24AA00/24LC00/24C00
128-Bit I2C Bus Serial EEPROM
Device Selection Table
Package Types
Device
VCC Range
Temp Range
24AA00
1.8-5.5
I
NC
1
8
24LC00
2.5-5.5
I
NC
2
7
NC
24C00
4.5-5.5
I,E
NC
3
6
SCL
Vss
4
5
SDA
8-PIN PDIP/SOIC
Features
• Single Supply with Operation down to 1.8V for
24AA00 Devices, 2.5V for 24LC00 Devices
• Low-Power CMOS Technology:
- Read current 500 A, typical
- Standby current 100 nA, typical
• 2-Wire Serial Interface, I2C Compatible
• Schmitt Trigger Inputs for Noise Suppression
• Output Slope Control to Eliminate Ground Bounce
• 100 kHz and 400 kHz Clock Compatibility
• Page Write Time 3 ms, Typical
• Self-Timed Erase/Write Cycle
• ESD Protection >4000V
• More than 1 Million Erase/Write Cycles
• Data Retention >200 Years
• Factory Programming Available
• Packages include 8-lead PDIP, SOIC, TSSOP,
DFN, TDFN and 5-lead SOT-23
• Pb-Free and RoHS Compliant
• Temperature Ranges Available:
- Industrial (I): -40C to +85C
- Automotive (E): -40C to +125C
Description
The Microchip Technology Inc. 24AA00/24LC00/
24C00 (24XX00*) is a 128-bit Electrically Erasable
PROM memory organized as 16 x 8 with a 2-wire
serial interface. Low-voltage design permits operation
down to 1.8 volts for the 24AA00 version, and every
version maintains a maximum standby current of only
1 A and typical active current of only 500 A. This
device was designed for where a small amount of
EEPROM is needed for the storage of calibration
values, ID numbers or manufacturing information, etc.
The 24XX00 is available in 8-pin PDIP, 8-pin SOIC
(3.90 mm), 8-pin TSSOP, 8-pin 2x3 DFN, TDFN and
the 5-pin SOT-23 packages.
VCC
8-PIN TSSOP
NC
NC
NC
VSS
1
2
3
4
8
7
6
5
5-PIN SOT-23
SCL
1
VSS
2
SDA
3
VCC
NC
SCL
SDA
DFN/TDFN
5
VCC
NC 1
NC 2
4
NC
NC 3
VSS 4
8 VCC
7 NC
6 SCL
5 SDA
Block Diagram
HV Generator
I/O
Control
Logic
SDA
VCC
VSS
SCL
Memory
Control
Logic
XDEC
EEPROM
Array
YDEC
Sense AMP
R/W Control
*24XX00 is used in this document as a generic part number for
the 24AA00/24LC00/24C00 devices.
1996-2018 Microchip Technology Inc.
DS20001178J-page 1
24AA00/24LC00/24C00
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings(†)
VCC .............................................................................................................................................................................6.5V
All inputs and outputs w.r.t. VSS ......................................................................................................... -0.6V to VCC +1.0V
Storage temperature ...............................................................................................................................-65°C to +150°C
Ambient temperature with power applied ................................................................................................-40°C to +125°C
ESD protection on all pins ..........................................................................................................................................4 kV
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to
the device. This is a stress rating only and functional operation of the device at those or any other conditions
above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating
conditions for extended periods may affect device reliability.
TABLE 1-1:
DC CHARACTERISTICS
All Parameters apply across the
recommended operating ranges unless
otherwise noted
Parameter
TA = -40°C to +85°C,
TA = -40°C to +125°C,
Industrial (I):
Automotive (E)
Symbol
Min.
Max.
