APT10026L2FLL
1000V 38A 0.260Ω
POWER MOS 7
R
FREDFET
TO-264
Max
®
Power MOS 7 is a new generation of low loss, high voltage, N-Channel
enhancement mode power MOSFETS. Both conduction and switching
®
losses are addressed with Power MOS 7 by significantly lowering RDS(ON)
®
and Qg. Power MOS 7 combines lower conduction and switching losses
along with exceptionally fast switching speeds inherent with APT's
patented metal gate structure.
• Lower Input Capacitance
• Lower Miller Capacitance
• Increased Power Dissipation
• Easier To Drive
• Lower Gate Charge, Qg
• Popular TO-264 MAX Package
MAXIMUM RATINGS
Symbol
VDSS
ID
D
G
S
All Ratings: TC = 25°C unless otherwise specified.
Parameter
APT10026L2FLL
UNIT
1000
Volts
Drain-Source Voltage
38
Continuous Drain Current @ TC = 25°C
1
Amps
IDM
Pulsed Drain Current
VGS
Gate-Source Voltage Continuous
±30
VGSM
Gate-Source Voltage Transient
±40
Total Power Dissipation @ TC = 25°C
893
Watts
Linear Derating Factor
7.14
W/°C
PD
TJ,TSTG
152
Operating and Storage Junction Temperature Range
TL
Lead Temperature: 0.063" from Case for 10 Sec.
IAR
Avalanche Current
EAR
Repetitive Avalanche Energy
EAS
1
-55 to 150
°C
300
Amps
38
(Repetitive and Non-Repetitive)
1
Single Pulse Avalanche Energy
Volts
50
4
mJ
3200
STATIC ELECTRICAL CHARACTERISTICS
MIN
BVDSS
Drain-Source Breakdown Voltage (VGS = 0V, ID = 250µA)
1000
RDS(on)
Drain-Source On-State Resistance
IDSS
IGSS
VGS(th)
2
(VGS = 10V, 19A)
TYP
MAX
Volts
0.260
Zero Gate Voltage Drain Current (VDS = 1000V, VGS = 0V)
100
Zero Gate Voltage Drain Current (VDS = 800V, VGS = 0V, TC = 125°C)
500
Gate-Source Leakage Current (VGS = ±30V, VDS = 0V)
Gate Threshold Voltage (VDS = VGS, ID = 5mA)
3
Ohms
µA
±100
nA
5
Volts
CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.
APT Website - http://www.advancedpower.com
UNIT
12-2003
Characteristic / Test Conditions
050-7112 Rev A
Symbol
APT10026L2FLL
DYNAMIC CHARACTERISTICS
Symbol
Characteristic
Test Conditions
Ciss
Input Capacitance
VGS = 0V
Coss
Output Capacitance
VDS = 25V
C rss
Total Gate Charge
Qgs
3
Qgd
Gate-Drain ("Miller ") Charge
Turn-on Delay Time
ID = 38A @ 25°C
RESISTIVE SWITCHING
VGS = 15V
Rise Time
td(off)
VDD = 500V
Turn-off Delay Time
tf
ID = 38A @ 25°C
Fall Time
Turn-on Switching Energy
Eoff
Turn-off Switching Energy
INDUCTIVE SWITCHING @ 25°C
6
Turn-on Switching Energy
Eoff
Turn-off Switching Energy
6
ns
1196
VDD = 667V, VGS = 15V
Eon
nC
9
RG = 0.6Ω
Eon
UNIT
pF
224
267
34
173
17
8
39
VGS = 10V
td(on)
MAX
7114
1268
VDD = 500V
Gate-Source Charge
tr
TYP
f = 1 MHz
Reverse Transfer Capacitance
Qg
MIN
ID = 38A, RG = 3Ω
713
INDUCTIVE SWITCHING @ 125°C
2014
VDD = 667V VGS = 15V
ID = 38A, RG = 3Ω
µJ
971
SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS
Symbol
IS
ISM
Characteristic / Test Conditions
MIN
TYP
MAX
38
Continuous Source Current (Body Diode)
UNIT
Amps
Pulsed Source Current
1
