PAC1921
High-Side Current/Power Sensor
Evaluation Board
User’s Guide
2015 Microchip Technology Inc.
DS50002376A
Note the following details of the code protection feature on Microchip devices:
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Microchip products meet the specification contained in their particular Microchip Data Sheet.
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Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
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There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
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Microchip is willing to work with the customer who is concerned about the integrity of their code.
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Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
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Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
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Information contained in this publication regarding device
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and may be superseded by updates. It is your responsibility to
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MICROCHIP MAKES NO REPRESENTATIONS OR
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Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer,
LANCheck, MediaLB, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC,
SST, SST Logo, SuperFlash and UNI/O are registered
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The Embedded Control Solutions Company and mTouch are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo,
CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit
Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet,
KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo,
MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
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SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
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GestIC is a registered trademarks of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2015, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
ISBN: 978-1-63277-460-6
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
DS50002376A-page 2
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
2015 Microchip Technology Inc.
Object of Declaration: PAC1921 High-Side Current/Power Sensor Evaluation Board
2015 Microchip Technology Inc.
DS50002376A-page 3
PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide
NOTES:
DS50002376A-page 4
2015 Microchip Technology Inc.
PAC1921
HIGH-SIDE CURRENT/POWER SENSOR
EVALUATION BOARD USER’S GUIDE
Table of Contents
Preface ........................................................................................................................... 7
Introduction............................................................................................................ 7
Document Layout .................................................................................................. 7
Conventions Used in this Guide ............................................................................ 8
Warranty Registration............................................................................................ 8
Recommended Reading........................................................................................ 9
The Microchip Web Site ........................................................................................ 9
Customer Support ................................................................................................. 9
Document Revision History ................................................................................... 9
Chapter 1. Product Overview
1.1 Introduction ................................................................................................... 11
1.2 PAC1921 Evaluation System ........................................................................ 11
1.3 What is the PAC1921 High-Side Current/Power Sensor Evaluation Board? ..... 12
1.3.1 Board Layout ............................................................................................. 12
1.4 What the PAC1921 High-Side Current/Power Sensor Evaluation
Board Kit Contains................................................................................... 13
Chapter 2. Installation and Operation
2.1 Getting Started .............................................................................................. 15
2.1.1 System Requirements ................................................................................ 15
2.2 Installing the Evaluation Board Software....................................................... 15
2.3 Microchip USB Bridge Installation ................................................................. 19
Chapter 3. Hardware Description
3.1 Introduction.................................................................................................... 21
3.1.1 Power Source ............................................................................................. 21
3.2 USB-to-SMBus Bridge................................................................................... 21
3.2.1 Direct SMBus Connect Option ................................................................... 21
3.3 Operating Mode............................................................................................. 22
3.3.1 SMBus Mode .............................................................................................. 22
3.4 LED Indicators............................................................................................... 22
3.5 Jumper Settings ............................................................................................ 23
3.6 Test Points .................................................................................................... 24
3.7 Demo Mode Setup and Operation................................................................. 25
3.8 Sys Mode Setup and Operation .................................................................... 25
3.8.1 Jumper Positions ........................................................................................ 25
3.8.2 Load Connection ........................................................................................ 25
2015 Microchip Technology Inc.
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PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide
Chapter 4. Software Description
4.1 Overview ....................................................................................................... 27
4.1.1 Tips for Using the Evaluation Board GUI ...................................................28
4.2 Interface Description and Operation.............................................................. 29
4.2.1 Panel Control Section .................................................................................29
4.2.2 Main Configuration Panel............................................................................31
4.2.3 Overflow Status Panel ................................................................................32
4.2.4 Rsense Panel ...............................................................................................32
4.2.5 Panel and Integration Control Panel ...........................................................32
4.2.6 EVB Demo Configuration Panel..................................................................33
4.3 Tab Descriptions ........................................................................................... 34
4.3.1 Vbus & Vsense Tab ....................................................................................34
4.3.2 Vbus, Vsense and Vpower Tabs.................................................................35
4.3.3 Calculations/File IO Tab..............................................................................36
4.3.4 Integration Table Tab..................................................................................38
4.4 Evaluation Board Examples .......................................................................... 39
4.4.1 Power Pin-Controlled Integration Example .................................................39
4.4.2 Power Free-Run Integration Example.........................................................42
4.5 Troubleshooting............................................................................................. 45
4.5.1 GUI Controls Unresponsive After Installation .............................................45
4.5.2 GUI Freezes................................................................................................45
Appendix A. Schematic and Layouts
A.1 Introduction ................................................................................................... 47
A.2 Board – PAC1921 Current Shunt and Power Monitor Schematic................. 48
A.3 Board – USB Bridge and Sig Gen Schematic............................................... 49
A.4 Board – Top Silk ........................................................................................... 50
A.5 Board – Top Copper and Silk........................................................................ 50
A.6 Board – Top Copper ..................................................................................... 51
A.7 Board – Bottom Copper ................................................................................ 51
A.8 Board – Bottom Copper and Silk .................................................................. 52
A.9 Board – Bottom Silk ...................................................................................... 52
Appendix B. Bill of Materials (BOM) ...........................................................................53
Worldwide Sales and Service .....................................................................................56
DS50002376A-page 6
2015 Microchip Technology Inc.
PAC1921
HIGH-SIDE CURRENT/POWER SENSOR
EVALUATION BOARD USER’S GUIDE
Preface
NOTICE TO CUSTOMERS
All documentation becomes dated, and this manual is no exception. Microchip tools and
documentation are constantly evolving to meet customer needs, so some actual dialogs
and/or tool descriptions may differ from those in this document. Please refer to our web site
(www.microchip.com) to obtain the latest documentation available.
Documents are identified with a “DS” number. This number is located on the bottom of each
page, in front of the page number. The numbering convention for the DS number is
“DSXXXXXXXXA”, where “XXXXXXXX” is the document number and “A” is the revision level
of the document.
For the most up-to-date information on development tools, see the MPLAB® IDE on-line help.
Select the Help menu, and then Topics to open a list of available on-line help files.
INTRODUCTION
This chapter contains general information that will be useful to know before using the
PAC1921 High-Side Current/Power Sensor Evaluation Board. Items discussed in this
chapter include:
•
•
•
•
•
•
•
Document Layout
Conventions Used in this Guide
Warranty Registration
Recommended Reading
The Microchip Web Site
Customer Support
Document Revision History
DOCUMENT LAYOUT
This document describes how to use the PAC1921 High-Side Current/Power Sensor
Evaluation Board as a development tool to emulate and debug firmware on a target
board. The manual layout is as follows:
• Chapter 1. “Product Overview” – Important information about the PAC1921
High-Side Current/Power Sensor Evaluation Board.
• Chapter 2. “Installation and Operation” – Includes instructions on installing and
starting the application.
• Chapter 3. “Hardware Description” – Shows hardware details of the PAC1921
High-Side Current/Power Sensor Evaluation Board.
• Chapter 4. “Software Description” – Describes the main operations in the software.
• Appendix A. “Schematic and Layouts” – Shows the schematic and layout
diagrams for the PAC1921 High-Side Current/Power Sensor Evaluation Board.
