APT2X61DC120J
APT2X60DC120J
ISOTOP® SiC Diode
Power Module
2
2
3
1
4
Anti-Parallel
1
APT2X60DC120J
VRRM = 1200V
IF = 60A @ TC = 100°C
3
Application
Uninterruptible Power Supply (UPS)
Induction heating
Welding equipment
High speed rectifiers
4
Parallel
APT2X61DC120J
3
2
4
1
Features
SiC Schottky Diode
- Zero reverse recovery
- Zero forward recovery
- Temperature Independent switching behavior
- Positive temperature coefficient on VF
ISOTOP® Package (SOT-227)
Very low stray inductance
High level of integration
Benefits
Outstanding performance at high frequency operation
Low losses
Low noise switching
Direct mounting to heatsink (isolated package)
Low junction to case thermal resistance
RoHS Compliant
ISOTOP
Symbol
VR
VRRM
IF(AV)
IFSM
Parameter
Maximum DC reverse Voltage
Maximum Peak Repetitive Reverse Voltage
Maximum Average Forward Current Duty cycle = 50%
Non-Repetitive Forward Surge Current
10 µs
TC = 100°C
TC = 25°C
Max ratings
Unit
1200
V
60
750
A
These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. See application note
APT0502 on www.microsemi.com
www.microsemi.com
1–4
APT2X61_60DC120J – Rev 1 October, 2012
Absolute maximum ratings (per leg)
APT2X61DC120J
APT2X60DC120J
All ratings @ Tj = 25°C unless otherwise specified
Electrical Characteristics (per leg)
Symbol Characteristic
Test Conditions
VF
Diode Forward Voltage
IRM
Maximum Reverse Leakage Current
QC
Total Capacitive Charge
C
Total Capacitance
Min
Tj = 25°C
IF = 60A
Tj = 175°C
Tj = 25°C
VR = 1200V
Tj = 175°C
IF = 60A, VR = 600V
di/dt =3000A/µs
f = 1MHz, VR = 200V
f = 1MHz, VR = 400V
Typ
1.6
2.3
192
336
Max
1.8
3.0
1200
6000
Unit
V
µA
240
nC
576
414
pF
Thermal and package characteristics (per leg)
Symbol
RthJC
RthJA
VISOL
TJ,TSTG
TL
Torque
Wt
Characteristic
Junction to Case Thermal resistance
Junction to Ambient (IGBT & Diode)
Min
RMS Isolation Voltage, any terminal to case t =1 min, I isol
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