APTGT100TL60T3G
Three level inverter
Trench + Field Stop IGBT3
Power Module
VCES = 600V
IC = 100A @ Tc = 80°C
Application
Solar converter
Uninterruptible Power Supplies
Features
Trench + Field Stop IGBT3
- Low voltage drop
- Low tail current
- Switching frequency up to 20 kHz
- Low leakage current
- RBSOA and SCSOA rated
Kelvin emitter for easy drive
Very low stray inductance
High level of integration
Internal thermistor for temperature monitoring
Benefits
Stable temperature behavior
Very rugged
Direct mounting to heatsink (isolated package)
Low junction to case thermal resistance
Low profile
RoHS Compliant
All multiple inputs and outputs must be shorted together
Example: 10/11/12 ; 7/8 …
All ratings @ Tj = 25°C unless otherwise specified
Q1 to Q4 Absolute maximum ratings (per IGBT)
ICM
VGE
PD
RBSOA
TC = 25°C
Max ratings
600
150
100
200
±20
340
Tj = 150°C
200A @ 550V
TC = 25°C
TC = 80°C
TC = 25°C
Continuous Collector Current
Pulsed Collector Current
Gate – Emitter Voltage
Power Dissipation
Reverse Bias Safe Operating Area
Unit
V
November, 2017
IC
Parameter
Collector - Emitter Voltage
A
V
W
These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.
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1-8
APTGT100TL60T3G – Rev 2
Symbol
VCES
APTGT100TL60T3G
Q1 to Q4 Electrical Characteristics (per IGBT)
Symbol Characteristic
ICES
Zero Gate Voltage Collector Current
VCE(sat)
Collector Emitter Saturation Voltage
VGE(th)
IGES
Gate Threshold Voltage
Gate – Emitter Leakage Current
Test Conditions
VGE = 0V, VCE = 600V
Tj = 25°C
VGE =15V
IC = 100A
Tj = 150°C
VGE = VCE , IC = 1.5 mA
VGE = 20V, VCE = 0V
Min
Typ
5.0
1.5
1.7
5.8
Max
Unit
250
1.9
µA
6.5
400
V
nA
Max
Unit
V
Q1 to Q4 Dynamic Characteristics (per IGBT)
Symbol
Cies
Coes
Cres
QG
Td(on)
Tr
Td(off)
Tf
Characteristic
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate charge
Turn-on Delay Time
Rise Time
Turn-off Delay Time
Fall Time
Td(on)
Tr
Turn-on Delay Time
Rise Time
Td(off)
Turn-off Delay Time
Tf
Fall Time
Eon
Turn on Energy
Eoff
Turn off Energy
Isc
Short Circuit data
RthJC
Test Conditions
VGE = 0V
VCE = 25V
f = 1MHz
Min
VGE=±15V, IC=100A
VCE=300V
Inductive Switching (25°C)
VGE = ±15V
VBus = 300V
IC = 100A
RG = 3.3
Inductive Switching (150°C)
VGE = ±15V
VBus = 300V
IC = 100A
RG = 3.3
VGE = ±15V
VBus = 300V
IC = 100A
RG = 3.3
Typ
6100
390
190
pF
1.1
µC
115
45
225
ns
55
130
50
ns
300
70
Tj = 150°C
0.875
mJ
Tj = 150°C
3.5
mJ
500
A
VGE ≤15V ; VBus = 360V
tp ≤ 6µs ; Tj = 150°C
Junction to Case Thermal Resistance
0.44
°C/W
CR1 to CR4 diode ratings and characteristics (per diode)
Peak Repetitive Reverse Voltage
Reverse Leakage Current
DC Forward current
VR=600V
VF
Diode Forward Voltage
IF = 75A
VGE = 0V
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
Err
Reverse Recovery Energy
RthJC
IF = 75A
VR = 300V
di/dt =2000A/µs
Junction to Case Thermal Resistance
Min
Typ
Tc = 80°C
Tj = 25°C
Tj = 150°C
Tj = 25°C
75
1.6
1.5
100
Tj = 150°C
Tj = 25°C
150
3.6
Tj = 150°C
Tj = 25°C
Tj = 150°C
7.6
0.85
1.8
Max
Unit
600
150
V
µA
A
2
V
ns
µC
mJ
0.98
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November, 2017
VRRM
IRM
IF
Test Conditions
°C/W
2-8
APTGT100TL60T3G – Rev 2
Symbol Characteristic
APTGT100TL60T3G
CR5 & CR6 diode ratings and characteristics (per diode)
Symbol
VRRM
IRM
IF
Characteristic
Peak Repetitive Reverse Voltage
Reverse Leakage Current
DC Forward Current
VF
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
Test Conditions
RthJC
Typ
VR=600V
IF = 100A
VGE = 0V
IF = 100A
VR = 300V
di/dt =2000A/µs
Err
Min
Reverse Recovery Energy
Tc = 80°C
Tj = 25°C
Tj = 150°C
Tj = 25°C
Tj = 150°C
Tj = 25°C
100
1.6
1.5
125
220
4.7
Tj = 150°C
Tj = 25°C
9.9
1.1
Tj = 150°C
2.4
Max
600
150
2
Unit
V
µA
A
V
ns
µC
mJ
Junction to Case Thermal Resistance
0.77
°C/W
Temperature sensor NTC (see application note APT0406 on www.microsemi.com for more information).
