MB2029070YL

SPECIFICATION FOR APPROVAL REF : 20090527-A PROD. NAME PAGE: 1 ABC'S DWG NO. ABC'S ITEM NO. MB□□□□□□□□ L□-□□□ HIGH CURRENT MULTILAYER CHIP BEAD A Ⅰ﹒CONFIGURATION & DIMENSIONS： D D I C G I ( PCB Pattern ) B Unit : m/m C 1.5±0.2 1.6±0.2 1.1±0.2 0.9±0.2 0.8±0.2 D 0.6 ±0.4 0.6 ±0.4 0.6 ±0.4 0.5 ±0.3 0.3 ±0.2 G 3.0 3.0 2.2 1.0 0.7 H 3.0 1.4 1.4 1.0 0.7 I 1.5 1.5 1.1 1.0 0.7 Series MB4532 MB4516 MB3261 MB2029 MB1608 A 4.5±0.2 4.5±0.2 3.2±0.2 2.0±0.2 1.6±0.2 B 3.2±0.2 1.6±0.2 1.6±0.2 1.2±0.2 0.8±0.2 Ⅱ﹒SCHEMATIC DIAGRAM： Ⅲ﹒MATERIALS： a﹒Body：Ferrite b﹒Internal conductor：Silver or Ag / Pd c﹒Terminal：Ag/Ni/Sn d﹒Remark：Products comply with RoHS' requirements a b c Ⅳ﹒GENERAL SPECIFICATION： a﹒Storage temp.：-40℃ ---- +105℃ b﹒Operating temp.：-55℃ ---- +125℃ c﹒Terminal strength： F Type MB4532 MB4516 MB3261 MB2029 MB1608 d﹒Solderability： Solder : Sn96.5 / Ag3 / Cu0.5 or equivalent Solder temp. : 260±5℃ Flux : Rosin Dip time : 4±1 seconds AR-001A F ( kgf ) 1.5 1.0 1.0 0.6 0.5 Time ( sec ) 250 Peak Temp： 260 ℃ m ax. Max time above 230℃ ：50sec max. Max time above 200℃ ：70sec max. Temperature Rising Area +4.0℃ / sec max. Preheat Area 1 50 ~ 200 ℃ / 60 ~ 120 sec Reflow Area +2.0 ~ 4.0℃ / sec max. Forced Cooling Area -(1.0 ~ 5.0)℃ / sec max. Peak Temperature: 260℃ 50sec max. 230℃ 30±5 T e m p e ra t u re ( ℃ ) 200 150 70sec max. 100 50 0 50 100 150 Time ( seconds ) 200 H 250 SPECIFICATION FOR APPROVAL REF : 20090527-A PROD. NAME PAGE: 2-1 ABC'S DWG NO. ABC'S ITEM NO. MB□□□□□□□□L□-□□□ HIGH CURRENT MULTILAYER CHIP BEAD Ⅴ﹒ELECTRICAL CHARACTERISTICS： DWG No. MB4532700YL□ -□□□ MB4532121YL□ -□□□ MB4532131YL□ -□□□ MB4516600YL□ -□□□ MB4516750YL□ -□□□ MB4516800YL□ -□□□ 1). □：Paclaging Information… A：Bulk 2)."":Reference code Impedance (Ω) at 100MHz 70±25% 120±25% 125±25% 60±25% 75±25% 80±25% B：Taping Reel RDC (mΩ) max. 30 50 50 10 25 50 IDC (A) max. 6.0 3.0 3.0 6.0 3.0 3.0 □□□ MB4532700YL□ MB4532121YL□ MB4532131YL□ MB4516600YL□ MB4516750YL□ MB4516800YL□ AR-001A SPECIFICATION FOR APPROVAL REF : 20090527-A PROD. NAME PAGE: 2-2 ABC'S DWG NO. ABC'S ITEM NO. MB□□□□□□□□ L□-□□□ HIGH CURRENT MULTILAYER CHIP BEAD Ⅴ ﹒ELECTRICAL CHARACTERISTICS： DWG No. MB3261190YL□ -□□□ MB3261260YL□ -□□□ MB3261310YL□ -□□□ MB3261500YL□ -□□□ MB3261800YL□ -□□□ MB2029070YL□ -□□□ MB2029100YL□ -□□□ MB2029300YL□ -□□□ MB1608300YL□ -□□□ 2)."