MCP2200
Breakout Module
User’s Guide
2012 Microchip Technology Inc.
DS52064A
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
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OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
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arising from this information and its use. Use of Microchip
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Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,
PIC32 logo, rfPIC and UNI/O are registered trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, chipKIT,
chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net,
dsPICworks, dsSPEAK, ECAN, ECONOMONITOR,
FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP,
Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB,
MPLINK, mTouch, Omniscient Code Generation, PICC,
PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE,
rfLAB, Select Mode, Total Endurance, TSHARC,
UniWinDriver, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2012, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 978-1-62076-297-4
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS52064A-page 2
2012 Microchip Technology Inc.
MCP2200 BREAKOUT MODULE
USER’S GUIDE
Table of Contents
Preface ........................................................................................................................... 5
Introduction............................................................................................................ 5
Document Layout .................................................................................................. 5
Conventions Used in this Guide ............................................................................ 6
Recommended Reading........................................................................................ 7
The Microchip Web Site ........................................................................................ 7
Customer Support ................................................................................................. 7
Document Revision History ................................................................................... 7
Chapter 1. Product Overview
1.1 Introduction ..................................................................................................... 9
1.2 What Is the MCP2200 Breakout Module? ...................................................... 9
1.3 What the MCP2200 Breakout Module Kit Contains ....................................... 9
Chapter 2. Installation and Operation
2.1 Introduction ................................................................................................... 11
2.2 Board Setup ................................................................................................. 11
2.3 Board Operation ........................................................................................... 12
2.4 MCP2200 Typical Usage Scenarios ............................................................. 13
Appendix A. Schematic and Layouts
A.1 Introduction .................................................................................................. 15
A.2 Board – Schematic ....................................................................................... 16
A.3 Board – Top Silk .......................................................................................... 17
A.4 Board – Top Silk and Pads .......................................................................... 18
A.5 Board – Top Copper .................................................................................... 19
A.6 Board – Bottom Silk ..................................................................................... 20
A.7 Board – Bottom Silk and Pads ..................................................................... 21
A.8 Board – Bottom Copper ............................................................................... 22
Appendix B. Bill of Materials (BOM)
Worldwide Sales and Service .................................................................................... 24
2012 Microchip Technology Inc.
DS52064A-page 3
2012 Microchip Technology Inc.
DS52064A-page 4
MCP2200 BREAKOUT MODULE
USER’S GUIDE
Preface
NOTICE TO CUSTOMERS
All documentation becomes dated, and this manual is no exception. Microchip tools and
documentation are constantly evolving to meet customer needs, so some actual dialogs
and/or tool descriptions may differ from those in this document. Please refer to our web site
(www.microchip.com) to obtain the latest documentation available.
Documents are identified with a “DS” number. This number is located on the bottom of each
page, in front of the page number. The numbering convention for the DS number is
“DSXXXXXA”, where “XXXXX” is the document number and “A” is the revision level of the
document.
For the most up-to-date information on development tools, see the MPLAB® IDE online help.
Select the Help menu, and then Topics to open a list of available online help files.
INTRODUCTION
This chapter contains general information that will be useful to know before using the
MCP2200 Breakout Module. Items discussed in this chapter include:
•
•
•
•
•
•
Document Layout
Conventions Used in this Guide
Recommended Reading
The Microchip Web Site
Customer Support
Document Revision History
DOCUMENT LAYOUT
This document describes how to use the MCP2200 Breakout Module board. The
manual layout is as follows:
• Chapter 1. “Product Overview” – Important information about the MCP2200
Breakout Module
• Chapter 2. “Installation and Operation” – Covers the initial set-up of this board,
required tools and board operation
• Appendix A. “Schematic and Layouts” – Shows the schematic and board
layouts for the MCP2200 Breakout Module
• Appendix B. “Bill of Materials (BOM)” – Lists the parts used to populate the
MCP2200 Breakout Module
2012 Microchip Technology Inc.
DS52064A-page 5
MCP2200 Breakout Module User’s Guide
CONVENTIONS USED IN THIS GUIDE
This manual uses the following documentation conventions:
DOCUMENTATION CONVENTIONS
Description
Arial font:
Italic characters
Initial caps
Quotes
Underlined, italic text with
right angle bracket
Bold characters
N‘Rnnnn
Text in angle brackets < >
Courier New font:
Plain Courier New
Represents
Referenced books
Emphasized text
A window
A dialog
A menu selection
A field name in a window or
dialog
A menu path
MPLAB® IDE User’s Guide
...is the only compiler...
the Output window
the Settings dialog
select Enable Programmer
“Save project before build”
A dialog button
A tab
A number in verilog format,
where N is the total number of
digits, R is the radix and n is a
digit.
