AT24C32D-SSHM-T

AT24C32D I²C-Compatible (2-Wire) Serial EEPROM 32‑Kbit (4,096 x 8) Features • • • • • • • • • • • • • • Low-Voltage and Standard-Voltage Operation: – VCC = 1.7V to 5.5V Internally Organized as 4,096 x 8 (32K) Industrial Temperature Range: -40°C to +85°C I2C-Compatible (2-Wire) Serial Interface: – 100 kHz Standard mode, 1.7V to 5.5V – 400 kHz Fast mode, 1.7V to 5.5V – 1 MHz Fast Mode Plus (FM+), 2.5V to 5.5V Schmitt Triggers, Filtered Inputs for Noise Suppression Bidirectional Data Transfer Protocol Write‑Protect Pin for Full Array Hardware Data Protection Ultra Low Active Current (3 mA maximum) and Standby Current (6 μA maximum) 32-Byte Page Write Mode: – Partial page writes allowed Random and Sequential Read Modes Self‑Timed Write Cycle within 5 ms Maximum High Reliability: – Endurance: 1,000,000 write cycles – Data retention: 100 years Green Package Options (Lead-free/Halide-free/RoHS compliant) Die Sale Options: Wafer Form and Bumped Wafers Packages • 8-Lead SOIC, 8-Lead TSSOP, 8-Pad UDFN, 8-Pad XDFN, 5-Lead SOT23 and 8-Ball VFBGA © 2018 Microchip Technology Inc. Datasheet DS20006047A-page 1 AT24C32D Table of Contents Features.......................................................................................................................... 1 Packages.........................................................................................................................1 1. Package Types (not to scale).................................................................................... 4 2. Pin Descriptions.........................................................................................................5 2.1. 2.2. 2.3. 2.4. 2.5. 2.6. Device Address Inputs (A0, A1, A2).............................................................................................5 Ground......................................................................................................................................... 5 Serial Data (SDA).........................................................................................................................5 Serial Clock (SCL)........................................................................................................................5 Write-Protect (WP)....................................................................................................................... 6 Device Power Supply................................................................................................................... 6 3. Description.................................................................................................................7 3.1. 3.2. System Configuration Using 2-Wire Serial EEPROMs ................................................................7 Block Diagram.............................................................................................................................. 8 4. Electrical Characteristics........................................................................................... 9 4.1. 4.2. 4.3. 4.4. 4.5. Absolute Maximum Ratings..........................................................................................................9 DC and AC Operating Range.......................................................................................................9 DC Characteristics....................................................................................................................... 9 AC Characteristics......................................................................................................................10 Electrical Specifications..............................................................................................................11 5. Device Operation and Communication....................................................................13 5.1. 5.2. 5.3. 5.4. 5.5. Clock and Data Transition Requirements...................................................................................13 Start and Stop Conditions.......................................................................................................... 13 Acknowledge and No-Acknowledge...........................................................................................14 Standby Mode............................................................................................................................ 14 Software Reset...........................................................................................................................15 6. Memory Organization.............................................................................................. 16 6.1. Device Addressing..................................................................................................................... 16 7. Write Operations......................................................................................................18 7.1. 7.2. 7.3. 7.4. 7.5. Byte Write...................................................................................................................................18 Page Write..................................................................................................................................18 Acknowledge Polling.................................................................................................................. 19 Write Cycle Timing..................................................................................................................... 19 Write Protection..........................................................................................................................20 8. Read Operations..................................................................................................... 21 8.1. 8.2. Current Address Read................................................................................................................21 Random Read............................................................................................................................ 21 © 2018 Microchip Technology Inc. Datasheet DS20006047A-page 2 AT24C32D 8.3. Sequential Read.........................................................................................................................22 9. Device Default Condition from Microchip................................................................ 23 10. Packaging Information.............................................................................................24 10.1. Package Marking Information.....................................................................................................24 11. Revision History.......................................................................................................36 The Microchip Web Site................................................................................................ 37 Customer Change Notification Service..........................................................................37 Customer Support......................................................................................................... 37 Product Identification System........................................................................................ 