93AA46AE48
1K Microwire Serial EEPROM with EUI-48™ Node Identity
Device Selection Table
Part Number
93AA46AE48
VCC Range
Word Size
Temp. Ranges
Packages
Node Address
1.8V-5.5V
8-bit
I
SN, OT
EUI-48™
Features
Description
• Preprogrammed Globally Unique 48-Bit Node
Address
• Compatible with EUI-48™ and EUI-64™
• Compatible with LAN9210, LAN9211, LAN9215,
LAN9217, LAN9218, LAN9220, LAN9221
• Low-Power CMOS Technology
• 128 x 8-Bit Organization
• Self-Timed Erase/Write Cycles
(including Auto-Erase)
• Automatic Erase All (ERAL) before Write All
(WRAL)
• Power-On/Off Data Protection Circuitry
• Industry Standard 3-Wire Serial I/O
• Device Status Signal (Ready/Busy)
• Sequential Read Function
• 1,000,000 Erase/Write Cycles
• Data Retention: >200 Years
• RoHS Compliant
• Temperature Ranges Supported:
The Microchip Technology Inc. 93AA46AE48 device is
a 1 Kbit low-voltage Serial Electrically Erasable PROM
(EEPROM) featuring an 8-bit word size. Advanced
CMOS technology makes this device ideal for
low-power, nonvolatile memory applications. The
93AA46AE48 is available in standard 8-lead SOIC and
6-lead SOT-23 packages.
- Industrial (I): -40°C to +85°C
2013-2018 Microchip Technology Inc.
Package Types (not to scale)
SOIC
(SN)
6-Lead SOT-23
(OT)
CS
1
8
VCC
CLK
2
7
NC
DI
3
6
NC
DO
4
5
VSS
DO
1
6
VCC
VSS
2
5
CS
DI
3
4
CLK
Pin Function Table
Name
Function
CS
Chip Select
CLK
Serial Data Clock
DI
Serial Data Input
DO
Serial Data Output
VSS
Ground
NC
No Internal Connection
VCC
Power Supply
DS20005229D-page 1
93AA46AE48
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings(†)
VCC.............................................................................................................................................................................7.0V
All inputs and outputs w.r.t. VSS ..........................................................................................................-0.6V to VCC +1.0V
Storage temperature ...............................................................................................................................-65°C to +150°C
Ambient temperature with power applied..................................................................................................-40°C to +85°C
ESD protection on all pins........................................................................................................................................ ≥4 kV
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to
the device. This is a stress rating only and functional operation of the device at those or any other conditions
above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating
conditions for extended periods may affect device reliability.
TABLE 1-1:
DC CHARACTERISTICS
Electrical Characteristics:
Industrial (I):
TA = -40°C to +85°C, VCC = +1.8V to +5.5V
DC CHARACTERISTICS
Param.
No.
D1
Symbol
VIH1
Characteristic
High-Level Input Voltage
VIH2
D2
VIL1
D3
VOL1
D4
VOH1
Low-Level Input Voltage
Min.
Typ.
Max.
Units
Conditions
2.0
—
VCC +1
V
0.7 VCC
—
VCC +1
V
VCC 2.7V
-0.3
—
0.8
V
VCC ≥ 2.7V
VCC ≥ 2.7V
-0.3
—
0.2 VCC
V
VCC 2.7V
Low-Level Output Voltage
—
—
0.4
V
IOL = 2.1 mA, VCC = 4.5V
—
—
0.2
V
IOL = 100 µA, VCC = 2.5V
High-Level Output Voltage
2.4
—
—
V
IOH = -400 µA, VCC = 4.5V
VIL2
VOL2
VOH2
VCC - 0.2
—
—
V
IOH = -100 µA, VCC = 2.5V
ILI
Input Leakage Current
—
—
±1
µA
VIN = VSS or VCC
D6
ILO
Output Leakage Current
—
—
±1
µA
VOUT = VSS or VCC
D7
CIN,
COUT
Pin Capacitance
(all inputs/outputs)
—
—
7
pF
VIN/VOUT = 0V (Note 1)
TA = 25°C, FCLK = 1 MHz
D5
D8
D9
ICCWRITE Write Current
ICCREAD
Read Current
—
—
2
mA
VCC = 5.5V
—
500
—
µA
VCC = 2.5V
—
—
1
mA
FCLK = 2 MHz, VCC = 5.5V
—
—
500
µA
FCLK = 2 MHz, VCC = 3.0V
—
100
—
µA
FCLK = 2 MHz, VCC = 2.5V
D10
ICCS
Standby Current
—
—
1
µA
CLK = CS = 0V
DI = VSS or VCC (Note 2)
D11
VPOR
VCC Voltage Detect
—
1.5
—
V
Note 1
Note 1: This parameter is periodically sampled and not 100% tested.
