202R2M2AU 2.20 ± 20％ 6.00 4.00 61.0 51.0 GSSM04203R3M2AU 3.30 ± 20％ 4.00 3.50 76.0 69.0 GSSM04203R6M2AU 3.60 ± 20％ 3.80 3.10 90.0 75.0 GSSM04204R7M2AU 4.70 ± 20％ 3.50 2.60 105.0 95.0 GSSM04205R6M2AU 5.60 ± 20％ 3.00 2.20 125.0 112.0 DWG No. AR-001C SPECIFICATION FOR APPROVAL REF : NAME GSSM0420□□□□2□U ABC'S DWG NO. PROD. Shielded Smd Power Inductor REV. 20201207-A PAGE 3 Ⅳ﹒Electrical characteristics ： RDC ( mΩ ) Inductance ( μH ) Isat (A) typ. Irms (A) typ. max. typ. GSSM04206R8M2AU 6.80 ± 20％ 2.80 2.10 172.0 150.0 GSSM04208R2M2AU 8.20 ± 20％ 2.50 2.00 180.0 158.0 GSSM0420100M2AU 10.00 ± 20％ 2.30 1.80 243.0 215.0 GSSM0420120M2AU 12.00 ± 20％ 2.10 1.65 330.0 275.0 GSSM0420150M2AU 15.00 ± 20％ 1.90 1.50 374.0 325.0 GSSM0420200M2AU 20.00 ± 20％ 1.70 1.30 480.0 435.0 GSSM0420220M2AU 22.00 ± 20％ 1.40 1.20 500.0 470.0 DWG No. 1). Electrical specifications at 25℃ 2). Measured frequency of inductance is 100 kHz / 1V 3). Isat base on △ L/L0A＝30％ typ. (Approximately transient current) 4). Irms base on Temp. rise 40℃ typ. AR-001C SPECIFICATION FOR APPROVAL REF : NAME GSSM0420□□□□2□U ABC'S DWG NO. PROD. Shielded Smd Power Inductor REV. 20201207-A PAGE Ⅴ﹒ Curve： GSSM0420R10Y2AU 120% 100.0 100% 80.0 80% △ T(℃ ) L(uH) 60.0 60% 40.0 40% 20.0 20% 0% 0.0 0.0 8.5 17.0 IDC(A) 25.5 34.0 42.5 0.0 8.0 16.0 IDC(A) 24.0 32.0 GSSM04201R0M2AU 120% 100.0 100% 80.0 80% △ T(℃ ) L(uH) 60.0 60% 40.0 40% 20.0 20% 0% 0.0 0.0 2.0 4.0 IDC(A) 6.0 8.0 10.0 0.0 2.0 4.0 0.0 0.6 1.2 IDC(A) 6.0 8.0 10.0 1.8 2.4 3.0 GSSM0420100M2AU 120% 100.0 100% 80.0 80% △ T(℃ ) L(uH) 60.0 60% 40.0 40% 20.0 20% 0% 0.0 0.0 0.9 1.8 IDC(A) 2.7 3.6 4.5 IDC(A) GSSM0420220M2AU 120% 100.0 100% 80.0 80% △ T(℃ ) L(uH) 60.0 60% 40.0 40% 20.0 20% 0% 0.0 0.0 AR-001A 0.5 1.0 IDC(A) 1.5 2.0 2.5 0.00 0.55 1.10 IDC(A) 1.65 2.20 4 SPECIFICATION FOR APPROVAL REF : GSSM0420□□□□2□U ABC'S DWG NO. PROD. Shielded Smd Power Inductor NAME REV. 20201207-A PAGE 5 Ⅵ﹒Packaging information： ( 1 ) Configuration Cover tape B A 2.0±0.5 ∮C ∮C D G Embossed carrier ※Carrier tape width : D 4 mm P:8 mm Start End 1R0 1R0 1R0 1R0 Leader no component 192 mm min. Trailer no component 400 mm min. Components User direction of feed ( 2 ) Dimensions Unit:mm Style A B C 13 - 12 330 100 ±0.2 13 +0.5 -0.2 D G 12 12.4 +2 -0 ( 3 ) Q'TY & G.W. Per package Inner : Reel Code A AR-001A Q'TY (pcs) G.W. (g) 3,000 975 Outer : Carton Style 13 - 12 Q'TY (pcs) G.W. (kg) Size (cm) 36,000 18.0 38 x 37 x 22 SPECIFICATION FOR APPROVAL REF : ABC'S DWG NO. PROD. Shielded Smd Power Inductor NAME REV. GSSM0420□□□□2□U 20201207-A PAGE Ⅶ﹒Drawing number expression： G S S M 0 4 2 0 Desigen code Package code Classification code Tolerance code Elrctrical code Dimension code Product type code Application code Package Information Code A AR-001C Inner package T / R ( Reel package ) Inner package Q'TY 3,000 PCS Remark 6 SPECIFICATION FOR APPROVAL REF. : PROD. ABC'S DWG NO. Shielded Smd Power Inductor NAME REV. GSSM0420□□□□2□U 20201207-A PAGE 7 Ⅷ. Reliability test： Item 1.High Temperature Exposure Reference documents MIL-STD-202 Method 108 2.Temperature Cycling JESD22-A 104 3.Biased Humidity Test MIL-STD-202 Method 103 Test Condition 1.Temperature: 125±2℃ 2.Time:96±2 hours. 