Symbol
R25
∆R25/R25
B25/85
∆B/B
Characteristic
Resistance @ 25°C
Min
T25 = 298.15 K
TC=100°C
RT
R25
Typ
50
5
3952
4
Max
Unit
k
%
K
%
T: Thermistor temperature
1
1 RT: Thermistor value at T
exp B25 / 85
T
T
25
Thermal and package characteristics
Min
4000
-40
-40
-40
-40
2
Max
175
TJmax -25
125
125
3
110
Unit
V
°C
N.m
g
November, 2017
Characteristic
RMS Isolation Voltage, any terminal to case t =1 min, 50/60Hz
Operating junction temperature range
Recommended junction temperature under switching conditions
Storage Temperature Range
Operating Case Temperature
Mounting torque
To heatsink
M4
Package Weight
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3-8
APTGT100TL60T3G – Rev 2
Symbol
VISOL
TJ
TJOP
TSTG
TC
Torque
Wt
APTGT100TL60T3G
Package outline (dimensions in mm)
See application note 1906 - Mounting Instructions for SP3F Power Modules on www.microsemi.com
Q1 to Q4 Typical performance curve
80
VCE=300V
D=50%
R G=3.3Ω
T J=150°C
60
40
T c =85°C
Hard
switching
20
0
25
50
75
100
125
150
IC (A)
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November, 2017
0
4-8
APTGT100TL60T3G – Rev 2
Fmax, Operating Frequency (kHz)
Operating Frequency vs Collector Current
APTGT100TL60T3G
Output Characteristics (VGE=15V)
Output Characteristics
200
200
TJ=25°C
175
TJ=150°C
125
IC (A)
IC (A)
150
TJ=125°C
150
100
75
50
25
25
TJ=25°C
0.5
1
1.5
VCE (V)
VGE=9V
0
2
2.5
0
3
7
175
1
1.5
2
VCE (V)
VCE = 300V
VGE = 15V
RG = 3.3Ω
TJ = 150°C
6
TJ=25°C
150
5
E (mJ)
125
100
TJ=125°C
75
0.5
TJ=150°C
TJ=25°C
4
3
5
6
7
Eon
0
0
8
9
10
11
0
12
25
50
75
100 125 150 175 200
IC (A)
VGE (V)
Switching Energy Losses vs Gate Resistance
Reverse Bias Safe Operating Area
250
VCE = 300V
VGE =15V
IC = 100A
TJ = 150°C
200
Eoff
Eon
IF (A)
E (mJ)
3.5
Eoff
1
25
6
3
2
50
8
2.5
Energy losses vs Collector Current
Transfert Characteristics
200
IC (A)
VGE=15V
100
50
0
VGE=13V
125
75
0
VGE=19V
TJ = 150°C
175
4
150
100
2
VGE=15V
TJ=150°C
RG=3.3Ω
50
0
0
0
5
10
15
20
25
Gate Resistance (ohms)
30
0
100
200
300 400
VCE (V)
500
600
700
Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration
0.4
0.9
0.7
November, 2017
0.3
0.5
0.2
0.1
0.3
0.1
0.05
0
0.00001
Single Pulse
0.0001
0.001
0.01
0.1
1
10
Rectangular Pulse Duration in Seconds
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5-8
APTGT100TL60T3G – Rev 2
Thermal Impedance (°C/W)
0.5
APTGT100TL60T3G
CR1 to CR4 Typical performance curve
Forward Characteristic of diode
150
125
IF (A)
100
75
50
TJ=150°C
25
TJ=25°C
0
0
0.4
0.8
1.2
1.6
VF (V)
2
2.4
Switching Energy Losses vs Gate Resistance
Energy losses vs Collector Current
2
3
VCE = 300V
IC = 75A
TJ = 150°C
2
E (mJ)
E (mJ)
1.5
VCE = 300V
RG = 4.7Ω
TJ = 150°C
1
1
0.5
0
0
5
10
15
20
25
30
0
35
0
25
50
75
100
125
150
IF (A)
Gate Resistance (ohms)
maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration
0.8
0.9
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.05
0
0.00001
Single Pulse
0.0001
0.001
0.01
0.1
1
November, 2017
1
10
Rectangular Pulse Duration in Seconds
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6-8
APTGT100TL60T3G – Rev 2
Thermal Impedance (°C/W)
1.2
APTGT100TL60T3G
CR5 & CR6 Typical performance curve
Forward Characteristic of diode
200