A key on the keyboard
Click OK
Click the Power tab
4‘b0010, 2‘hF1
Italic Courier New
Sample source code
Filenames
File paths
Keywords
Command-line options
Bit values
Constants
A variable argument
Square brackets [ ]
Optional arguments
Curly brackets and pipe
character: { | }
Ellipses...
Choice of mutually exclusive
arguments; an OR selection
Replaces repeated text
Represents code supplied by
user
DS52064A-page 6
Examples
File>Save
Press ,
#define START
autoexec.bat
c:\mcc18\h
_asm, _endasm, static
-Opa+, -Opa0, 1
0xFF, ‘A’
file.o, where file can be
any valid filename
mcc18 [options] file
[options]
errorlevel {0|1}
var_name [,
var_name...]
void main (void)
{ ...
}
2012 Microchip Technology Inc.
Preface
RECOMMENDED READING
This user's guide describes how to use the MCP2200 Breakout Module. Another useful
document is listed below. The following Microchip document is available and
recommended as a supplemental reference resource.
• MCP2200 Data Sheet - “USB 2.0 to UART Protocol Converter with GPIO”
(DS22228)
THE MICROCHIP WEB SITE
Microchip provides online support via our web site at www.microchip.com. This web
site is used as a means to make files and information easily available to customers.
Accessible by using your favorite Internet browser, the web site contains the following
information:
• Product Support – Data sheets and errata, application notes and sample
programs, design resources, user’s guides and hardware support documents,
latest software releases and archived software
• General Technical Support – Frequently Asked Questions (FAQs), technical
support requests, online discussion groups, Microchip consultant program
member listing
• Business of Microchip – Product selector and ordering guides, latest Microchip
press releases, listing of seminars and events, listings of Microchip sales offices,
distributors and factory representatives
CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels:
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Customers should contact their distributor, representative or field application engineer
(FAE) for support. Local sales offices are also available to help customers. A listing of
sales offices and locations is included in the back of this document.
Technical support is available through the web site at:
http://www.microchip.com/support.
DOCUMENT REVISION HISTORY
Revision A (May 2012)
• Initial Release of this Document.
2012 Microchip Technology Inc.
DS52064A-page 7
MCP2200 Breakout Module User’s Guide
NOTES:
DS52064A-page 8
2012 Microchip Technology Inc.
MCP2200 BREAKOUT
MODULE USER’S GUIDE
Chapter 1. Product Overview
1.1
INTRODUCTION
This chapter provides an overview of the MCP2200 Breakout Module and covers the
following topics:
• What Is the MCP2200 Breakout Module?
• What the MCP2200 Breakout Module Kit Contains
1.2
WHAT IS THE MCP2200 BREAKOUT MODULE?
The MCP2200 Breakout Module is a development and evaluation platform for the
USB-to-UART (Universal Serial Bus-to-Universal Asynchronous Receiver/Transmitter)
serial converter MCP2200 device. The module is comprised of a single Dual In-Line
Package (DIP) form-factor board.
The MCP2200 Breakout Module has the following features:
• UART Tx and Rx signals
• UART RTS and CTS signals
• 8 General Purpose (GP) lines - configurable for GPIO or dedicated function operation
• User selectable power supply of 3.3V or 5V (up to 500 mA) by using a jumper
• DIP form-factor (0.6 inches overall row spacing between pins)
• PICkit™ Serial Analyzer header – used for UART communication only
A Windows®-based PC software was created to help with the evaluation/demonstration
of the MCP2200 device as a USB-to-UART protocol converter. It allows I/O control and
custom device configuration. The software is downloadable from the board web page
on www.microchip.com.
1.3
WHAT THE MCP2200 BREAKOUT MODULE KIT CONTAINS
The MCP2200 Breakout Module kit includes:
• MCP2200 Breakout Module (ADM00393)
• Mini-USB cable
• Important Information Sheet
2012 Microchip Technology Inc.
DS52064A-page 9
MCP2200 Breakout Module User’s Guide
NOTES:
DS52064A-page 10
2012 Microchip Technology Inc.
MCP2200 BREAKOUT
MODULE USER’S GUIDE
Chapter 2. Installation and Operation
2.1
INTRODUCTION
The MCP2200 Breakout Module is designed to demonstrate the device as an
USB-to-UART protocol converter solution.
