APTDF400KK120G

APTDF400KK120G VCES = 1200V IC = 400A @ Tc = 60°C Dual Common Cathode diodes Power Module Application A1     K Uninterruptible Power Supply (UPS) Induction heating Welding equipment High speed rectifiers Features       A2 Ultra fast recovery times Soft recovery characteristics High blocking voltage High current Low leakage current Very low stray inductance - Symmetrical design - M5 power connectors High level of integration  Benefits       Outstanding performance at high frequency operation Low losses Low noise switching Direct mounting to heatsink (isolated package) Low junction to case thermal resistance RoHS Compliant Symbol VR VRRM Parameter Maximum DC reverse Voltage Maximum Peak Repetitive Reverse Voltage IF(AV) Maximum Average Forward Current IF(RMS) IFSM RMS Forward Current Duty cycle = 50% Non-Repetitive Forward Surge Current 8.3ms Duty cycle = 50% Max ratings Unit 1200 V TC = 25°C 470 TC = 60°C TC = 45°C TC = 45°C 400 500 3000 A These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. See application note APT0502 on www.microsemi.com www.microsemi.com 1-5 APTDF400KK120G – Rev 2 October, 2012 Absolute maximum ratings APTDF400KK120G All ratings @ Tj = 25°C unless otherwise specified Electrical Characteristics Symbol Characteristic VF Diode Forward Voltage IRM Maximum Reverse Leakage Current CT Junction Capacitance Test Conditions IF = 400A IF = 600A Tj = 125°C IF = 400A Tj = 25°C VR = 1200V Tj = 125°C Min Typ 2.4 2.7 1.8 Max 3.0 V 250 1000 VR = 1200V Unit 440 µA pF Dynamic Characteristics Symbol Characteristic trr Reverse Recovery Time trr Reverse Recovery Time Qrr Reverse Recovery Charge IRRM Reverse Recovery Current trr Reverse Recovery Time Qrr Reverse Recovery Charge IRRM Reverse Recovery Current Test Conditions IF=1A,VR=30V di/dt = 400A/µs IF = 400A VR = 800V di/dt = 800A/µs IF = 400A VR = 800V Min Typ Tj = 25°C 45 Tj = 25°C 385 Tj = 125°C 480 Tj = 25°C Tj = 125°C 4.2 20.9 Tj = 25°C 24 Tj = 125°C 76 Tj = 125°C di/dt = 4000A/µs Max Unit ns ns µC A 210 ns 38 µC 280 A Thermal and package characteristics Characteristic Junction to Case Thermal Resistance Min RMS Isolation Voltage, any terminal to case t =1 min, 50/60Hz Torque Mounting torque 4000 -40 -40 -40 3 2 Wt Package Weight Operating junction temperature range Storage Temperature Range Operating Case Temperature To heatsink For terminals www.microsemi.com M6 M5 Typ Max 0.14 175 125 100 5 3.5 300 Unit °C/W V °C N.m g 2-5 APTDF400KK120G – Rev 2 October, 2012 Symbol RthJC VISOL TJ TSTG TC APTDF400KK120G Typical Performance Curve Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration Thermal Impedance (°C/W) 0.16 0.14 0.9 0.12 0.7 0.1 0.08 0.5 0.06 0.3 0.04 0.1 0.05 0.02 Single Pulse 0 0.00001 0.0001 0.001 0.01 0.1 1 10 Rectangular Pulse Duration (Seconds) Forward Current vs Forward Voltage Trr vs. Current Rate of Charge TJ=175°C 800 TJ=125°C 600 400 TJ=-55°C 200 TJ=25°C 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 600 TJ=125°C VR=800V 500 400 600 A 300 400 A 200 200 A 100 0 0 3.5 800 1600 2400 3200 4000 4800 -diF/dt (A/µs) IRRM vs. Current Rate of Charge QRR vs. Current Rate Charge 48 TJ=125°C VR=800V 600 A 40 400 A 32 24 200 A 16 0 800 1600 2400 3200 4000 4800 IRRM, Reverse Recovery Current (A) QRR, Reverse Recovery Charge (µC) VF, Anode to Cathode Voltage (V) 300 TJ=125°C VR=800V 250 200 A 150 100 50 0 800 1600 2400 3200 4000 4800 -diF/dt (A/µs) Capacitance vs. Reverse Voltage Max. Average Forward Current vs. Case Temp. 600 2500 500 2000 400 IF(AV) (A) C, Capacitance (pF) 400 A 200 -diF/dt (A/µs) 3000 600 A 1500 1000 Duty Cycle = 0.5 TJ=175°C 300 200 100 500 0 0 1 10 100 VR, Reverse Voltage (V) 1000 0 25 50 75 100 125 150 175 Case Temperature (ºC) www.microsemi.com 3-5 APTDF400KK120G – Rev 2 October, 2012 1000 trr, Reverse Recovery Time (ns) IF, Forward Current (A) 1200 APTDF400KK120G www.microsemi.com 4-5 APTDF400KK120G – Rev 2 October, 