APT20M18B2VFRG

APT20M18B2VFR A20M18LVFR 200V 100A POWER MOS V® FREDFET 0.018Ω B2VFR T-MAX™ Power MOS V® is a new generation of high voltage N-Channel enhancement mode power MOSFETs. This new technology minimizes the JFET effect, increases packing density and reduces the on-resistance. Power MOS V® also achieves faster switching speeds through optimized gate layout. TO-264 LVFR • T-MAX™ or TO-264 Package • Avalanche Energy Rated • Faster Switching • FAST RECOVERY BODY DIODE D G • Lower Leakage S MAXIMUM RATINGS Symbol VDSS ID All Ratings: TC = 25°C unless otherwise specified. Parameter APT20M18B2VFR_LVFR UNIT 200 Volts Drain-Source Voltage Continuous Drain Current 6 100 @ TC = 25°C Amps IDM Pulsed Drain Current VGS Gate-Source Voltage Continuous ±30 VGSM Gate-Source Voltage Transient ±40 Total Power Dissipation @ TC = 25°C 625 Watts Linear Derating Factor 5.00 W/°C PD TJ,TSTG 1 400 Operating and Storage Junction Temperature Range TL Lead Temperature: 0.063" from Case for 10 Sec. IAR Avalanche Current EAR EAS 1 -55 to 150 Amps 100 1 Single Pulse Avalanche Energy °C 300 (Repetitive and Non-Repetitive) Repetitive Avalanche Energy Volts 50 4 mJ 3000 STATIC ELECTRICAL CHARACTERISTICS MIN BVDSS Drain-Source Breakdown Voltage (VGS = 0V, ID = 250µA) 200 RDS(on) Drain-Source On-State Resistance IDSS IGSS VGS(th) 2 (VGS = 10V, ID = 50A) TYP MAX UNIT Volts 0.018 Ohms Zero Gate Voltage Drain Current (VDS = 200V, VGS = 0V) 250 Zero Gate Voltage Drain Current (VDS = 160V, VGS = 0V, TC = 125°C) 1000 Gate-Source Leakage Current (VGS = ±30V, VDS = 0V) ±100 nA 4 Volts Gate Threshold Voltage (VDS = VGS, ID = 2.5mA) 2 CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. APT Website - http://www.advancedpower.com Downloaded from Elcodis.com electronic components distributor µA 5-2004 Characteristic / Test Conditions 050-5906 Rev A Symbol APT20M18B2VFR_LVFR DYNAMIC CHARACTERISTICS Symbol Characteristic MIN Test Conditions TYP Ciss Input Capacitance Coss VGS = 0V Output Capacitance VDS = 25V 2320 Reverse Transfer Capacitance f = 1 MHz 700 Crss Qg Total Gate Charge Qgs 3 Gate-Source Charge Qgd Gate-Drain ("Miller") Charge td(on) Turn-on Delay Time tr Rise Time td(off) Turn-off Delay Time tf Fall Time MAX UNIT 9880 VGS = 10V 330 VDD = 150V 55 ID = 100A @ 25°C 145 VGS = 15V 18 VDD = 150V 27 ID = 100A @ 25°C 55 RG = 0.6Ω 6 pF nC ns SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS Symbol IS ISM Characteristic / Test Conditions MIN TYP MAX 100 Continuous Source Current (Body Diode) UNIT Amps Pulsed Source Current 1 (Body Diode) 400 VSD Diode Forward Voltage 2 (VGS = 0V, IS = -100A) 1.3 Volts dv/ Peak Diode Recovery 8 V/ns dt dv/ 5 dt t rr Reverse Recovery Time (IS = -100A, di/dt = 100A/µs) Tj = 25°C 230 Tj = 125°C 450 Q rr Reverse Recovery Charge (IS = -100A, di/dt = 