• Appendix B. “Bill of Materials (BOM)” – Lists the parts used to build the
PAC1921 High-Side Current/Power Sensor Evaluation Board.
2015 Microchip Technology Inc.
DS50002376A-page 7
PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide
CONVENTIONS USED IN THIS GUIDE
This manual uses the following documentation conventions:
DOCUMENTATION CONVENTIONS
Description
Arial font:
Italic characters
Initial caps
Quotes
Underlined, italic text with
right angle bracket
Bold characters
N‘Rnnnn
Text in angle brackets < >
Courier New font:
Plain Courier New
Represents
Examples
Referenced books
Emphasized text
A window
A dialog
A menu selection
A field name in a window or
dialog
A menu path
MPLAB® IDE User’s Guide
...is the only compiler...
the Output window
the Settings dialog
select Enable Programmer
“Save project before build”
A dialog button
A tab
A number in verilog format,
where N is the total number of
digits, R is the radix and n is a
digit.
A key on the keyboard
Click OK
Click the Power tab
4‘b0010, 2‘hF1
Italic Courier New
Sample source code
Filenames
File paths
Keywords
Command-line options
Bit values
Constants
A variable argument
Square brackets [ ]
Optional arguments
Curly brackets and pipe
character: { | }
Ellipses...
Choice of mutually exclusive
arguments; an OR selection
Replaces repeated text
Represents code supplied by
user
File>Save
Press ,
#define START
autoexec.bat
c:\mcc18\h
_asm, _endasm, static
-Opa+, -Opa0, 1
0xFF, ‘A’
file.o, where file can be
any valid filename
mcc18 [options] file
[options]
errorlevel {0|1}
var_name [,
var_name...]
void main (void)
{ ...
}
WARRANTY REGISTRATION
Please complete the enclosed Warranty Registration Card and mail it promptly.
Sending in the Warranty Registration Card entitles users to receive new product
updates. Interim software releases are available at the Microchip web site.
DS50002376A-page 8
2015 Microchip Technology Inc.
Preface
RECOMMENDED READING
This user’s guide describes how to use PAC1921 High-Side Current/Power Sensor
Evaluation Board. Other useful documents are listed below. The following Microchip
documents are available and recommended as supplemental reference resources.
PAC1921 Data Sheet (DS20005293)
This data sheet describes the operation and features of the PAC1921 high-side
power/current monitor device with a configurable analog output.
THE MICROCHIP WEB SITE
Microchip provides online support via our web site at www.microchip.com. This web
site is used as a means to make files and information easily available to customers.
Accessible by using your favorite Internet browser, the web site contains the following
information:
• Product Support – Data sheets and errata, application notes and sample
programs, design resources, user’s guides and hardware support documents,
latest software releases and archived software
• General Technical Support – Frequently Asked Questions (FAQs), technical
support requests, online discussion groups, Microchip consultant program
member listing
• Business of Microchip – Product selector and ordering guides, latest Microchip
press releases, listing of seminars and events, listings of Microchip sales offices,
distributors and factory representatives
CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels:
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Customers should contact their distributor, representative or field application engineer
(FAE) for support. Local sales offices are also available to help customers. A listing of
sales offices and locations is included in the back of this document.
Technical support is available through the web site at:
http://www.microchip.com/support
DOCUMENT REVISION HISTORY
Revision A (June 2015)
• Initial Release of this Document.
2015 Microchip Technology Inc.
DS50002376A-page 9
PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide
NOTES:
DS50002376A-page 10
2015 Microchip Technology Inc.
PAC1921
HIGH-SIDE CURRENT/POWER SENSOR
EVALUATION BOARD USER’S GUIDE
Chapter 1. Product Overview
1.1
INTRODUCTION
The PAC1921 is a dedicated power monitoring device with a configurable output. The
PAC1921 High-Side Current/Power Sensor Evaluation Board package provides users
with the means to exercise device functionality while connected either to target
systems (Sys mode) or while utilizing on-board sources (Demo mode).
1.2
PAC1921 EVALUATION SYSTEM
The evaluation system has three major parts, as shown in Figure 1-1:
• Customer-provided Windows® PC with an available USB port
• Microchip PAC1921 Graphical User Interface (GUI) (based on
National Instruments™ LabVIEW™ software)
• Microchip PAC1921 High-Side Current/Power Sensor Evaluation Board
• USB Cable for GUI communications (Standard-A plug to Mini-B plug)
PC with 3$& GUI and
Microchip USB Bridge Driver
USB Cable
Microchip
3$&
Device
3$& (YDOXDWLRQ%RDUG
FIGURE 1-1:
Note:
2015 Microchip Technology Inc.
PAC1921 Evaluation System.
Screen captures in this document were taken on a PC with Windows® 7
Professional using the default desktop colors. The colors on your screen
may vary, especially if a Windows theme has been applied on the PC.
DS50002376A-page 11
PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide
1.3
WHAT IS THE PAC1921 HIGH-SIDE CURRENT/POWER SENSOR
EVALUATION BOARD?
The evaluation system is comprised of the ADM00592 and a LabVIEW software-based
application which allows the user to do the following:
• View and change register values
• Saving settings of all registers allowing for quick configuration at a later time
• Graphing registers
The hardware platform provides the following features to the user:
• Headers for connecting a sense resistor
• USB-to-SMBus bridge for communications
• Capability to connect directly to an external SMBus master
1.3.1
Board Layout
The evaluation board was designed for ease of use and user experimentation.
Figure 1-2 shows the top silkscreen for the board.
FIGURE 1-2:
Top Silkscreen.
DS50002376A-page 12
PAC1921 High-Side Current/Power Sensor Evaluation Board –
2015 Microchip Technology Inc.
Product Overview
1.4
WHAT THE PAC1921 HIGH-SIDE CURRENT/POWER SENSOR EVALUATION
BOARD KIT CONTAINS
This PAC1921 High-Side Current/Power Sensor Evaluation Board kit includes:
• PAC1921 High-Side Current/Power Sensor Evaluation Board (ADM00592)
• Supplied USB Mini Connector Cable
• Important Information Sheet
2015 Microchip Technology Inc.
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PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide
NOTES:
DS50002376A-page 14
2015 Microchip Technology Inc.
PAC1921
HIGH-SIDE CURRENT/POWER SENSOR
EVALUATION BOARD USER’S GUIDE
Chapter 2. Installation and Operation
2.1
GETTING STARTED
2.1.1
System Requirements
To use the PAC1921 High-Side Current/Power Sensor Evaluation Board, the following
are required:
• A PC running the Microsoft® Windows® operating system
• A display resolution of 800x600 or larger, for viewing several windows
simultaneously
• An available USB port
2.2
INSTALLING THE EVALUATION BOARD SOFTWARE
Follow these steps in order to install the board’s Graphical User Interface (GUI):
1. Download the software archive from the board’s web page, unzip it and
double-click the Setup.exe to start the installation. Figure 2-1 shows the initial
installation screen, which displays briefly as the setup program loads.