38 Microchip Devices Code Protection Feature................................................................. 38 Legal Notice...................................................................................................................39 Trademarks................................................................................................................... 39 Quality Management System Certified by DNV.............................................................40 Worldwide Sales and Service........................................................................................41 © 2018 Microchip Technology Inc. Datasheet DS20006047A-page 3 AT24C32D Package Types (not to scale) 1. Package Types (not to scale) 5-lead SOT23(1) (Top View) 8-pad UDFN/XDFN (Top View) A0 1 8 Vcc SCL 1 A1 2 7 WP GND 2 A2 3 6 SCL GND 4 5 SDA SDA 3 5 WP 4 Vcc 8-lead SOIC/TSSOP (Top View) 8-ball VFBGA (Top View) A0 1 8 Vcc A0 1 8 Vcc A1 2 7 WP A1 2 7 WP A2 3 6 SCL A2 3 6 SCL GND 4 5 SDA GND 4 5 SDA Note:  1. Refer to 6.1 Device Addressing for details about addressing the SOT23 version of the device. © 2018 Microchip Technology Inc. Datasheet DS20006047A-page 4 AT24C32D Pin Descriptions 2. Pin Descriptions The descriptions of the pins are listed in Table 2-1. Table 2-1. Pin Function Table Name 8‑Lead SOIC 8‑Lead TSSOP 8‑Pad UDFN(1) 8-Pad XDFN 5-Lead SOT23 8‑Ball VFBGA Function A0(2) A1(2) 1 1 1 1 — 1 2 2 2 2 — 2 Device Address Input A2(2) 3 3 3 3 — 3 Device Address Input GND 4 4 4 4 2 4 Ground SDA 5 5 5 5 3 5 Serial Data SCL WP(2) 6 6 6 6 1 6 Serial Clock 7 7 7 7 5 7 Write-Protect VCC 8 8 8 8 4 8 Device Power Supply Device Address Input Note:  1. The exposed pad on this package can be connected to GND or left floating. 2. If the A0, A1, A2 or WP pins are not driven, they are internally pulled down to GND. In order to operate in a wide variety of application environments, the pull‑down mechanism is intentionally designed to be somewhat strong. Once these pins are biased above the CMOS input buffer’s trip point (~0.5 x VCC), the pull‑down mechanism disengages. Microchip recommends connecting these pins to a known state whenever possible. 2.1 Device Address Inputs (A0, A1, A2) The A0, A1 and A2 pins are device address inputs that are hard-wired (directly to GND or to VCC) for compatibility with other 2-wire Serial EEPROM devices. When the pins are hard-wired, as many as eight devices may be addressed on a single bus system. A device is selected when a corresponding hardware and software match is true. If these pins are left floating, the A0, A1 and A2 pins will be internally pulled down to GND. However, due to capacitive coupling that may appear in customer applications, Microchip recommends always connecting the address pins to a known state. When using a pull‑up resistor, Microchip recommends using 10 kΩ or less. 2.2 Ground The ground reference for the power supply. GND should be connected to the system ground. 2.3 Serial Data (SDA) The SDA pin is an open‑drain bidirectional input/output pin used to serially transfer data to and from the device. The SDA pin must be pulled high using an external pull‑up resistor (not to exceed 10 kΩ in value) and may be wire-ORed with any number of other open‑drain or open‑collector pins from other devices on the same bus. 2.4 Serial Clock (SCL) The SCL pin is used to provide a clock to the device and to control the flow of data to and from the device. Command and input data present on the SDA pin is always latched in on the rising edge of SCL, © 2018 Microchip Technology Inc. Datasheet DS20006047A-page 5 AT24C32D Pin Descriptions while output data on the SDA pin is clocked out on the falling edge of SCL. The SCL pin must either be forced high when the serial bus is idle or pulled high using an external pull‑up resistor. 2.5 Write-Protect (WP) The write-protect input, when connected to GND, allows normal write operations. When the WP pin is connected directly to VCC, all write operations to the protected memory are inhibited. If the pin is left floating, the WP pin will be internally pulled down to GND. However, due to capacitive coupling that may appear in customer applications, Microchip recommends always connecting the WP pin to a known state. When using a pull‑up resistor, Microchip recommends using 10 kΩ or less. Table 2-2. Write-Protect 2.6 WP Pin Status Part of the Array Protected At VCC Full Array At GND Normal Write Operations Device Power Supply The VCC pin is used to supply the source voltage to the device. Operations at invalid VCC voltages may produce spurious results and should not be attempted. © 2018 Microchip Technology Inc. Datasheet DS20006047A-page 6 AT24C32D Description 3. Description The AT24C32D provides 32,768 bits of Serial Electrically Erasable and Programmable Read-Only Memory (EEPROM) organized as 4,096 words of 8 bits each. The device’s cascading feature allows up to eight devices to share a common 2‑wire bus. The device is optimized for use in many industrial and commercial applications where low‑power and low‑voltage operation are essential. The devices are available in space‑saving 8-lead SOIC, 8-lead TSSOP, 8-pad UDFN, 8-pad XDFN, 5-lead SOT23 and 8ball VFBGA packages. All packages operate from 1.7V to 5.5V. 3.1 System Configuration Using 2-Wire Serial EEPROMs VCC RPUP(max) = VCC RPUP(min) = tR(max) 0.8473 x CL VCC - VOL(max) IOL SCL SDA WP I2C Bus Master: Microcontroller A0 VCC A0 VCC A0 VCC A1 Slave 0 WP AT24Cxxx SDA A1 Slave 1 WP AT24Cxxx SDA A1 Slave 7 WP AT24Cxxx SDA A2 GND © 2018 Microchip Technology Inc. GND SCL A2 GND Datasheet SCL A2 GND SCL DS20006047A-page 7 AT24C32D Description 3.2 Block Diagram © 2018 Microchip Technology Inc. Datasheet DS20006047A-page 8 AT24C32D Electrical Characteristics 4. Electrical Characteristics 4.1 Absolute Maximum Ratings Temperature under bias -55°C to +125°C Storage temperature -65°C to +150°C VCC 6.25V Voltage on any pin with respect to ground -1.0V to +7.0V DC output current 5.0 mA ESD protection >3kV Note:  Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 4.2 DC and AC Operating Range Table 4-1. DC and AC Operating Range AT24C32D 4.3 Operating Temperature (Case) Industrial Temperature Range -40°C to +85°C VCC Power Supply Low Voltage Grade 1.7V to 5.5V DC Characteristics Table 4-2. DC Characteristics Typical(1) Maximum Symbol Minimum Supply Voltage VCC1 1.7 — 5.5 V Supply Current ICC1 — 0.4 1.0 mA VCC = 5.0V, Read at 400 kHz Supply Current ICC2 — 2.0 3.0 mA VCC = 5.0V, Write at 400 kHz Standby Current ISB1 — — 1.0 μA VCC = 1.7V, VIN = VCC or GND — — 6.0 μA VCC = 5.0V, VIN = VCC or GND Parameter Units Test Conditions Input Leakage Current ILI — 0.10 3.0 μA VIN = VCC or GND; VCC = 5.0V Output Leakage Current ILO — 0.05 3.0 μA VOUT = VCC or GND; VCC = 5.0V Input Low Level VIL -0.6 — VCC x 0.3 V Note 2 Input High Level VIH VCC x 0.7 — VCC + 0.5 V Note 2 © 2018 Microchip Technology Inc. Datasheet DS20006047A-page 9 AT24C32D Electrical Characteristics ...........continued Parameter Typical(1) Maximum Symbol Minimum Units Test Conditions Output Low Level VOL1 — — 0.2 V VCC = 1.7V, IOL = 0.15 mA Output Low Level VOL2 — — 0.4 V VCC = 3.0V, IOL = 2.1 mA Note:  1. 2. 