2: Ready/Busy status must be cleared from DO; see Section 4.4 “Data Out (DO)”.
2013-2018 Microchip Technology Inc.
DS20005229D-page 2
93AA46AE48
TABLE 1-2:
AC CHARACTERISTICS
AC CHARACTERISTICS
Param.
Symbol
No.
A1
A2
A3
A4
FCLK
TCKH
TCKL
TCSS
Characteristic
Clock Frequency
Clock High Time
Clock Low Time
Chip Select Setup Time
Electrical Characteristics:
Industrial (I):
TA = -40°C to +85°C, VCC = +1.8V to +5.5V
Min.
Max.
Units
Conditions
—
2
MHz
2.5V ≤ VCC 5.5V
—
1
MHz
1.8V ≤ VCC 2.5V
250
—
ns
2.5V ≤ VCC 5.5V
450
—
ns
1.8V ≤ VCC 2.5V
200
—
ns
2.5V ≤ VCC 5.5V
450
—
ns
1.8V ≤ VCC 2.5V
50
—
ns
4.5V ≤ VCC 5.5V
100
—
ns
2.5V ≤ VCC 4.5V
250
—
ns
1.8V ≤ VCC 2.5V
A5
TCSH
Chip Select Hold Time
0
—
ns
1.8V ≤ VCC 5.5V
A6
TCSL
Chip Select Low Time
250
—
ns
1.8V ≤VCC 5.5V
A7
TDIS
Data Input Setup Time
100
—
ns
2.5V ≤ VCC 5.5V
250
—
ns
1.8V ≤ VCC 2.5V
A8
TDIH
Data Input Hold Time
100
—
ns
2.5V ≤ VCC 5.5V
A9
TPD
Data Output Delay Time
A10
A11
A12
TCZ
TSV
TWC
Data Output Disable Time
Status Valid Time
Program Cycle Time
250
—
ns
1.8V ≤ VCC 2.5V
—
200
ns
4.5V ≤ VCC 5.5V, CL = 100 pF
—
250
ns
2.5V ≤ VCC 4.5V, CL = 100 pF
—
400
ns
1.8V ≤ VCC 2.5V, CL = 100 pF
—
100
ns
4.5V ≤ VCC 5.5V (Note 1)
—
200
ns
1.8V ≤ VCC 4.5V (Note 1)
—
200
ns
4.5V ≤ VCC 5.5V, CL = 100 pF
—
300
ns
2.5V ≤ VCC 4.5V, CL = 100 pF
—
500
ns
1.8V ≤VCC 2.5V, CL = 100 pF
—
6
ms
Erase/Write mode
A13
TEC
—
6
ms
ERAL mode, 4.5V ≤ VCC ≤ 5.5V
A14
TWL
—
15
ms
WRAL mode, 4.5V ≤ VCC ≤ 5.5V
1M
—
A15
Endurance
cycles 25°C, VCC = 5.0V (Note 2)
Note 1: This parameter is periodically sampled and not 100% tested.
2: This application is not tested but ensured by characterization. For endurance estimates in a specific
application, please consult the Total Endurance™ Model, which may be obtained from Microchip’s website
at www.microchip.com.
2013-2018 Microchip Technology Inc.
DS20005229D-page 3
93AA46AE48
FIGURE 1-1:
CS
SYNCHRONOUS DATA TIMING
VIH
TCSS
VIL
TCKH
TCKL
TCSH
VIH
CLK
VIL
TDIS
TDIH
VIH
DI
VIL
DO
(Read)
DO
(Program)
Note:
VOH
VOL
TPD
TPD
TCZ
TCZ
TSV
VOH
Status Valid
VOL
TSV is relative to CS.