Units
VCC = 1.8V to 5.5V
VCC = 4.5V to 5.5V
Conditions
SCL and SDA pins:
High-level input voltage
VIH
0.7 VCC
—
V
(Note)
Low-level input voltage
VIL
—
0.3 VCC
V
(Note)
Hysteresis of Schmitt Trigger
inputs
VHYS
.05 VCC
—
V
VCC 2.5V (Note)
Low-level output voltage
VOL
—
0.4
V
IOL = 3.0 mA, VCC = 4.5V
IOL = 2.1 mA, VCC = 2.5V
ILI
—
±1
A
VIN = VCC or VSS
Output leakage current
ILO
—
±1
A
VOUT = VCC or VSS
Pin capacitance (all inputs/outputs)
CIN,
COUT
—
10
pF
VCC = 5.0V (Note)
TA = 25°C, FCLK = 1 MHz
Operating current
ICC Write
—
2
mA
VCC = 5.5V, SCL = 400 kHz
ICC Read
—
1
mA
VCC = 5.5V, SCL = 400 kHz
ICCS
—
1
A
VCC = 5.5V, SDA = SCL = VCC
Input leakage current
Standby current
Note:
This parameter is periodically sampled and not 100% tested.
FIGURE 1-1:
BUS TIMING DATA
THIGH
TF
SCL
TSU:STA
TLOW
SDA
IN
TR
TSP
TSU:DAT
THD:DAT
TSU:STO
THD:STA
TAA
TBUF
SDA
OUT
DS20001178J-page 2
1996-2018 Microchip Technology Inc.
24AA00/24LC00/24C00
TABLE 1-2:
AC CHARACTERISTICS
All Parameters apply across all
recommended operating ranges
unless otherwise noted
Parameter
Industrial (I):
Automotive (E):
Symbol
TA = -40°C to +85°C, VCC = 1.8V to 5.5V
TA = -40°C to +125°C, VCC = 4.5V to 5.5V
Min
Max
Units
Conditions
Clock frequency
FCLK
—
—
—
100
100
400
kHz
4.5V Vcc 5.5V (E Temp range)
1.8V Vcc 4.5V
4.5V Vcc 5.5V
Clock high time
THIGH
4000
4000
600
—
—
—
ns
4.5V Vcc 5.5V (E Temp range)
1.8V Vcc 4.5V
4.5V Vcc 5.5V
Clock low time
TLOW
4700
4700
1300
—
—
—
ns
4.5V Vcc 5.5V (E Temp range)
1.8V Vcc 4.5V
4.5V Vcc 5.5V
SDA and SCL rise time
(Note 1)
TR
—
—
—
1000
1000
300
ns
4.5V Vcc 5.5V (E Temp range)
1.8V Vcc 4.5V
4.5V Vcc 5.5V
SDA and SCL fall time
TF
—
300
ns
(Note 1)
Start condition hold time
THD:STA
4000
4000
600
—
—
—
ns
4.5V Vcc 5.5V (E Temp range)
1.8V Vcc 4.5V
4.5V Vcc 5.5V
Start condition setup time
TSU:STA
4700
4700
600
—
—
—
ns
4.5V Vcc 5.5V (E Temp range)
1.8V Vcc 4.5V
4.5V Vcc 5.5V
Data input hold time
THD:DAT
0
—
ns
(Note 2)
Data input setup time
TSU:DAT
250
250
100
—
—
—
ns
4.5V Vcc 5.5V (E Temp range)
1.8V Vcc 4.5V
4.5V Vcc 5.5V
Stop condition setup time
TSU:STO
4000
4000
600
—
—
—
ns
4.5V Vcc 5.5V (E Temp range)
1.8V Vcc 4.5V
4.5V Vcc 5.5V
Output valid from clock
(Note 2)
TAA
—
—
—
3500
3500
900
ns
4.5V Vcc 5.5V (E Temp range)
1.8V Vcc 4.5V
4.5V Vcc 5.5V
4700
4700
1300
—
—
—
ns
4.5V Vcc 5.5V (E Temp range)
1.8V Vcc 4.5V
4.5V Vcc 5.5V
Bus free time: Time the bus must TBUF
be free before a new transmission can start
Output fall time from VIH
minimum to VIL maximum
TOF
20+0.1
CB
250
ns
(Note 1), CB 100 pF
Input filter spike suppression
(SDA and SCL pins)
TSP
—
50
ns
(Notes 1, 3)
Write cycle time
TWC
Endurance
Note 1:
2:
3:
4:
—
4
ms
1M
—
cycles
(Note 4)
Not 100% tested. CB = total capacitance of one bus line in pF.
