0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
APA450-BGG456

APA450-BGG456

  • 厂商:

    ACTEL(微芯科技)

  • 封装:

    BBGA456

  • 描述:

    IC FPGA 344 I/O 456BGA

  • 数据手册
  • 价格&库存
APA450-BGG456 数据手册
v5.9 ® ProASICPLUS® Flash Family FPGAs Features and Benefits High Performance Routing Hierarchy • • • • High Capacity Commercial and Industrial • • • I/O 75,000 to 1 Million System Gates 27 K to 198 Kbits of Two-Port SRAM 66 to 712 User I/Os • • Military • • • • • • • 300, 000 to 1 Million System Gates 72 K to 198 Kbits of Two Port SRAM 158 to 712 User I/Os Reprogrammable Flash Technology • • • • • • • • • • • • • 3.3 V, 32-Bit PCI, up to 50 MHz (33 MHz over military temperature) Two Integrated PLLs External System Performance up to 150 MHz Flexibility with Choice of Industry-Standard Front-End Tools Efficient Design through Front-End Timing and Gate Optimization ISP Support • In-System Programming (ISP) via JTAG Port SRAMs and FIFOs • The Industry’s Most Effective Security Key (FlashLock®) • Low Power • • • PLL with Flexible Phase, Multiply/Divide, and Delay Capabilities Internal and/or External Dynamic PLL Configuration Two LVPECL Differential Pairs for Clock or Data Inputs Standard FPGA and ASIC Design Flow Secure Programming • Schmitt-Trigger Option on Every Input 2.5 V / 3.3 V Support with Individually-Selectable Voltage and Slew Rate Bidirectional Global I/Os Compliance with PCI Specification Revision 2.2 Boundary-Scan Test IEEE Std. 1149.1 (JTAG) Compliant Pin-Compatible Packages across the ProASICPLUS Family Unique Clock Conditioning Circuitry 0.22 µm 4 LM Flash-Based CMOS Process Live At Power-Up (LAPU) Level 0 Support Single-Chip Solution No Configuration Device Required Retains Programmed Design during Power-Down/Up Cycles Mil/Aero Devices Operate over Full Military Temperature Range Performance • Ultra-Fast Local and Long-Line Network High-Speed Very Long-Line Network High-Performance, Low Skew, Splittable Global Network 100% Routability and Utilization Low Impedance Flash Switches Segmented Hierarchical Routing Structure Small, Efficient, Configurable (Combinatorial or Sequential) Logic Cells SmartGen Netlist Generation Ensures Optimal Usage of Embedded Memory Blocks 24 SRAM and FIFO Configurations with Synchronous and Asynchronous Operation up to 150 MHz (typical) Table 1 • ProASICPLUS Product Profile Device Maximum System Gates Tiles (Registers) Embedded RAM Bits (k=1,024 bits) Embedded RAM Blocks (256x9) LVPECL PLL Global Networks Maximum Clocks Maximum User I/Os JTAG ISP PCI Package (by pin count) TQFP PQFP PBGA FBGA CQFP2 CCGA/LGA2 Notes: APA075 75,000 3,072 27 k 12 2 2 4 24 158 Yes Yes APA150 150,000 6,144 36k 16 2 2 4 32 242 Yes Yes APA3001 300,000 8,192 72 k 32 2 2 4 32 290 Yes Yes APA450 450,000 12,288 108 k 48 2 2 4 48 344 Yes Yes APA6001 600,000 21,504 126 k 56 2 2 4 56 454 Yes Yes APA750 750,000 32,768 144 k 64 2 2 4 64 562 Yes Yes APA10001 1,000,000 56,320 198 k 88 2 2 4 88 712 Yes Yes 100, 144 208 – 144 100 208 456 144, 256 – 208 456 144, 256 208, 352 – 208 456 144, 256, 484 – 208 456 256, 484, 676 208, 352 624 – 208 456 676, 896 – 208 456 896, 1152 208, 352 624 1. Available as Commercial/Industrial and Military/MIL-STD-883B devices. 2. These packages are available only for Military/MIL-STD-883B devices. D e c e m b er 2 0 0 9 © 2009 Actel Corporation i See the Actel website for the latest version of the datasheet. ProASICPLUS Flash Family FPGAs Ordering Information APA1000 _ FG G 1152 I Application (Ambient Temperature Range) Blank = Commercial (0°C to +70°C) I = Industrial (–40°C to +85°C) PP = Pre-production ES = Engineering Silicon (room temperature only) M = Military (–55°C to 125°C) B = MIL-STD-883 Class B Package Lead Count Lead-free packaging Blank = Standard Packaging G = RoHS Compliant Packaging Package Type TQ = Thin Quad Flat Pack (0.5 mm pitch) PQ = Plastic Quad Flat Pack (0.5 mm pitch) FG = Fine Pitch Ball Grid Array (1.0 mm pitch) BG = Plastic Ball Grid Array (1.27 mm pitch) CQ = Ceramic Quad Flat Pack (1.05 mm pitch) CG = Ceramic Column Grid Array (1.27 mm pitch) LG = Land Grid Array (1.27 mm pitch) Speed Grade Blank = Standard Speed Part Number APA075 APA150 APA300 APA450 APA600 APA750 APA1000 ii = = = = = = = 75,000 Equivalent System Gates 150,000 Equivalent System Gates 300,000 Equivalent System Gates 450,000 Equivalent System Gates 