APTGF150A120T3AG

APTGF150A120T3AG

  • 厂商:

    ACTEL(微芯科技)

  • 封装:

    SP3

  • 描述:

    IGBT 模块 NPT 半桥 1200 V 210 A 1041 W 底座安装 SP3

  • 详情介绍
  • 数据手册
  • 价格&库存
APTGF150A120T3AG 数据手册
APTGF150A120T3AG Phase leg NPT IGBT Power Module Power Module 29 30 31 32 Application  Welding converters  Switched Mode Power Supplies  Uninterruptible Power Supplies  Motor control 13 4 3 26 27 28 22 23 25 Features  Non Punch Through (NPT) Fast IGBT - Low voltage drop - Low tail current - Switching frequency up to 50 kHz - Soft recovery parallel diodes - Low diode VF - Low leakage current - RBSOA and SCSOA rated  Very low stray inductance  Kelvin emitter for easy drive  Internal thermistor for temperature monitoring  High level of integration  AlN substrate for improved thermal performance R1 8 7 16 28 27 26 25 18 19 20 14 20 19 18 23 22 29 16 30 15 31 14 32 13 2 3 4 7 8 VCES = 1200V IC = 150A @ Tc = 100°C 10 11 12 Pins 29/30/31/32 must be shorted together Pins 26/27/28/22/23/25 must be shorted together to achieve a phase leg Pins 16/18/19/20 must be shorted together Benefits  Direct mounting to heatsink (isolated package)  Low junction to case thermal resistance  Solderable terminals both for power and signal for easy PCB mounting  Low profile  RoHS Compliant Symbol VCES IC ICM VGE PD RBSOA Parameter Collector - Emitter Breakdown Voltage TC = 25°C Continuous Collector Current TC = 100°C Pulsed Collector Current Gate – Emitter Voltage Maximum Power Dissipation Reverse Bias Safe Operating Area TC = 25°C TC = 25°C TJ = 150°C Max ratings 1200 210 150 300 ±20 1041 300A @ 1150V Unit V A V W These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. See application note APT0502 on www.microsemi.com www.microsemi.com 1–6 APTGF150A120T3AG – Rev 1 October, 2012 Absolute maximum ratings APTGF150A120T3AG All ratings @ Tj = 25°C unless otherwise specified Electrical Characteristics Symbol Characteristic ICES Zero Gate Voltage Collector Current VCE(sat) Collector Emitter Saturation Voltage VGE(th) IGES Gate Threshold Voltage Gate – Emitter Leakage Current Test Conditions Min VGE = 0V, VCE = 1200V Tj = 25°C VGE =15V IC = 150A Tj = 125°C VGE = VCE , IC = 6mA VGE = 20V, VCE = 0V Typ 4.5 3.2 3.9 5.5 Min Typ Max Unit 250 3.7 µA 6.5 400 V nA Max Unit V Dynamic Characteristics Symbol Characteristic Cies Coes Cres Input Capacitance Output Capacitance Reverse Transfer Capacitance QG Gate charge Td(on) Tr Td(off) Tf Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Td(on) Tr Td(off) Turn-on Delay Time Rise Time Turn-off Delay Time Tf Fall Time Eon Turn-on Switching Energy Eoff Turn-off Switching Energy Isc Short Circuit data Test Conditions VGE = 0V VCE = 25V f = 1MHz VGE= ±15V ; VCE=600V IC=150A Inductive Switching (25°C) VGE = ±15V VBus = 600V IC = 150A RG = 5.6 Inductive Switching (125°C) VGE = ±15V VBus = 600V IC = 150A RG = 5.6 VGE = ±15V Tj = 125°C VBus = 600V IC = 150A Tj = 125°C RG = 5.6 VGE ≤15V ; VBus = 900V tp ≤ 10µs ; Tj = 125°C 9.3 1.4 0.7 nF 1.6 µC 120 50 310 20 ns 130 60 360 ns 30 18 mJ 8 900 A Reverse diode ratings and characteristics VRRM IRM IF VF Test Conditions Min VR=1200V DC Forward Current Diode Forward Voltage trr Reverse Recovery Time Qrr Reverse Recovery Charge Max 1200 Maximum Peak Repetitive Reverse Voltage Maximum Reverse Leakage Current Typ IF = 120A VR = 800V di/dt =400A/µs www.microsemi.com V Tj = 25°C Tj = 125°C 150 600 Tj = 125°C 120 2.5 3 1.8 Tj = 25°C 265 Tj = 125°C Tj = 25°C 350 1120 Tj = 125°C 5780 Tc = 100°C IF = 120A IF = 240A IF = 120A Unit µA A 3 V ns nC 2–6 APTGF150A120T3AG – Rev 1 October, 2012 Symbol Characteristic APTGF150A120T3AG Thermal and package characteristics Symbol Characteristic RthJC VISOL TJ TSTG TC Torque Wt Min Junction to Case Thermal Resistance RMS Isolation Voltage, any terminal to case t =1 min, 50/60Hz Operating junction temperature range Storage Temperature Range Operating Case Temperature Mounting torque Package Weight Typ IGBT Diode To heatsink M4 4000 -40 -40 -40 2 Max 0.12 0.37 Unit °C/W V 150 125 100 3 110 °C N.m g Temperature sensor NTC (see application note APT0406 on www.microsemi.com for more information). Symbol R25 ∆R25/R25 B25/85 ∆B/B Characteristic Resistance @ 25°C Min T25 = 298.15 K TC=100°C RT  R25 Typ 50 5 3952 4 Max Unit k % K % T: Thermistor temperature   1 1  RT: Thermistor value at T exp  B25 / 85    T T  25   See application note 1901 - Mounting Instructions for SP3 Power Modules on www.microsemi.com www.microsemi.com 3–6 APTGF150A120T3AG – Rev 1 October, 2012 SP3 Package outline (dimensions in mm) APTGF150A120T3AG Typical Performance Curve Output Characteristics 300 250 250 TJ=25°C 150 VGE=20V VGE=12V VGE=9V 100 TJ=125°C 50 50 0 0 0 1 2 3 VCE (V) 4 5 6 0 1 2 3 4 VCE (V) 5 6 Energy losses vs Collector Current Transfert Characteristics 300 56 VCE = 600V VGE = 15V RG = 5.6 Ω TJ = 125°C 48 250 40 E (mJ) 200 TJ=125°C 150 Eon 32 24 100 Eoff 16 TJ=25°C 50 8 0 0 5 6 7 8 9 10 11 0 12 50 100 150 200 250 300 IC (A) VGE (V) Switching Energy Losses vs Gate Resistance Reverse Bias Safe Operating Area 70 350 50 40 300 250 Eon IC (A) VCE = 600V VGE =15V IC = 