As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region
(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.
The combined TSP and VHYS specifications are due to new Schmitt Trigger inputs which provide improved
noise spike suppression. This eliminates the need for a TI specification for standard operation.
This parameter is not tested but ensured by characterization. For endurance estimates in a specific
application, please consult the Total Endurance™ Model which can be obtained at www.microchip.com.
1996-2018 Microchip Technology Inc.
DS20001178J-page 3
24AA00/24LC00/24C00
2.0
PIN DESCRIPTIONS
Pin Function Table
PDIP
SOIC
TSSOP
DFN(1)
TDFN(1)
SOT-23
NC
1, 2, 3, 7
1, 2, 3, 7
1, 2, 3, 7
1, 2, 3, 7
1, 2, 3, 7
4
Not Connected
VSS
4
4
4
4
4
2
Ground
Name
Description
SDA
5
5
5
5
5
3
Serial Address/Data I/O
SCL
6
6
6
6
6
1
Serial Clock
VCC
8
8
8
8
8
5
+1.8V to 5.5V Power Supply
Note 1:
2.1
The exposed pad on the DFN/TDFN packages can be connected to VSS or left floating.
SDA Serial Data
This is a bidirectional pin used to transfer addresses
and data into and data out of the device. It is an open
drain terminal, therefore the SDA bus requires a pull-up
resistor to VCC (typical 10 k for 100 kHz, 2 k for
400 kHz).
For normal data transfer SDA is allowed to change only
during SCL low. Changes during SCL high are
reserved for indicating the Start and Stop conditions.
2.2
SCL Serial Clock
This input is used to synchronize the data transfer from
and to the device.
2.3
Noise Protection
The SCL and SDA inputs have Schmitt Trigger and
filter circuits which suppress noise spikes to assure
proper device operation even on a noisy bus.
DS20001178J-page 4
1996-2018 Microchip Technology Inc.
24AA00/24LC00/24C00
3.0
FUNCTIONAL DESCRIPTION
The 24XX00 supports a bidirectional 2-wire bus and
data transmission protocol. A device that sends data
onto the bus is defined as a transmitter, and a device
receiving data as a receiver. The bus has to be
controlled by a master device which generates the
Serial Clock (SCL), controls the bus access, and
generates the Start and Stop conditions, while the
24XX00 works as slave. Both master and slave can
operate as transmitter or receiver, but the master
device determines which mode is activated.
4.0
BUS CHARACTERISTICS
The following bus protocol has been defined:
• Data transfer may be initiated only when the bus
is not busy.
• During data transfer, the data line must remain
stable whenever the clock line is high. Changes in
the data line while the clock line is high will be
interpreted as a Start or Stop condition.
Accordingly, the following bus conditions have been
defined (Figure 4-1).
4.1
Bus Not Busy (A)
Both data and clock lines remain high.
4.2
Start Data Transfer (B)
A high-to-low transition of the SDA line while the clock
(SCL) is high determines a Start condition. All
commands must be preceded by a Start condition.
4.3
Stop Data Transfer (C)
A low-to-high transition of the SDA line while the clock
(SCL) is high determines a Stop condition. All
operations must be ended with a Stop condition.
4.4
Data Valid (D)
The state of the data line represents valid data when,
after a Start condition, the data line is stable for the
duration of the high period of the clock signal.
The data on the line must be changed during the low
period of the clock signal. There is one bit of data per
clock pulse.
Each data transfer is initiated with a Start condition and
terminated with a Stop condition. The number of the
data bytes transferred between the Start and Stop
conditions is determined by the master device and is
theoretically unlimited.
1996-2018 Microchip Technology Inc.