4.4 Typical values characterized at TA = +25°C unless otherwise noted. This parameter is characterized but is not 100% tested in production. AC Characteristics Table 4-3. AC Characteristics(1) Parameter Symbol 1.7V 2.5V, 5.0V Min. Max. Min. Max. Units Clock Frequency, SCL fSCL — 400 — 1000 kHz Clock Pulse Width Low tLOW 1300 — 500 — ns Clock Pulse Width High tHIGH 600 — 400 — ns tI — 100 — 50 ns Clock Low to Data Out Valid tAA 50 900 50 450 ns Bus Free Time between Stop and Start(2) tBUF 1300 — 500 — ns Start Hold Time tHD.STA 600 — 250 — ns Start Set‑up Time tSU.STA 600 — 250 — ns Data In Hold Time tHD.DAT 0 — 0 — ns Data In Set‑up Time tSU.DAT 100 — 100 — ns Inputs Rise Time(2) tR — 300 — 300 ns Inputs Fall Time(2) tF — 300 — 100 ns Stop Set-up Time tSU.STO 600 — 250 — ns Data Out Hold Time tDH 50 — 50 — ns Write Cycle Time tWR — 5 — 5 ms Noise Suppression Time(2) Note:  1. AC measurement conditions: – CL = 100 pF – RPUP (SDA bus line pull-up resistor to VCC): 1.3 kΩ (1000 kHz), 4 kΩ (400 kHz), 10 kΩ (100 kHz) – Input pulse voltages: 0.3 VCC to 0.7 VCC – Input rise and fall times: ≤ 50 ns © 2018 Microchip Technology Inc. Datasheet DS20006047A-page 10 AT24C32D Electrical Characteristics 2. – Input and output timing reference voltages: 0.5 x VCC This parameter is ensured by characterization and is not 100% tested. Figure 4-1. Bus Timing tF tHIGH tR tLOW SCL tSU.STA tHD.STA tHD.DAT tSU.DAT tSU.STO SDA In tBUF tAA tDH SDA Out 4.5 Electrical Specifications 4.5.1 Power-up Requirements and Reset Behavior During a power-up sequence, the VCC supplied to the AT24C32D should monotonically rise from GND to the minimum VCC level, as specified in Table 4-1, with a slew rate no faster than 0.1 V/μs. 4.5.1.1 Device Reset To prevent inadvertent write operations or any other spurious events from occurring during a power‑up sequence, the AT24C32D includes a Power-on Reset (POR) circuit. Upon power‑up, the device will not respond to any commands until the VCC level crosses the internal voltage threshold (VPOR) that brings the device out of Reset and into Standby mode. The system designer must ensure the instructions are not sent to the device until the VCC supply has reached a stable value greater than or equal to the minimum VCC level. Additionally, once the VCC is greater than or equal to the minimum VCC level, the bus master must wait at least tPUP before sending the first command to the device. See Table 4-4 for the values associated with these power‑up parameters. Table 4-4. Power-up Conditions(1) Symbol Parameter tPUP Time required after VCC is stable before the device can accept commands VPOR Power-on Reset Threshold Voltage tPOFF Minimum time at VCC = 0V between power cycles Min. Max. Units 100 － µs — 1.5 V 500 — ms Note:  1. These parameters are characterized but they are not 100% tested in production. If an event occurs in the system where the VCC level supplied to the AT24C32D drops below the maximum VPOR level specified, it is recommended that a full power cycle sequence be performed by first driving the VCC pin to GND, waiting at least the minimum tPOFF time and then performing a new power-up sequence in compliance with the requirements defined in this section. © 2018 Microchip Technology Inc. Datasheet DS20006047A-page 11 AT24C32D Electrical Characteristics 4.5.2 Pin Capacitance Table 4-5. Pin Capacitance(1) Symbol Test Condition Max. Units Conditions CI/O Input/Output Capacitance (SDA) 8 pF VI/O = 0V CIN Input Capacitance (A0, A1, A2 and SCL) 6 pF VIN = 0V Note:  1. This parameter is characterized but is not 100% tested in production. 4.5.3 EEPROM Cell Performance Characteristics Table 4-6. EEPROM Cell Performance Characteristics Operation Test Condition Write Endurance(1) TA = 25°C, VCC = 3.3V, Page Write mode Data Retention(1) Min. Max. Units 1,000,000 — Write Cycles 100 — Years TA = 55°C Note:  1. Performance is determined through characterization and the qualification process. © 2018 Microchip Technology Inc. Datasheet DS20006047A-page 12 AT24C32D Device Operation and Communication 5. Device Operation and Communication The AT24C32D operates as a slave device and utilizes a simple I2C-compatible 2-wire digital serial interface to communicate with a host controller, commonly referred to as the bus master. The master initiates and controls all read and write operations to the slave devices on the serial bus, and both the master and the slave devices can transmit and receive data on the bus. The serial interface is comprised of just two signal lines: Serial Clock (SCL) and Serial Data (SDA). The SCL pin is used to receive the clock signal from the master, while the bidirectional SDA pin is used to receive command and data information from the master as well as to send data back to the master. Data is always latched into the AT24C32D on the rising edge of SCL and always output from the device on the falling edge of SCL. Both the SCL and SDA pin incorporate integrated spike suppression filters and Schmitt Triggers to minimize the effects of input spikes and bus noise. All command and data information is transferred with the Most Significant bit (MSb) first. During bus communication, one data bit is transmitted every clock cycle, and after eight bits (one byte) of data have been transferred, the receiving device must respond with either an Acknowledge (ACK) or a No-Acknowledge (NACK) response bit during a ninth clock cycle (ACK/NACK clock cycle) generated by the master. Therefore, nine clock cycles are required for every one byte of data transferred. There are no unused clock cycles during any read or write operation, so there must not be any interruptions or breaks in the data stream during each data byte transfer and ACK or NACK clock cycle. During data transfers, data on the SDA pin must only change while SCL is low, and the data must remain stable while SCL is high. If data on the SDA pin changes while SCL is high, then either a Start or a Stop condition will occur. Start and Stop conditions are used to initiate and end all serial bus communication between the master and the slave devices. The number of data bytes transferred between a Start and a Stop condition is not limited and is determined by the master. In order for the serial bus to be idle, both the SCL and SDA pins must be in the logic-high state at the same time. 5.1 Clock and Data Transition Requirements The SDA pin is an open-drain terminal and therefore must be pulled high with an external pull‑up resistor. SCL is an input pin that can either be driven high or pulled high using an external pull‑up resistor. Data on the SDA pin may change only during SCL low time periods. Data changes during SCL high periods will indicate a Start or Stop condition as defined below. The relationship of the AC timing parameters with respect to SCL and SDA for the AT24C32D are shown in the timing waveform in Figure 4-1. The AC timing characteristics and specifications are outlined in 4.4 AC Characteristics. 5.2 Start and Stop Conditions 5.2.1 Start Condition A Start condition occurs when there is a high-to-low transition on the SDA pin while the SCL pin is at a stable logic ‘1’ state and will bring the device out of Standby mode. The master uses a Start condition to initiate any data transfer sequence; therefore, every command must begin with a Start condition. The device will continuously monitor the SDA and SCL pins for a Start condition but will not respond unless one is detected. Refer to Figure 5-1 for more details. 