APTDF400AA20G

APTDF400AA20G Dual Common Anode diodes Power Module VRRM = 200V IC = 400A @ Tc = 80°C Application K1     A Uninterruptible Power Supply (UPS) Induction heating Welding equipment High speed rectifiers Features       K2  Ultra fast recovery times Soft recovery characteristics High blocking voltage High current Low leakage current Very low stray inductance - Symmetrical design - M5 power connectors High level of integration Benefits       Outstanding performance at high frequency operation Low losses Low noise switching Direct mounting to heatsink (isolated package) Low junction to case thermal resistance RoHS Compliant Symbol VR VRRM Parameter Maximum DC reverse Voltage Maximum Peak Repetitive Reverse Voltage IF(AV) Maximum Average Forward Current IF(RMS) IFSM RMS Forward Current Duty cycle = 50% Non-Repetitive Forward Surge Current 8.3ms Duty cycle = 50% Max ratings Unit 200 V TC = 25°C 500 TC = 80°C TC = 45°C TC = 45°C 400 500 3000 A These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. See application note APT0502 on www.microsemi.com www.microsemi.com 1-5 APTDF400AA20G – Rev 2 October, 2012 Absolute maximum ratings APTDF400AA20G All ratings @ Tj = 25°C unless otherwise specified Electrical Characteristics Symbol Characteristic VF Diode Forward Voltage IRM Maximum Reverse Leakage Current CT Junction Capacitance Test Conditions IF = 400A IF = 800A Tj = 125°C IF = 400A Tj = 25°C VR = 200V Tj = 125°C Min Typ 1.0 1.4 0.9 Max 1.1 V 750 1000 VR = 200V Unit 1600 µA pF Dynamic Characteristics Symbol Characteristic trr Reverse Recovery Time trr Reverse Recovery Time Qrr Reverse Recovery Charge IRRM Reverse Recovery Current trr Reverse Recovery Time Qrr Reverse Recovery Charge IRRM Reverse Recovery Current Test Conditions IF=1A,VR=30V di/dt = 400A/µs IF = 400A VR = 133V di/dt = 800A/µs IF = 400A VR = 133V Min Typ Tj = 25°C 39 Tj = 25°C 60 Tj = 125°C 110 Tj = 25°C Tj = 125°C 800 3360 Tj = 25°C 24 Tj = 125°C 60 Tj = 125°C di/dt = 4000A/µs Max Unit ns ns nC A 80 ns 7.64 µC 176 A Thermal and package characteristics Characteristic Junction to Case Thermal Resistance Min RMS Isolation Voltage, any terminal to case t =1 min, 50/60Hz Torque Mounting torque 4000 -40 -40 -40 3 2 Wt Package Weight Operating junction temperature range Storage Temperature Range Operating Case Temperature To heatsink For terminals www.microsemi.com M6 M5 Typ Max 0.14 150 125 100 5 3.5 300 Unit °C/W V °C N.m g 2-5 APTDF400AA20G – Rev 2 October, 2012 Symbol RthJC VISOL TJ TSTG TC APTDF400AA20G Typical Performance Curve Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration Thermal Impedance (°C/W) 0.16 0.14 0.9 0.12 0.7 0.1 0.08 0.5 0.06 0.3 0.04 0.1 0.05 0.02 Single Pulse 0 0.00001 0.0001 0.001 0.01 0.1 1 10 Rectangular Pulse Duration (Seconds) Forward Current vs Forward Voltage trr, Reverse Recovery Time (ns) 1000 800 600 TJ=25°C TJ=150°C 400 TJ=125°C TJ=-55°C 200 0 0.0 0.5 1.0 1.5 TJ=125°C VR=133V 400 A 100 520 A 80 200 A 60 40 2.0 0 800 QRR vs. Current Rate Charge 9 TJ=125°C VR=133V 8 400 A 520 A 7 200 A 6 5 4 3 2 0 800 1600 2400 3200 4000 4800 IRRM, Reverse Recovery Current (A) QRR, Reverse Recovery Charge (µC) VF, Anode to Cathode Voltage (V) IRRM vs. Current Rate of Charge 200 TJ=125°C VR=133V 160 400 A 520 A 200 A 120 80 40 0 800 -diF/dt (A/µs) 1600 2400 3200 4000 4800 -diF/dt (A/µs) Capacitance vs. Reverse Voltage Max. Average Forward Current vs. Case Temp. 600 15000 Duty Cycle = 0.5 TJ=150°C 500 12000 IF(AV) (A) C, Capacitance (pF) 1600 2400 3200 4000 4800 -diF/dt (A/µs) 9000 6000 400 300 200 3000 100 0 0 1 10 100 1000 VR, Reverse Voltage (V) www.microsemi.com 25 50 75 100 125 150 Case Temperature (°C) 3-5 APTDF400AA20G – Rev 2 October, 2012 IF, Forward Current (A) Trr vs. Current Rate of Charge 120 1200 APTDF400AA20G www.microsemi.com 4-5 APTDF400AA20G – Rev 2 October, 2012 SP6 Package outline (dimensions in mm) APTDF400AA20G DISCLAIMER The information contained in the document (unless it is publicly available on the Web without access restrictions) is PROPRIETARY AND CONFIDENTIAL information of Microsemi and cannot be copied, published, uploaded, posted, transmitted, distributed or disclosed or used without the express duly signed written consent of Microsemi. 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Buyer agrees not to use Products in any Life Support Applications and to the extent it does it shall conduct extensive testing of the Product in such applications and further agrees to indemnify and hold Seller, and its officers, employees, subsidiaries, affiliates, agents, sales representatives and distributors harmless against all claims, costs, damages and expenses, and attorneys' fees and costs arising, directly or directly, out of any claims of personal injury, death, damage or otherwise associated with the use of the goods in Life Support Applications, even if such claim includes allegations that Seller was negligent regarding the design or manufacture of the goods. www.microsemi.com 5-5 APTDF400AA20G – Rev 2 October, 2012 Buyer must notify Seller in writing before using Seller’s Products in Life Support Applications. 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