600,000 Equivalent System Gates 750,000 Equivalent System Gates 1,000,000 Equivalent System Gates v5.9 ProASICPLUS Flash Family FPGAs Device Resources User I/Os2 Military/MIL-STD-883B Commercial/Industrial Device CCGA/ LGA CQFP CQFP TQFP3 TQFP3 PQFP3 PBGA3 FBGA3 FBGA3 FBGA3 FBGA3 FBGA3 FBGA3 100-Pin 144-Pin 208-Pin 456-Pin 144-Pin 256-Pin 484-Pin 676-Pin 896-Pin 1152-Pin 208-Pin 352-Pin 624-Pin APA075 66 APA150 66 APA300 APA450 APA600 107 158 100 158 242 100 186 4 158 5 290 5 100 5 186 4, 5 158 158 5 344 356 100 5 APA750 158 356 APA1000 158 5 356 5 186 186 4 344 4, 5 158 248 158 248 440 158 248 440 4 370 4 454 454 562 6 642 5, 6 712 6 Notes: 1. Package Definitions: TQFP = Thin Quad Flat Pack, PQFP = Plastic Quad Flat Pack, PBGA = Plastic Ball Grid Array, FBGA = Fine Pitch Ball Grid Array, CQFP = Ceramic Quad Flat Pack, CCGA = Ceramic Column Grid Array, LGA = Land Grid Array 2. Each pair of PECL I/Os is counted as one user I/O. 3. Available in RoHS compatible packages. Ordering code is "G." 4. FG256 and FG484 are footprint-compatible packages. 5. Military Temperature Plastic Package Offering 6. FG896 and FG1152 are footprint-compatible packages. General Guideline Maximum performance numbers in this datasheet are based on characterized data. Actel does not guarantee performance beyond the limits specified within the datasheet. v5.9 iii ProASICPLUS Flash Family FPGAs Temperature Grade Offerings Package APA075 APA150 TQ100 C, I C, I TQ144 C, I PQ208 C, I BG456 FG144 FG256 C, I APA300 APA450 APA600 APA750 APA1000 C, I C, I, M C, I C, I, M C, I C, I, M C, I C, I, M C, I C, I, M C, I C, I, M C, I C, I, M C, I C, I C, I, M C, I C, I, M C, I C, I, M FG484 FG676 C, I, M C, I FG896 C, I FG1152 C, I, M C, I CQ208 M, B M, B M, B CQ352 M, B M, B M, B M, B M, B CG624 Note: C = Commercial I = Industrial M = Military B = MIL-STD-883 Speed Grade and Temperature Matrix Std. C ✓ I ✓ M, B ✓ Note: C = Commercial I = Industrial M = Military B = MIL-STD-883 iv v5.9 ProASICPLUS Flash Family FPGAs Device Family Overview The ProASICPLUS family of devices, Actel’s secondgeneration family of flash FPGAs, offers enhanced performance over Actel’s ProASIC family. It combines the advantages of ASICs with the benefits of programmable devices through nonvolatile flash technology. This enables engineers to create high-density systems using existing ASIC or FPGA design flows and tools. In addition, the ProASICPLUS family offers a unique clock conditioning circuit based on two on-board phase-locked loops (PLLs). The family offers up to one million system gates, supported with up to 198 kbits of two-port SRAM and up to 712 user I/Os, all providing 50 MHz PCI performance. combination of fine granularity, flexible routing resources, and abundant flash switches allows 100% utilization and over 95% routability for highly congested designs. Tiles and larger functions are interconnected through a four-level routing hierarchy. Embedded two-port SRAM blocks with built-in FIFO/RAM control logic can have user-defined depths and widths. Users can also select programming for synchronous or asynchronous operation, as well as parity generations or checking. Advantages to the designer extend beyond performance. Unlike SRAM-based FPGAs, four levels of routing hierarchy simplify routing, while the use of flash technology allows all functionality to be live at powerup. No external boot PROM is required to support device programming. While on-board security mechanisms prevent access to the program information, reprogramming can be performed in-system to support future design iterations and field upgrades. The device’s architecture mitigates the complexity of ASIC migration at higher user volume. This makes ProASICPLUS a costeffective solution for applications in the networking, communications, computing, and avionics markets. The unique clock conditioning circuitry in each device includes two clock conditioning blocks. Each block provides a PLL core, delay lines, phase shifts (0° and 180°), and clock multipliers/dividers, as well as the circuitry needed to provide bidirectional access to the PLL. The PLL block contains four programmable frequency dividers which allow the incoming clock signal to be divided by a wide range of factors from 1 to 64. The clock conditioning circuit also delays or advances the incoming reference clock up to 8 ns (in