TABLE 1-3: INSTRUCTION SET
Instruction
SB
Opcode
Address
Data In
Data Out
Req. CLK Cycles
ERASE
1
11
A6 A5 A4 A3 A2 A1 A0
—
(RDY/BSY)
10
ERAL
1
00
1
0
X
X
X
X
X
—
(RDY/BSY)
10
EWDS
1
00
0
0
X
X
X
X
X
—
High Z
10
EWEN
1
00
1
1
X
X
X
X
X
—
High Z
10
READ
1
10
A6 A5 A4 A3 A2 A1 A0
—
D7-D0
18
WRITE
1
01
A6 A5 A4 A3 A2 A1 A0
D7-D0
(RDY/BSY)
18
WRAL
1
00
D7-D0
(RDY/BSY)
18
2013-2018 Microchip Technology Inc.
0
1
X
X
X
X
X
DS20005229D-page 4
93AA46AE48
2.0
FUNCTIONAL DESCRIPTION
2.3
Data Protection
Instructions, addresses and write data are clocked into
the DI pin on the rising edge of the clock (CLK). The DO
pin is normally held in a High Z state except when
reading data from the device, or when checking the
Ready/Busy status during a programming operation.
The Ready/Busy status can be verified during an
erase/write operation by polling the DO pin; DO low
indicates that programming is still in progress, while
DO high indicates the device is ready. DO will enter the
High Z state on the falling edge of CS.
All modes of operation are inhibited when VCC is below
a typical voltage of 1.5V.
2.1
After power-up, the device is automatically in the EWDS
mode. Therefore, an EWEN instruction must be
performed before the initial ERASE or WRITE instruction
can be executed.
Start Condition
The Start bit is detected by the device if CS and DI are
both high with respect to the positive edge of CLK for
the first time.
Before a Start condition is detected, CS, CLK and DI
may change in any combination (except to that of a
Start condition), without resulting in any device
operation (Read, Write, Erase, EWEN, EWDS, ERAL
or WRAL). As soon as CS is high, the device is no
longer in Standby mode.
The EWEN and EWDS commands give additional
protection against accidentally programming during
normal operation.
Note:
For added protection, an EWDS command
should be performed after every write
operation and an external 10 k
pull-down protection resistor should be
added to the CS pin.
Block Diagram
VCC
VSS
Memory
Array
An instruction following a Start condition will only be
executed if the required opcode, address and data bits
for any particular instruction are clocked in.
Note:
2.2
When preparing to transmit an instruction,
either the CLK or DI signal levels must be
at a logic low as CS is toggled active-high.
Address
Counter
Data Register
2013-2018 Microchip Technology Inc.
Output
Buffer
DO
DI
Data In/Data Out (DI/DO)
It is possible to connect the Data In and Data Out pins
together. However, with this configuration, it is possible
for a “bus conflict” to occur during the “dummy zero”
that precedes the read operation if A0 is a logic high
level. Under such a condition, the voltage level seen at
Data Out is undefined and depends upon the relative
impedances of Data Out and the signal source driving
A0. The higher the current sourcing capability of A0,
the higher the voltage at the Data Out pin. In order to
limit this current, a resistor should be connected
between DI and DO.
Address
Decoder
CS
CLK
Mode
Decode
Logic
Clock
Register
DS20005229D-page 5
93AA46AE48
2.4
The DO pin indicates the Ready/Busy status of the
device if CS is brought high after a minimum of 250 ns
low (TCSL). DO at logical ‘0’ indicates that programming
is still in progress. DO at logical ‘1’ indicates that the
register at the specified address has been erased and
the device is ready for another instruction.
Erase
The ERASE instruction forces all data bits of the
specified address to the logical ‘1’ state. CS is brought
low following the loading of the last address bit. This
falling edge of the CS pin initiates the self-timed
programming cycle.
Note:
FIGURE 2-1:
After the Erase cycle is complete, issuing
a Start bit and then taking CS low will clear
the Ready/Busy status from DO.
ERASE TIMING
TCSL
CS
Check Status
CLK
DI
1
1
1
AN
AN-1 AN-2
•••
A0
TCZ
TSV
DO
High-Z
Busy
Ready
High Z
TWC
2013-2018 Microchip Technology Inc.
DS20005229D-page 6
93AA46AE48
2.5
The DO pin indicates the Ready/Busy status of the
device if CS is brought high after a minimum of 250 ns
low (TCSL).
Erase All (ERAL)
The Erase All (ERAL) instruction will erase the entire
memory array to the logical ‘1’ state. The ERAL cycle is
identical to the erase cycle, except for the different
opcode. The ERAL cycle is completely self-timed and
commences at the falling edge of the CS. Clocking of
the CLK pin is not necessary after the device has
entered the ERAL cycle.
FIGURE 2-2:
VCC must be ≥4.5V for proper operation of ERAL.