DS20001178J-page 5
24AA00/24LC00/24C00
4.5
Acknowledge
The device that acknowledges has to pull down the
SDA line during the Acknowledge clock pulse in such a
way that the SDA line is stable low during the high
period of the acknowledge related clock pulse. Of
course, setup and hold times must be taken into
account. A master must signal an end of data to the
slave by not generating an Acknowledge bit on the last
byte that has been clocked out of the slave. In this
case, the slave must leave the data line high to enable
the master to generate the Stop condition (Figure 4-2).
Each receiving device, when addressed, is obliged to
generate an acknowledge after the reception of each
byte. The master device must generate an extra clock
pulse which is associated with this Acknowledge bit.
Note:
The 24XX00 does not generate any
Acknowledge bits if an internal programming cycle is in progress.
FIGURE 4-1:
SCL
(A)
DATA TRANSFER SEQUENCE ON THE SERIAL BUS
(B)
(C)
(D)
Start
Condition
Address or
Acknowledge
Valid
(C)
(A)
SDA
FIGURE 4-2:
Stop
Condition
Data
Allowed
to Change
ACKNOWLEDGE TIMING
Acknowledge
Bit
SCL
1
SDA
2
3
4
5
6
7
Data from transmitter
Transmitter must release the SDA line at this point
allowing the Receiver to pull the SDA line low to
acknowledge the previous eight bits of data.
DS20001178J-page 6
8
9
1
2
3
Data from transmitter
Receiver must release the SDA line at this point
so the Transmitter can continue sending data.
1996-2018 Microchip Technology Inc.
24AA00/24LC00/24C00
5.0
DEVICE ADDRESSING
After generating a Start condition, the bus master
transmits a control byte consisting of a slave address
and a Read/Write bit that indicates what type of
operation is to be performed. The slave address for the
24XX00 consists of a 4-bit device code ‘1010’ followed
by three “don’t care” bits.
The last bit of the control byte determines the operation
to be performed. When set to a one a read operation is
selected, and when set to a zero a write operation is
selected (Figure 5-1). The 24XX00 monitors the bus for
its corresponding slave address all the time. It
generates an Acknowledge bit if the slave address was
true and it is not in a programming mode.
FIGURE 5-1:
CONTROL BYTE FORMAT
Read/Write Bit
Device Select
Bits
S
1
0
1
Don’t Care
Bits
0
x
x
x R/W ACK
Slave Address
Start Bit
Acknowledge Bit
1996-2018 Microchip Technology Inc.
DS20001178J-page 7
24AA00/24LC00/24C00
6.0
WRITE OPERATIONS
6.1
Byte Write
condition. This initiates the internal write cycle, and
during this time the 24XX00 will not generate Acknowledge signals (Figure 6-1). After a byte Write command,
the internal address counter will not be incremented
and will point to the same address location that was just
written. If a Stop bit is transmitted to the device at any
point in the Write command sequence before the entire
sequence is complete, then the command will abort
and no data will be written. If more than 8 data bits are
transmitted before the Stop bit is sent, then the device
will clear the previously loaded byte and begin loading
the data buffer again. If more than one data byte is
transmitted to the device and a Stop bit is sent before a
full eight data bits have been transmitted, then the
Write command will abort and no data will be written.
The 24XX00 employs a VCC threshold detector circuit
which disables the internal erase/write logic if the VCC
is below 1.5V (24AA00 and 24LC00) or 3.8V (24C00)
at nominal conditions.
Following the Start signal from the master, the device
code (4 bits), the “don’t care” bits (3 bits), and the R/W
bit (which is a logic low) are placed onto the bus by the
master transmitter. This indicates to the addressed
slave receiver that a byte with a word address will
follow after it has generated an Acknowledge bit during
the ninth clock cycle. Therefore, the next byte transmitted by the master is the word address and will be
written into the Address Pointer of the 24XX00. Only
the lower four address bits are used by the device, and
the upper four bits are “don’t cares.” The 24XX00 will
acknowledge the address byte and the master device
will then transmit the data word to be written into the
addressed memory location. The 24XX00 acknowledges again and the master generates a Stop
FIGURE 6-1:
BUS ACTIVITY
MASTER
SDA LINE
BYTE WRITE
S
T
A
R
T
S 1
BUS ACTIVITY
Control
Byte
0
1
0
x x
Word
Address
x
x
0
A
C
K
x
x
S
T
O
P
Data
P
x
A
C
K
A
C
K
x = “don’t care” bit
DS20001178J-page 8
1996-2018 Microchip Technology Inc.
