APTDR90X1601G

APTDR90X1601G

  • 厂商:

    ACTEL(微芯科技)

  • 封装:

    SP1

  • 描述:

    BRIDGE RECT 3PHASE 1.6KV 90A SP1

  • 数据手册
  • 价格&库存
APTDR90X1601G 数据手册
APTDR90X1601G VRRM = 1600V IC = 90A @ Tc = 80°C 3 Phase rectifier bridge Power Module 1 2 Application 7 9 11   8 10 12 Features 5 Input rectifiers for inverter Battery DC power supply     6 High blocking voltage High surge current Low leakage current Very low stray inductance - Symmetrical design High level of integration  Benefits     Solderable terminals for easy PCB mounting Direct mounting to heatsink (isolated package) Low profile RoHS compliant All multiple inputs and outputs must be shorted together 1/2 ; 5/6 ; 7/8 ; 9/10 ; 11/12 Symbol VR VRRM IF IFSM Parameter Maximum DC reverse Voltage Maximum Peak Repetitive Reverse Voltage DC Forward Current Non-Repetitive Forward Surge Current t=10ms TC = 80°C TJ = 45°C Max ratings Unit 1600 V 90 850 A These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. See application note APT0502 on www.microsemi.com www.microsemi.com 1-4 APTDR90X1601G – Rev 2 October, 2012 Absolute maximum ratings APTDR90X1601G All ratings @ Tj = 25°C unless otherwise specified Electrical Characteristics Symbol Characteristic Test Conditions IR Reverse Current VR = 1600V VF Forward Voltage IF = 90A VT rT On – state Voltage On – state Slope resistance Min Tj = 25°C Tj = 125°C Tj = 25°C Tj = 125°C Typ Max 50 4 1.3 1.1 0.8 4.8 Unit µA mA V V mΩ Thermal and package characteristics Symbol RthJC VISOL TJ TSTG TC Torque Wt Characteristic Junction to Case Thermal Resistance Min RMS Isolation Voltage, any terminal to case t =1 min, 50/60Hz 4000 -40 -40 -40 2 Operating junction temperature range Storage Temperature Range Operating Case Temperature Mounting torque Package Weight To heatsink M4 Typ Max 0.85 150 125 100 3 80 Unit °C/W V °C N.m g See application note 1904 - Mounting Instructions for SP1 Power Modules on www.microsemi.com www.microsemi.com 2-4 APTDR90X1601G – Rev 2 October, 2012 SP1 Package outline (dimensions in mm) APTDR90X1601G Typical Performance Curve Forward Characteristic Non-Repetitive Forward Surge Current 1000 180 150 800 TJ=125°C IFSM (A) IF (A) 120 90 TJ=45°C 600 TJ=125°C 400 60 TJ=25°C 30 0 0.01 0 0.0 0.4 0.8 1.2 50Hz 80% VRRM 200 1.6 2.0 0.1 t (s) VF (V) maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration 0.8 0.6 0.4 0.9 0.7 0.5 0.3 0.2 0.1 0.05 0 0.00001 Single Pulse 0.0001 0.001 0.01 0.1 1 10 Rectangular Pulse Duration in Seconds www.microsemi.com 3-4 APTDR90X1601G – Rev 2 October, 2012 Thermal Impedance (°C/W) 1 APTDR90X1601G DISCLAIMER The information contained in the document (unless it is publicly available on the Web without access restrictions) is PROPRIETARY AND CONFIDENTIAL information of Microsemi and cannot be copied, published, uploaded, posted, transmitted, distributed or disclosed or used without the express duly signed written consent of Microsemi. If the recipient of this document has entered into a disclosure agreement with Microsemi, then the terms of such Agreement will also apply. This document and the information contained herein may not be modified, by any person other than authorized personnel of Microsemi. No license under any patent, copyright, trade secret or other intellectual property right is granted to or conferred upon you by disclosure or delivery of the information, either expressly, by implication, inducement, estoppels or otherwise. Any license under such intellectual property rights must be approved by Microsemi in writing signed by an officer of Microsemi. Microsemi reserves the right to change the configuration, functionality and performance of its products at anytime without any notice. This product has been subject to limited testing and should not be used in conjunction with lifesupport or other mission-critical equipment or applications. Microsemi assumes no liability whatsoever, and Microsemi disclaims any express or implied warranty, relating to sale and/or use of Microsemi products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Any performance specifications believed to be reliable but are not verified and customer or user must conduct and complete all performance and other testing of this product as well as any user or customers final application. User or customer shall not rely on any data and performance specifications or parameters provided by Microsemi. It is the customer’s and user’s responsibility to independently determine suitability of any Microsemi product and to test and verify the same. The information contained herein is provided “AS IS, WHERE IS” and with all faults, and the entire risk associated with such information is entirely with the User. Microsemi specifically disclaims any liability of any kind including for consequential, incidental and punitive damages as well as lost profit. The product is subject to other terms and conditions which can be located on the web at http://www.microsemi.com/legal/tnc.asp Life Support Application Seller's Products are not designed, intended, or authorized for use as components in systems intended for space, aviation, surgical implant into the body, in other applications intended to support or sustain life, or for any other application in which the failure of the Seller's Product could create a situation where personal injury, death or property damage or loss may occur (collectively "Life Support Applications"). Buyer agrees not to use Products in any Life Support Applications and to the extent it does it shall conduct extensive testing of the Product in such applications and further agrees to indemnify and hold Seller, and its officers, employees, subsidiaries, affiliates, agents, sales representatives and distributors harmless against all claims, costs, damages and expenses, and attorneys' fees and costs arising, directly or directly, out of any claims of personal injury, death, damage or otherwise associated with the use of the goods in Life Support Applications, even if such claim includes allegations that Seller was negligent regarding the design or manufacture of the goods. www.microsemi.com 4-4 APTDR90X1601G – Rev 2 October, 2012 Buyer must notify Seller in writing before using Seller’s Products in Life Support Applications. Seller will study with Buyer alternative solutions to meet Buyer application specification based on Sellers sales conditions applicable for the new proposed specific part.
APTDR90X1601G 价格&库存

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