The module is comprised of a single board and has the following features:
• Small plug-in board with DIP form factor (0.6 inches overall row spacing between
pins)
• Mini-USB connector
• Access to the UART signals (Tx, Rx, RTS and CTS) and all GP signals
• PICkit™ Serial Analyzer compatible header
• 3.3 or 5V jumper selectable VDD; the breakout board can be used to supply up to
100 mA to the rest of the system. The board already provides a signal trace
between the VDD and the 3.3V rail. For systems requiring a 5V VDD power supply,
the VDD header must be mounted on the board. A jumper will close the middle pin
and the 5V pin.
2.2
BOARD SETUP
Follow these steps to set up the MCP2200 Breakout Module:
1. Download the support material (PC applications and DLL libraries) that can be
found on the board’s web page, on the Microchip web site.
2. Attach the MCP2200 Breakout Module to the system that requires the
USB-to-UART conversion, using a DIP adapter or the PICkit™ Serial Analyzer
header.
3. Plug the MCP2200 Breakout Module to a PC via a USB cable.
4. In the dialog window that appears, browse for MCP2200.inf to install the driver.
The board is now set up for operation.Optional steps include the following:
5. Install the downloaded PC software.
6. Start the demo application developed for the board, or a hyperterminal-like
application, in order to get access to the virtual COM port created by the PC for
the MCP2200 device.
2012 Microchip Technology Inc.
DS52064A-page 11
MCP2200 Breakout Module User’s Guide
FIGURE 2-1:
2.3
BREAKOUT BOARD LAYOUT
BOARD OPERATION
The MCP2200 device is detected by a Windows®-based PC host as a composite
device. The accompanying software can be used to exercise the board’s features and
also provides a reference point for users that want to design their own applications
based on the MCP2200 device.
2.3.1
MCP2200 Breakout Module Operation
The MCP2200 Breakout Module can be used with a UART-based system. The
breakout board eases the USB support addition.
The board has the following features:
• UART signals (Tx, Rx, RTS and CTS)
• 8 GP signals that can be configured for:
- GPIO functionality (digital input or output pins)
- Dedicated function pins (signaling import system states, such as USB
Configured, USB Suspend)
• Jumper selectable power supply: 3.3 or 5V (up to 500 mA)
• PICkit™ Serial Analyzer header - the board can be directly plugged into systems
that have this type of header. The MCP2200 Breakout Module provides the
UART-to-USB access.
• DIP form-factor (0.6 inches overall row spacing between pins)
By using the provided software and libraries, the user can create personalized PC
applications, using the breakout board as an USB-to-UART protocol converter.
DS52064A-page 12
2012 Microchip Technology Inc.
Installation and Operation
2.4
MCP2200 TYPICAL USAGE SCENARIOS
MCP2200 can be used in systems where a UART bus is available. The MCP2200
enables the USB connection to a UART-based system.
FIGURE 2-2:
MCP2200 TYPICAL USAGE DIAGRAM
MCP2200 Breakout Board
MCP2200
2012 Microchip Technology Inc.
Tx
VDD
GND
Rx
Rx
Tx
UART-based system
GND
DS52064A-page 13
MCP2200 Breakout Module User’s Guide
NOTES:
DS52064A-page 14
2012 Microchip Technology Inc.
MCP2200 BREAKOUT
MODULE USER’S GUIDE
Appendix A. Schematic and Layouts
A.1
INTRODUCTION
This appendix contains the following schematics and layouts for the MCP2200
Breakout Module:
•
•
•
•
•
•
•
Board – Schematic
Board – Top Silk
Board – Top Silk and Pads
Board – Top Copper
Board – Bottom Silk
Board – Bottom Silk and Pads
Board – Bottom Copper
2012 Microchip Technology Inc.
DS52064A-page 15
BOARD – SCHEMATIC
5V
J1
VDD
1
R1
4.7k
1 2 3
1
C3
0.1uF 10%
0603
GND
1
3
C5
0.1uF
0603
5
3
GND
GND
J3
D+
ID
GND
GND
2
HDR M 1x3 VERT
D-
USB-B-Mini SMD
GND D
VDD
J2
7 6 5 4 3 2 1
GND
5V
GND
D
C2
0.1uF
10%
0603
VOUT
X1
12MHz
USB_P
GND
GND
GP7
GP6
GP5
GP4
GP3
TX
RX
1
2
3
4
5
6
7
8
9
10
VDD
VSS
OSC1
D+
OSC2
DRST
VUSB
GP7/TxL ED GP0
GP6/RxL ED GP1
GP5
GP2
GP4
CTS
GP3
RX
TX
RTS
20
19
18
17
16
15
14
13
12
11
GND
VDD
USB_P
USB_N
VUSB
J4
C4
0603
0.1uF
10%
GP0
GP1
GP2
CTS
RTS
RX
U1
7 6 5 4 3 2 1
C1
4.7uF
0603
VIN
3.3V
2
2
4
VDD
MCP1700
3
GND
VUSB
U2
5V
VDD
5%
0603
USB_N
VBUS
HDR M 1x7 VERT
HDR M 1x7 VERT
2012 Microchip Technology Inc.
RTS
CTS
TX
RX
GND
VDD
TM
6 5 4 3 2 1
J5
HDR M 1x6 VERT
PICkit
Serial
MCP2200 Breakout Module User’s Guide
DS52064A-page 16
A.2
Schematic and Layouts
A.3
BOARD – TOP SILK
2012 Microchip Technology Inc.
DS52064A-page 17
MCP2200 Breakout Module User’s Guide
A.4
BOARD – TOP SILK AND PADS
DS52064A-page 18
2012 Microchip Technology Inc.
Schematic and Layouts
A.5
BOARD – TOP COPPER
2012 Microchip Technology Inc.
DS52064A-page 19
MCP2200 Breakout Module User’s Guide
A.6
BOARD – BOTTOM SILK
DS52064A-page 20
2012 Microchip Technology Inc.
Schematic and Layouts
A.7
BOARD – BOTTOM SILK AND PADS
2012 Microchip Technology Inc.
DS52064A-page 21
MCP2200 Breakout Module User’s Guide
A.8
BOARD – BOTTOM COPPER
DS52064A-page 22
2012 Microchip Technology Inc.
MCP2200 BREAKOUT
MODULE USER’S GUIDE
Appendix B. Bill of Materials (BOM)
TABLE B-1:
Qty.
BILL OF MATERIALS
Designator
Description
Manufacturer
Part Number
1
C1
Cap. Ceramic 4.7uF 6.3V 10% X5R 0603
TDK Corporation
C1608X5R0J475K
3
C2, C3, C4
Cap. Ceramic 1UF 10% 16V X7R 0603
AVX Corporation
0603YC104KAT2A
1
C5
Cap. Ceramic 0.1uF 16V 10% X7R 0603
TDK Corporation
C1608X7R1C104K
1
J1
Conn. Rcpt. USB Mini B R/A SMD
Hirose Electric Co., Ltd.
UX60SC-MB-5ST(80)
1
J2
Conn. Hdr. Male .100 1x3 POS Vert.
TE Connectivity
HDR M 1x3 Vertical
2
J3, J4
DO NOT POPULATE
Conn. Hdr. Male .100 1x7 POS Vert.
TE Connectivity
HDR M 1x7 Vertical
1
J5
DO NOT POPULATE
Conn. Hdr. Male .100 1x6 POS Vert.
TE Connectivity
HDR M 1x6 Vertical
1
JP1
Conn. Jumper with Handle 2 POS .100"
30 GOLD
TE Connectivity
881545-2
1
PCB
MCP2200 Breakout Module Printed
Circuit Board
—
104-00393
1
R1
Res. 4.7k Ohm 1/10W 5% 0603 SMD
Panasonic® - ECG
ERJ-3GEYJ472V
1
U1
IC USB-to-UART SSOP-20
Microchip Technology Inc.
MCP2200-I/SS
1
U2
IC Reg. LDO 3.3V 250 mA SOT-23-3
Microchip Technology Inc.
MCP1700T-3302E/TT
1
X1
Note 1:
Ceramic Resonator 12.0 MHz SMD
®
Murata Electronics
CSTCE12M0G55-R0
The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM
used in manufacturing uses all RoHS-compliant components.
2012 Microchip Technology Inc.
DS52064A-page 23
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
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Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
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Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
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Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
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Tel: 45-4450-2828
Fax: 45-4485-2829
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Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
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Fax: 949-462-9608
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Tel: 408-961-6444
Fax: 408-961-6445
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
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Tel: 86-10-8569-7000
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Tel: 86-28-8665-5511
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Tel: 86-571-2819-3187
Fax: 86-571-2819-3189
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
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Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
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Tel: 60-4-227-8870
Fax: 60-4-227-4068
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Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
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Tel: 63-2-634-9065
Fax: 63-2-634-9069
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Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
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Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-330-9305
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
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Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
DS52064A-page 24
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
11/29/11
2012 Microchip Technology Inc.
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