TYPICAL PERFORMANCE CURVES
600V APT50GT60BR_SR(G)
APT50GT60BR
APT50GT60SR
APT50GT60BRG*
APT50GT60SRG*
*G Denotes RoHS Compliant, Pb Free Terminal Finish.
Thunderbolt IGBT®
(B)
TO
• High Freq. Switching to 100KHz
• Low Tail Current
• Ultra Low Leakage Current
D 3 PA K
47
(S)
The Thunderblot IGBT® is a new generation of high voltage power IGBTs. Using Non- Punch
Through Technology, the Thunderblot IGBT® offers superior ruggedness and ultrafast
switching speed.
• Low Forward Voltage Drop
-2
C
G
G
C
E
E
C
• RBSOA and SCSOA Rated
G
E
MAXIMUM RATINGS
Symbol
All Ratings: TC = 25°C unless otherwise specified.
Parameter
APT50GT60BR_SR(G)
VCES
Collector-Emitter Voltage
600
VGE
Gate-Emitter Voltage
±30
I C1
Continuous Collector Current
I C2
Continuous Collector Current @ TC = 110°C
I CM
SSOA
PD
Pulsed Collector Current
7
@ TC = 25°C
TL
Volts
110
52
1
Amps
150
150A @ 600V
Switching Safe Operating Area @ TJ = 150°C
Total Power Dissipation
TJ,TSTG
UNIT
Watts
446
Operating and Storage Junction Temperature Range
-55 to 150
°C
Max. Lead Temp. for Soldering: 0.063" from Case for 10 Sec.
300
STATIC ELECTRICAL CHARACTERISTICS
Characteristic / Test Conditions
MIN
V(BR)CES
Collector-Emitter Breakdown Voltage (VGE = 0V, I C = 2mA)
600
VGE(TH)
Gate Threshold Voltage (VCE = VGE, I C = 1mA, Tj = 25°C)
VCE(ON)
Collector-Emitter On Voltage (VGE = 15V, I C = 50A, Tj = 25°C)
Collector-Emitter On Voltage (VGE = 15V, I C = 50A, Tj = 125°C)
I CES
Collector Cut-off Current (VCE = 600V, VGE = 0V, Tj = 25°C)
MAX
3
4
5
1.7
2.0
2.5
25
2
Gate-Emitter Leakage Current (VGE = ±20V)
CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.
MicrosemiWebsite-http://www.microsemi.com
Units
Volts
2.2
2
Collector Cut-off Current (VCE = 600V, VGE = 0V, Tj = 125°C)
I GES
TYP
μA
TBD
120
nA
052-6273 Rev D 3-2012
Symbol
DYNAMIC CHARACTERISTICS
Symbol
APT50GT60BR_SR(G)
Test Conditions
Characteristic
Cies
Input Capacitance
Coes
Output Capacitance
Cres
Reverse Transfer Capacitance
VGEP
Gate-to-Emitter Plateau Voltage
Qg
Qge
Total Gate Charge
SSOA
Switching Safe Operating Area
td(on)
Turn-on Delay Time
tr
td(off )
tf
Eon1
153
Gate Charge
7.5
VGE = 15V
240
VCE = 300V
20
I C = 50A
110
TJ = 150°C, R G = 4.3Ω, VGE =
15V, L = 100μH,VCE = 600V
32
Turn-off Delay Time
240
Current Fall Time
I C = 50A
36
Turn-on Switching Energy
RG = 4.3Ω
995
TJ = +25°C
5
14
Current Rise Time
VCC = 400V
32
Turn-off Delay Time
VGE = 15V
270
Turn-on Delay Time
I C = 50A
Current Fall Time
Turn-on Switching Energy
Turn-on Switching Energy (Diode)
Eoff
Turn-off Switching Energy
nC
ns
μJ
55
ns
95
1035
RG = 4.3Ω
44
Eon2
V
1070
Inductive Switching (125°C)
Eon1
pF
1110
6
UNIT
A
VGE = 15V
4
MAX
150
Current Rise Time
Turn-off Switching Energy
tf
f = 1 MHz
14
Eoff
td(off )
250
VCC = 400V
Turn-on Switching Energy (Diode)
tr
VGE = 0V, VCE = 25V
Inductive Switching (25°C)
Eon2
td(on)
2660
Gate-Emitter Charge
Gate-Collector ("Miller ") Charge
TYP
Capacitance
3
Qgc
MIN
TJ = +125°C
μJ
1655
6
1505
THERMAL AND MECHANICAL CHARACTERISTICS
Symbol
Characteristic
MIN
TYP
MAX
RθJC
Junction to Case (IGBT)
.28
RθJC
Junction to Case (DIODE)
N/A
WT
Package Weight
5.9
1 Repetitive Rating: Pulse width limited by maximum junction temperature.
2 For Combi devices, Ices includes both IGBT and FRED leakages
3 See MIL-STD-750 Method 3471.
4 Eon1 is the clamped inductive turn-on energy of the IGBT only, without the effect of a commutating diode reverse recovery current
adding to the IGBT turn-on loss. Tested in inductive switching test circuit shown in figure 21, but with a Silicon Carbide diode.
052-6273 Rev D 3-2012
5 Eon2 is the clamped inductive turn-on energy that includes a commutating diode reverse recovery current in the IGBT turn-on switching
loss. (See Figures 21, 22.)
6 Eoff is the clamped inductive turn-off energy measured in accordance with JEDEC standard JESD24-1. (See Figures 21, 23.)
7 Continuous current limited by package lead temperature.
Microsemi reserves the right to change, without notice, the specifications and information contained herein.
UNIT
°C/W
gm
TYPICAL PERFORMANCE CURVES
APT50GT60BR_SR(G)
200
160
V
GE
180
IC, COLLECTOR CURRENT (A)
TJ = 25°C
100
TJ = -55°C
80
TJ = 125°C
60
40
10
11V
160
10V
140
120
9V
100
80
8V
60
40
7V
20
0
1
2
3
4
VCE, COLLECTER-TO-EMITTER VOLTAGE (V)
0
5
6V
0
FIGURE 1, Output Characteristics(TJ = 25°C)
160
VGE, GATE-TO-EMITTER VOLTAGE (V)
IC, COLLECTOR CURRENT (A)
I = 50A
C
T = 25°C
J
14
TJ = -55°C
100
80
60
TJ = 25°C
40
TJ = 125°C
20
2
4
6
8
10
VGE, GATE-TO-EMITTER VOLTAGE (V)
VCE = 120V
12
VCE = 300V
10
VCE = 480V
8
6
4
2
0
12
0
50
FIGURE 3, Transfer Characteristics
TJ = 25°C.
250μs PULSE TEST
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