Note:
After the ERAL command is complete,
issuing a Start bit and then taking CS low
will clear the Ready/Busy status from DO.
ERAL TIMING
TCSL
CS
Check Status
CLK
DI
1
0
0
1
0
x
•••
x
TCZ
TSV
DO
Note:
High-Z
VCC must be ≥4.5V for proper operation of ERAL.
2013-2018 Microchip Technology Inc.
Busy
Ready
High Z
TEC
DS20005229D-page 7
93AA46AE48
2.6
To protect against accidental data disturbance, the
EWDS instruction can be used to disable all erase/write
functions and should follow all programming
operations. Execution of a READ instruction is
independent of both the EWEN and EWDS instructions.
Erase/Write Disable and Enable
(EWDS/EWEN)
The 93AA46AE48 powers up in the Erase/Write
Disable (EWDS) state. All programming modes must
be preceded by an Erase/Write Enable (EWEN)
instruction. Once the EWEN instruction is executed,
programming remains enabled until an EWDS
instruction is executed or Vcc is removed from the
device.
FIGURE 2-3:
EWDS TIMING
TCSL
CS
CLK
DI
1
FIGURE 2-4:
0
0
0
0
x
•••
x
EWEN TIMING
TCSL
CS
CLK
1
DI
2.7
0
0
1
1
x
•••
x
Read
The READ instruction outputs the serial data of the
addressed memory location on the DO pin. A dummy
zero bit precedes the 8-bit output string.
The output data bits will toggle on the rising edge of the
CLK and are stable after the specified time delay (TPD).
Sequential read is possible when CS is held high. The
memory data will automatically cycle to the next register
and output sequentially.
2013-2018 Microchip Technology Inc.
DS20005229D-page 8
93AA46AE48
FIGURE 2-5:
READ TIMING
CS
CLK
DI
1
0
AN
•••
High Z
DO
2.8
1
A0
0
Dx
•••
D0
Dx
•••
D0
Dx
•••
D0
Write
The WRITE instruction is followed by eight bits of data,
which are written into the specified address. For
93AA46AE48, after the last data bit is clocked into DI,
the falling edge of CS initiates the self-timed auto-erase
and programming cycle.
The DO pin indicates the Ready/Busy status of the
device if CS is brought high after a minimum of 250 ns
low (TCSL). DO at logical ‘0’ indicates that programming
is still in progress. DO at logical ‘1’ indicates that the
register at the specified address has been written with
the data specified and the device is ready for another
instruction.
Note:
After the Write cycle is complete, issuing a
Start bit and then taking CS low will clear
the Ready/Busy status from DO.
FIGURE 2-6:
WRITE TIMING
TCSL
CS
CLK
DI
1
0
1
AN
•••
A0
Dx
•••
D0
TSV
DO
High Z
Busy
TCZ
Ready
High Z
TWC
2013-2018 Microchip Technology Inc.
DS20005229D-page 9
93AA46AE48
2.9
Write All (WRAL)
The Write All (WRAL) instruction will write the entire
memory array with the data specified in the command.
For 93AA46AE48, after the last data bit is clocked into
DI, the falling edge of CS initiates the self-timed
auto-erase and programming cycle. Clocking of the
CLK pin is not necessary after the device has entered
the WRAL cycle. The WRAL command does include an
automatic ERAL cycle for the device. Therefore, the
WRAL instruction does not require an ERAL instruction,
but the chip must be in the EWEN status.
The DO pin indicates the Ready/Busy status of the
device if CS is brought high after a minimum of 250 ns
low (TCSL).
VCC must be 4.5V for proper operation of WRAL.
Note:
After the Write All cycle is complete,
issuing a Start bit and then taking CS low
will clear the Ready/Busy status from DO.
FIGURE 2-7:
WRAL TIMING
TCSL
CS
CLK
DI
1
0
0
0
1
x
•••
x
Dx
•••
D0
TSV
DO
High-Z
Busy
TCZ
Ready
HIGH-Z
TWL
Note:
VCC must be ≥4.5V for proper operation of WRAL.
2013-2018 Microchip Technology Inc.
DS20005229D-page 10
93AA46AE48
3.0
PREPROGRAMMED EUI-48
NODE ADDRESS
Note:
The 93AA46AE48 is programmed at the factory with a
globally unique node address stored at the beginning of
the array. It is preceded by the EEPROM Programmed
Indicator (EPI), which indicates valid programming.