FIGURE 2-1:
2015 Microchip Technology Inc.
Software Installation – Initialize Window.
DS50002376A-page 15
PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide
2. Click Next in the Destination Directory window, shown in Figure 2-2. For proper
operation, the files must be installed in the default locations. The default location
for the software files is C:\Program Files (x86)\Microchip\PAC1921
and for the LabVIEW™ software is C:\Program Files\
National Instruments.
FIGURE 2-2:
DS50002376A-page 16
Software Installation – Setting the Destination Directory.
2015 Microchip Technology Inc.
Installation and Operation
3. Read and accept the license agreement, then click Next.
FIGURE 2-3:
Software Installation – Software License Agreement.
4. To use the LabVIEW software, read and accept the license agreement, then click
Next.
FIGURE 2-4:
2015 Microchip Technology Inc.
Software Installation – LabVIEW™ Software License Agreement.
DS50002376A-page 17
PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide
5. Follow the on-screen instructions to complete the installation. During installation,
shortcuts will be created on the Windows Start Menu under Programs>PAC1921
and on the desktop.
DS50002376A-page 18
FIGURE 2-5:
Software Installation – LabVIEW™ Software Installation Screen.
FIGURE 2-6:
Software Installation – LabVIEW™ Software Installation Complete.
2015 Microchip Technology Inc.
Installation and Operation
When the installation is complete, the program will automatically run (see Figure 2-7).
FIGURE 2-7:
2.3
PAC1921 GUI Start-up Screen.
MICROCHIP USB BRIDGE INSTALLATION
Connect the USB mini connector to the evaluation board and the standard USB connector to any available USB port on the PC. If the Microchip USB bridge driver has not
previously been installed on the selected USB port, download the MCP2221 Windows
driver and installer from www.microchip.com at:
http://www.microchip.com/wwwproducts/Devices.aspx?product=MCP2221
Follow the on-screen instructions to complete the installation process.
2015 Microchip Technology Inc.
DS50002376A-page 19
PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide
NOTES:
DS50002376A-page 20
2015 Microchip Technology Inc.
PAC1921
HIGH-SIDE CURRENT/POWER SENSOR
EVALUATION BOARD USER’S GUIDE
Chapter 3. Hardware Description
3.1
INTRODUCTION
The PAC1921 High-Side Current/Power Sensor Evaluation Board provides the means
to evaluate features, and to view and modify registers. There are two modes for using
the evaluation board:
• Demo mode: Monitors an on-board power source
• Sys mode: Monitors an external power source
LEDs indicate status information and test points are included to monitor system
voltages with a user-provided voltmeter or oscilloscope.
The PAC1921 device is an SMBus-compliant, high-side current/power monitor in a
10-pin, 3 mm x 3 mm DFN package. For details regarding the PAC1921 device, refer
to the “PAC1921 Data Sheet” (DS20005293).
3.1.1
Power Source
The board requires only one Universal Serial Bus (USB) connection to power the
board. USB bus voltage is provided to the on-board test power sources and the
USB-to-SMBus bridge. The evaluation board circuitry uses the on-board regulator to
regulate the +5V USB power to +3.3V.
3.2
USB-TO-SMBus BRIDGE
The USB-to-SMBus is based on the MCP2221 USB-to-I2C™ protocol converter, which
provides the interface between the USB and the SMBus. Power is sourced to the
microcontroller from the USB interface for device power and communication.
3.2.1
Direct SMBus Connect Option
It is also possible to connect an external SMBus master to the PAC1921 High-Side
Current/Power Sensor Evaluation Board. A few modifications to the board are
required, as explained below:
• Remove the jumpers on J13 and connect the SMBus master to the
SMBus_DATA, SMBus_CLK and #READ/INT pins, as well as an external supply
for +3.3V. Note that a return is also provided on this header for convenience
(GND).
• The +3.3V can be supplied by the SMBus bridge by leaving the +3.3V jumper in
place and retaining the USB connection.
2015 Microchip Technology Inc.
DS50002376A-page 21
PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide
3.3
OPERATING MODE
3.3.1
SMBus Mode
By default, the evaluation board is configured so that the PAC1921 operates in SMBus
mode with an SMBus address of, 1001_100xb (98h). The address can be changed to
1001_101xb (9Ah) by moving jumper J8 to position 2-3. Cycle power to the evaluation
board in order for the change to take effect.
3.4
LED INDICATORS
LED locations are indicated in Figure 3-1.
LED 1
VDD Power
LED 6
READ/INT
LED 2
USB Power
FIGURE 3-1:
LED Indicator Locations.
LEDs indicate the status of the signals, as described in Table 3-1:
TABLE 3-1:
DS50002376A-page 22
LED STATUS INDICATORS
LED
Signal
OFF
Green
Red
LD1
VDD Power
VDD is not present
N/A
VDD is present
LD2
+5V USB Power
USB power is not present
N/A
+5V USB power is
present
LD6
READ/INT
Pin is not asserted
(Read State)
Pin is asserted
(Integrate State)
N/A
2015 Microchip Technology Inc.
Hardware Description
3.5
JUMPER SETTINGS
This evaluation board has pin headers and jumper configurations to evaluate the
features of the PAC1921. Jumper locations are indicated in Figure 3-2.
J11
GND
J2
VSOURCE-
J1
VSOURCE+
J3
Demo Sys
J4
Demo Sys
J13
Connections
J8
ADDR/SEL
J5
Reserved
J6
Reserved
J7
Reserved
Note:
Refer to Appendix A. “Schematic and Layouts” to see the
connections of each jumper position.
FIGURE 3-2:
2015 Microchip Technology Inc.
Jumper and External Connection Locations.
DS50002376A-page 23
PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide
Jumper settings are described in Table 3-2.
TABLE 3-2:
Pin
Header
JUMPER SETTINGS
Label
Default Position
Alternate Position(s)
J1, J2
Vsource+, Vsource-
External power source terminals. (See Section 3.8.2 “Load Connection”.)
J3, J4
Demo Sys
Select Demo mode RSENSE+/-.
Positions 3-2 are jumpered on both
jumpers. (See Section 3.7 “Demo
Mode Setup and Operation”.)
J5, J6,
J7
Reserved
Reserved for future use
J8
J8 (ADDR_SEL)
In SMBus mode, sets SMBus address to In SMBus mode, sets SMBus address to
(See
1001_100b at power-up.
1001_101b at power-up.
Section 3.3.1 “SMBus Positions 1-2 are jumpered.
Positions 2-3 are jumpered.
Mode”)
J11
GND
J13
GND, #READ/INT,
SMBus_DATA,
SMBus_CLK, VDD
3.6
TEST POINTS
Select Sys mode RSENSE+/-.
Positions 1-2 are jumpered on both
jumpers. (See Section 3.8 “Sys Mode
Setup and Operation”.)
Connect ground from external source for
Sys mode.
USB bridge generates on-board 3.3V
and provides SMBus host.
Positions 1-2, 3-4, 5-6, 7-8, 9-10 are all
jumpered.
(See Section 3.2.1 “Direct SMBus
Connect Option”.)