5.2.2 Stop Condition A Stop condition occurs when there is a low-to-high transition on the SDA pin while the SCL pin is stable in the logic ‘1’ state. © 2018 Microchip Technology Inc. Datasheet DS20006047A-page 13 AT24C32D Device Operation and Communication The master can use the Stop condition to end a data transfer sequence with the AT24C32D, which will subsequently return to Standby mode. The master can also utilize a repeated Start condition instead of a Stop condition to end the current data transfer if the master will perform another operation. Refer to Figure 5-1 for more details. 5.3 Acknowledge and No-Acknowledge After every byte of data is received, the receiving device must confirm to the transmitting device that it has successfully received the data byte by responding with what is known as an Acknowledge (ACK). An ACK is accomplished by the transmitting device first releasing the SDA line at the falling edge of the eighth clock cycle followed by the receiving device responding with a logic ‘0’ during the entire high period of the ninth clock cycle. When the AT24C32D is transmitting data to the master, the master can indicate that it is done receiving data and wants to end the operation by sending a logic ‘1’ response to the AT24C32D instead of an ACK response during the ninth clock cycle. This is known as a No-Acknowledge (NACK) and is accomplished by the master sending a logic ‘1’ during the ninth clock cycle, at which point the AT24C32D will release the SDA line so the master can then generate a Stop condition. The transmitting device, which can be the bus master or the Serial EEPROM, must release the SDA line at the falling edge of the eighth clock cycle to allow the receiving device to drive the SDA line to a logic ‘0’ to ACK the previous 8‑bit word. The receiving device must release the SDA line at the end of the ninth clock cycle to allow the transmitter to continue sending new data. A timing diagram has been provided in Figure 5-1 to better illustrate these requirements. Figure 5-1. Start Condition, Data Transitions, Stop Condition and Acknowledge SCL SDA Must Be Stable SDA Must Be Stable 1 2 Acknowledge Window 8 9 SDA Start Condition 5.4 Acknowledge Valid SDA Change Allowed SDA Change Allowed The transmitting device (Master or Slave) must release the SDA line at this point to allow the receiving device (Master or Slave) to drive the SDA line low to ACK the previous 8-bit word. Stop Condition The receiver (Master or Slave) must release the SDA line at this point to allow the transmitter to continue sending new data. Standby Mode The AT24C32D features a low‑power Standby mode that is enabled when any one of the following occurs: • A valid power-up sequence is performed (see 4.5.1 Power-up Requirements and Reset Behavior). • A Stop condition is received by the device unless it initiates an internal write cycle (see 7. Write Operations). • At the completion of an internal write cycle (see 7. Write Operations). © 2018 Microchip Technology Inc. Datasheet DS20006047A-page 14 AT24C32D Device Operation and Communication 5.5 Software Reset After an interruption in protocol, power loss or system Reset, any 2‑wire device can be protocol reset by clocking SCL until SDA is released by the EEPROM and goes high. The number of clock cycles until SDA is released by the EEPROM will vary. The software Reset sequence should not take more than nine dummy clock cycles. Once the software Reset sequence is complete, new protocol can be sent to the device by sending a Start condition followed by the protocol. Refer to Figure 5-2 for an illustration. Figure 5-2. Software Reset Dummy Clock Cycles SCL 1 2 3 8 SDA Released by EEPROM 9 Device is Software Reset SDA In the event that the device is still non-responsive or remains active on the SDA bus, a power cycle must be used to reset the device (see 4.5.1 Power-up Requirements and Reset Behavior). © 2018 Microchip Technology Inc. Datasheet DS20006047A-page 15 AT24C32D Memory Organization 6. Memory Organization The AT24C32D is internally organized as 128 pages of 32 bytes each. 6.1 Device Addressing Accessing the device requires an 8‑bit device address byte following a Start condition to enable the device for a read or write operation. Since multiple slave devices can reside on the serial bus, each slave device must have its own unique address so the master can access each device independently. The Most Significant four bits of the device address byte is referred to as the device type identifier. The device type identifier ‘1010’ (Ah) is required in bits 7 through 4 of the device address byte (see Table 6-1). Following the 4-bit device type identifier are the hardware slave address bits, A2, A1 and A0. These bits can be used to expand the address space by allowing up to eight Serial EEPROM devices on the same bus. These hardware slave address bits must correlate with the voltage level on the corresponding hardwired device address input pins A0, A1 and A2. The A0, A1 and A2 pins use an internal proprietary circuit that automatically biases the pin to a logic ‘0’ state if the pin is allowed to float. In order to operate in a wide variety of application environments, the pull‑down mechanism is intentionally designed to be somewhat strong. Once the pin is biased above the CMOS input buffer's trip point (~0.5 x VCC), the pull‑down mechanism disengages. Microchip recommends connecting the A0, A1 and A2 pins to a known state whenever possible. When utilizing the SOT23 package, the A2, A1 and A0 pins are not accessible and are left floating. The previously mentioned automatic pull-down circuit will set this pin to a logic ‘0’ state. As a result, to properly communicate with the device in the SOT23 package, the A2, A1 and A0 software bits must always be set to logic ‘0’ for any operation. Refer to Table 6-1 to review these bit positions. The eighth bit (bit 0) of the device address byte is the Read/Write Select bit. A read operation is initiated if this bit is high and a write operation is initiated if this bit is low. Upon the successful comparison of the device address byte, the AT24C32D will return an ACK. If a valid comparison is not made, the device will NACK. Table 6-1. Device Addressing Package Device Type Identifier Hardware Slave Address Bits R/W Select Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 SOIC, TSSOP, UDFN, XDFN, VFBGA 1 0 1 0 A2 A1 A0 R/W SOT23 1 0 1 0 0 0 0 R/W For all operations except the current address read, two 8‑bit word address bytes must be transmitted to the device immediately following the device address byte. The word address bytes consist of the 12‑bit memory array word address, and are used to specify which byte location in the EEPROM to start reading or writing. The first word address byte contains the four Most Significant bits of the word address (A11 through A8) in bit positions three through zero, as seen in Table 6-2. Bit 7 through bit 4 of the first word address are © 2018 Microchip Technology Inc. Datasheet DS20006047A-page 16 AT24C32D Memory Organization “don't care” bits as they are outside of the addressable 32‑Kbit range. Upon completion of the first word address byte, the AT24C32D will return an ACK. Table 6-2. First Word Address Byte Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 X X X X A11 A10 A9 A8 Next, the second word address byte is sent to the device which provides the remaining eight bits of the word address (A7 through A0). Upon completion of the second word address byte, the AT24C32D will return an ACK. See Table 6-3 to review these bit positions. Table 6-3. Second Word Address Byte Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 A7 A6 A5 A4 A3 A2 A1 A0 © 2018 Microchip Technology Inc. Datasheet DS20006047A-page 17 AT24C32D Write Operations 7. Write Operations All write operations for the AT24C32D begin with the master sending a Start condition, followed by a device address byte with the R/W bit set to logic ‘0’, and then by the word address bytes. The data value(s) to be written to the device immediately follow the word address bytes. 