APTM50DHM38G
Asymmetrical - bridge
MOSFET Power Module
VDSS = 500V
RDSon = 38mΩ typ @ Tj = 25°C
ID = 90A @ Tc = 25°C
Application
VBUS
•
•
•
Q1
CR3
Welding converters
Switched Mode Power Supplies
Switched Reluctance Motor Drives
G1
Features
OUT2
S1
•
Q4
OUT1
CR2
G4
0/VBUS
S4
•
•
•
Power MOS 7® MOSFETs
- Low RDSon
- Low input and Miller capacitance
- Low gate charge
- Avalanche energy rated
- Very rugged
Kelvin source for easy drive
Very low stray inductance
- Symmetrical design
- M5 power connectors
High level of integration
OUT1
Benefits
0/VBUS
S4
G4
OUT2
•
•
•
•
•
Outstanding performance at high frequency operation
Direct mounting to heatsink (isolated package)
Low junction to case thermal resistance
Low profile
RoHS Compliant
Absolute maximum ratings
Symbol
VDSS
ID
IDM
VGS
RDSon
PD
IAR
EAR
EAS
Parameter
Drain - Source Breakdown Voltage
Tc = 25°C
Tc = 80°C
Continuous Drain Current
Pulsed Drain current
Gate - Source Voltage
Drain - Source ON Resistance
Maximum Power Dissipation
Avalanche current (repetitive and non repetitive)
Repetitive Avalanche Energy
Single Pulse Avalanche Energy
Tc = 25°C
Max ratings
500
90
67
360
±30
45
694
46
50
2500
Unit
V
A
V
mΩ
W
A
July, 2006
VBUS
S1
mJ
These Devices are sensitive to Electrostatic Discharge. Proper Handing Procedures Should Be Followed. See application note
APT0502 on www.microsemi.com
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1–6
APTM50DHM38G – Rev 3
G1
APTM50DHM38G
All ratings @ Tj = 25°C unless otherwise specified
Electrical Characteristics
RDS(on)
VGS(th)
IGSS
Test Conditions
Zero Gate Voltage Drain Current
Drain – Source on Resistance
Gate Threshold Voltage
Gate – Source Leakage Current
Characteristic
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total gate Charge
Qgs
Gate – Source Charge
Qgd
Gate – Drain Charge
Td(on)
Turn-on Delay Time
Tr
Td(off)
Eon
Turn-on Switching Energy
Eoff
Turn-off Switching Energy
Eon
Turn-on Switching Energy
Eoff
Turn-off Switching Energy
Diode ratings and characteristics
Maximum Reverse Leakage Current
IF
DC Forward Current
VF
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
38
Min
Test Conditions
IF = 100A
VR = 400V
di/dt = 200A/µs
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Unit
Max
Unit
µA
mΩ
V
nA
nF
nC
130
18
35
77
1510
µJ
1452
2482
µJ
1692
Min
600
Tj = 25°C
Tj = 125°C
Tc = 80°C
ns
87
Inductive switching @ 125°C
VGS = 15V, VBus = 333V
ID = 90A, R G = 2Ω
IF = 100A
IF = 200A
IF = 100A
Typ
11.2
2.4
0.18
246
Max
200
1000
45
5
±150
66
Inductive switching @ 25°C
VGS = 15V, VBus = 333V
ID = 90A, R G = 2Ω
VR=600V
Typ
3
Inductive switching @ 125°C
VGS = 15V
VBus = 333V
ID = 90A
R G = 2Ω
Symbol Characteristic
VRRM Maximum Peak Repetitive Reverse Voltage
IRM
T j = 125°C
VGS = 10V
VBus = 250V
ID = 90A
Turn-off Delay Time
Fall Time
VGS = 0V,VDS = 400V
Test Conditions
VGS = 0V
VDS = 25V
f = 1MHz
Rise Time
Tf
Tj = 25°C
VGS = 10V, ID = 45A
VGS = VDS, ID = 5mA
VGS = ±30 V, VDS = 0V
Dynamic Characteristics
Symbol
Ciss
Coss
Crss
Qg
Min
VGS = 0V,VDS = 500V
Typ
Max
250
500
Tj = 125°C
100
1.6
1.9
1.4
Tj = 25°C
180
Tj = 125°C
220
Tj = 25°C
390
Tj = 125°C
1450
Unit
V
µA
A
1.8
V
ns
July, 2006
IDSS
Characteristic
nC
2–6
APTM50DHM38G – Rev 3
Symbol
APTM50DHM38G
Thermal and package characteristics
Symbol Characteristic
Min
Transistor
Diode
RthJC
Junction to Case Thermal Resistance
VISOL
TJ