24AA00/24LC00/24C00
7.0
ACKNOWLEDGE POLLING
Since the device will not acknowledge during a write
cycle, this can be used to determine when the cycle is
complete (this feature can be used to maximize bus
throughput). Once the Stop condition for a Write
command has been issued from the master, the device
initiates the internally timed write cycle. ACK polling
can be initiated immediately. This involves the master
sending a Start condition followed by the control byte
for a Write command (R/W = 0). If the device is still
busy with the write cycle, then no ACK will be returned.
If no ACK is returned, then the Start bit and control byte
must be re-sent. If the cycle is complete, then the
device will return the ACK and the master can then
proceed with the next Read or Write command. See
Figure 7-1 for flow diagram.
FIGURE 7-1:
ACKNOWLEDGE
POLLING FLOW
Send
Write Command
Send Stop
Condition to
Initiate Write Cycle
Send Start
Send Control Byte
with R/W = 0
Did Device
Acknowledge
(ACK = 0)?
No
Yes
Next
Operation
1996-2018 Microchip Technology Inc.
DS20001178J-page 9
24AA00/24LC00/24C00
8.0
READ OPERATIONS
Read operations are initiated in the same way as write
operations with the exception that the R/W bit of the
slave address is set to one. There are three basic types
of read operations: current address read, random read
and sequential read.
8.1
Current Address Read
The 24XX00 contains an address counter that maintains the address of the last word accessed, internally
incremented by one. Therefore, if the previous read
access was to address n, the next current address read
operation would access data from address n + 1. Upon
receipt of the slave address with the R/W bit set to one,
the device issues an acknowledge and transmits the
eight-bit data word. The master will not acknowledge
the transfer, but does generate a Stop condition and the
device discontinues transmission (Figure 8-1).
8.2
Random Read
Random read operations allow the master to access
any memory location in a random manner. To perform
this type of read operation, first the word address must
be set. This is done by sending the word address to the
device as part of a write operation.
FIGURE 8-1:
8.3
Sequential Read
Sequential reads are initiated in the same way as a
random read except that after the device transmits the
first data byte, the master issues an acknowledge as
opposed to a Stop condition in a random read. This
directs the device to transmit the next sequentially
addressed 8-bit word (Figure 8-3).
To provide sequential reads the 24XX00 contains an
internal Address Pointer which is incremented by one
at the completion of each read operation. This Address
Pointer allows the entire memory contents to be serially
read during one operation.
CURRENT ADDRESS READ
BUS ACTIVITY
MASTER
S
T
A
R
T
SDA LINE
S 10 10 xxx 1
BUS ACTIVITY
x = “don’t care” bit
DS20001178J-page 10
After the word address is sent, the master generates a
Start condition following the acknowledge. This terminates the write operation, but not before the internal
Address Pointer is set. Then the master issues the
control byte again, but with the R/W bit set to a one.
The 24XX00 will then issue an acknowledge and transmits the eight bit data word. The master will not
acknowledge the transfer, but does generate a Stop
condition and the device discontinues transmission
(Figure 8-2). After this command, the internal address
counter will point to the address location following the
one that was just read.
Control
Byte
S
T
O
P
Data
P
A
C
K
N
O
A
C
K
1996-2018 Microchip Technology Inc.