7.1 Byte Write The AT24C32D supports the writing of a single 8‑bit byte. Selecting a data word in the AT24C32D requires a 12‑bit word address. Upon receipt of the proper device address and the word address bytes, the EEPROM will send an Acknowledge. The device will then be ready to receive the 8‑bit data word. Following receipt of the 8‑bit data word, the EEPROM will respond with an ACK. The addressing device, such as a bus master, must then terminate the write operation with a Stop condition. At that time, the EEPROM will enter an internally self‑timed write cycle, which will be completed within tWR, while the data word is being programmed into the nonvolatile EEPROM. All inputs are disabled during this write cycle, and the EEPROM will not respond until the write is complete. Figure 7-1. Byte Write SCL 1 2 3 4 5 6 7 8 9 1 2 Device Address Byte SDA 1 0 1 0 A2 A1 3 4 5 6 7 8 9 A8 0 First Word Address Byte A0 0 0 MSB X X X X A11 A10 A9 MSB Start Condition by Master ACK from Slave 1 2 3 4 5 ACK from Slave 6 7 8 9 1 2 3 A6 A5 A4 A3 A2 A1 A0 0 MSB 6 7 8 9 D7 D6 D5 D4 D3 D2 D1 D0 0 MSB ACK from Slave 7.2 5 Data Word Second Word Address Byte A7 4 Stop Condition ACK from Slave by Master Page Write A page write operation allows up to 32 bytes to be written in the same write cycle, provided all bytes are in the same row of the memory array (where address bits A11 throught A5 are the same). Partial page writes of less than 32 bytes are also allowed. A page write is initiated the same way as a byte write, but the bus master does not send a Stop condition after the first data word is clocked in. Instead, after the EEPROM acknowledges receipt of the first data word, the bus master can transmit up to thirty one additional data words. The EEPROM will respond with an ACK after each data word is received. Once all data to be written has been sent to the device, the bus master must issue a Stop condition (see Figure 7-2) at which time the internally self-timed write cycle will begin. The lower five bits of the word address are internally incremented following the receipt of each data word. The higher order address bits are not incremented and retain the memory page row location. Page write © 2018 Microchip Technology Inc. Datasheet DS20006047A-page 18 AT24C32D Write Operations operations are limited to writing bytes within a single physical page, regardless of the number of bytes actually being written. When the incremented word address reaches the page boundary, the address counter will roll‑over to the beginning of the same page. Nevertheless, creating a roll‑over event should be avoided as previously loaded data in the page could become unintentionally altered. Figure 7-2. Page Write 1 SCL 2 3 4 5 6 7 8 9 1 2 Device Address Byte SDA 1 0 1 0 A2 A1 A0 0 0 X A6 6 7 X X X A11 A10 3 4 5 6 A5 A4 A3 A2 MSB 8 9 A8 0 7 8 9 1 2 ACK from Slave 3 4 5 6 7 8 9 Data Word (n) A1 A0 0 D7 D6 D5 D4 D3 D2 1 2 3 4 5 6 7 8 9 Data Word (n+x), max of 32 without rollover D1 D0 MSB 0 D7 D6 D5 D4 D3 D2 D1 D0 0 MSB ACK from Slave 7.3 A9 ACK from Slave Second Word Address Byte A7 5 MSB Start Condition by Master 2 4 First Word Address Byte MSB 1 3 Stop Condition ACK by Master from Slave ACK from Slave Acknowledge Polling An Acknowledge Polling routine can be implemented to optimize time‑sensitive applications that would prefer not to wait the fixed maximum write cycle time (tWR). This method allows the application to know immediately when the Serial EEPROM write cycle has completed, so a subsequent operation can be started. Once the internally self‑timed write cycle has started, an Acknowledge Polling routine can be initiated. This involves repeatedly sending a Start condition followed by a valid device address byte with the R/W bit set at logic ‘0’. The device will not respond with an ACK while the write cycle is ongoing. Once the internal write cycle has completed, the EEPROM will respond with an ACK, allowing a new read or write operation to be immediately initiated. A flowchart has been included below in Figure 7-3 to better illustrate this technique. Figure 7-3. Acknowledge Polling Flowchart Send any Write protocol Send Stop condition to initiate the write cycle Send Start condition followed by a valid Device Address byte with R/W = 0 Did the device ACK? YES Proceed to next Read or Write operation NO 7.4 Write Cycle Timing The length of the self‑timed write cycle (tWR) is defined as the amount of time from the Stop condition that begins the internal write cycle to the Start condition of the first device address byte sent to the AT24C32D © 2018 Microchip Technology Inc. Datasheet DS20006047A-page 19 AT24C32D Write Operations that it subsequently responds to with an ACK. Figure 7-4 has been included to show this measurement. During the internally self‑timed write cycle, any attempts to read from or write to the memory array will not be processed. Figure 7-4. Write Cycle Timing SCL 8 9 9 ACK ACK Data Word n SDA D0 tWR Stop Condition 7.5 Start Condition First Acknowledge from the device to a valid device address sequence after write cycle is initiated. The minimum tWR can only be determined through the use of an ACK Polling routine. Stop Condition Write Protection The AT24C32D utilizes a hardware data protection scheme that allows the user to write‑protect the entire memory contents when the WP pin is at VCC (or a valid VIH). No write protection will be set if the WP pin is at GND or left floating. Table 7-1. AT24C32D Write-Protect Behavior WP Pin Voltage Part of the Array Protected VCC Full Array GND None － Write Protection Not Enabled The status of the WP pin is sampled at the Stop condition for every byte write or page write operation prior to the start of an internally self‑timed write cycle. Changing the WP pin state after the Stop condition has been sent will not alter or interrupt the execution of the write cycle. If an attempt is made to write to the device while the WP pin has been asserted, the device will acknowledge the device address, word address and data bytes, but no write cycle will occur when the Stop condition is issued. The device will immediately be ready to accept a new read or write command. © 2018 Microchip Technology Inc. Datasheet DS20006047A-page 20 AT24C32D Read Operations 8. Read Operations Read operations are initiated the same way as write operations with the exception that the Read/Write Select bit in