APTGT150A120T3AG
VCES = 1200V
IC = 150A @ Tc = 100°C
Phase leg
Trench + Field Stop IGBT3
Power Module
29
30
31
32
13
Application
Welding converters
Switched Mode Power Supplies
Uninterruptible Power Supplies
Motor control
4
3
26
27
28
22
23
25
Features
Trench + Field Stop IGBT3
- Low voltage drop
- Low tail current
- Switching frequency up to 20 kHz
- Low leakage current
- RBSOA and SCSOA rated
Very low stray inductance
Kelvin emitter for easy drive
Internal thermistor for temperature monitoring
AlN substrate for improved thermal performance
R1
8
7
16
18
19
20
14
Benefits
Direct mounting to heatsink (isolated package)
Low junction to case thermal resistance
Solderable terminals both for power and signal for
easy PCB mounting
Low profile
RoHS Compliant
Pins 29/30/31/32 must be shorted together
Pins 26/27/28/22/23/25 must be shorted together
to achieve a phase leg
Pins 16/18/19/20 must be shorted together
Absolute maximum ratings (Per IGBT)
Symbol
VCES
IC
ICM
VGE
PD
RBSOA
Parameter
Collector - Emitter Voltage
TC = 25°C
TC = 100°C
TC = 25°C
Continuous Collector Current
Pulsed Collector Current
Gate – Emitter Voltage
Power Dissipation
TC = 25°C
Reverse Bias Safe Operating Area
Tj = 125°C
Max ratings
1200
220
150
300
±20
833
Unit
V
A
V
W
300A @ 1150V
These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.
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1–6
APTGT150A120T3AG – Rev 2 November, 2017
All ratings @ Tj = 25°C unless otherwise specified
APTGT150A120T3AG
Electrical Characteristics (Per IGBT)
Symbol Characteristic
ICES
Zero Gate Voltage Collector Current
VCE(sat)
Collector Emitter Saturation Voltage
VGE(th)
IGES
Gate Threshold Voltage
Gate – Emitter Leakage Current
Test Conditions
VGE = 0V, VCE = 1200V
Tj = 25°C
VGE = 15V
IC = 150A
Tj = 125°C
VGE = VCE , IC = 3 mA
VGE = 20V, VCE = 0V
Min
Typ
5.0
1.7
2.0
5.8
Max
Unit
250
2.1
µA
6.5
400
V
nA
Max
Unit
V
Dynamic Characteristics (Per IGBT)
Symbol
Cies
Coes
Cres
QG
Td(on)
Tr
Td(off)
Tf
Td(on)
Tr
Td(off)
Characteristic
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate charge
Turn-on Delay Time
Rise Time
Turn-off Delay Time
Fall Time
Turn-on Delay Time
Rise Time
Turn-off Delay Time
Tf
Fall Time
Eon
Turn-on Switching Energy
Eoff
Turn-off Switching Energy
Isc
Short Circuit data
RthJC
Test Conditions
VGE = 0V
VCE = 25V
f = 1MHz
Min
VGE= ±15V ; VCE=600V
IC=150A
Inductive Switching (25°C)
VGE = ±15V
VBus = 600V
IC = 150A
RG = 2.2
Inductive Switching (125°C)
VGE = ±15V
VBus = 600V
IC = 150A
RG = 2.2
VGE = ±15V
Tj = 125°C
VBus = 600V
IC = 150A
Tj = 125°C
RG = 2.2
VGE ≤15V ; VBus = 900V
tp ≤ 10µs ; Tj = 125°C
Typ
10.7
0.56
0.48
nF
1.4
µC
280
40
420
ns
75
290
45
520
ns
90
14
mJ
16
600
Junction to Case Thermal Resistance
A
0.15
°C/W
Max
1200
350
Unit
V
µA
A
Reverse diode ratings and characteristics (Per diode)
Characteristic
Peak Repetitive Reverse Voltage
Reverse Leakage Current
DC Forward Current
VF
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
Test Conditions
RthJC
Typ
VR=1200V
Tj = 25°C
Tj = 125°C
Tj = 25°C
Tj = 125°C
Tj = 25°C
150
1.6
1.6
170
280
14
Tj = 125°C
Tj = 25°C
Tj = 125°C
28
6
11
Tc = 80°C
IF = 150A
VGE = 0V
IF = 150A
VR = 600V
di/dt =2500A/µs
Er
Min
Reverse Recovery Energy
Junction to Case Thermal Resistance
2.1
ns
µC
mJ
0.25
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V
°C/W
2–6
APTGT150A120T3AG – Rev 2 November, 2017
Symbol
VRRM
IRM
IF
APTGT150A120T3AG
Thermal and package characteristics
Symbol
VISOL
TJ
TJOP
TSTG
TC
Torque
Wt
Characteristic
RMS Isolation Voltage, any terminal to case t =1 min, 50/60Hz
Operating junction temperature range
Recommended junction temperature under switching conditions
Storage Temperature Range
Operating Case Temperature
Mounting torque
To heatsink
M4
Package Weight
Min
4000
-40
-40
-40
-40
2
Max
150
TJmax -25
125
125
3
110
Unit
V
°C
N.m
g
Temperature sensor NTC (see application note APT0406 on www.microsemi.com for more information).