The 93AA46AE48 is designed to be compatible with
the following SMSC Ethernet controllers: LAN9210,
LAN9211, LAN9215, LAN9217, LAN9218, LAN9220,
and LAN9221. These controllers will automatically
detect and load the EUI-48 node address from the
93AA46AE48 at start-up.
3.1
EUI-48 Node Address
The 6-byte EUI-48 node address value of the
93AA46AE48 is stored in array locations 0x01 through
0x06, as shown in Figure 3-1. The first three bytes are
the Organizationally Unique Identifier (OUI) assigned
to Microchip by the IEEE Registration Authority. The
remaining three bytes are the Extension Identifier, and
are generated by Microchip to ensure a globally
unique, 48-bit value.
3.1.0.1
3.1.1
EUI-64 SUPPORT USING THE
93AA46AE48
The preprogrammed EUI-48 node address of the
93AA46AE48 can easily be encapsulated at the
application level to form a globally unique, 64-bit node
address for systems utilizing the EUI-64 standard. This
is done by adding 0xFFFE between the OUI and the
Extension Identifier as shown below.
3.2
EEPROM Programmed Indicator
(EPI)
In addition to the node address, a programmed
indicator code is stored at the location 0x00. The code
is fixed as 0xA5. Its purpose is to let the master device
know that the EEPROM has been programmed with a
valid MAC address.
Organizationally Unique Identifiers
(OUIs)
Note:
Each OUI provides roughly 16M (224) addresses. Once
the address pool for an OUI is exhausted, Microchip
will acquire a new OUI from IEEE to use for
programming this model. For more information on past
and current OUIs see “Organizationally Unique
Identifiers For Preprogrammed EUI-48 and EUI-64
Address Devices” Technical Brief (DS90003187).
FIGURE 3-1:
The OUI will change as addresses are
exhausted. Customers are not guaranteed to receive a specific OUI and should
design their application to accept new
OUIs as they are introduced.
The preprogrammed values are not
write-protected and can be overwritten by
the user. Care must be taken not to
overwrite the values unintentionally.
EUI-48 NODE ADDRESS PHYSICAL MEMORY MAP EXAMPLE
Description
EPI
24-bit Organizationally
Unique Identifier
24-bit Extension
Identifier
Data
A5h
00h
04h
A3h
12h
34h
56h
Array
Address
00h
01h
02h
03h
04h
05h
06h
Corresponding EUI-48™ Node Address: 00-04-A3-12-34-56
Corresponding EUI-64™ Node Address After Encapsulation: 00-04-A3-FF-FE-12-34-56
2013-2018 Microchip Technology Inc.
DS20005229D-page 11
93AA46AE48
4.0
PIN DESCRIPTIONS
The description of the pins are listed in Table 4-1.
TABLE 4-1:
4.1
PIN FUNCTION TABLE
Name
SOIC
SOT-23
CS
1
5
Chip Select
CLK
2
4
Serial Clock
DI
3
3
Data In
DO
4
1
Data Out
VSS
5
2
Ground
NC
6
—
No Internal Connection
NC
7
—
No Internal Connection
VCC
8
6
Power Supply
Chip Select (CS)
A high level selects the device; a low level deselects
the device and forces it into Standby mode. However, a
programming cycle that is already in progress will be
completed, regardless of the Chip Select (CS) input
signal. If CS is brought low during a program cycle, the
device will go into Standby mode as soon as the
programming cycle is completed.
CS must be low for 250 ns minimum (TCSL) between
consecutive instructions. If CS is low, the internal
control logic is held in a Reset status.
4.2
Function
Serial Clock (CLK)
The Serial Clock is used to synchronize the
communication between a master device and the
93AA46AE48 series device. Opcodes, address and
data bits are clocked in on the positive edge of CLK.
Data bits are also clocked out on the positive edge of
CLK.
CLK can be stopped anywhere in the transmission
sequence (at high or low level) and can be continued
anytime with respect to clock high time (TCKH) and
clock low time (TCKL). This gives the controlling master
freedom in preparing opcode, address and data.
4.3
Data In (DI)
Data In (DI) is used to clock in a Start bit, opcode,
address and data synchronously with the CLK input.
4.4
Data Out (DO)
Data Out (DO) is used in the Read mode to output data
synchronously with the CLK input (TPD after the
positive edge of CLK).
This pin also provides Ready/Busy status information
during erase and write cycles. Ready/Busy status
information is available on the DO pin if CS is brought
high after being low for minimum Chip Select low time
(TCSL) and an erase or write operation has been
initiated.