The PAC1921 High-Side Current/Power Sensor Evaluation Board provides test points
for ground reference and signal access. Table 3-3 summarizes these test points.
TABLE 3-3:
TEST POINTS
Test Point
Marking
Signal Function Monitored
1
Vsense+ (orange)
SENSE+
2
Vsense- (yellow)
SENSE-
3
OUT (white)
OUT Pin
4
ADDR_SEL
SMBus Address Select
5
Vdd (red)
VDD
6
GND (black)
Ground
7
#READ/INT (yellow)
READ/INT Pin
DS50002376A-page 24
2015 Microchip Technology Inc.
Hardware Description
3.7
DEMO MODE SETUP AND OPERATION
Demo mode uses an on-board current source to exercise and demonstrate the features
of the PAC1921 power monitor. The 100 mV constant-current source is provided using
a +5V USB as the supply. Parallel sense resistors are provided to convert the current
to a corresponding voltage for the PAC1921 to read at the SENSE+ and SENSEinputs. The evaluation board is assembled with jumpers J3 and J4 positioned for Demo
mode (see Section 3.5 “Jumper Settings”). Current is controlled by the evaluation
board Demo Configuration section of the evaluation board GUI (see
Section 4.2.6 “EVB Demo Configuration Panel”).
3.8
SYS MODE SETUP AND OPERATION
Sys mode uses external current sources to exercise and demonstrate the features of
the PAC1921 power monitor.
3.8.1
Jumper Positions
To use Sys mode, reposition jumpers J3 and J4 (see Table 3-2) to disconnect the
on-board demonstration current sources.
3.8.2
Load Connection
A 5 milliohm (1% tolerance) sense resistor, connected between J1 and J2, is provided
on-board the PAC1921 evaluation board to measure system current.
Load connections to the system can be established, as shown in Figure 3-3.
..
J11 GND
Connect to
System Ground
FIGURE 3-3:
2015 Microchip Technology Inc.
J2 VSOURCEConnect to
System DC
Load or Supply
J1 VSOURCE+
Connect to
System DC
Load or Supply
Load Connection Location.
DS50002376A-page 25
PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide
NOTES:
DS50002376A-page 26
2015 Microchip Technology Inc.
PAC1921
HIGH-SIDE CURRENT/POWER SENSOR
EVALUATION BOARD USER’S GUIDE
Chapter 4. Software Description
4.1
OVERVIEW
To get the Graphical User Interface (GUI) and the Evaluation Board (EVB) running,
follow these instructions:
1. Start the PAC1921 GUI software: from the Windows Start menu, select
Programs>PAC1921.
2. Connect the USB mini connector end of the cable to the board and the standard
USB connector of the cable to any available USB port on the PC. The VDD and
USB power LEDs (LD1 and LD2, respectively) will illuminate RED, indicating that
the PAC1921 is powered up and the MCP2221 USB bridge is connected to the PC.
The PAC1921 High-Side Current/Power Sensor Evaluation Board Graphical User
Interface (GUI) is shown in Figure 4-1.
Overflow Status Panel
Main Configuration Panel
Rsense Option Panel
EVB Demo Configuration Panel
FIGURE 4-1:
Configuration/View Tabs
Panel Control
Panel and Integration Control
GUI Interface Panel.
2015 Microchip Technology Inc.
DS50002376A-page 27
PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide
When the evaluation board is connected or disconnected, a message displays as
shown in Figure 4-2. With the evaluation board connected, click Auto-detect Address
to restart communications.
FIGURE 4-2:
4.1.1
Communications Failure Message.
Tips for Using the Evaluation Board GUI
• After a power-up of the evaluation board, the default settings are loaded. Users
can save the setting configurations to user-named files, which can be reloaded at
any time for quick reconfiguration (see Section 4.3.3.1 “Configuration Save and
Load”).
• To configure the GUI and PAC1921 for free-run integration power measurement,
press the function key on the keyboard.
• To reload the PAC1921 register defaults, press the function key on the
keyboard.
• When using the GUI, the PAC1921 can enter a Sleep state; however, it wakes to
service the GUI SMBus communications, then returns to Sleep. For this reason,
the current consumption will be slightly higher than expected in Sleep state when
using the GUI.
• When the PAC1921 enters Sleep state, the PAC1921 clears the measurement
registers, and consequently, the GUI Calculations/File IO tab is cleared. To
prevent the PAC1921 from entering Sleep, check the “SLEEP OVR” box in the
Main Configuration section.
DS50002376A-page 28
2015 Microchip Technology Inc.
Software Description
4.2
INTERFACE DESCRIPTION AND OPERATION
4.2.1
Panel Control Section
The Panel Control section on the right side of the GUI, shown in Figure 4-3, affects the
GUI operation.
Stop Button
SMBus
Address
Indicator
COM Status
Indicator
Enable Single
Read Option
Register Content
FIGURE 4-3:
4.2.1.1
Panel Control Section.
STOP AND RUN BUTTONS
Pressing the Stop button, as shown in Figure 4-3, interrupts the GUI software communications with the evaluation board. When the Stop button is clicked, the Run button is
displayed on the menu bar (see Figure 4-4).
Run Button
FIGURE 4-4:
2015 Microchip Technology Inc.
Run Button.
DS50002376A-page 29
PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide
To restart the communication between the software and the evaluation board, click the
Run button. The arrow button disappears when the communications resume.
Note 1:
2:
Stopping and restarting the GUI does not affect register settings. To
restore default register settings, disconnect power from the evaluation
board, then reconnect power.
Stopping the GUI clears the “Enable DC Vsense- Stimulus” box (see
Section 4.2.6 “EVB Demo Configuration Panel”).
To close the program, use the Close (X) button in the upper right corner of the window.
4.2.1.2
SMBus ADDRESS
The “SMBus Address” box, shown in Figure 4-5, indicates the selected SMBus
address. The SMBus address can be changed by moving a jumper (see
Section 3.3.1 “SMBus Mode”).
SMBus
Address
Indicator
COM Status
Indicator
Single Read
Button
FIGURE 4-5:
4.2.1.3
SMBus Address Indicator.
COM STATUS INDICATOR
The “COM” status indicator, on the right side of the panel as shown in Figure 4-5,
indicates the status of communications over the SMBus. During normal operation, the
“COM” indicator is black. If the SMBus communications fail, the “COM” indicator turns
red.
4.2.1.4
SINGLE READ/CONTINUOUS READ
The panel defaults to continuous register reads (toggle switch in down position, as
shown in Figure 4-5). To stop continuous register reads, check the “Enable Single
Read” box. In order to capture the register values at a given time, click the switch, which
will briefly flip to “Single Read”.
4.2.1.5
REGISTER CONTENT
“Reg Content”, shown in Figure 4-3, is a scrollable list of the PAC1921 registers and
the last read value. It is important to note that not all addresses are physical memory
locations on the device; these registers will read ‘0’. Likewise, some registers shown
(undocumented in the data sheet) may have data. Editing these registers can cause
unexpected results.
To update a register value, locate the register address in the left column, type the new
value in the corresponding cell in the right column, and press Enter on the keyboard or
click on another part of the GUI.