24AA00/24LC00/24C00
FIGURE 8-2:
RANDOM READ
S
T
BUS ACTIVITY A
MASTER
R
Control
Byte
Word
Address(n)
T
S 10 10xxx 0
SDA LINE
x xxx
Control
Byte
P
A
C
K
x = “don’t care” bit
FIGURE 8-3:
BUS ACTIVITY
MASTER
S
T
O
P
Data (n)
S 10 10xxx 1
A
C
K
A
C
K
BUS ACTIVITY
S
T
A
R
T
N
O
A
C
K
SEQUENTIAL READ
Control
Byte
Data n
Data n + 1
Data n + 2
S
T
O
P
Data n + x
P
SDA LINE
BUS ACTIVITY
A
C
K
1996-2018 Microchip Technology Inc.
A
C
K
A
C
K
A
C
K
N
O
A
C
K
DS20001178J-page 11
24AA00/24LC00/24C00
9.0
PACKAGING INFORMATION
9.1
Package Marking Information
8-Lead PDIP (300 mil)
XXXXXXXX
T/XXXNNN
YYWW
8-Lead SOIC (3.90 mm)
XXXXXXXT
XXXXYYWW
NNN
Example:
24LC00
I/P e3 13F
0527
Example:
24LC00I
SN e3 0527
13F
8-Lead TSSOP
Example:
XXXX
4L00
TYWW
I527
NNN
13F
8-Lead 2x3 DFN
XXX
YWW
NN
8-Lead 2x3 TDFN
XXX
YWW
NN
Example:
204
527
13
Example:
A04
527
13
5-Lead SOT-23
Example:
XXNN
M03F
DS20001178J-page 12
1996-2018 Microchip Technology Inc.
24AA00/24LC00/24C00
1st Line Marking Codes
Part Number
TSSOP
SOT-23
DFN
TDFN
I Temp.
E Temp.
I Temp.
E Temp.
I Temp.
E Temp.
4A00
B0NN
—
201
—
A01
—
24LC00
4L00
M0NN
—
204
—
A04
—
24C00
4C00
D0NN
E0NN
207
—
A07
A08
24AA00
Note:
NN = Alphanumeric traceability code
Legend: XX...X
T
Y
YY
WW
NNN
e3
Note:
Note:
Note:
Part number or part number code
Temperature (I, E)
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code (2 characters for small packages)
Pb-free JEDEC designator for Matte Tin (Sn)
For very small packages with no room for the Pb-free JEDEC designator
e3 , the marking will only appear on the outer carton or reel label.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
Please visit www.microchip.com/Pbfree for the latest information on Pb-free conversion.
*Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.
1996-2018 Microchip Technology Inc.
DS20001178J-page 13
24AA00/24LC00/24C00
8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
N
B
E1
NOTE 1
1
2
TOP VIEW
E
C
A2
A
PLANE
L
c
A1
e
eB
8X b1
8X b
.010
C
SIDE VIEW
END VIEW
Microchip Technology Drawing No. C04-018D Sheet 1 of 2
DS20001178J-page 14
1996-2018 Microchip Technology Inc.
24AA00/24LC00/24C00
8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
ALTERNATE LEAD DESIGN
(VENDOR DEPENDENT)
DATUM A
DATUM A
b
b
e
2
e
2
e
Units
Dimension Limits
Number of Pins
N
e
Pitch
Top to Seating Plane
A
Molded Package Thickness
A2
Base to Seating Plane
A1
Shoulder to Shoulder Width
E
Molded Package Width
E1
Overall Length
D
Tip to Seating Plane
L
c
Lead Thickness
Upper Lead Width
b1
b
Lower Lead Width
Overall Row Spacing
eB
§
e
MIN
.115
.015
.290
.240
.348
.115
.008
.040
.014
-
INCHES
NOM
8
.100 BSC
.130
.310
.250
.365
.130
.010
.060
.018
-
MAX
.210
.195
.325
.280
.400
.150
.015
.070
.022
.430
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing No. C04-018D Sheet 2 of 2
1996-2018 Microchip Technology Inc.
DS20001178J-page 15
24AA00/24LC00/24C00
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20001178J-page 16
1996-2018 Microchip Technology Inc.
24AA00/24LC00/24C00
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