increments of 0.25 ns). The PLL can be configured internally or externally during operation without redesigning or reprogramming the part. In addition to the PLL, there are two LVPECL differential input pairs to accommodate high-speed clock and data inputs. The ProASICPLUS family achieves its nonvolatility and reprogrammability through an advanced flash-based 0.22 μm LVCMOS process with four layers of metal. Standard CMOS design techniques are used to implement logic and control functions, including the PLLs and LVPECL inputs. This results in predictable performance compatible with gate arrays. To support customer needs for more comprehensive, lower-cost, board-level testing, Actel’s ProASICPLUS devices are fully compatible with IEEE Standard 1149.1 for test access port and boundary-scan test architecture. For more information concerning the flash FPGA implementation, please refer to the "Boundary Scan (JTAG)" section on page 2-8. The ProASICPLUS architecture provides granularity comparable to gate arrays. The device core consists of a Sea-of-Tiles™. Each tile can be configured as a flip-flop, latch, or three-input/one-output logic function by programming the appropriate Flash switches. The ProASICPLUS devices are available in a variety of highperformance plastic packages. Those packages and the performance features discussed above are described in more detail in the following sections. v5.9 1-1 ProASICPLUS Flash Family FPGAs ProASICPLUS Architecture The proprietary ProASICPLUS architecture granularity comparable to gate arrays. the appropriate logic cell inputs and outputs. Dedicated high-performance lines are connected as needed for fast, low-skew global signal distribution throughout the core. Maximum core utilization is possible for virtually any design. provides The ProASICPLUS device core consists of a Sea-of-Tiles (Figure 1-1). Each tile can be configured as a three-input logic function (e.g., NAND gate, D-Flip-Flop, etc.) by programming the appropriate flash switch interconnections (Figure 1-2 and Figure 1-3 on page 1-3). Tiles and larger functions are connected with any of the four levels of routing hierarchy. Flash switches are distributed throughout the device to provide nonvolatile, reconfigurable interconnect programming. Flash switches are programmed to connect signal lines to ProASICPLUS devices also contain embedded, two-port SRAM blocks with built-in FIFO/RAM control logic. Programming options include synchronous or asynchronous operation, two-port RAM configurations, user-defined depth and width, and parity generation or checking. Refer to the "Embedded Memory Specifications" section on page 2-54 for more information. RAM Block 256x9 Two-Port SRAM or FIFO Block I/Os Logic Tile RAM Block 256x9 Two Port SRAM or FIFO Block Figure 1-1 • The ProASICPLUS Device Architecture Floating Gate Sensing Switch In Switching Word Switch Out Figure 1-2 • Flash Switch 1 -2 v5.9 ProASICPLUS Flash Family FPGAs Local Routing In 1 Efficient Long-Line Routing In 2 (CLK) In 3 (Reset) Figure 1-3 • Core Logic Tile Live at Power-Up Flash Switch PLUS Unlike SRAM FPGAs, ProASICPLUS uses a live-at-power-up ISP flash switch as its programming element. The Actel flash-based ProASIC devices support Level 0 of the live at power-up (LAPU) classification standard. This feature helps in system component initialization, executing critical tasks before the processor wakes up, setting up and configuring memory blocks, clock generation, and bus activity management. The LAPU feature of flash-based ProASICPLUS devices greatly simplifies total system design and reduces total system cost, often eliminating the need for complex programmable logic device (CPLD) and clock generation PLLs that are used for this purpose in a system. In addition, glitches and brownouts in system power will not corrupt the ProASICPLUS device's flash configuration, and unlike SRAM-based FPGAs, the device will not have to be reloaded when system power is restored. This enables the reduction or complete removal of the configuration PROM, expensive voltage monitor, brownout detection, and clock generator devices from the PCB design. Flash-based ProASICPLUS devices simplify total system design, and reduce cost and design risk, while increasing system reliability and improving system initialization time. In the ProASICPLUS flash switch, two