The Status signal is not available on DO if CS is held
low during the entire erase or write cycle. In this case,
DO is in the High Z mode. If status is checked after the
erase/write cycle, the data line will be high to indicate
the device is ready.
Note:
After a programming cycle is complete,
issuing a Start bit and then taking CS low
will clear the Ready/Busy status from DO.
CLK is a “don't care” if CS is low (device deselected). If
CS is high, but the Start condition has not been
detected (DI = 0), any number of clock cycles can be
received by the device without changing its status
(i.e., waiting for a Start condition).
CLK cycles are not required during the self-timed write
(i.e., auto erase/write) cycle.
After detection of a Start condition, the specified
number of clock cycles (respectively low-to-high
transitions of CLK) must be provided. These clock
cycles are required to clock in all required opcode,
address and data bits before an instruction is executed.
CLK and DI then become “don't care” inputs waiting for
a new Start condition to be detected.
2013-2018 Microchip Technology Inc.
DS20005229D-page 12
93AA46AE48
5.0
PACKAGING INFORMATION
5.1
Package Marking Information
8-Lead SOIC
Example
XXXXXXXX
XXXXYYWW
NNN
3A4AE48I
SN e3 1628
1L7
6-Lead SOT-23
Example
XXXXY
WWNNN
AAAK6
281L7
1st Line Marking Codes
Part Number
93AA46AE48
Legend: XX...X
T
Y
YY
WW
NNN
e3
SOIC
SOT-23
3A4AE48T
AAAKY
Part number or part number code
Temperature (I, E)
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code (2 characters for small packages)
Pb-free JEDEC® designator for Matte Tin (Sn)
Note:
For very small packages with no room for the Pb-free JEDEC® designator
e3 , the marking will only appear on the outer carton or reel label.
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
2013-2018 Microchip Technology Inc.
DS20005229D-page 13
93AA46AE48
8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2X
0.10 C A–B
D
A
D
NOTE 5
N
E
2
E1
2
E1
E
NOTE 1
2
1
e
B
NX b
0.25
C A–B D
NOTE 5
TOP VIEW
0.10 C
C
A A2
SEATING
PLANE
8X
A1
SIDE VIEW
0.10 C
h
R0.13
h
R0.13
H
SEE VIEW C
VIEW A–A
0.23
L
(L1)
VIEW C
Microchip Technology Drawing No. C04-057-SN Rev D Sheet 1 of 2
2013-2018 Microchip Technology Inc.
DS20005229D-page 14
93AA46AE48
8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
Number of Pins
N
e
Pitch
Overall Height
A
Molded Package Thickness
A2
§
Standoff
A1
Overall Width
E
Molded Package Width
E1
Overall Length
D
Chamfer (Optional)
h
Foot Length
L
Footprint
L1
Foot Angle
c
Lead Thickness
b
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
MIN
1.25
0.10
0.25
0.40
0°
0.17
0.31
5°
5°
MILLIMETERS
NOM
8
1.27 BSC
6.00 BSC
3.90 BSC
4.90 BSC
1.04 REF
-
MAX
1.75
0.25
0.50
1.27
8°
0.25
0.51
15°
15°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed 0.15mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
5. Datums A & B to be determined at Datum H.
Microchip Technology Drawing No. C04-057-SN Rev D Sheet 2 of 2
2013-2018 Microchip Technology Inc.
DS20005229D-page 15
93AA46AE48
8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
SILK SCREEN
C
Y1
X1
E
RECOMMENDED LAND PATTERN
Units
Dimension Limits
E
Contact Pitch
Contact Pad Spacing
C
Contact Pad Width (X8)
X1
Contact Pad Length (X8)
Y1
MIN
MILLIMETERS
NOM
1.27 BSC
5.40
MAX
0.60
1.55
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-2057-SN Rev B
2013-2018 Microchip Technology Inc.
DS20005229D-page 16
93AA46AE48
6-Lead Plastic Small Outline Transistor (OT, OTY) [SOT-23]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2X
0.15 C A-B
D
e1
A
D
E
2
E1
E
E1
2
2X
0.15 C D
2X
0.20 C A-B
e
6X b
B
0.20
C A-B D
TOP VIEW
C
A
A2
SEATING PLANE
6X
A1
0.10 C
SIDE VIEW
R1
L2
R
c
GAUGE PLANE
L
Ĭ
(L1)
END VIEW
Microchip Technology Drawing C04-028C (OT) Sheet 1 of 2
2013-2018 Microchip Technology Inc.
