SPECIFICATION FOR APPROVAL
REF : PROD. NAME PAGE: 1
MULTILAYER CHIP BEAD
ABC'S DWG NO. ABC'S ITEM NO.
SM□□□□□□□□L□-□□□
Ⅰ﹒CONFIGURATION & DIMENSIONS:
A
D
D
I C B Series SM4532 SM4516 SM3266 SM3261 SM2029 SM1608 A 4.5 ±0.2 4.5 ±0.2 3.2 ±0.2 3.2 ±0.2 2.0 ±0.2 1.6 ±0.2 B 3.2±0.2 1.6±0.2 1.6±0.2 1.6±0.2 1.2±0.2 0.8±0.2 C 1.5±0.2 1.6±0.2 1.6±0.2 1.1±0.2 0.9±0.2 0.8±0.2 D 0.60 ±0.4 0.60 ±0.4 0.60 ±0.4 0.60 ±0.4 0.50 ±0.3 0.30 ±0.2
G ( PCB Pattrn )
I
G 3.0 3.0 2.2 2.2 1.0 0.7
H 3.0 1.4 1.4 1.4 1.0 0.7
H Unit : m/m I 1.5 1.5 1.1 1.1 1.0 0.7 a b c F
Peak Temp :260 ℃ max. Max time above 230℃ : 50sec max. Max time above 200℃ : 70sec max.
Temperature Rising Area +4.0℃ / sec max. Preheat Area 150 ~ 200 ℃ / 60 ~ 120sec Reflow Area +2.0 ~ 4.0℃ / sec max. Forced Cooling Area -(1.0 ~ 5.0)℃ / sec max.
Peak Temperature: 260℃ 50sec max. 230℃
Ⅱ﹒SCHEMATIC DIAGRAM:
Ⅲ﹒MATERIALS:
a﹒Body:Ferrite b﹒Internal conductor:Silver or Ag / Pd c﹒ Terminal electrode:Ag/Ni/Sn d﹒Remark:Products comply with RoHS' requirements
Ⅳ﹒GENERAL SPECIFICATION:
a﹒Storage temp.:-40℃ ---- +105℃ b﹒Operating temp.:-55℃ ---- +125℃ c﹒Terminal Strength:
T emperatu re ( ℃ )
Type SM4532 SM4516 SM3261 SM3266 SM2029 SM1608 d﹒Solderability:
F ( kgf ) 1.5 1.0 1.0 1.0 0.6 0.5
time ( sec )
250
30±5
200 150
70sec max.
100 50
Solder : Sn96.5 / Ag3 / Cu0.5 or equivalent Solder temp. : 260±5℃ Flux : Rosin Dip time : 4±1 seconds AR-001A
0
50
100
150 Time ( seconds )
200
250
SPECIFICATION FOR APPROVAL
REF : PROD. NAME PAGE: 2-1
MULTILAYER CHIP BEAD
ABC'S DWG NO. ABC'S ITEM NO.
SM□□□□□□□□ L□-□□□
Ⅴ﹒ELECTRICAL CHARACTERISITCS:
DWG No. SM4532700YL□-□□□ SM4532121YL□-□□□ SM4532131YL□-□□□ SM4516800YL□-□□□ SM4516151YL□-□□□ SM3266600YL□-□□□ Impedance (Ω ) at 100MHz 70±25% 120±25% 125±25% 80±25% 150±25% 60±25% RDC (Ω ) max. 0.3 0.3 0.3 0.3 0.3 0.3 IDC (mA) max. 300 300 300 300 300 400
1). □ : Packaging Information… A:Bulk B:Taping Reel 2)."":Reference code
□□□
SM4532700YL□
S M4532121YL□
SM4532131YL□
SM4516800YL□
SM4516151YL□
SM3266600YL□
AR-001A
SPECIFICATION FOR APPROVAL
REF : PROD. NAME PAGE: 2-2
MULTILAYER CHIP BEAD
ABC'S DWG NO. ABC'S ITEM NO.
SM□□□□□□□□L□-□□□
Ⅴ﹒ELECTRICAL CHARACTERISITCS:
DWG No. SM3261190YL□-□□□ SM3261260YL□-□□□ SM3261310YL□-□□□ SM2029070YL□-□□□ SM2029100YL□-□□□ SM2029110YL□-□□□ SM1608050YL□-□□□ SM1608090YL□-□□□ SM1608300YL□-□□□ Impedance (Ω ) at 100MHz 19±25% 26±25% 31±25% 7±25% 10±25% 11±25% 5±25% 9±25% 30±25% RDC (Ω ) max. 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.3 IDC (mA) max. 500 500 500 600 600 600 600 500 400
1). □:Packaging Information… A:Bulk B:Taping Reel 2)."":Reference code
□□□
SM3261190YL□
SM3261260YL□
SM3261310YL□
SM2029070YL□
SM2029100YL□
SM2029110YL□
SM1608050YL□
SM1608090YL□
SM1608300YL□
1000
AR-001A
SPECIFICATION FOR APPROVAL
REF : PROD. NAME PAGE: 3
MULTILAYER CHIP BEAD
ABC'S DWG NO. ABC'S ITEM NO.