175
150
IF (A)
125
100
75
TJ=150°C
50
25
TJ=25°C
0
0
0.4
0.8
1.2
1.6
VF (V)
2
2.4
Energy losses vs Collector Current
Switching Energy Losses vs Gate Resistance
4
3
VCE = 300V
IC = 100A
TJ = 150°C
2.5
3
E (mJ)
E (mJ)
2
VCE = 300V
RG = 3.3Ω
TJ = 150°C
1.5
1
2
1
0.5
0
0
0
5
10
15
20
25
0
30
25
50
75
100 125 150 175 200
IF (A)
Gate Resistance (ohms)
Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration
0.6
0.5
0.4
0.3
0.2
0.1
0.9
0.7
0.5
0.3
0.1
0.05
0
0.00001
Single Pulse
0.0001
0.001
0.01
0.1
1
November, 2017
0.7
10
Rectangular Pulse Duration in Seconds
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7-8
APTGT100TL60T3G – Rev 2
Thermal Impedance (°C/W)
0.8
APTGT100TL60T3G
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without any notice. This product has been subject to limited testing and should not be used in conjunction with lifesupport or other mission-critical equipment or applications. Microsemi assumes no liability whatsoever, and Microsemi
disclaims any express or implied warranty, relating to sale and/or use of Microsemi products including liability or
warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other
intellectual property right. Any performance specifications believed to be reliable but are not verified and customer or
user must conduct and complete all performance and other testing of this product as well as any user or customers final
application. User or customer shall not rely on any data and performance specifications or parameters provided by
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is subject to other terms and conditions which can be located on the web at http://www.microsemi.com/legal/tnc.asp
Life Support Application
Seller's Products are not designed, intended, or authorized for use as components in systems intended for space,
aviation, surgical implant into the body, in other applications intended to support or sustain life, or for any other
application in which the failure of the Seller's Product could create a situation where personal injury, death or property
damage or loss may occur (collectively "Life Support Applications").
Buyer agrees not to use Products in any Life Support Applications and to the extent it does it shall conduct extensive
testing of the Product in such applications and further agrees to indemnify and hold Seller, and its officers, employees,
subsidiaries, affiliates, agents, sales representatives and distributors harmless against all claims, costs, damages and
expenses, and attorneys' fees and costs arising, directly or directly, out of any claims of personal injury, death, damage
or otherwise associated with the use of the goods in Life Support Applications, even if such claim includes allegations
that Seller was negligent regarding the design or manufacture of the goods.
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8-8
APTGT100TL60T3G – Rev 2
November, 2017
Buyer must notify Seller in writing before using Seller’s Products in Life Support Applications. Seller will study with
Buyer alternative solutions to meet Buyer application specification based on Sellers sales conditions applicable for the
new proposed specific part.