DS50002376A-page 30
2015 Microchip Technology Inc.
Software Description
4.2.1.5.1
Numbering Systems Views
The “Reg Content” section allows values to be displayed using different numbering
systems: Decimal, Hex, Octal, Binary or SI Notation.
To view a value using a different numbering system, click the indicator to the left of the
value in the cell, shown circled in Figure 4-6.
FIGURE 4-6:
4.2.2
Numbering System Indicators.
Main Configuration Panel
The Main Configuration section, shown in Figure 4-7, contains the PAC1921 configuration controls in registers 00h, 01h and 02h. Refer to the data sheet for register bit
descriptions.
FIGURE 4-7:
4.2.2.1
Main Configuration Panel.
ENABLE AUTO INT_EN
The “Enable Auto INT_EN” control is a GUI control convenience. Under normal
operation, for most of the integration parameter settings, changes do not take effect
until the PAC1921 is placed in the Read state. When the “Enable Auto INT_EN” control
is activated (light green – shown as “Enabled” in Figure 4-8), it automatically places the
PAC1921 into the Read state and back to Integrate state whenever a Main Configuration control is changed. It also updates the GUI calculations. When the
“Enable Auto INT_EN” control is disabled (dark green), the user must place the device
in the Read state before the “I_RES”, “V_RES”, “SAMPLES”, “VSENSE FILT_EN” and
“VBUS FILT_EN” changes take effect, and to update the GUI calculations.
It is recommended that the “Enable Auto INT_EN” control be activated when using
the GUI.
FIGURE 4-8:
2015 Microchip Technology Inc.
Enable Auto INT_EN GUI Control.
DS50002376A-page 31
PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide
4.2.3
Overflow Status Panel
The Overflow Status section, shown in Figure 4-9, represents the three bits in the
Overflow Status Register 1Ch. When an indicator turns red, it indicates an overflow.
FIGURE 4-9:
4.2.4
Overflow Status.
Rsense Panel
The Rsense section, shown in Figure 4-10, needs to reflect the value of the RSENSE
resistor in use on the evaluation board. This value is used in calculations done by the
GUI. In Demo mode, select the 1 Ohm - Demo button. In Sys mode, select the
0.005 Ohm - System button. If another resistor is used, check the Custom option
button and fill the corresponding value in the spin box underneath the option.
FIGURE 4-10:
4.2.5
Rsense Configuration Panel.
Panel and Integration Control Panel
The Panel and Integration Control section, shown in Figure 4-11, contains GUI controls
which set and clear the INT_EN bit. When using these controls, check the “READ/INT
OVR” box in the Main Configuration section to allow the INT_EN bit to override the
READ/INT pin state.
Note:
Read Period (ms) is always enabled.
“READ/INT OVR” Box is Checked
FIGURE 4-11:
DS50002376A-page 32
Panel and Integration Control.
2015 Microchip Technology Inc.
Software Description
4.2.6
EVB Demo Configuration Panel
The EVB Demo Configuration panel, shown in Figure 4-12, contains GUI controls
which affect the Demo mode. To inject current onto VSENSE-, check the “Enable DC
Vsense- Stimulus” box. To set the current level, rotate the “DC Vsense- Stimulus” dial
or type a value between 0 and 100 in the (mV) spin box below the dial.
FIGURE 4-12:
2015 Microchip Technology Inc.
Evaluation Board Demo Configuration.
DS50002376A-page 33
PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide
4.3
TAB DESCRIPTIONS
4.3.1
Vbus & Vsense Tab
The Vbus & Vsense tab, shown in Figure 4-13, displays plots for calculated VBUS in
volts and calculated VSENSE in volts. The plots are not self-scaling. If the value in the
box at the right of the plot (indicated with arrows) falls outside the Y-axis range on the
plot, click the top and/or bottom value on the axis and type in a new value.
Click to enter new values to scale the plot.
FIGURE 4-13:
DS50002376A-page 34
Vbus & Vsense Tab.
2015 Microchip Technology Inc.
Software Description
To change the look of the plot lines, click the applicable graphic in the legend on the
right of the tab to display a menu of options, as shown in Figure 4-14.
FIGURE 4-14:
4.3.2
Plot Legend Context Menu.
Vbus, Vsense and Vpower Tabs
There are separate tabs to show individual plots for Vbus, Vsense and Vpower. They
operate similarly to the Vbus & Vsense tab described above.
2015 Microchip Technology Inc.
DS50002376A-page 35
PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide
4.3.3
Calculations/File IO Tab
The Calculations/File IO tab, shown in Figure 4-15, displays register data (in decimal
by default). It also shows calculated results which were obtained by applying the data
sheet equations to the register data.
FIGURE 4-15:
Calculations/File IO Tab.
An example of using the equations to calculate power is as follows.
The value of one LSB in the VPOWER Result registers, in watts, can be calculated
according to Equation 4-1.
EQUATION 4-1:
LSB CALCULATION
0.1V
32V
---------------------------------------- --------------------------R DI_GAIN DV_GAIN
1LSB = ------------------------------------------------------------------------6
1023 2
Where:
DS50002376A-page 36
1LSB
=
LSB value in watts for VPOWER Result Registers 1Dh and 1Eh
0.1V
=
Maximum VSENSE voltage
R
=
Value of RSENSE resistor in ohms
DI_GAIN
=
Digital current gain
32V/DV_GAIN
=
Maximum voltage
1023
=
(210 – 1) = 10-bit FSR
26
=
Adjustment for 6 unused register bits when read as a 16-bit number
2015 Microchip Technology Inc.
Software Description
The power calculation using the VPOWER Result registers value from Figure 4-15 is
shown in Equation 4-2.
EQUATION 4-2:
POWER CALCULATION
0.1V
32V
----------------- ---------1 1
1
---------------------------------- 42 = 0.13138W
1023
Where:
0.1V
=
Maximum VSENSE voltage
1
=
Value of RSENSE resistor
1
=
Digital current gain
32V/1
=
Maximum voltage
1023
=
10-bit FSR
42
=
Decimal value of VPOWER Result Registers 1Dh and 1Eh
4.3.3.1
CONFIGURATION SAVE AND LOAD
The Calculations/File IO tab contains controls, as shown in Figure 4-16, which save the
settings currently configured in the PAC1921 to allow quick reconfiguration at any time.
FIGURE 4-16:
Save/Load Section.
To save configuration settings, configure the PAC1921 as desired, then display the
Calculations/File IO tab. The “FF Reg File Path” box defaults to where the GUI software is installed. To change the location, type in a path, or click the folder icon to use
a Windows® system-based navigation aid to select the folder where the configuration
file will be saved. The file should be named with the.txt extension or similar text file
format. Once a file name and location have been chosen, click the Save switch, and
the file is saved.
Note:
If a file with the same name already exists, the file will be overwritten
without warning and old data will be lost.
The data is saved in two columns, separated by tabs. The first column is the register
address and the second column is the register data.
Once a file is saved, it can be recalled at any time by selecting the file in the “FF Reg
File Path” box and clicking the Load switch.