TSTG
TC
RMS Isolation Voltage, any terminal to case t =1 min, I isol ID(on)xR DS(on)MAX
250µs pulse test @ < 0.5 duty cycle
200
150
100
TJ=25°C
50
T J=125°C
5.5V
0
0
0
5
10
15
20
VDS, Drain to Source Voltage (V)
25
0
RDS(on) vs Drain Current
Normalized to
VGS=10V @ 45A
1.15
VGS=10V
1.10
1.05
1
2
3
4
5
6
7
VGS, Gate to Source Voltage (V)
8
DC Drain Current vs Case Temperature
100
I D, DC Drain Current (A)
1.20
TJ=-55°C
V GS=20V
1.00
0.95
0.90
0.85
0.80
80
60
40
20
0
0
50
100
150
200
ID, Drain Current (A)
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25
50
75
100
125
TC, Case Temperature (°C)
150
July, 2006
I D, Drain Current (A)
10
250
350
RDS(on) Drain to Source ON Resistance
1
4–6
APTM50DHM38G – Rev 3
Thermal Impedance (°C/W)
0.2
1.1
1.0
0.9
0.8
0.7
-50 -25
0
25 50
75 100 125 150
ON resistance vs Temperature
2.5
VGS =10V
ID=45A
2.0
1.5
1.0
0.5
0.0
-50 -25 0 25 50 75 100 125 150
TJ, Junction Temperature (°C)
TJ, Junction Temperature (°C)
Threshold Voltage vs Temperature
Maximum Safe Operating Area
1000
1.1
ID, Drain Current (A)
VGS (TH), Threshold Voltage
(Normalized)
1.2
1.0
0.9
0.8
0.7
0.6
100µs
limited by R DSon
100
10
1ms
Single pulse
TJ =150°C
TC=25°C
10ms
1
-50 -25 0 25 50 75 100 125 150
TC, Case Temperature (°C)
1
Capacitance vs Drain to Source Voltage
VGS , Gate to Source Voltage (V)
100000
Ciss
10000
Coss
1000
Crss
100
10
0
10
20
30
40
VDS, Drain to Source Voltage (V)
50
10
100
1000
VDS, Drain to Source Voltage (V)
Gate Charge vs Gate to Source Voltage
14
V DS =100V
I D=90A
12 T =25°C
J
V =250V
DS
10
VDS=400V
8
6
4
2
0
0
40
80 120 160 200 240 280 320
Gate Charge (nC)
July, 2006
C, Capacitance (pF)
limited by RDSon
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5–6
APTM50DHM38G – Rev 3
BVDSS, Drain to Source Breakdown
Voltage (Normalized)
Breakdown Voltage vs Temperature
1.2
RDS(on), Drain to Source ON resistance
(Normalized)
APTM50DHM38G
APTM50DHM38G
Delay Times vs Current
Rise and Fall times vs Current
120
100
80
60
40
V DS =333V
RG =2Ω
T J=125°C
L=100µH
td(on)
20
80
60
40
tr
0
20
40
60
80 100 120
ID, Drain Current (A)
140
20
VDS=333V
RG=2Ω
T J=125°C
L=100µH
4
3
80
100
120
140
Switching Energy vs Gate Resistance
Eon
Eoff
2
60
8
Switching Energy (mJ)
5
40
I D, Drain Current (A)
Switching Energy vs Current
1
VDS=333V
ID=90A
TJ=125°C
L=100µH
7
6
5
Eoff
4
Eon
3
2
Eoff
1
0
0
20
40
60
80
100
120
0
140
I D, Drain Current (A)
Operating Frequency vs Drain Current
IDR, Reverse Drain Current (A)
350
V DS=333V
D=50%
R G=2Ω
T J=125°C
T C=75°C
ZVS
300
250
200
150
ZCS
100
Hard
switching
50
0
20
30
40
50
60
5
10
15
20
25
Gate Resistance (Ohms)
400
Frequency (kHz)
tf
20
0
Switching Energy (mJ)
VDS=333V
RG=2Ω
T J=125°C
L=100µH
100
tr and t f (ns)
t d(on) and td(off) (ns)
td(off)
70
80
1000
Source to Drain Diode Forward Voltage
T J=150°C
100
10
TJ=25°C
1
0.2 0.4 0.6 0.8
1
1.2 1.4 1.6 1.8
VSD, Source to Drain Voltage (V)
Microsemi reserves the right to change, without notice, the specifications and information contained herein
Microsemi's products are covered by one or more of U.S patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522
5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 and foreign patents. U.S and Foreign patents pending. All Rights Reserved.
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6–6
APTM50DHM38G – Rev 3
July, 2006
ID, Drain Current (A)