DS20005229D-page 17
93AA46AE48
6-Lead Plastic Small Outline Transistor (OT, OTY) [SOT-23]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
N
Number of Leads
e
Pitch
Outside lead pitch
e1
Overall Height
A
Molded Package Thickness
A2
Standoff
A1
Overall Width
E
Molded Package Width
E1
Overall Length
D
Foot Length
L
Footprint
L1
Seating Plane to Gauge Plane
L1
φ
Foot Angle
c
Lead Thickness
Lead Width
b
MIN
0.90
0.89
0.00
0.30
0°
0.08
0.20
MILLIMETERS
NOM
6
0.95 BSC
1.90 BSC
1.15
2.80 BSC
1.60 BSC
2.90 BSC
0.45
0.60 REF
0.25 BSC
-
MAX
1.45
1.30
0.15
0.60
10°
0.26
0.51
Notes:
1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed 0.25mm per side.
2. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-028C (OT) Sheet 2 of 2
2013-2018 Microchip Technology Inc.
DS20005229D-page 18
93AA46AE48
6-Lead Plastic Small Outline Transistor (OT, OTY) [SOT-23]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
GX
Y
Z
C G
G
SILK SCREEN
X
E
RECOMMENDED LAND PATTERN
Units
Dimension Limits
E
Contact Pitch
C
Contact Pad Spacing
X
Contact Pad Width (X3)
Y
Contact Pad Length (X3)
G
Distance Between Pads
Distance Between Pads
GX
Z
Overall Width
MIN
MILLIMETERS
NOM
0.95 BSC
2.80
MAX
0.60
1.10
1.70
0.35
3.90
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing No. C04-2028B (OT)
2013-2018 Microchip Technology Inc.
DS20005229D-page 19
93AA46AE48
APPENDIX A:
REVISION HISTORY
Revision A (October 2013)
Initial release of this document.
Revision B (December 2014)
Updated Section 3.0 “Preprogrammed EUI-48 Node
Address”; Updated “Product Identification System”
section; Minor typographical corrections.
Revision C (August 2016)
Added new OUI (54-10-EC) to list.
Revision D (02/2018)
Added detailed description of OUIs.
2013-2018 Microchip Technology Inc.
DS20005229D-page 20
93AA46AE48
THE MICROCHIP WEBSITE
CUSTOMER SUPPORT
Microchip provides online support via our website at
www.microchip.com. This website is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the website contains the following information:
Users of Microchip products can receive assistance
through several channels:
• Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
• General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
• Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Customers
should
contact
their
distributor,
representative or Field Application Engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical support is available through the website
at: http://microchip.com/support
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip website at
www.microchip.com. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.
2013-2018 Microchip Technology Inc.
DS20005229D-page 21
93AA46AE48
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
X
PART NO.
Device
Device:
(1)
X
Tape & Reel
93AA46AE48:
Temperature
Range
/XX
Package
Examples:
a)
1K 1.8V Microwire Serial EEPROM
with EUI-48™ Node Identity
b)
Tape and
Blank =
Reel Option: T
=
Standard packaging (tube or tray)
Tape and Reel(1)
Temperature I
Range:
=
-40°C to +85°C
=
=
Plastic SOT-23, 6-lead (Tape & Reel only)
Plastic SOIC (3.9 mm body), 8-lead
c)
Package:
OT
SN
93AA46AE48-I/SN: 1K, 128x8 Serial
EEPROM,
with
EUI-48 Node Identity, 1.8V, Industrial
Temperature, SOIC
package.
93AA46AE48T-I/SN: 1K, 128x8 Serial
EEPROM
with
EUI-48 Node Identity, 1.8V, Tape &
Reel,
Industrial
Temperature SOIC
package.
93AA46AE48T-I/OT: 1K, 128x8 Serial
EEPROM
with
EUI-48 Node Identity, 1.8V, Tape &
Reel,
Industrial
Temperature,
SOT-23 package.
Note 1:
2013-2018 Microchip Technology Inc.
Tape and Reel identifier only
appears in the catalog part number
description. This identifier is used for
ordering purposes and is not printed
on the device package. Check with
your Microchip Sales Office for
package availability with the Tape
and Reel option.