2012 SP6 Package outline (dimensions in mm) APTDF400KK120G DISCLAIMER The information contained in the document (unless it is publicly available on the Web without access restrictions) is PROPRIETARY AND CONFIDENTIAL information of Microsemi and cannot be copied, published, uploaded, posted, transmitted, distributed or disclosed or used without the express duly signed written consent of Microsemi. If the recipient of this document has entered into a disclosure agreement with Microsemi, then the terms of such Agreement will also apply. This document and the information contained herein may not be modified, by any person other than authorized personnel of Microsemi. No license under any patent, copyright, trade secret or other intellectual property right is granted to or conferred upon you by disclosure or delivery of the information, either expressly, by implication, inducement, estoppels or otherwise. Any license under such intellectual property rights must be approved by Microsemi in writing signed by an officer of Microsemi. Microsemi reserves the right to change the configuration, functionality and performance of its products at anytime without any notice. This product has been subject to limited testing and should not be used in conjunction with lifesupport or other mission-critical equipment or applications. Microsemi assumes no liability whatsoever, and Microsemi disclaims any express or implied warranty, relating to sale and/or use of Microsemi products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Any performance specifications believed to be reliable but are not verified and customer or user must conduct and complete all performance and other testing of this product as well as any user or customers final application. User or customer shall not rely on any data and performance specifications or parameters provided by Microsemi. It is the customer’s and user’s responsibility to independently determine suitability of any Microsemi product and to test and verify the same. The information contained herein is provided “AS IS, WHERE IS” and with all faults, and the entire risk associated with such information is entirely with the User. Microsemi specifically disclaims any liability of any kind including for consequential, incidental and punitive damages as well as lost profit. The product is subject to other terms and conditions which can be located on the web at http://www.microsemi.com/legal/tnc.asp Life Support Application Seller's Products are not designed, intended, or authorized for use as components in systems intended for space, aviation, surgical implant into the body, in other applications intended to support or sustain life, or for any other application in which the failure of the Seller's Product could create a situation where personal injury, death or property damage or loss may occur (collectively "Life Support Applications"). Buyer agrees not to use Products in any Life Support Applications and to the extent it does it shall conduct extensive testing of the Product in such applications and further agrees to indemnify and hold Seller, and its officers, employees, subsidiaries, affiliates, agents, sales representatives and distributors harmless against all claims, costs, damages and expenses, and attorneys' fees and costs arising, directly or directly, out of any claims of personal injury, death, damage or otherwise associated with the use of the goods in Life Support Applications, even if such claim includes allegations that Seller was negligent regarding the design or manufacture of the goods. www.microsemi.com 5-5 APTDF400KK120G – Rev 2 October, 2012 Buyer must notify Seller in writing before using Seller’s Products in Life Support Applications. Seller will study with Buyer alternative solutions to meet Buyer application specification based on Sellers sales conditions applicable for the new proposed specific part.