ABM7-48.000MHZ-D3-W-T

ABM7-48.000MHZ-D3-W-T

  • 厂商:

    ABRACON(阿布雷肯)

  • 封装:

    XO-2P_6035(METRIC)

  • 描述:

    ABM7-48.000MHZ-D3-W-T

  • 数据手册
  • 价格&库存
ABM7-48.000MHZ-D3-W-T 数据手册
ABM7 series Ceramic SMD Microprocessor Crystal Description The ABM7 series of quartz crystals offers fundamental oscillation in the frequency range of 8MHz to 48MHz. Tight frequency tolerance and temperature stability options are available, over extended operating temperature ranges up to -40°C to +105°C. The ABM7 Series is offered in an industry standard 6.0mm x 3.5mm x 1.4mm two pad SMD glass-seal package. Features • • • • Typical Applications Superior heat-resistant glass sealing Hermetically seam-sealed ceramic package REACH/RoHS II Compliant; Pb in glass, exemption 7(c) MSL Level 1   Computers, Modems, Communication equipment Industrial wide temperature applications Electrical Specifications Parameters Frequency Range Operating Temperature Range Storage Temperature Range Frequency Tolerance @ +25°C Frequency Stability over the Operating Temperature (ref. to +25°C) Equivalent series resistance Shunt capacitance (C0) Min. 8.000 -10 -55 -50 Typ. -50 Units MHz °C °C ppm Notes Fundamental AT-cut See options +50 ppm See options 7 Ω pF pF µW ppm See options 100 ±5 MΩ @ 100Vdc dB Fo to Fo+5000 ppm See table 1 below Load capacitance (CL) Drive Level Aging@25°C±3°C Insulation Resistance Sealing Method Spurious Max. 48.000 +60 +125 +50 18 10 500 See options Frist year Glass Sealing -3 Table 1 Frequency (MHz) 8.000-9.999 10.000-11.999 12.000-15.999 16.000-48.000 Revision: T Initial Release 4/17/2024 ESR(Ω) max. 100 80 60 50 Disclaimer Page 1 Check Inventory R tS l Request Samples ABM7 series Ceramic SMD Microprocessor Crystal Part Identification ABM7- -MHz - - - - - - Frequency in MHz e.g. 14.31818 MHz 26.000MHz Packaging Blank: Bulk T: 1k pcs / reel T2: 250 pcs / reel Load Capacitance (pF) Please specify CL in pF or S for series (8 to 33pF) Please contact ABRACON for other values Custom ESR if other than standard R□ □: Specify a value in Ω (e.g.: R40) Operating Temp. E: 0°C ~ +70°C B: -20°C ~ +70°C C: -30°C ~ +70°C N: -30°C ~ +85°C D: -40°C ~ +85°C J (***): -40°C ~ +105°C (***)±100 ppm only please check with Abracon for non-standard frequencies with these operating temperature options. Revision: T Initial Release 4/17/2024 Disclaimer Page 2 Freq. Tolerance (**) 1: ± 10 ppm 7: ± 15 ppm 2: ± 20 ppm 3: ± 25 ppm 4: ± 30 ppm Freq. Stability U: ± 10 ppm(*) G: ± 15 ppm(**) X: ± 20 ppm W: ± 25 ppm Y: ± 30 ppm H: ± 35 ppm Q: ± 100 ppm (*) -10°C to 60 °C only. (**)Contact ABRACON for Availability for -40°C to +85°C Check Inventory R tS l Request Samples ABM7 series Ceramic SMD Microprocessor Crystal Mechanical Dimensions Dimensions: inches (mm) Note: Due to the availability of raw materials, this part may be manufactured with a chamfer on pin 1. Be advised that this does not affect the electrical characteristics of the crystal in any way. Revision: T Initial Release 4/17/2024 Disclaimer Page 3 Check Inventory R tS l Request Samples ABM7 series Ceramic SMD Microprocessor Crystal Mechanical Dimensions (Alternate) Dimensions: inches (mm) Note: Due to the availability of raw materials, this part may be manufactured with a chamfer on pin 1. Be advised that this does not affect the electrical characteristics of the crystal in any way. Revision: T Initial Release 4/17/2024 Disclaimer Page 4 Check Inventory R tS l Request Samples ABM7 series Ceramic SMD Microprocessor Crystal Reflow Profile [JEDEC J-STD-020] Table 1 SnPb Eutectic Process Classification Temperatures (Tc) Package Thickness Volume mm3 350 2.5 mm 220 °C 220 °C Table 2 Pb-Free Process Classification Temperatures (Tc) Package Thickness Volume mm3 2000 2.5 mm 250 °C 245 °C 245 °C Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly 100°C 150°C 60 - 120 sec. 3°C/sec. max 183°C 60 - 150 sec. see Table 1 20 sec. 6°C/sec. max 6 min. max 2 max 150°C 200°C 60 - 120 sec. 3°C/sec. max 217°C 60 - 150 sec. see Table 2 30 sec. 6°C/sec. max 8 min. max 2 max Preheat / soak Temperature minimum (Tsmin) Temperature maximum (Tsmax) Time (Tsmin to Tsmax) (ts) Average ramp-up rate (Tsmax to TP) Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP)* Time (tp)** within 5°C of the specified classification temperature (TC) Ramp-down rate (Tp to Tsmax) Time 25°C to peak temperature Reflow cycles *Tolerance for peak profile temperature (TP) is defined as a supplier minimum and a user maximum. **Tolerance for time at peak profile temperature (tp) is defined as supplier minimum and a user maximum. Revision: T Initial Release 4/17/2024 Disclaimer Page 5 Check Inventory R tS l Request Samples ABM7 series Ceramic SMD Microprocessor Crystal Packaging T: 1,000pcs/reel T2: 250pcs/reel Dimensions: inches (mm) Revision: T Initial Release 4/17/2024 Disclaimer Page 6 Check Inventory R tS l Request Samples
ABM7-48.000MHZ-D3-W-T 价格&库存

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