the device address byte must be a logic ‘1’. There are three read operations: • • • 8.1 Current Address Read Random Address Read Sequential Read Current Address Read The internal data word address counter maintains the last address accessed during the last read or write operation, incremented by one. This address stays valid between operations as long the VCC is maintained to the part. The address roll‑over during a read is from the last byte of the last page to the first byte of the first page of the memory. A current address read operation will output data according to the location of the internal data word address counter. This is initiated with a Start condition, followed by a valid device address byte with the R/W bit set to logic ‘1’. The device will ACK this sequence and the current address data word is serially clocked out on the SDA line. All types of read operations will be terminated if the bus master does not respond with an ACK (it NACKs) during the ninth clock cycle. After the NACK response, the master may send a Stop condition to complete the protocol, or it can send a Start condition to begin the next sequence. Figure 8-1. Current Address Read 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 D2 D1 D0 1 SCL Device Address Byte SDA 1 MSB Start Condition by Master 8.2 0 1 0 A2 A1 Data Word (n) A0 1 0 D7 D6 D5 D4 D3 MSB ACK from Slave Stop Condition NACK by Master from Master Random Read A random read begins in the same way as a byte write operation does to load in a new data word address. This is known as a “dummy write” sequence; however, the data byte and the Stop condition of the byte write must be omitted to prevent the part from entering an internal write cycle. Once the device address and word address are clocked in and acknowledged by the EEPROM, the bus master must generate another Start condition. The bus master now initiates a current address read by sending a Start condition, followed by a valid device address byte with the R/W bit set to logic ‘1’. The EEPROM will ACK the device address and serially clock out the data word on the SDA line. All types of read operations will be terminated if the bus master does not respond with an ACK (it NACKs) during the ninth clock cycle. After the NACK response, the master may send a Stop condition to complete the protocol, or it can send a Start condition to begin the next sequence. © 2018 Microchip Technology Inc. Datasheet DS20006047A-page 21 AT24C32D Read Operations Figure 8-2. Random Read 1 SCL 2 3 4 5 6 7 8 9 1 2 Device Address Byte SDA 1 0 1 0 A2 3 4 5 6 7 8 9 1 2 First Word Address Byte A1 A0 0 X 0 MSB X X X A11 A10 4 5 6 7 8 9 A0 0 Second Word Address Byte A9 A8 0 A7 MSB Start Condition by Master 3 A6 A5 A4 A3 A2 A1 MSB ACK from Slave ACK from Slave ACK from Slave Dummy Write 1 2 3 4 5 6 7 8 9 1 2 3 0 1 0 A2 A1 A0 1 0 D7 MSB 6 7 8 9 D6 D5 D4 D3 D2 D1 D0 1 MSB Start Condition by Master 8.3 5 Data Word (n) Device Address Byte 1 4 Stop Condition NACK from Master by Master ACK from Slave Sequential Read Sequential reads are initiated by either a current address read or a random read. After the bus master receives a data word, it responds with an Acknowledge. As long as the EEPROM receives an ACK, it will continue to increment the word address and serially clock out sequential data words. When the maximum memory address is reached, the data word address will roll-over and the sequential read will continue from the beginning of the memory array. All types of read operations will be terminated if the bus master does not respond with an ACK (it NACKs) during the ninth clock cycle. After the NACK response, the master may send a Stop condition to complete the protocol, or it can send a Start condition to begin the next sequence. Figure 8-3. Sequential Read 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 D2 D1 D0 0 SCL Device Address Byte SDA 1 0 1 0 A2 A1 Data Word (n) A0 1 0 D7 MSB Start Condition by Master 1 2 D6 D5 D4 D3 ACK from Slave 3 4 5 6 7 8 9 1 2 Data Word (n+1) D7 D6 MSB D5 D4 D3 D2 MSB 3 4 5 6 7 8 9 1 2 Data Word (n+2) D1 D0 0 D7 D6 D5 D4 D3 D2 3 4 5 6 7 8 9 D1 D0 1 Data Word (n+x) D1 D0 MSB ACK from Master © 2018 Microchip Technology Inc. ACK from Master 0 D7 D6 D5 D4 D3 D2 MSB ACK from Master Datasheet Stop Condition NACK by Master from Master DS20006047A-page 22 AT24C32D Device Default Condition from Microchip 9. Device Default Condition from Microchip The AT24C32D is delivered with the EEPROM array set to logic ‘1’, resulting in FFh data in all locations. © 2018 Microchip Technology Inc. Datasheet DS20006047A-page 23 AT24C32D Packaging Information 10. Packaging Information 10.1 Package Marking Information AT24C32D: Package Marking Information 8-lead TSSOP 8-lead SOIC 8-pad UDFN 2.0 x 3.0 mm Body YYWWNNN 8-pad XDFN 5-lead SOT23 1.8 x 2.2 mm Body 8-ball VFBGA 1.5 x 2.0 mm Body ##%UYY WWNNN ### NNN Note 1: ### H% NNN ATHYWW ###%CO ATMLHYWW ###% CO YYWWNNN ###U WNNN designates pin 1 Note 2: Package drawings are not to scale Note 3: For SOT23 package with date codes before 7B, the bottom line (YMXX) is marked on the bottom side and there is no Country of Assembly (@) mark on the top line. Catalog Number Truncation AT24C32D Truncation Code ###: 32D / ##: BD Date Codes YY = Year 16: 2016 17: 2017 18: 2018 19: 2019 Voltages 20: 2020 21: 2021 22: 2022 23: 2023 Y = Year 6: 2016 7: 2017 8: 2018 9: 2019 0: 2020 1: 2021 2: 2022 3: 2023 WW = Work Week of Assembly 02: Week 2 04: Week 4 ... 52: Week 52 Country of Origin Device Grade CO = Country of Origin H or U: Industrial Grade % = Minimum Voltage M: 1.7V min Atmel Truncation AT: Atmel ATM: Atmel ATML: Atmel Trace Code NNN = Alphanumeric Trace Code (2 Characters for Small Packages) Diagram Order: EIAJ, PDIP, SOIC, TSSOP, UDFN, SOT23,VFBGA,XDFN © 2018 Microchip Technology Inc. Datasheet DS20006047A-page 24 AT24C32D Packaging Information 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2X 0.10 C A–B D A D NOTE 5 N E 2 E1 2 E1 E NOTE 1 2 1 e B NOTE 5 NX b 0.25 C A–B D TOP VIEW 0.10 C C A A2 SEATING PLANE 8X A1 SIDE VIEW 0.10 C h R0.13 h R0.13 H 0.23 L SEE VIEW C (L1) VIEW A–A VIEW C Microchip Technology Drawing No. C04-057-SN Rev D Sheet 1 of 2 © 2017 Microchip Technology Inc. © 2018 Microchip Technology Inc. Datasheet DS20006047A-page 25 AT24C32D Packaging Information 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units Dimension Limits Number of Pins N e Pitch Overall Height A Molded Package Thickness A2 § Standoff A1 Overall Width E Molded Package Width E1 Overall Length D Chamfer (Optional) h Foot Length L L1 Footprint Foot Angle c Lead Thickness b Lead Width Mold Draft Angle Top Mold Draft Angle Bottom MIN 1.25 0.10 0.25 0.40 0° 0.17 0.31 5° 5° MILLIMETERS NOM 8 1.27 BSC 6.00 BSC 3.90 BSC 4.90 BSC 1.04 REF - MAX 1.75 0.25 0.50 1.27 8° 0.25 0.51 15° 15° Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. § Significant Characteristic 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm per side. 4. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. 