Symbol
R25
∆R25/R25
B25/85
∆B/B
Characteristic
Resistance @ 25°C
Min
T25 = 298.15 K
TC=100°C
RT
R25
Typ
50
5
3952
4
Max
Unit
k
%
K
%
T: Thermistor temperature
1
1 RT: Thermistor value at T
exp B25 / 85
T
T
25
See application note 1906 - Mounting Instructions for SP3F Power Modules on www.microsemi.com
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3–6
APTGT150A120T3AG – Rev 2 November, 2017
Package outline (dimensions in mm)
APTGT150A120T3AG
Typical Performance Curve
Output Characteristics (VGE=15V)
Output Characteristics
300
300
TJ = 125°C
250
TJ=25°C
200
150
VGE=15V
150
100
100
50
50
VGE=9V
0
0
1
2
3
4
0
1
VCE (V)
30
TJ=25°C
250
200
2
VCE (V)
3
4
Energy losses vs Collector Current
Transfert Characteristics
300
VCE = 600V
VGE = 15V
RG = 2.2 Ω
TJ = 125°C
25
20
TJ=125°C
E (mJ)
IC (A)
VGE=13V
200
0
150
Eoff
Eon
15
Er
10
100
TJ=125°C
50
5
0
0
5
6
7
8
9
10
11
0
12
50
Switching Energy Losses vs Gate Resistance
Eon
250
300
250
20
IC (A)
25
200
350
VCE = 600V
VGE =15V
IC = 150A
TJ = 125°C
30
150
Reverse Bias Safe Operating Area
40
35
100
IC (A)
VGE (V)
E (mJ)
VGE=17V
TJ=125°C
IC (A)
IC (A)
250
Eoff
15
Er
10
200
150
VGE=15V
TJ=125°C
RG=2.2 Ω
100
50
5
0
0
0
2
4
6
8
10 12
Gate Resistance (ohms)
14
16
0
400
800
VCE (V)
1200
1600
maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration
0.9
0.12
0.08
IGBT
0.7
0.5
0.3
0.04
0.1
Single Pulse
0.05
0
0.00001
0.0001
0.001
0.01
0.1
1
10
rectangular Pulse Duration (Seconds)
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4–6
APTGT150A120T3AG – Rev 2 November, 2017
Thermal Impedance (°C/W)
0.16
APTGT150A120T3AG
VCE=600V
D=50%
RG=2.2 Ω
TJ=125°C
TC=75°C
80
ZVS
60
40
20
0
Forward Characteristic of diode
300
250
200
IF (A)
Fmax, Operating Frequency (kHz)
Operating Frequency vs Collector Current
100
ZCS
100
40
TJ=125°C
50
Hard
Switching
10
TJ=125°C
150
TJ=25°C
0
70
0
100 130 160 190 220
0.4
IC (A)
0.8
1.2
1.6
VF (V)
2
2.4
maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration
Diode
0.9
0.2
0.7
0.5
0.1
0.3
0.1
0.05
0
0.00001
Single Pulse
0.0001
0.001
0.01
0.1
1
10
rectangular Pulse Duration (Seconds)
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5–6
APTGT150A120T3AG – Rev 2 November, 2017
Thermal Impedance (°C/W)
0.3
APTGT150A120T3AG
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without any notice. This product has been subject to limited testing and should not be used in conjunction with lifesupport or other mission-critical equipment or applications. Microsemi assumes no liability whatsoever, and Microsemi
disclaims any express or implied warranty, relating to sale and/or use of Microsemi products including liability or
warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other
intellectual property right. Any performance specifications believed to be reliable but are not verified and customer or
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Life Support Application
Seller's Products are not designed, intended, or authorized for use as components in systems intended for space,
aviation, surgical implant into the body, in other applications intended to support or sustain life, or for any other
application in which the failure of the Seller's Product could create a situation where personal injury, death or property
damage or loss may occur (collectively "Life Support Applications").
Buyer agrees not to use Products in any Life Support Applications and to the extent it does it shall conduct extensive
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expenses, and attorneys' fees and costs arising, directly or directly, out of any claims of personal injury, death, damage
or otherwise associated with the use of the goods in Life Support Applications, even if such claim includes allegations
that Seller was negligent regarding the design or manufacture of the goods.
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APTGT150A120T3AG – Rev 2 November, 2017
Buyer must notify Seller in writing before using Seller’s Products in Life Support Applications. Seller will study with
Buyer alternative solutions to meet Buyer application specification based on Sellers sales conditions applicable for the
new proposed specific part.