SM□□□□□□□□ L□-□□□
Ⅵ﹒PACKAGING INFORMATION:
( 1 ) Configuration T
Cover Tape
2.0±0.5 N ∮C ∮C B
A
G P:4 m/m End 4 m/m
D
Embossed Carrier
※ C arrier tape width : D Start
Leader no component 200 m/m min.
Components User direction of feed
Trailer no component 400 m/m min.
( 2 ) Dimensions Style 07 - 08 07 - 12 A 178 178 B 21±0.8 21±0.8 C 13 13 D 8 12 G 10 +0 14 +0 N 50 -0 50 -0
Unit:m/m T 12.5 16.5
( 3 ) Q'TY & G.W. Per package Inner : Reel Series SM1608 SM2029 SM3261 SM3266 SM4516 SM4532
Q'TY (pcs) G.W. (gw) Style
Outer : Carton
G.W. (Kg) Size (cm)
4,000 4,000 3,000 2,000 2,000 1,000
90 120 150 140 180 170
07 - 08 07 - 08 07 - 08 07 - 08 07 - 12 07 - 12
200 200 120 80 80 30
7.0 8.5 8.5 8.2 9.7 9.3
41 x 39 x 22 41 x 39 x 22 41 x 39 x 22 41 x 39 x 22 41 x 39 x 22 41 x 39 x 22
AR-001A
SPECIFICATION FOR APPROVAL
REF : PROD. NAME ABC'S DWG NO. PAGE: 4
MULTILAYER CHIP BEAD
ABC'S ITEM NO. ( 4 ) TYPE DIMENSIONS
1.75 ±0.1 (0.069 ± 0.004 )
SM□□□□□□□□ L□-□□□
Fig 1.
4±0.1 (0.157 ±0.004)
φ1.55 ±0.05 2± 0.05 (0.079 ±0.002) (0.061 ±0.002)
T max.
F ±0.05 ( 0.0 02)
P ±0.1 (0.004)
A±0.1 (0.004)
1.7 5 ± 0 .1 (0.0 69 ±0.0 04)
Fig 2.
4±0.1 (0.157 ±0.004)
φ1.55 ±0.05 2± 0.05 (0.079 ±0.002) (0.061 ±0.002)
B ±0 .1(0.004)
W ±0 .2 ( 0 .008 )
0.23 ± 0. 1(0.004 )
F ±0.05 ( 0 .002 )
B±0 .1(0.0 04)
W ±0.2 ( 0.008)
P ±0.1 (0.004)
A± 0.1 (0.004)
T± 0. 1(0.00 4)
Unit:m/m Type SM1608 SM2029 SM3261 SM3266 SM4516 SM4532 A 1.05 1.50 1.88 1.88 1.93 3.66 B 1.85 2.30 3.50 3.53 4.95 4.95 F 3.50 3.50 3.50 3.50 5.50 5.50 P 4.0 4.0 4.0 4.0 4.0 8.0 T 1.10 1.10 1.27 1.80 1.93 1.85 W 8.0 8.0 8.0 8.0 12.0 12.0 Fig 1 1 2 2 2 2
AR-001A
SPECIFICATION FOR APPROVAL
REF : PROD. NAME ABC'S DWG NO. PAGE: 5
MULTILAYER CHIP BEAD
ABC'S ITEM NO.
SM□□□□□□□□L□-□□□
Ⅶ﹒DWGING NUMBER EXPRESSION:
S
M Reference code Appendix code 2 : Package Appendix code 1 : Classification Tolerance code Electrical code Dimension code Type code
Appendix code 1:Product Classification L:Lead Free Standard products comply with RoHS' requirements 1 ~ 9:Lead Free Special products comply with RoHS' requirements
Appendix code 2:Package Information
Code A
Inner package T.B.D. T / R ( Reel package ) T / R ( Reel package )
Inner package Q'TY T.B.D. 1000 2000 2000 3000 4000 4000 pcs pcs pcs pcs pcs pcs
Remark
SM4532 SM4516 SM3266 SM3261 SM2029 SM1608
B
T / R ( Reel package ) T / R ( Reel package ) T / R ( Reel package ) T / R ( Reel package )
AR-001A
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