Click the Chip Defaults switch or press the function key on the keyboard to
reload register defaults on the PAC1921.
2015 Microchip Technology Inc.
DS50002376A-page 37
PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide
Click the Quick Setup switch or press the function key on the keyboard to set up
the GUI and PAC1921 for free-run integration power measurement. The Quick Setup
switch does the following:
-
Enables the “Enable Auto INT_EN” option.
Enables the “READ/INT OVR” option.
Enables the “INT_EN” option.
Sets “MUX_SEL” to VPOWER free-run.
Enables the “Enable DC Vsense- Stimulus” option.
4.3.4
Integration Table Tab
The Integration Table tab, shown in Figure 4-17, shows the maximum integration
periods for a selected number of samples with various settings.
FIGURE 4-17:
DS50002376A-page 38
Integration Table Tab.
2015 Microchip Technology Inc.
Software Description
4.4
EVALUATION BOARD EXAMPLES
4.4.1
Power Pin-Controlled Integration Example
This example provides steps to experiment with pin-controlled integration in SMBus
mode and see the effects of gain.
1. In the Main Configuration section, check the “READ/INT OVR” box. This allows
the INT_EN bit to override the READ/INT pin state. Also check the “Enable Auto
INT_EN” control to set automatic GUI updates.
2. In the Panel and Integration Control section, check the “Integration Time GUI
Controlled” box, and set the “Read Period (ms)” to 500 ms. This causes the
INT_EN bit to toggle between high for 500 ms (putting the PAC1921 in the
Integrate state) and low for 500 ms (putting the device in the Read state).
3. In the EVB Demo Configuration section, check the “Enable DC VsenseStimulus” box and type 40 mV in the “DC Vsense- Stimulus (mV)” box.
4. Observe the plots on the Vbus & Vsense tab, as shown in Figure 4-18. The
evaluation board demo VBUS is ~5.1V and VSENSE is ~0.04V.
Check the “READ/INT OVR” Box
Check the “Enable Auto INT_EN” Control
FIGURE 4-18:
Pin-Controlled Integration, No Gain.
2015 Microchip Technology Inc.
DS50002376A-page 39
PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide
5. Observe the data on the Calculations/File IO tab, as shown in Figure 4-19.
FIGURE 4-19:
Pin-Controlled Integration without Gain.
6. To see the effects of gain, change “DI_GAIN” to 2X and “DV_GAIN” to 4X in the
Gain Config 00h section, as shown in Figure 4-20.
FIGURE 4-20:
DS50002376A-page 40
Pin-Controlled Integration with Gain.
2015 Microchip Technology Inc.
Software Description
7. Observe the data on the Calculations/File IO tab, as shown in Figure 4-21.
Notice that the Register Data values (with the exception of the accumulators)
reflect the gain.
FIGURE 4-21:
2015 Microchip Technology Inc.
Pin-Controlled Integration with Gain.
DS50002376A-page 41
PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide
4.4.2
Power Free-Run Integration Example
This section provides steps to experiment with free-run integration in SMBus mode and
see the effects of filtering, resolution and sampling. It starts by showing the fastest
integration period and progressively shows higher accuracy.
1. Press the function key on the keyboard. This performs Quick Setup, which
checks the “READ/INT OVR” box, the “INT_EN” bit box and the “Enable DC
Vsense- Stimulus” box, enables the “Enable Auto INT_EN” control and sets
“MUX_SEL” to VPOWER free-run. Integration begins using the 1 sample default.
2. In the Main Configuration section, click the “I_RES” and “V_RES” boxes so 11-bit
shows; this lowers the resolution from 14 bits to 11 bits.
3. In the Main Configuration section, uncheck the “VSENSE FILT_EN” and “VBUS
FILT_EN” boxes to disable the ADC post filters.
4. In the EVB Demo Configuration section, type 40 mV in the “DC VsenseStimulus” spin box.
5. Observe the plots on the Vbus & Vsense tab, as shown in Figure 4-22, adjusting
the Y-axis values as desired. These settings result in the shortest integration
period.
FIGURE 4-22:
DS50002376A-page 42
Free-Run Integration, Shortest Period.
2015 Microchip Technology Inc.
Software Description
6. Check the “VSENSE FILT_EN” and “VBUS FILT_EN” boxes to enable the ADC
post filters, and observe the improvement in the plots on the Vbus & Vsense tab,
as shown in Figure 4-23.
FIGURE 4-23:
Free-Run Integration with ADC Post Filters Enabled.
2015 Microchip Technology Inc.
DS50002376A-page 43
PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide
7. Uncheck the “I_RES” and “V_RES” boxes to enable 14-bit resolution, and
observe the improvement in the plots on the Vbus & Vsense tab, as shown in
Figure 4-24.
FIGURE 4-24:
DS50002376A-page 44
Free-Run Integration with 14-Bit Resolution.
2015 Microchip Technology Inc.
Software Description
8. Change the number of “SAMPLES” to 8 and observe the improvement in the
plots on the Vbus & Vsense tab, as shown in Figure 4-25.
FIGURE 4-25:
4.5
Increased Sample Effect.
TROUBLESHOOTING
4.5.1
GUI Controls Unresponsive After Installation
Restart the computer. In some cases, a restart is required after installation.
4.5.2
GUI Freezes
If the GUI freezes for unknown reasons, communications cannot be stopped and the
program cannot be closed. Disconnect the USB cable from the evaluation board, then
close the program. Reconnect the evaluation board, then restart the GUI.
2015 Microchip Technology Inc.
DS50002376A-page 45
PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide
NOTES:
DS50002376A-page 46
2015 Microchip Technology Inc.
PAC1921
HIGH-SIDE CURRENT/POWER SENSOR
EVALUATION BOARD USER’S GUIDE
Appendix A. Schematic and Layouts
A.1
INTRODUCTION
This appendix contains the following schematics and layouts for the PAC1921
High-Side Current/Power Sensor Evaluation Board:
•
•
•
•
•
•
•
•
Board – PAC1921 Current Shunt and Power Monitor Schematic
Board – USB Bridge and Sig Gen Schematic
Board – Top Silk
Board – Top Copper and Silk
Board – Top Copper
Board – Bottom Copper
Board – Bottom Copper and Silk
Board – Bottom Silk
2015 Microchip Technology Inc.
DS50002376A-page 47
BOARD – PAC1921 CURRENT SHUNT AND POWER MONITOR SCHEMATIC
JP6
VDD
JP7
Shunt 2.54 mm 1x2 Handle
TP5
TP LOOP Red
VDD
JP3
GND
Shunt 2.54 mm 1x2 Handle
IDEMO
VSOURCE-
Idemo
R2
R3
2R
2010
5%
2R
2010
5%
Demo
Sys
2 1
EDZ250/2
Out
TP2
HDR-2.54 Male 1x3
VSENSE-
TP LOOP Yellow
JP4
J11
1
2
3
4
5
VSENSE+
VSENSE-
J4
Shunt 2.54 mm 1x2 Handle
100R
0603
1%
VDD
R8
R9
R10
R11
12.1k
0603
1%
12.1k
0603
1%
12.1k
0603
1%
12.1k
0603
1%
1 2 3
OUT
VDD
SENSE+
SENSEOUT
GND
TP3
TP LOOP White
GP2
J6
SM_CLK
SM_DATA
READ/INT
COMM_SEL
ADDR_SEL
10
9
8
7
6
COMM_SEL
J7
HDR-2.54 Male 1x3
SMBus_CLK
SMBus_DATA
#READ/INT
JP5
R12
1 2 3
R4
J5
HDR-2.54 Male 1x3
SMBUS_CLK
SMBUS_DATA
#READ/INT
2k
0603
1%
Shunt 2.54mm 1x2 Handle
PAC1921-1
120R
0603
1%
1 2 3
HDR-2.54 Male 1x3
U1
EP
3 2 1
Demo
HDR-2.54 Male 1x3
0.005R
1%
1 μF
16V
0603
0.1 μF
16V
0603
TP LOOP Orange
11
1
2 1
J2
RS1
+5V_USB
1 2 3
4
3
C1
TP1
Sys
C2
TP7
TP LOOP Yellow
ADDR_SEL
/GAIN_SEL
C3
0.001 μF
50V
0603
R5
120R
0603
1%
J8
3 2 1
J3
VSOURCE+
EDZ250/2
EDZ250/2
TP LOOP Black
VSENSE+
2
2 1
J1
R1
TP6
Shunt 2.54mm 1x2 Handle
VDD
TP4
TP LOOP White
HDR-2.54 Male 1x3
JP8
2015 Microchip Technology Inc.
Shunt 2.54 mm 1x2 Handle
J 8, 1-2 Close (default) = 1001_100x b -> 98h
J 8, 2-3 Close (alternative) = 1001_101x b -> 9Ah
J 8, Open (alternative) = Apply external resistor
for GAIN_SEL function in Stand-Alone mode.
Read the data sheet for more information
#READ/INT
R6
R7
12.1k
0603
1%
12.1k
0603
1%
VDD
#READ/INT
LD6
GREEN
PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide
DS50002376A-page 48
A.2
BOARD – USB BRIDGE AND SIG GEN SCHEMATIC
+5V_USB
Waveform Current Generator
GMCP87050
VDD
14
12.1k
0603
1%
8
OUTD
VSS
R37
120R
0603
1%
+D
2200 pF
50V
0603
MCP6004
9
-C
VDD
G MCP87050
GP1
+C
2
3
1
R38
120R
0603
1%
12.1k
0603
1%
10k
3386F
10%
R70
2200 pF
50V
0603
R50
1
R73
0.1 μF
16V
0603
Q2
C13
10
C8
1 μF
16V
0603
0.022 μF
50V
0603
OUTC
VSS
C9
12
U4C
C20
U4A
C19
MCP6004
-A
0.1 μF
16V
0603
2
VDD
R49
15.4k
0603
1%
12.1k
0603
1%
7
OUTA
VSS
+A
3
C17
0.1 μF
16V
0603
C15
1 μF
16V
0603
R72
U4B
R48
MCP6004
4
R41
15.4k
0603
1%
Idemo
4
R40
4
2200 pF
50V
0603
3.32k
0603
1%
D
-D
13
R44
7.5k
0603
1%
S
Q1
C12
MCP6004
11
D
4
U4D
R43
11
C14
Idemo
11
IDEMO
-B
6
VDD
C18
0.1uF
16V
0603
R46
R47
7.5k
0603
1%
3.32k
0603
1%
GP3
OUTB
VSS
11
Steady state current generator
S
2015 Microchip Technology Inc.
A.3
+B
5
1
2
R74
10k
3386F
10%
3
R51
12.1k
0603
1%
C16
0.1 μF
16V
0603
20R
0603
1%
20R
0603
1%
JP9
Shunt 2.54 mm 1x2 Handle
JP10
Shunt 2.54 mm 1x2 Handle
JP11
+3.3V
+3.3V
Shunt 2.54 mm 1x2 Handle
+3.3V
SMBUS_CLK
SMBUS_DATA
#READ/INT
9 7 5 3 1
10 8 6 4 2
J13
SMBus_CLK
SMBus_DATA
#READ/INT
10 μF
10V
0603
USB Power
2k
0603
1%
GP0
R20
R21
1k
0603
1%
R26
12.1k
U2
+3.3V
0603
1
VDD
1% GP0
2
GP0
GP1
3
GP1
RESET
4
RST
5
RX
UART RX
6
TX
UART TX
7
GP2
OUT
GP2
VSS
D+
DVUSB
SCL
SDA
GP3
14
13
12
11
10
9
8
+3.3V
C10
0.47 μF
6.3V
0603
+3.3V
SMBusCLK
SMBusDATA
GP3
PAD1
MCP2221
+5V_USB
Rubber Pad Cyl D7.9H5.3
U3
+3.3V
3
VDD
+5V_USB
VOUT
VIN
GND
2
MCP1825S/3.3V
1
VBUS
FB1
C5
0.1 μF
16V
0603
C4
10 μF
10V
0603
1
2
RED
VDD Power
12.1k
0603
1%
0.1 μF
16V
0603
D1
ESD5V3
3
DD+
1
2
3
4
5
VBUS
DD+
ID
GND
R27
1M
0603
1%
C21
DS50002376A-page 49
100 pF
50V
0603
PAD2
Rubber Pad Cyl D7.9H5.3
PAD3
Rubber Pad Cyl D7.9H5.3
USB MINI-B Female
PAD4
Rubber Pad Cyl D7.9H5.3
Schematic and Layouts
LD1
12.1k
0603
1%
R25
1k
0603
1%
RED
R19
SMBusCLK
SMBusDATA
HDR-2.54 Male 2x5
LD2
R18
P1
VDD
C6
+3.3V
C7
Shunt 2.54 mm 1x2 Handle
0
JP12
PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide
A.4
BOARD – TOP SILK
A.5
BOARD – TOP COPPER AND SILK
DS50002376A-page 50
2015 Microchip Technology Inc.
Schematic and Layouts
A.6
BOARD – TOP COPPER
A.7
BOARD – BOTTOM COPPER
2015 Microchip Technology Inc.
DS50002376A-page 51
PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide
A.8
BOARD – BOTTOM COPPER AND SILK
A.9
BOARD – BOTTOM SILK
DS50002376A-page 52
2015 Microchip Technology Inc.
PAC1921
HIGH-SIDE CURRENT/POWER SENSOR
EVALUATION BOARD USER’S GUIDE
Appendix B. Bill of Materials (BOM)
TABLE B-1:
Qty
2
BILL OF MATERIALS (BOM)(1)
Reference
Description
Manufacturer
Part Number
8
C1, C5, C6,
Cap. Ceramic, 0.1 µF, 16V, 10%, X7R, NIC Components Corp. NMC0603X7R104K16TRPF
C16, C17,
SMD, 0603
C18, C19, C20
1
C10
Cap. Ceramic, 0.47 µF, 6.3V, 10%,
X5R, SMD, 0603
Murata Electronics®
GRM188R60J474KA01D
1
C14
Cap. Ceramic, 0.022 µF, 50V, 10%,
X7R, SMD, 0603
TDK Corporation
C1608X7R1H223K
3
C2, C8, C15
Cap. Ceramic, 1 µF, 16V, 10%, X7R,
SMD, 0603
Taiyo Yuden Co., Ltd.