5. Datums A & B to be determined at Datum H. Microchip Technology Drawing No. C04-057-SN Rev D Sheet 2 of 2 © 2017 Microchip Technology Inc. © 2018 Microchip Technology Inc. Datasheet DS20006047A-page 26 AT24C32D Packaging Information 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging SILK SCREEN C Y1 X1 E RECOMMENDED LAND PATTERN Units Dimension Limits E Contact Pitch Contact Pad Spacing C Contact Pad Width (X8) X1 Contact Pad Length (X8) Y1 MIN MILLIMETERS NOM 1.27 BSC 5.40 MAX 0.60 1.55 Notes: 1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-2057-SN Rev B © 2017 Microchip Technology Inc. © 2018 Microchip Technology Inc. Datasheet DS20006047A-page 27 MAT24C32D Packaging Diagrams and Parameters Packaging Information 8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D N E E1 NOTE 1 1 2 b e c A φ A2 A1 L L1 Units Dimension Limits Number of Pins MILLIMETERS MIN N NOM MAX 8 Pitch e Overall Height A – 0.65 BSC – Molded Package Thickness A2 0.80 1.00 1.05 Standoff A1 0.05 – 0.15 1.20 Overall Width E Molded Package Width E1 4.30 6.40 BSC 4.40 Molded Package Length D 2.90 3.00 3.10 Foot Length L 0.45 0.60 0.75 Footprint L1 4.50 1.00 REF Foot Angle φ 0° – 8° Lead Thickness c 0.09 – 0.20 Lead Width b 0.19 – 0.30 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side. 3. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-086B © 2007 Microchip Technology Inc. © 2018 Microchip Technology Inc. DS00049AR-page 117 Datasheet DS20006047A-page 28 M Note: AT24C32D Packaging Diagrams and Parameters Packaging Information For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2009 Microchip Technology Inc. DS00049BC-page 96 © 2018 Microchip Technology Inc. Datasheet DS20006047A-page 29 AT24C32D Packaging Information e1 C 4 5 E1 C L E L1 1 2 TOP VIEW 3 END VIEW b A2 SEATING PLANE e A A1 D SIDE VIEW 1. Dimension D does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15 mm per end. Dimension E1 does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.15 mm per side. 2. The package top may be smaller than the package bottom. Dimensions D and E1 are determined at the outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs and interlead flash, but including any mismatch between the top and bottom of the plastic body. 3. These dimensions apply to the flat section of the lead between 0.08 mm and 0.15 mm from the lead tip. 4. Dimension "b" does not include dambar protrusion. Allowable dambar protrusion shall be 0.08 mm total in excess of the "b" dimension at maximum material condition. The dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and an adjacent lead shall not be less than 0.07 mm. This drawing is for general information only. Refer to JEDEC Drawing MO-193, Variation AB for additional information. COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX A — — 1.00 A1 0.00 — 0.10 A2 0.70 0.90 1.00 c 0.08 — 0.20 NOTE 3 D 2.90 BSC 1,2 E 2.80 BSC 1,2 E1 1.60 BSC 1,2 L1 0.60 REF e 0.95 BSC e1 b 1.90 BSC 0.30 — 0.50 3,4 2/2/16 TITLE GPC 5TS1, 5-lead 1.60mm Body, Plastic Thin Shrink Small Outline Package (Shrink SOT) TSZ DRAWING NO. 5TS1 REV. E Note:  For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging. © 2018 Microchip Technology Inc. Datasheet DS20006047A-page 30 AT24C32D Packaging Information 8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (Q4B) - 2x3 mm Body [UDFN] Atmel Legacy YNZ Package Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A B N (DATUM A) E (DATUM B) NOTE 1 2X 0.10 C 1 2 2X 0.10 C TOP VIEW A1 0.10 C C SEATING PLANE A 8X (A3) SIDE VIEW 0.10 0.08 C C A B D2 e 2 1 2 0.10 E2 C A B K N L 8X b 0.10 0.05 e C A B C BOTTOM VIEW Microchip Technology Drawing C04-21355-Q4B Rev A Sheet 1 of 2 © 2018 Microchip Technology Incorporated © 2018 Microchip Technology Inc. Datasheet DS20006047A-page 31 AT24C32D Packaging Information 8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (Q4B) - 2x3 mm Body [UDFN] Atmel Legacy YNZ Package Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units Dimension Limits Number of Terminals N e Pitch A Overall Height Standoff A1 Terminal Thickness A3 Overall Length D Exposed Pad Length D2 Overall Width E Exposed Pad Width E2 b Terminal Width Terminal Length L Terminal-to-Exposed-Pad K MIN 0.50 0.00 1.40 1.20 0.18 0.35 0.20 MILLIMETERS NOM 8 0.50 BSC 0.55 0.02 0.152 REF 2.00 BSC 1.50 3.00 BSC 1.30 0.25 0.40 - MAX 0.60 0.05 1.60 1.40 0.30 0.45 - Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package is saw singulated 3. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-21355-Q4B Rev A Sheet 2 of 2 © 2018 Microchip Technology Incorporated © 2018 Microchip Technology Inc. Datasheet DS20006047A-page 32 AT24C32D Packaging Information 8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (Q4B) - 2x3 mm Body [UDFN] Atmel Legacy YNZ Package Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging X2 EV G2 8 ØV C Y2 G1 Y1 1 2 SILK SCREEN X1 E RECOMMENDED LAND PATTERN Units Dimension Limits E Contact Pitch Optional Center Pad Width X2 Optional Center Pad Length Y2 Contact Pad Spacing C Contact Pad Width (X8) X1 Contact Pad Length (X8) Y1 Contact Pad to Center Pad (X8) G1 Contact Pad to Contact Pad (X6) G2 Thermal Via Diameter V Thermal Via Pitch EV MIN MILLIMETERS NOM 0.50 BSC MAX 1.60 1.40 2.90 0.30 0.85 0.20 0.33 0.30 1.00 Notes: 1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. 2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process Microchip Technology Drawing C04-21355-Q4B Rev A © 2018 Microchip Technology Incorporated © 2018 Microchip Technology Inc. Datasheet DS20006047A-page 33 AT24C32D Packaging Information 0.10 d (4X) E 0.08 C d f 0.10 C A C D 2. b j j PIN 1 BALL PAD CORNER n 0.15 m C A B n 0.08m C A1 B A2 TOP VIEW PIN 1 BALL PAD CORNER 3 2 1 A SIDE VIEW 4 d (d1) 8 7 6 5 COMMON DIMENSIONS (Unit of Measure - mm) e (e1) BOTTOM VIEW 8 SOLDER BALLS Notes: 1. This drawing is for general information only. SYMBOL MIN NOM MAX A 0.73 0.79 0.85 A1 0.09 0.14 0.19 A2 0.40 0.45 0.50 b 0.20 0.25 0.30 D 2. Dimension ‘b’ is measured at maximum solder ball diameter. 3. Solder ball composition shall be 95.5Sn-4.0Ag-.5Cu. NOTE 2 1.50 BSC E 2.0 BSC e 0.50 BSC e1 0.25 REF d 1.00 BSC d1 0.25 REF 7/1/14 TITLE GPC DRAWING NO. 8U3-1, 8-ball, 1.50mm x 2.00mm body, 0.50mm pitch, Very Thin, Fine-Pitch Ball Grid Array Package (VFBGA) GXU 8U3-1 REV. G Note:  For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging. © 2018 Microchip Technology Inc. Datasheet DS20006047A-page 34 AT24C32D Packaging Information D 7 8 6 5 E PIN #1 ID 2 1 3 4 A1 Top View A Side View e1 b L COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL 0.10 PIN #1 ID 0.15 b e MIN NOM MAX A – – 0.40 A1 0.00 – 0.05 D 1.70 1.80 1.90 E 2.10 2.20 2.30 b 0.15 0.20 0.25 e 0.40 TYP e1 L End View NOTE 1.20 REF 0.26 0.30 0.35 9/10/2012 TITLE GPC DRAWING NO. REV. 8ME1, 8-pad (1.80mm x 2.20mm body) Extra Thin DFN (XDFN) DTP 8ME1 B Note:  For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging. © 2018 Microchip Technology Inc. Datasheet DS20006047A-page 35 AT24C32D Revision History 11. Revision History Atmel Document 8866 revision A (August 2013) Split AT24C32D from AT24C64D due to growing differences in package offerings. Added 5-ball WLCSP package. Updated template and Atmel logos. Atmel Document 8866 revision B (January 2015) Added the UDFN Expanded Quantity Option. Updated the 8X and 8MA2 package outline drawings, the part markings page, and the ordering information section Atmel Document 8866 revision C (December 2015) Add the AT24C32D-STUMHY-T option and updated the 8S1 and 8MA2 package drawings. Atmel