transistors share the floating gate, which stores the programming information. One is the sensing transistor, which is only used for writing and verification of the floating gate voltage. The other is the switching transistor. It can be used in the architecture to connect/separate routing nets or to configure logic. It is also used to erase the floating gate (Figure 1-2 on page 1-2). Logic Tile The logic tile cell (Figure 1-3) has three inputs (any or all of which can be inverted) and one output (which can connect to both ultra-fast local and efficient long-line routing resources). Any three-input, one-output logic function (except a three-input XOR) can be configured as one tile. The tile can be configured as a latch with clear or set or as a flip-flop with clear or set. Thus, the tiles can flexibly map logic and sequential gates of a design. v5.9 1-3 ProASICPLUS Flash Family FPGAs Data Sheet Categories In order to provide the latest information to designers, some datasheets are published before data has been fully characterized. Datasheets are designated as "Product Brief," "Advanced," "Production," and "Datasheet Supplement." The definition of these categories are as follows: Product Brief The product brief is a summarized version of a datasheet (advanced or production) containing general product information. This brief gives an overview of specific device and family information. Advance This datasheet version contains initial estimated information based on simulation, other products, devices, or speed grades. This information can be used as estimates, but not for production. Unmarked (production) This datasheet version contains information that is considered to be final. Datasheet Supplement The datasheet supplement gives specific device information for a derivative family that differs from the general family datasheet. The supplement is to be used in conjunction with the datasheet to obtain more detailed information and for specifications that do not differ between the two families. Export Administration Regulations (EAR) The products described in this datasheet are subject to the Export Administration Regulations (EAR). They could require an approved export license prior to export from the United States. An export includes release of product or disclosure of technology to a foreign national inside or outside the United States. Actel Safety Critical, Life Support, and High-Reliability Applications Policy The Actel products described in this advance status datasheet may not have completed Actel’s qualification process. Actel may amend or enhance products during the product introduction and qualification process, resulting in changes in device functionality or performance. It is the responsibility of each customer to ensure the fitness of any Actel product (but especially a new product) for a particular purpose, including appropriateness for safety-critical, lifesupport, and other high-reliability applications. Consult Actel’s Terms and Conditions for specific liability exclusions relating to life-support applications. A reliability report covering all of Actel’s products is available on the Actel website at http://www.actel.com/documents/ORT_Report.pdf. Actel also offers a variety of enhanced qualification and lot acceptance screening procedures. Contact your local Actel sales office for additional reliability information. 1 -4 v5.9 Actel and the Actel logo are registered trademarks of Actel Corporation. All other trademarks are the property of their owners. Actel is the leader in low-power and mixed-signal FPGAs and offers the most comprehensive portfolio of system and power management solutions. Power Matters. Learn more at www.actel.com. Actel Corporation Actel Europe Ltd. Actel Japan Actel Hong Kong 2061 Stierlin Court Mountain View, CA 94043-4655 USA Phone 650.318.4200 Fax 650.318.4600 River Court, Meadows Business Park Station Approach, Blackwater Camberley Surrey GU17 9AB United Kingdom Phone +44 (0) 1276 609 300 Fax +44 (0) 1276 607 540 EXOS Ebisu Building 4F 1-24-14 Ebisu Shibuya-ku Tokyo 150 Japan Phone +81.03.3445.7671 Fax +81.03.3445.7668 http://jp.actel.com Room 2107, China Resources Building 26 Harbour Road Wanchai, Hong Kong Phone +852 2185 6460 Fax +852 2185 6488 www.actel.com.cn 5172161-25/12.09
APA450-BGG456 价格&库存

很抱歉,暂时无法提供与“APA450-BGG456”相匹配的价格&库存,您可以联系我们找货

免费人工找货