MZ1608102YL

SPECIFICATION FOR APPROVAL REF : PROD. NAME ABC'S DWG NO. P AGE: 1 MULTILAYER CHIP BEAD ABC'S ITEM NO. M □□□□□□□□□L□-□□□ Ⅰ﹒CONFIGURATION & DIMENSIONS： A C I B G I ( PCB Pattern ) Unit : m/m C D 0.30±0.2 0.50±0.3 0.60±0.4 G 0.7 1.0 2.2 H 0.7 1.0 1.4 I 0.7 1.0 1.1 Series M □1608 M □2029 M □3261 A 1.6±0.2 2.0±0.2 3.2±0.2 B 0.8±0.2 1.2±0.2 1.6±0.2 0.8±0.2 0.9±0.2 1.1±0.2 Ⅱ﹒SCHEMATIC DIAGRAM： Ⅲ﹒MATERIALS： a﹒ Body：Ferrite b﹒ Internal conductor： Silver or Ag / Pd c﹒ Terminal electrode：Ag/Ni/Sn d﹒Remark： Products comply with RoHS' requirements a b H c Peak Temp： 260 ℃ m ax. Max time above 230℃ ：50sec max. Max time above 200℃ ：70sec max. D D Ⅳ﹒GENERAL SPECIFICATION： a﹒ Storage temp.： -40 ---- +105℃ b﹒ Operating temp.：-55 ---- +125℃ c﹒ Terminal strength： F Type M □1608 M □2029 M □3261 d﹒Solderability： Solder : Sn96.5 / Ag3 / Cu0.5 or equivalent Solder temp. : 260±5℃ Flux : Rosin Dip time : 4±1 seconds AR-001A F ( kgf ) 0.5 0.6 1.0 Time ( sec ) 250 T e m p e ra t u re ( ℃ ) Temperature Rising Area +4.0℃ / sec max. Preheat Area 150 ~ 200 ℃ / 60 ~ 120sec Reflow Area +2.0 ~ 4.0℃ / sec max. Forced Cooling Area -(1.0 ~ 5.0)℃ / sec max. P eak Temperature: 260℃ 230℃ 30±5 50s ec max. 200 150 70sec max. 100 50 0 50 100 150 Time ( seconds ) 200 250 SPECIFICATION FOR APPROVAL REF : PROD. NAME PAGE: 2-1 MULTILAYER CHIP BEAD ABC'S DWG NO. ABC'S ITEM NO. M□□□□□□□□□ L□-□□□ Ⅴ﹒ELECTRICAL CHARACTERISITCS： DWG No. MD1608400YL□ -□□□ MG1608800YL□ -□□□ MG1608121YL□ -□□□ MU1608221YL□ -□□□ MU1608301YL□ -□□□ MZ1608601YL□ -□□□ MZ1608102YL□ -□□□ MG1608152YL□ -□□□ MG1608202YL□ -□□□ Impedance (Ω) at 100MHz 40±25% 80±25% 120±25% 220±25% 300±25% 600±25% 1000±25% 1500±25% 2000±25% RDC (Ω) max. 0.30 0.30 0.30 0.30 0.35 0.45 0.60 0.70 0.80 IDC (mA) max. 300 300 200 200 150 100 100 50 50 1). □：Packaging Information… A：Bulk B：Taping Reel 2) ."":Reference code □□□ MD1608400YL□ MG1608800YL□ MG1608121YL□ MU1608221YL□ MU1608301YL□ MZ1608601YL□ MZ1608102YL□ MG1608152YL□ MG1608202YL□ AR-001A SPECIFICATION FOR APPROVAL REF : PROD. NAME PAGE: 2-2 MULTILAYER CHIP BEAD ABC'S DWG NO. ABC'S ITEM NO. M □□□□□□□□□ L□-□□□ Ⅴ﹒ELECTRICAL CHARACTERISITCS： DWG No. MD2029400YL□ -□□□ MG2029800YL□ -□□□ MG2029121YL□ -□□□ MU2029221YL□ -□□□ MU2029301YL□ -□□□ MZ2029601YL□ -□□□ MZ2029102YL□ -□□□ MG2029152YL□ -□□□ MG2029202YL□ -□□□ Impedance (Ω) at 100MHz 40±25% 80±25% 120±25% 220±25% 300±25% 600±25% 1000±25% 1500±25% 2000±25% RDC (Ω ) max. 0.20 0.20 0.25 0.30 0.30 0.40 0.45 0.55 0.60 IDC (mA) max. 300 300 300 200 200 100 100 100 50 1). □ ：Packaging Information… A：Bulk B：Taping Reel 2) ."":Reference code □□□ MD2029400YL□ MG2029800YL□ MG2029121YL□ MU2029221YL□ MU2029301YL□ MZ2029601YL□ MZ2029102YL□ MG2029152YL□ MG2029202YL□ AR-001A SPECIFICATION FOR APPROVAL REF : PROD. NAME PAGE: 2-3 MULTILAYER CHIP BEAD