EMK107B7105KA-T
1
C21
Cap. Ceramic, 100 pF, 50V, 1%, C0G,
SMD, 0603
TDK Corporation
C1608C0G1H101F
1
C3
Cap. Ceramic, 0.001 µF, 50V, 20%,
X7R, SMD, 0603
KEMET™
C0603C102M5RAC
2
C4, C7
Cap. Ceramic, 10 µF, 10V, 20%, X5R,
SMD, 0603
Panasonic®
ECJ-1VB1A106M
3
C9, C12, C13 Cap. Ceramic, 2200 pF, 50V, 10%,
X7R, SMD, 0603
KEMET
C0603C222K5RACTU
1
D1
DIO TVSARR, ESD5V3U2U, 5.3V,
SMD, SOT-883
Infineon Technologies
ESD5V3U2U-03LRH E6327
1
FB1
Ferrite, 500 mA, 0.1R, SMD, 0603
Laird-Signal Integrity
LI0603E470R-10
3
J1, J2, J11
Conn. Terminal, 5.08 mm, 15A,
Female, 1x2, TH R/A
On Shore Technology
Inc.
EDZ250/2
1
J13
Conn. HDR-2.54, Male, 2x5, 0.100"
(2.54 mm), TH Vert.
Samtec, Inc.
TSW-105-07-G-D
6
J3, J4, J5, J6, Conn. HDR-2.54, Male, 1x3, Tin,
J7, J8
5.84 MH, TH Vert.
Samtec, Inc.
TSW-103-07-T-S
10
JP3, JP4, JP5, Mech. HW Jumper, 2.54 mm, 1x2,
JP6, JP7, JP8, Handle Gold
JP9, JP10,
JP11, JP12
TE Connectivity, Ltd.
881545-2
2
LD1, LD2
DIO LED Red, 1.95V, 20 mA, 220 mcd, Kingbright Corp.
Clear, SMD, 0805
1
LD6
DIO LED Green, 2V, 30 mA, 120 mcd,
Diffuse, SMD, 0805
Avago Technologies US HSMM-C170
Inc.
1
P1
Conn. USB Mini-B Female, SMD, R/A
Hirose Electric Co., Ltd. UX60SC-MB-5ST(80)
4
PAD1, PAD2,
PAD3, PAD4
Mech. HW Rubber Pad, Cylindrical,
D7.9, H5.3, Black
3M
Q1, Q2
MCHP Analog PWM Controller, 1 MHz, Microchip Technology
MCP87050-U/MF, PDFN-8
Inc.
Note 1:
APT2012SURCK
SJ61A11
MCP87050T-U/MF
The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM
used in manufacturing uses all RoHS-compliant components.
2015 Microchip Technology Inc.
DS50002376A-page 53
PAC1921
TABLE B-1:
Qty
BILL OF MATERIALS (BOM)(1) (CONTINUED)
Reference
Description
Manufacturer
Part Number
1
R1
Res., TKF, 100R, 1%, 1/10W, SMD,
0603
ROHM Semiconductor
MCR03EZPFX1000
1
R12,
Res., TKF, 2k, 1%, 1/10W, SMD, 0603
Stackpole Electronics,
Inc.
RMCF0603FT2K00
2
R2, R3
Res., TKF, 2R, 5%, 3/4W, SMD, 2010
Panasonic® - ECG
ERJ-12ZYJ2R0U
2
R20, R21
Res., TKF, 1k, 1%, 1/10W, SMD, 0603
Panasonic - ECG
ERJ-3EKF1001V
1
R25
Res., TKF, 2k, 1%, 1/10W, SMD, 0603
Stackpole Electronics,
Inc.
RMCF0603FT2K00
1
R27
Res., TKF, 1M, 1%, 1/10W, SMD, 0603
Panasonic - ECG
ERJ-3EKF1004V
4
R4, R5, R37,
R38
Res., TKF, 120R, 1%, 1/10W, SMD, 0603 Panasonic - ECG
ERJ-3EKF1200V
2
R40, R49
Res., TKF, 15.4k, 1%, 1/10W, SMD, 0603 Panasonic - ECG
ERJ-3EKF1542V
2
R43, R46
Res., TKF, 3.32k, 1%, 1/10W, SMD, 0603 ROHM
MCR03EZPFX3321
2
R43, R46
Res., TKF, 7.5k, 1%, 1/10W, SMD, 0603 Panasonic - ECG
ERJ-3EKF7501V
1
R51
Res., TKF, 12.1k, 1%, 1/10W, SMD, 0603 Panasonic - ECG
ERJ-3EKF1212V
12
R6, R7, R8,
Res., TKF, 12.1k, 1%, 1/10W, SMD, 0603 Panasonic - ECG
R9, R10, R11,
R18, R19,
R26, R41,
R48, R50
ERJ-3EKF1212V
2
R70, R72
ERJ-3EKF20R0V
Res., TKF, 20R, 1%, 1/10W, SMD, 0603 Panasonic - ECG
®,
Inc.
3386F-1-103TLF
2
R73, R74
Res., Trimmer Cermet, 10k, 10%,
500 mW, TH, 3386F
Bourns
1
RS1
Res., Shunt, 0.005R, 1%, 2W, 1%,
2412
Ohmite® Manufacturing LVK25R005FER
1
TP1
Conn. TP Loop, Orange, TH
Keystone Electronics
Corp.
5013
2
TP2, TP7
Conn. TP Loop, Yellow, TH
Keystone Electronics
Corp.
5014
2
TP3, TP4
Conn. TP Loop, White, TH
Keystone Electronics
Corp.
5012
1
TP5
Conn. TP Loop, Red, TH
Keystone Electronics
Corp.
5010
1
TP6
Conn. TP Loop, Black, TH
Keystone Electronics
Corp.
5011
1
U1
MCHP Analog Current Sense Monitor,
PAC1921-1-AIA-TR, DFN-10
Microchip Technology
Inc.
PAC1921-1-AIA-TR
1
U2
MCHP Interface USB I2C™ UART,
MCP2221-I/ST, TSSOP-14
Microchip Technology
Inc.
MCP2221-I/ST
1
U3
MCHP Analog LDO, 3.3V,
MCP1825ST-3302E/DB, SOT-223-3
Microchip Technology
Inc.
MCP1825S-3302E/DB
1
U4
MCHP Analog Op Amp, 4-Ch, 1 MHz,
MCP6004-I/SL, SOIC-14
Microchip Technology
Inc.
MCP6004-I/SL
Note 1:
The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM
used in manufacturing uses all RoHS-compliant components.
DS50002376A-page 54
2015 Microchip Technology Inc.
Bill of Materials (BOM)
NOTES:
2015 Microchip Technology Inc.
DS50002376A-page 55
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DS50002376A-page 56
2015 Microchip Technology Inc.
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