100A/µs) Tj = 25°C 0.9 Tj = 125°C 3.4 IRRM Peak Recovery Current (IS = -100A, di/dt = 100A/µs) Tj = 25°C 11 Tj = 125°C 20 ns µC Amps THERMAL CHARACTERISTICS Symbol Characteristic MIN TYP MAX 0.20 RθJC Junction to Case RθJA Junction to Ambient 40 1 Repetitive Rating: Pulse width limited by maximum junction temperature 2 Pulse Test: Pulse width < 380 µs, Duty Cycle < 2% 3 See MIL-STD-750 Method 3471 0.9 0.7 Note: 0.5 0.10 PDM Z JC, THERMAL IMPEDANCE (°C/W) θ 050-5906 Rev A 5-2004 0.25 0.15 0.3 t2 0.1 0 SINGLE PULSE 0.05 10-5 t1 Duty Factor D = t1/t2 0.05 10-4 Peak TJ = PDM x ZθJC + TC 10-3 10-2 10-1 RECTANGULAR PULSE DURATION (SECONDS) FIGURE 1, MAXIMUM EFFECTIVE TRANSIENT THERMAL IMPEDANCE, JUNCTION-TO-CASE vs PULSE DURATION Downloaded from Elcodis.com electronic components distributor °C/W 4 Starting Tj = +25°C, L = 600µH, RG = 25Ω, Peak IL = 100A 5 dv/dt numbers reflect the limitations of the test circuit rather than the device itself. IS ≤ -ID100A di/dt ≤ 200A/µs VR ≤200V TJ ≤ 150°C 6 The maximum current is limited by lead temperature. APT Reserves the right to change, without notice, the specifications and information contained herein. 0.20 UNIT 1.0 Typical Performance Curves APT20M18B2VFR_LVFR 250 VGS =15 &10 V 0.0302 Power (watts) 0.0729 0.0955 0.00809F 0.0182F 0.264F ID, DRAIN CURRENT (AMPERES) RC MODEL Junction temp. (°C) 7V 200 6.5V 150 6V 100 5.5V 50 5V 4.5V Case temperature. (°C) 0 120 1.40 80 60 TJ = -55°C 40 TJ = +25°C 20 0 1 2 3 4 5 6 7 VGS, GATE-TO-SOURCE VOLTAGE (VOLTS) FIGURE 4, TRANSFER CHARACTERISTICS BVDSS, DRAIN-TO-SOURCE BREAKDOWN VOLTAGE (NORMALIZED) ID, DRAIN CURRENT (AMPERES) 1.20 VGS=10V 1.10 1.00 0.90 0.80 VGS=20V 0 1.15 100 80 60 40 20 0 25 50 75 100 125 150 TC, CASE TEMPERATURE (°C) FIGURE 6, MAXIMUM DRAIN CURRENT vs CASE TEMPERATURE 2.5 I V D 20 40 60 80 100 120 140 160 180 ID, DRAIN CURRENT (AMPERES) FIGURE 5, RDS(ON) vs DRAIN CURRENT 1.10 1.05 1.00 0.95 0.90 -50 -25 0 25 50 75 100 125 150 TJ, JUNCTION TEMPERATURE (°C) FIGURE 7, BREAKDOWN VOLTAGE vs TEMPERATURE 1.2 = 50A GS = 10V VGS(TH), THRESHOLD VOLTAGE (NORMALIZED) RDS(ON), DRAIN-TO-SOURCE ON RESISTANCE (NORMALIZED) GS 1.30 2.0 1.5 1.0 0.5 0.0 -50 -25 0 25 50 75 100 125 150 TJ, JUNCTION TEMPERATURE (°C) FIGURE 8, ON-RESISTANCE vs. TEMPERATURE Downloaded from Elcodis.com electronic components distributor 1.1 1.0 0.9 0.8 5-2004 0 TJ = +125°C NORMALIZED TO = 10V @ 50A V 0.7 0.6 -50 -25 0 25 50 75 100 125 150 TC, CASE TEMPERATURE (°C) FIGURE 9, THRESHOLD VOLTAGE vs TEMPERATURE 050-5906 Rev A ID, DRAIN CURRENT (AMPERES) 100 RDS(ON), DRAIN-TO-SOURCE ON RESISTANCE FIGURE 2, TRANSIENT THERMAL IMPEDANCE MODEL 5 10 15 20 25 30 VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS) FIGURE 3, LOW VOLTAGE OUTPUT CHARACTERISTICS VDS> ID (ON) x RDS (ON)MAX. 250 µSEC. PULSE TEST @