150A TJ = 125°C 60 E (mJ) VGE=15V 150 100 IC (A) TJ = 125°C 200 200 IC (A) IC (A) Output Characteristics (VGE=15V) 300 30 20 200 150 VGE=15V TJ=125°C RG=5.6 Ω 100 Eoff 50 10 0 0 0 5 0 10 15 20 25 30 35 40 45 50 Gate Resistance (ohms) 300 600 900 1200 1500 VCE (V) maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration 0.12 0.1 0.9 IGBT 0.7 0.08 0.06 0.5 0.04 0.3 0.02 0.1 Single Pulse 0.05 0 0.00001 0.0001 0.001 0.01 0.1 1 10 rectangular Pulse Duration (Seconds) www.microsemi.com 4–6 APTGF150A120T3AG – Rev 1 October, 2012 Thermal Impedance (°C/W) 0.14 APTGF150A120T3AG Forward Characteristic of diode 150 ZVS 120 ZCS 300 VCE=600V D=50% RG=5.6 Ω TJ=125°C TC=75°C 250 200 IF (A) Fmax, Operating Frequency (kHz) Operating Frequency vs Collector Current 180 90 150 TJ=125°C 100 60 30 TJ=25°C 50 hard switching 0 0 0 40 80 120 IC (A) 160 0 200 0.5 1 1.5 2 VF (V) 2.5 3 3.5 maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration 0.35 0.3 Diode 0.9 0.7 0.25 0.2 0.15 0.5 0.3 0.1 0.05 0.1 Single Pulse 0.05 0 0.00001 0.0001 0.001 0.01 0.1 1 10 rectangular Pulse Duration (Seconds) www.microsemi.com 5–6 APTGF150A120T3AG – Rev 1 October, 2012 Thermal Impedance (°C/W) 0.4 APTGF150A120T3AG DISCLAIMER The information contained in the document (unless it is publicly available on the Web without access restrictions) is PROPRIETARY AND CONFIDENTIAL information of Microsemi and cannot be copied, published, uploaded, posted, transmitted, distributed or disclosed or used without the express duly signed written consent of Microsemi. If the recipient of this document has entered into a disclosure agreement with Microsemi, then the terms of such Agreement will also apply. This document and the information contained herein may not be modified, by any person other than authorized personnel of Microsemi. No license under any patent, copyright, trade secret or other intellectual property right is granted to or conferred upon you by disclosure or delivery of the information, either expressly, by implication, inducement, estoppels or otherwise. Any license under such intellectual property rights must be approved by Microsemi in writing signed by an officer of Microsemi. Microsemi reserves the right to change the configuration, functionality and performance of its products at anytime without any notice. This product has been subject to limited testing and should not be used in conjunction with lifesupport or other mission-critical equipment or applications. Microsemi assumes no liability whatsoever, and Microsemi disclaims any express or implied warranty, relating to sale and/or use of Microsemi products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Any performance specifications believed to be reliable but are not verified and customer or user must conduct and complete all performance and other testing of this product as well as any user or customers final application. User or customer shall not rely on any data and performance specifications or parameters provided by Microsemi. It is the customer’s and user’s responsibility to independently determine suitability of any Microsemi product and to test and verify the same. The information contained herein is provided “AS IS, WHERE IS” and with all faults, and the entire risk associated with such information is entirely with the User. Microsemi specifically disclaims any liability of any kind including for consequential, incidental and punitive damages as well as lost profit. The product is subject to other terms and conditions which can be located on the web at http://www.microsemi.com/legal/tnc.asp Life Support Application Seller's Products are not designed, intended, or authorized for use as components in systems intended for space, aviation, surgical implant into the body, in other applications intended to support or sustain life, or for any other application in which the failure of the Seller's Product could create a situation where personal injury, death or property damage or loss may occur (collectively "Life Support Applications"). Buyer agrees not to use Products in any Life Support Applications and to the extent it does it shall conduct extensive testing of the Product in such applications and further agrees to indemnify and hold Seller, and its officers, employees, subsidiaries, affiliates, agents, sales representatives and distributors harmless against all claims, costs, damages and expenses, and attorneys' fees and costs arising, directly or directly, out of any claims of personal injury, death, damage or otherwise associated with the use of the goods in Life Support Applications, even if such claim includes allegations that Seller was negligent regarding the design or manufacture of the goods. www.microsemi.com 6–6 APTGF150A120T3AG – Rev 1 October, 2012 Buyer must notify Seller in writing before using Seller’s Products in Life Support Applications. Seller will study with Buyer alternative solutions to meet Buyer application specification based on Sellers sales conditions applicable for the new proposed specific part.
APTGF150A120T3AG
物料型号:APTGF150A120T3AG