Document 8866 revision D (December 2016) Removed AT24C32D-STUMHY-T part number from data sheet. Removed Product Variation code from Ordering Code Detail. Part marking SOT23: - Moved backside mark (YMXX) to front side line2. - Added @ = Country of Assembly. Revision A (September 2018) Updated to the Microchip template. Microchip DS20006047 replaces Atmel document 8866. Corrected tLOW typo from 400 ns to 500 ns. Corrected tAA typo from 550 ns to 450 ns. Updated Part Marking Information. Updated the “Software Reset” section. Added ESD rating. Removed lead finish designation. Updated trace code format in package markings. Updated section content throughout for clarification. Added a figure for “System Configuration Using 2-Wire Serial EEPROMs”. Added POR recommendations section. Removed the 5-ball WLCSP package offering. Replaced the 8U2-1 VFBGA Package Outline Drawing with the 8U3-1 VFBGA Package Outline Drawing. Updated the SOIC, TSSOP and UDFN package drawings to Microchip format. © 2018 Microchip Technology Inc. Datasheet DS20006047A-page 36 AT24C32D The Microchip Web Site Microchip provides online support via our web site at http://www.microchip.com/. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: • • • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives Customer Change Notification Service Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at http://www.microchip.com/. Under “Support”, click on “Customer Change Notification” and follow the registration instructions. Customer Support Users of Microchip products can receive assistance through several channels: • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Customers should contact their distributor, representative or Field Application Engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://www.microchip.com/support © 2018 Microchip Technology Inc. Datasheet DS20006047A-page 37 AT24C32D Product Identification System To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. AT 24C 3 2 D - S S H M- B Shipping Carrier Option B = Bulk (Tubes) T = Tape and Reel, Standard Quantity Option E = Tape and Reel, Extended Quantity Option Product Family Operating Voltage 24C = Standard I2C-compatible Serial EEPROM M = 1.7V to 5.5V Device Grade or Wafer/Die Thickness Device Density 32 = 32 Kilobit H or U = Industrial Temperature Range (-40°C to +85°C) 11 = 11mil Wafer Thickness Device Revision Package Option SS X MA ME ST C WWU = SOIC = TSSOP = 2.0mm x 3.0mm UDFN = 1.8mm x 2.2mm XDFN = SOT23 = VFBGA = Wafer Unsawn Examples Device Package Package Package Drawing Option Code Shipping Carrier Option Device Grade Industrial Temperature (-40°C to +85°C) AT24C32D‑SSHM‑B SOIC SN SS Bulk (Tubes) AT24C32D‑SSHM‑T SOIC SN SS Tape and Reel TSSOP ST X Tape and Reel AT24C32D‑MAHM‑T UDFN Q4B MA Tape and Reel AT24C32D‑MAHM‑E UDFN Q4B MA Extended Qty. Tape and Reel AT24C32D‑MEHM‑T XDFN 8ME1 ME Tape and Reel AT24C32D-CUM-T VFBGA 8U3-1 C Tape and Reel AT24C32D-STUM-T SOT23 5TS1 ST Tape and Reel AT24C32D‑XHM‑T Microchip Devices Code Protection Feature Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. © 2018 Microchip Technology Inc. Datasheet DS20006047A-page 38 AT24C32D • • • • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Legal Notice Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. 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Trademarks The Microchip name and logo, the Microchip logo, AnyRate, AVR, AVR logo, AVR Freaks, BitCloud, chipKIT, chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq, Kleer, LANCheck, LINK MD, maXStylus, maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch, SAM-BA, SpyNIC, SST, SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. ClockWorks, The Embedded Control Solutions Company, EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and Quiet-Wire are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total © 2018 Microchip Technology Inc. Datasheet DS20006047A-page 39 AT24C32D Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2018, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 978-1-5224-3541-9 Quality Management System Certified by DNV ISO/TS 16949 Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California ® ® and India. The Company’s quality system processes and procedures are for its PIC MCUs and dsPIC ® DSCs, KEELOQ code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. © 2018 Microchip Technology Inc. Datasheet DS20006047A-page 40 Worldwide Sales and Service AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/ support Web Address: www.microchip.com Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Austin, TX Tel: 512-257-3370 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Novi, MI Tel: 248-848-4000 Houston, TX Tel: 281-894-5983 Indianapolis Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 Tel: 317-536-2380 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Tel: 951-273-7800 Raleigh, NC Tel: 919-844-7510 New York, NY Tel: 631-435-6000 San Jose, CA Tel: 408-735-9110 Tel: 408-436-4270 Canada - Toronto Tel: 905-695-1980 Fax: 905-695-2078 Australia - Sydney Tel: 61-2-9868-6733 China - Beijing Tel: 86-10-8569-7000 China - Chengdu Tel: 86-28-8665-5511 China - Chongqing Tel: 86-23-8980-9588 China - Dongguan Tel: 86-769-8702-9880 China - Guangzhou Tel: 86-20-8755-8029 China - Hangzhou Tel: 86-571-8792-8115 China - Hong Kong SAR Tel: 852-2943-5100 China - Nanjing Tel: 86-25-8473-2460 China - Qingdao Tel: 86-532-8502-7355 China - Shanghai Tel: 86-21-3326-8000 China - Shenyang Tel: 86-24-2334-2829 China - Shenzhen Tel: 86-755-8864-2200 China - Suzhou Tel: 86-186-6233-1526 China - Wuhan Tel: 86-27-5980-5300 China - Xian Tel: 86-29-8833-7252 China - Xiamen Tel: 86-592-2388138 China - Zhuhai Tel: 86-756-3210040 India - Bangalore Tel: 91-80-3090-4444 India - New Delhi Tel: 91-11-4160-8631 India - Pune Tel: 91-20-4121-0141 Japan - Osaka Tel: 81-6-6152-7160 Japan - Tokyo Tel: 81-3-6880- 3770 Korea - Daegu Tel: 82-53-744-4301 Korea - Seoul Tel: 82-2-554-7200 Malaysia - Kuala Lumpur Tel: 60-3-7651-7906 Malaysia - Penang Tel: 60-4-227-8870 Philippines - Manila Tel: 63-2-634-9065 Singapore Tel: 65-6334-8870 Taiwan - Hsin Chu Tel: 886-3-577-8366 Taiwan - Kaohsiung Tel: 886-7-213-7830 Taiwan - Taipei Tel: 886-2-2508-8600 Thailand - Bangkok Tel: 66-2-694-1351 Vietnam - Ho Chi Minh Tel: 84-28-5448-2100 Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 Finland - Espoo Tel: 358-9-4520-820 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Garching Tel: 49-8931-9700 Germany - Haan Tel: 49-2129-3766400 Germany - Heilbronn Tel: 49-7131-67-3636 Germany - Karlsruhe Tel: 49-721-625370 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Germany - Rosenheim Tel: 49-8031-354-560 Israel - Ra’anana Tel: 972-9-744-7705 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Italy - Padova Tel: 39-049-7625286 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Norway - Trondheim Tel: 47-7289-7561 Poland - Warsaw Tel: 48-22-3325737 Romania - Bucharest Tel: 40-21-407-87-50 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 Sweden - Gothenberg Tel: 46-31-704-60-40 Sweden - Stockholm Tel: 46-8-5090-4654 UK - Wokingham Tel: 44-118-921-5800 Fax: 44-118-921-5820 © 2018 Microchip Technology Inc. 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