DS20005229D-page 22
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate, AVR,
AVR logo, AVR Freaks, BeaconThings, BitCloud, chipKIT, chipKIT
logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR,
Heldo, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, LINK
MD, maXStylus, maXTouch, MediaLB, megaAVR, MOST, MOST
logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32
logo, Prochip Designer, QTouch, RightTouch, SAM-BA, SpyNIC,
SST, SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are
registered trademarks of Microchip Technology Incorporated in
the U.S.A. and other countries.
ClockWorks, The Embedded Control Solutions Company,
EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,
mTouch, Precision Edge, and Quiet-Wire are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BodyCom, CodeGuard,
CryptoAuthentication, CryptoCompanion, CryptoController,
dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM,
ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, InterChip Connectivity, JitterBlocker, KleerNet, KleerNet logo, Mindi,
MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB,
MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation,
PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, QMatrix,
RightTouch logo, REAL ICE, Ripple Blocker, SAM-ICE, Serial
Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II,
Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
Silicon Storage Technology is a registered trademark of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip Technology
Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2013-2018, Microchip Technology Incorporated, All Rights
Reserved.
ISBN: 978-1-5224-2739-1
== ISO/TS 16949 ==
2013-2018 Microchip Technology Inc.
DS20005229D-page 23
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Australia - Sydney
Tel: 61-2-9868-6733
India - Bangalore
Tel: 91-80-3090-4444
China - Beijing
Tel: 86-10-8569-7000
India - New Delhi
Tel: 91-11-4160-8631
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
China - Chengdu
Tel: 86-28-8665-5511
India - Pune
Tel: 91-20-4121-0141
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
China - Chongqing
Tel: 86-23-8980-9588
Japan - Osaka
Tel: 81-6-6152-7160
Finland - Espoo
Tel: 358-9-4520-820
China - Dongguan
Tel: 86-769-8702-9880
Japan - Tokyo
Tel: 81-3-6880- 3770
China - Guangzhou
Tel: 86-20-8755-8029
Korea - Daegu
Tel: 82-53-744-4301
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
China - Hangzhou
Tel: 86-571-8792-8115
Korea - Seoul
Tel: 82-2-554-7200
China - Hong Kong SAR
Tel: 852-2943-5100
Malaysia - Kuala Lumpur
Tel: 60-3-7651-7906
China - Nanjing
Tel: 86-25-8473-2460
Malaysia - Penang
Tel: 60-4-227-8870
China - Qingdao
Tel: 86-532-8502-7355
Philippines - Manila
Tel: 63-2-634-9065
China - Shanghai
Tel: 86-21-3326-8000
Singapore
Tel: 65-6334-8870
China - Shenyang
Tel: 86-24-2334-2829
Taiwan - Hsin Chu
Tel: 886-3-577-8366
China - Shenzhen
Tel: 86-755-8864-2200
Taiwan - Kaohsiung
Tel: 886-7-213-7830
China - Suzhou
Tel: 86-186-6233-1526
Taiwan - Taipei
Tel: 886-2-2508-8600
China - Wuhan
Tel: 86-27-5980-5300
Thailand - Bangkok
Tel: 66-2-694-1351
China - Xian
Tel: 86-29-8833-7252
Vietnam - Ho Chi Minh
Tel: 84-28-5448-2100
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Austin, TX
Tel: 512-257-3370
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Novi, MI
Tel: 248-848-4000
Houston, TX
Tel: 281-894-5983
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Tel: 317-536-2380
China - Xiamen
Tel: 86-592-2388138
China - Zhuhai
Tel: 86-756-3210040
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Tel: 951-273-7800
Raleigh, NC
Tel: 919-844-7510
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Tel: 408-436-4270
Canada - Toronto
Tel: 905-695-1980
Fax: 905-695-2078
2013-2018 Microchip Technology Inc.
Germany - Garching
Tel: 49-8931-9700
Germany - Haan
Tel: 49-2129-3766400
Germany - Heilbronn
Tel: 49-7131-67-3636
Germany - Karlsruhe
Tel: 49-721-625370
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Germany - Rosenheim
Tel: 49-8031-354-560
Israel - Ra’anana
Tel: 972-9-744-7705
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Italy - Padova
Tel: 39-049-7625286
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Norway - Trondheim
Tel: 47-7289-7561
Poland - Warsaw
Tel: 48-22-3325737
Romania - Bucharest
Tel: 40-21-407-87-50
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Gothenberg
Tel: 46-31-704-60-40
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
DS20005229D-page 24
10/25/17
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