1.Temperature: -40℃ ~ +125℃ 2.Number of cycle:100 cycles 3.Dwell time:30 minutes 1.Temperature：85±2 ℃ 2.Humidity: 85% RH. 3.Time:96±2 Hours 1.Temperature: 125℃ (Temp. rise included) 2.Time:96±2 hours. 3.Rated current： 4.Operational Life JESD22-A 108 5.External Visual JESD22-B 101 & Inspect product constructions, marking and MIL-STD-883 Method 2009 workmanship. 6.Physical Dimensions JESD22-B 100 7.Resistance to solvents MIL-STD-202 Method 215 Test Specification 1.No mechanical or electrical damage. 2.Inductance shall not change more than ±20%. 1.No mechanical or electrical damage. 2.Inductance shall not change more than ±20%. 1.No mechanical or electrical damage. 2.Inductance shall not change more than ±20%. 1.No mechanical or electrical damage. 2.Inductance shall not change more than ±20%. 1.No pollution on the surface of products. 2.Clear marking. 3.No crack. Verify physical dimensions to the applicable product detail specification. Per product specification standard Immerse into solvent for 3±0.5 minutes & brush 10 times for 3 cycles. 1.No body change in apperarance. 2.No marking blurred. 3.Inductance shall not change more than ±20%. 8.Vibration Test MIL-STD-202 Method 204 9.Resistance To Soldering Heat Test MIL-STD-202 Method 210 & J-STD020D.1 10.Saturation Current JIS C 6436 & User SPEC. 1.Frequency and Amplitued : 10-2000-10 Hz, 1.5 mm. 2.Direction:X, Y, Z 3.Test duration:2 hours for each direction, 6 hours in total. 1.Highest temperature：260±5℃. 2.Time（temp.≧ 217℃）：60~150 Seconds. 3.IR reflow times：3 times. 1.Applied rated current for 5 seconds. 2.Saturation current： 11.Over load JIS C 6436 & User SPEC. 1.Applied one and half rated current for a period of 5 minutes. 2.Rated current： No electrical or mechanical damage 12.Temperature Rise Current JIS C 6436 & User SPEC. 1.Applied rated current for 10 minutes. 2.Temperature measure by digital surface thermometer. 3.Irms current： Surface temperature rise is less than 40℃ typ. 13.Solderability Test J-STD-002 & JESD22-B 102 1.Baking in pre-testing： 150±5℃ / 16Hours±30 min. 2.Peak temperature：240±5℃ 3.Time（temp.≧217℃）：60~150 seconds. 4.IR reflow times：1 time. More than 95% soldering coverage min on terminations. 14.Electrical Characteriazation MIL-STD-202 Method 304 & User SPEC. 15.Drop 1.Products shall be mounted on SPEC. PCB and dropped down from a height of 1m CNS-C6354 & GB/T 2423.8 2.Drop total time：6 times (Every side of sample drop 2 times) 16.Terminal Strength Test IEC 60068-2-21 AR-001C 1.Operating temperature：-40℃~125℃ 2.Room temperature：25℃. 1.Apply push force to samples mounted on PCB. 2.Force of 1.8 kg for 60±1 seconds. 1.No mechanical or electrical damage. 2.Inductance shall not change more than ±20%. 1.No mechanical or electrical damage. 2.Inductance shall not change more than ±20%. Inductance shall not drop more than 30% typ. 1.No mechanical or electrical damage. 2.Inductance shall not change more than ±20%. 1. Adhesion on PCB shall be enough. 2. Product appearance shall not break. 3. No electrical damage. After test, inductors shall be no mechanical damage.