(Body Diode)
152
VSD
Diode Forward Voltage
2
(VGS = 0V, IS = -38A)
1.3
Volts
dv/
Peak Diode Recovery
18
V/ns
dt
dv/
dt
5
Reverse Recovery Time
(IS = -38A, di/dt = 100A/µs)
Tj = 25°C
310
Tj = 125°C
625
Q rr
Reverse Recovery Charge
(IS = -38A, di/dt = 100A/µs)
Tj = 25°C
2.0
Tj = 125°C
6.0
IRRM
Peak Recovery Current
(IS = -38A, di/dt = 100A/µs)
Tj = 25°C
15
Tj = 125°C
2.6
t rr
ns
µC
Amps
THERMAL CHARACTERISTICS
Symbol
Characteristic
RθJC
Junction to Case
RθJA
Junction to Ambient
MIN
TYP
MAX
0.14
40
1 Repetitive Rating: Pulse width limited by maximum junction
temperature
2 Pulse Test: Pulse width < 380 µs, Duty Cycle < 2%
3 See MIL-STD-750 Method 3471
0.14
0.9
0.12
0.7
0.5
Note:
0.06
PDM
Z JC, THERMAL IMPEDANCE (°C/W)
θ
050-7112 Rev A
12-2003
0.16
0.08
0.3
0.04
t1
t2
0.02
Duty Factor D = t1/t2
0.1
0.05
0
10-5
SINGLE PULSE
10-4
°C/W
4 Starting Tj = +25°C, L = 4.43mH, RG = 25Ω, Peak IL = 38A
5 dv/dt numbers reflect the limitations of the test circuit rather than the
device itself. IS ≤ -30A di/dt ≤ 700A/µs VR ≤ 1000 TJ ≤ 150°C
6 Eon includes diode reverse recovery. See figures 18, 20.
APT Reserves the right to change, without notice, the specifications and information contained herein.
0.10
UNIT
Peak TJ = PDM x ZθJC + TC
10-3
10-2
10-1
RECTANGULAR PULSE DURATION (SECONDS)
FIGURE 1, MAXIMUM EFFECTIVE TRANSIENT THERMAL IMPEDANCE, JUNCTION-TO-CASE vs PULSE DURATION
1.0
Typical Performance Curves
APT10026L2FLL
90
15 &10V
RC MODEL
Junction
temp. (°C)
0.0509
0.0522F
Power
(watts)
0.0894
0.988F
ID, DRAIN CURRENT (AMPERES)
80
Case temperature. (°C)
70
6.5V
60
50
40
6V
30
20
5.5V
10
5V
TJ = -55°C
80
60
40
TJ = +25°C
20
TJ = +125°C
0
0
1
2
3
4
5
6
7
8
VGS, GATE-TO-SOURCE VOLTAGE (VOLTS)
FIGURE 4, TRANSFER CHARACTERISTICS
40
BVDSS, DRAIN-TO-SOURCE BREAKDOWN
VOLTAGE (NORMALIZED)
NORMALIZED TO
= 10V @ I = 19A
GS
D
1.3
1.2
VGS=10V
1.1
1.0
VGS=20V
0.9
0.8
0
10
20
30
40
50
60
70
80
ID, DRAIN CURRENT (AMPERES)
FIGURE 5, RDS(ON) vs DRAIN CURRENT
30
25
20
15
10
5
0
25
50
75
100
125
150
TC, CASE TEMPERATURE (°C)
FIGURE 6, MAXIMUM DRAIN CURRENT vs CASE TEMPERATURE
2.5
I
D
1.00
0.95
0.90
0.85
-50
= 19A
GS
= 10V
2.0
1.5
1.0
0.5
0.0
-50
1.05
-25
0
25
50 75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
FIGURE 7, BREAKDOWN VOLTAGE vs TEMPERATURE
1.2
VGS(TH), THRESHOLD VOLTAGE
(NORMALIZED)
V
1.10
-25
0
25 50
75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
FIGURE 8, RDS(ON) vs. TEMPERATURE
1.1
1.0
0.9
0.8
12-2003
ID, DRAIN CURRENT (AMPERES)
V
1.15
35
RDS(ON), DRAIN-TO-SOURCE ON RESISTANCE
(NORMALIZED)
0
5
10
15
20
25
30
VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS)
FIGURE 3, LOW VOLTAGE OUTPUT CHARACTERISTICS
1.4
0.7
0.6
-50
-25
0
25
50
75 100 125 150
TC, CASE TEMPERATURE (°C)
FIGURE 9, THRESHOLD VOLTAGE vs TEMPERATURE
050-7112 Rev A
ID, DRAIN CURRENT (AMPERES)
100
VDS> ID (ON) x RDS(ON) MAX.
250 µSEC. PULSE TEST
@