ABC'S DWG NO. ABC'S ITEM NO. M □□□□□□□□□L□-□□□ Ⅴ﹒ELECTRICAL CHARACTERISITCS： DWG No. MG3261151YL□ -□□□ MG3261301YL□ -□□□ MU3261301YL□ -□□□ MU3261601YL□ -□□□ MZ3261601YL□ -□□□ MZ3261122YL□ -□□□ MU3261122YL□ -□□□ MZ3261202YL□ -□□□ MU3261202YL□ -□□□ Impedance (Ω ) at 100MHz 150±25% 300±25% 300±25% 600±25% 600±25% 1200±25% (at 50MHz) 1200±25% (at 50MHz) 2000±25% (at 30MHz) 2000±25% (at 30MHz) RDC (Ω ) max. 0.30 0.30 0.30 0.30 0.30 0.50 0.50 0.60 0.60 IDC (mA) max. 300 300 300 200 200 100 100 100 100 1). □：Packaging Information… A：Bulk B：Taping Reel 2) ."":Reference code □□□ MZ3261151YL□ MG3261301YL□ MU3261301YL□ MU3261601YL□ MZ3261601YL□ MZ3261122YL□ MU3261122YL□ MZ3261202YL□ MU3261202YL□ AR-001A SPECIFICATION FOR APPROVAL REF : PROD. NAME P AGE: 3 MULTILAYER CHIP BEAD ABC'S DWG NO. ABC'S ITEM NO. M □□□□□□□□□L□-□□□ Ⅵ﹒PACKAGING INFORMATION： ( 1 ) Configuration T Cover Tape 2.0±0.5 A ∮C ∮C N B G D Embossed Carrier ※ Carrier tape width : D P:4 m/m End 4 m/m Start Leader no component 200 m/m min. Components User direction of feed Trailer no comppnent 400 m/m min. ( 2 ) Dimensions Style 07 - 08 A 178 B 21±0.8 C 13 D 8 G 10 +0 N 50 -0 Unit:m/m T 12.5 ( 3 ) Q'TY & G.W. Per package Inner : Reel Series M □1608 M □2029 M □3261 Q'TY (pcs) G.W. (gw) Style Q'TY(kpcs) Outer : Carton G.W. (Kg) Size (cm) 4,000 4,000 3,000 90 120 150 07 - 08 07 - 08 07 - 08 200 200 120 7.0 8.5 8.5 41 x 39 x 22 41 x 39 x 22 41 x 39 x 22 AR-001A SPECIFICATION FOR APPROVAL REF : PROD. NAME P AGE: 4 MULTILAYER CHIP BEAD ( 4 ) TYPE DIMENSIONS 1.75± 0.1 (0.069 ±0.004) ABC'S DWG NO. ABC'S ITEM NO. M □□□□□□□□□L□-□□□ Fig 1. φ1.55±0.05 2±0.05 4±0.1 (0.157±0.004) (0.079 ±0.002) (0.061±0.002) T max. F± 0.05 ( 0.002) P±0.1 (0.004) A± 0.1 (0.004) 1.75 ± 0.1 (0.069 ± 0.004) F ig 2. φ1.55±0.05 4±0.1 2±0.05 (0.157±0.004) (0.079 ±0.002) (0.061±0.002) B±0 .1(0.004) W± 0.2 ( 0.008) 0.23 ±0.1(0.004) F±0.05 ( 0.002) B± 0 .1(0.004) W±0.2 ( 0.008) P±0.1 (0.004) A±0.1 (0.004) T±0. 1(0.004) Unit:m/m Type M □1608 M □2029 M □3261 A 1.05 1.50 1.88 B 1.85 2.30 3.50 F 3.50 3.50 3.50 P 4.0 4.0 4.0 T 1.10 1.10 1.27 W 8.0 8.0 8.0 Fig 1 1 2 AR-001A SPECIFICATION FOR APPROVAL REF : PROD. NAME P AGE: 5 MULTILAYER CHIP BEAD ABC'S DWG NO. ABC'S ITEM NO. M □□□□□□□□□L□-□□□ Ⅶ﹒DWGING NUMBER EXPRESSION： M Reference code Appendix code 2 : Package Appendix code 1 : Classification Tolerance code Electrical code Dimension code Type code Appendix code 1： Product Classification L ：Lead Free Standard products comply with RoHS' requirements 1 ~ 9： Lead Free Special products comply with RoHS' requirements Appendix code 2： Package Information Code A Inner package T.B.D. T / R ( Reel package ) B T / R ( Reel package ) T / R ( Reel package ) Inner package Q'TY T.B.D. 4000 4000 3000 pcs pcs pcs M □1608 M □2029 M □3261 Remark AR-001A