- Impedance (Ω ) at 100MHz 19±25% 26±25% 31±25% 50±25% 80±25% 7±25% 10±25% 30±25% 30±25% RDC (mΩ) max. 40 40 40 25 30 30 30 25 60 IDC (A) max. 3.0 3.0 3.0 3.0 3.0 3.0 3.0 3.0 1.0 1). □：Paclaging Information… A：Bulk B：Taping Reel □□□":Reference code MB3261190YL□ MB3261260YL□ MB3261310YL□ MB3261500YL□ MB3261800YL□ MB2029070YL□ MB2029100YL□ MB2029300YL□ MB1608300YL□ AR-001A SPECIFICATION FOR APPROVAL REF : 20090527-A PROD. NAME PAGE: 3 ABC'S DWG NO. ABC'S ITEM NO. MB□□□□□□□□ L□-□□□ HIGH CURRENT MULTILAYER CHIP BEAD Ⅵ﹒PACKAGING INFORMATION： ( 1 ) Configuration T C over Tape 2.0±0.5 A N ∮C ∮C B G D Embossed Carrier ※Carrier tape width : D P:4 m/m End 4 m/m Start Leader no component 200 m/m min. Components User direction of feed Trailer no component 400 m/m min. ( 2 ) Dimensions Style 07 - 08 07 - 12 A 178 178 B 21 ±0.8 21 ±0.8 C 13 13 D 8 12 G 10 +0 14 +0 N 50 -0 50 -0 Unit:m/m T 12.5 16.5 ( 3 ) Q'TY & G.W. Per package Inner : Reel Series MB4532 MB4516 MB3261 MB2029 MB1608 Q'TY (pcs) G.W. (gw) Style Q'TY(kpcs) Outer : Cartion G.W. (Kg) Size (cm) 1,000 2,000 3,000 4,000 4,000 170 180 150 120 90 07 - 12 07 - 12 07 - 08 07 - 08 07 - 08 30 80 120 200 200 9.3 9.7 8.5 8.5 7.0 41 x 39 x 22 41 x 39 x 22 41 x 39 x 22 41 x 39 x 22 41 x 39 x 22 AR-001A SPECIFICATION FOR APPROVAL REF : 20090527-A PROD. NAME PAGE: 4 ABC'S DWG NO. ABC'S ITEM NO. MB□□□□□□□□L□-□□□ HIGH CURRENT MULTILAYER CHIP BEAD ( 4 ) TYPE DIMENSIONS Fig 1. 1.75 ±0.1 (0.069 ±0.004) 4± 0.1 (0.157 ±0.004) φ1.55 ±0.05 2± 0.05 (0.079 ±0.002) (0.061 ± 0.002) T max. F ± 0.05 ( 0.002) P± 0.1 (0.004) A± 0.1 (0.004) Fig 2. 1.75 ± 0.1 (0.069 ±0.004) 4± 0.1 (0.157 ±0.004) φ1.55 ±0.05 2± 0.05 (0.079 ±0.002) (0.061 ± 0.002) B ±0 .1(0.004) W ± 0.2 ( 0.008) 0.23 ± 0. 1 (0.00 4 ) F ±0.05 ( 0.002) B ± 0 .1(0.004) W ± 0.2 ( 0.008) P± 0.1 (0.004) A ±0.1 (0.004) T± 0. 1(0.00 4 ) Unit:m/m Type MB4532 MB4516 MB3261 MB2029 MB1608 A 3.66 1.93 1.88 1.50 1.05 B 4.95 4.95 3.50 2.30 1.85 F 5.50 5.50 3.50 3.50 3.50 P 8.0 4.0 4.0 4.0 4.0 T 1.85 1.93 1.27 1.10 1.10 W 12.0 12.0 8.0 8.0 8.0 Fig 2 2 2 1 1 AR-001A SPECIFICATION FOR APPROVAL REF : 20090527-A PAGE: 5 ABC'S DWG NO. ABC'S ITEM NO. MB□□□□□□□□L□-□□□ PROD. NAME HIGH CURRENT MULTILAYER CHIP BEAD Ⅶ﹒DWGING NUMBER EXPRESSION： MB Reference code Appendix code 2 : Package Appendix code 1 : Classification Tolerance code Electrical code Dimension code Type code Appendix code 1：Product Classification L：Lead Free Standard products comply with RoHS' requirements 1 ~ 9：Lead Free Special products comply with RoHS' requirements Appendix code 2：Package Information C ode A Inner package T.B.D. T / R ( Reel package ) T / R ( Reel package ) B T / R ( Reel package ) T / R ( Reel package ) T / R ( Reel package ) Inner package Q'TY T.B.D. 1000 2000 3000 4000 4000 pcs pcs pcs pcs pcs MB4532 MB4516 MB3261 MB2029 MB1608 Remark AR-001A