器件简介:这是一个非穿透型(NPT)快速IGBT功率模块,适用于焊接转换器、开关电源、不间断电源和电机控制等应用。

引脚分配:文档中提到,引脚29/30/31/32必须短接在一起,引脚26/27/28/22/23/25也必须短接在一起以形成相腿,引脚16/18/19/20必须短接在一起。

参数特性: - 集电极-发射极击穿电压(VCES):1200V - 集电极连续电流(Ic):在25°C时为150A,100°C时为150A - 脉冲集电极电流(ICM):在25°C时为300A - 栅极-发射极电压(VGE):±20V - 最大功率耗散(Pp):在25°C时为1041W - 反向偏置安全工作区(RBSOA):在150°C时为300A@1150V

功能详解:该模块具有低电压降、低尾电流、高达50kHz的开关频率、软恢复并联二极管、低二极管正向电压(VF)、低漏电流、低杂散电感等特点。此外,它还具有Kelvin发射极以便于驱动和内部热敏电阻以进行温度监测。

应用信息:适用于焊接转换器、开关电源、不间断电源和电机控制等。

封装信息:直接安装到散热器(隔离封装)、低结到外壳的热阻、可焊接的电源和信号端子便于PCB安装、低轮廓、符合RoHS标准。

注意事项:这些设备对静电放电敏感,应遵循适当的处理程序。有关更多信息,请参阅Microsemi网站上的应用说明APT0502。
APTGF150A120T3AG 价格&库存

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