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AT27BV1024-15JI

AT27BV1024-15JI

  • 厂商:

    ACTEL(微芯科技)

  • 封装:

    LCC-44

  • 描述:

    IC EPROM 1MBIT PARALLEL 44PLCC

  • 数据手册
  • 价格&库存
AT27BV1024-15JI 数据手册
Features • Fast Read Access Time - 90 ns • Dual Voltage Range Operation • • • • • • • • – Unregulated Battery Power Supply Range, 2.7V to 3.6V or Standard 5V ± 10% Supply Range Pin Compatible with JEDEC Standard AT27C1024 Low Power CMOS Operation – 20 µA max. (less than 1 µA typical) Standby for VCC = 3.6V – 36 mW max. Active at 5 MHz for VCC = 3.6V JEDEC Standard Surface Mount Packages – 44-Lead PLCC – 40-Lead VSOP (10 x 14mm) High Reliability CMOS Technology – 2,000V ESD Protection – 200 mA Latchup Immunity Rapid™ Programming Algorithm - 100 µs/word (typical) CMOS and TTL Compatible Inputs and Outputs – JEDEC Standard for LVTTL and LVBO Integrated Product Identification Code Commercial and Industrial Temperature Ranges 1-Megabit (64K x 16) Unregulated Battery-Voltage™ High-Speed OTP EPROM Description The AT27BV1024 is a high performance, low power, low voltage 1,048,576-bit onetime programmable read only memory (OTP EPROM) organized as 64K by 16 bits. It requires only one supply in the range of 2.7V to 3.6V in normal read mode operation. The by-16 organization makes this part ideal for portable and handheld 16- and 32-bit microprocessor based systems using either regulated or unregulated battery power. (continued) AT27BV1024 Pin Configurations Pin Name Function A0 - A15 Addresses O0 - O15 Outputs CE Chip Enable OE Output Enable PGM Program Strobe NC No Connect Note: Both GND pins must be connected. 6 5 4 3 2 1 44 43 42 41 40 O13 O14 O15 CE VPP NC VCC PGM NC A15 A14 PLCC Top View 39 38 37 36 35 34 33 32 31 30 29 18 19 20 21 22 23 24 25 26 27 28 7 8 9 10 11 12 13 14 15 16 17 A13 A12 A11 A10 A9 GND NC A8 A7 A6 A5 O3 O2 O1 O0 OE NC A0 A1 A2 A3 A4 O12 O11 O10 O9 O8 GND NC O7 O6 O5 O4 VSOP Top View Type 1 A9 A10 A11 A12 A13 A14 A15 NC PGM VCC VPP CE O15 O14 O13 O12 O11 O10 O9 O8 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 GND A8 A7 A6 A5 A4 A3 A2 A1 A0 OE O0 O1 O2 O3 O4 O5 O6 O7 GND Rev. 0631B–10/98 Note: PLCC Package Pins 1 and 23 are DON’T CONNECT. 1 Atmel’s innovative design techniques provide fast speeds that rival 5V parts while keeping the low power consumption of a 3V supply. At V CC = 2.7V, any word can be accessed in less than 120 ns. With a typical power dissipation of only 18 mW at 5 MHz and VCC = 3V, the AT27BV1024 consumes less than one fifth the power of a standard 5V EPROM. Standby mode supply current is typically less than 1 µA at 3V. The AT27BV1024 simplifies system design and stretches battery lifetime even further by eliminating the need for power supply regulation. The AT27BV1024 is available in industry standard JEDECapproved one-time programmable (OTP) plastic PLCC and VSOP packages. All devices feature two-line control (CE, OE) to give designers the flexibility to prevent bus contention. The AT27BV1024 operating with V CC at 3.0V produces TTL level outputs that are compatible with standard TTL logic devices operating at VCC = 5.0V. At VCC = 2.7V, the part is compatible with JEDEC approved low voltage battery operation (LVBO) interface specifications. The device is also capable of standard 5-volt operation making it ideally suited for dual supply range systems or card products that are pluggable in both 3-volt and 5-volt hosts. Atmel’s AT27BV1024 has additional features to ensure high quality and efficient production use. The Rapid™ Pro- Block Diagram 2 AT27BV1024 gramming Algorithm reduces the time required to program the part and guarantees reliable programming. Programming time is typically only 100 µs/word. The Integrated Product Identification Code electronically identifies the device and manufacturer. This feature is used by industry standard programming equipment to select the proper programming algorithms and voltages. The AT27BV1024 programs exactly the same way as a standard 5V AT27C1024 and uses the same programming equipment. System Considerations Switching between active and standby conditions via the Chip Enable pin may produce transient voltage excursions. Unless accommodated by the system design, these transients may exceed data sheet limits, resulting in device non-conformance. At a minimum, a 0.1 µF high frequency, low inherent inductance, ceramic capacitor should be utilized for each device. This capacitor should be connected between the V CC and Ground terminals of the device, as close to the device as possible. Additionally, to stabilize the supply voltage level on printed circuit boards with large EPROM arrays, a 4.7 µF bulk electrolytic capacitor should be utilized, again connected between the VCC and Ground terminals. This capacitor should be positioned as close as possible to the point where the power supply is connected to the array. AT27BV1024 Absolute Maximum Ratings* Temperature Under Bias ................................ -55°C to +125°C *NOTICE: Storage Temperature ..................................... -65°C to +150°C Voltage on Any Pin with Respect to Ground .........................................-2.0V to +7.0V(1) Voltage on A9 with Respect to Ground ......................................-2.0V to +14.0V(1) Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability VPP Supply Voltage with Respect to Ground .......................................-2.0V to +14.0V(1) Note: 1. Minimum voltage is -0.6V dc which may undershoot to -2.0V for pulses of less than 20 ns. Maximum output pin voltage is VCC + 0.75V dc which may overshoot to +7.0V for pulses of less than 20 ns. Operating Modes Mode \ Pin Read CE (2) VIL Output Disable (2) Standby(2) Rapid Program (3) (3) PGM Verify OE PGM VIL (1) X Ai Ai VPP X VCC VCC DOUT (2) High Z High Z X VIH X X X VCC VIH X X X X(5) VCC(2) VIL VIL VIH VIL VIL VIH Ai Ai VPP VPP VCC (3) DIN VCC (3) DOUT (3) High Z (3) PGM Inhibit VIH X X X VPP VCC Product Identification(3)(5) VIL VIL X A9 = VH(4) A0 = VIH or VIL A1 - A15 = VIL VCC VCC(3) Notes: Outputs (2) Identification Code 1. X can be VIL or VIH. 2. Read, output disable, and standby modes require, 2.7V ≤ VCC ≤ 3.6V, or 4.5V ≤ VCC ≤ 5.5V. 3. Refer to Programming Characteristics. Programming modes require VCC = 6.5V. 4. VH = 12.0 ± 0.5V. 5. Two identifier words may be selected. All Ai inputs are held low (VIL), except A9 which is set to VH and A0 which is toggled low (VIL) to select the Manufacturer’s Identification word and high (VIH) to select the Device Code word. 3 DC and AC Operating Conditions for Read Operation Com. Operating Temperature (Case) Ind. AT27BV1024-90 AT27BV1024-12 AT27BV1024-15 0°C - 70°C 0°C - 70°C 0°C - 70°C -40°C - 85°C -40°C - 85°C -40°C - 85°C 2.7V to 3.6V 2.7V to 3.6V 2.7V to 3.6V 5V ± 10% 5V ± 10% 5V ± 10% VCC Power Supply DC and Operating Characteristics for Read Operation Symbol Parameter Condition Min Max Units VCC = 2.7V to 3.6V ILI Input Load Current VIN = 0V to VCC ±1 µA ILO Output Leakage Current VOUT = 0V to VCC ±5 µA VPP = VCC 10 µA ISB1 (CMOS), CE = VCC ± 0.3V 20 µA ISB2 (TTL), CE = 2.0 to VCC + 0.5V 100 µA 8 mA IPP1(2) VPP ISB VCC(1) Standby Current ICC VCC Active Current VIL Input Low Voltage VIH Input High Voltage VOL VOH (1) Read/Standby Current Output Low Voltage Output High Voltage f = 5 MHz, IOUT = 0 mA, CE = VIL, VCC = 3.6V VCC = 3.0 to 3.6V -0.6 0.8 V VCC = 2.7 to 3.6V -0.6 0.2 x VCC V VCC = 3.0 to 3.6V 2.0 VCC + 0.5 V VCC = 2.7 to 3.6V 0.7 x VCC VCC + 0.5 V IOL = 2.0 mA 0.4 V IOL = 100 µA 0.2 V IOL = 20 µA 0.1 V IOH = -2.0 mA 2.4 V IOH = -100 µA VCC - 0.2 V IOH = -20 µA VCC - 0.1 V VCC = 4.5V to 5.5V ILI Input Load Current VIN = 0V to VCC ±1 µA ILO Output Leakage Current VOUT = 0V to VCC ±5 µA VPP = VCC 10 µA ISB1 (CMOS), CE = VCC ± 0.3V 100 µA ISB2 (TTL), CE = 2.0 to VCC + 0.5V 1 mA f = 5 MHz, IOUT = 0 mA, CE = VIL 30 mA IPP1(2) VPP ISB VCC(1) Standby Current ICC VCC Active Current VIL Input Low Voltage -0.6 0.8 V VIH Input High Voltage 2.0 VCC + 0.5 V VOL Output Low Voltage IOL = 2.1 mA 0.4 V VOH Output High Voltage IOH = -400 µA Notes: (1) Read/Standby Current 2.4 V 1. VCC must be applied simultaneously with or before VPP, and removed simultaneously with or after VPP. 2. VPP may be connected directly to VCC, except during programming. The supply current would then be the sum of ICC and IPP. 4 AT27BV1024 AT27BV1024 AC Characteristics for Read Operation VCC = 2.7V to 3.6V and 4.5V to 5.5V AT27BV1024 -90 Min -12 Symbol Parameter Condition tACC(3) Address to Output Delay CE = OE = VIL 90 tCE(2) CE to Output Delay OE = VIL tOE(2)(3) OE to Output Delay CE = VIL tDF(4)(5) OE or CE High to Output Float, whichever occurred first tOH Output Hold from Address, CE or OE, whichever occurred first 0 Max Min -15 Max Units 120 150 ns 90 120 150 ns 30 35 50 ns 30 30 40 ns 0 Max Min 0 ns AC Waveforms for Read Operation(1) Notes: 1. Timing measurement references are 0.8V and 2.0V. Input AC drive levels are 0.45V and 2.4V, unless otherwise specified. 2. OE may be delayed up to tCE - tOE after the falling edge of CE without impact on tCE. 3. OE may be delayed up to tACC - tOE after the address is valid without impact on tACC. 4. This parameter is only sampled and is not 100% tested. 5. Output float is defined as the point when data is no longer driven. 6. When reading a 27BV1024, a 0.1 µF capacitor is required across VCC and ground to suppress spurious voltage transients. 5 Input Test Waveforms and Measurement Levels Output Test Load tR, tF < 20 ns (10% to 90%) Note: CL = 100 pF including jig capacitance. Pin Capacitance f = 1 MHz T = 25°C (1) Symbol Typ Max Units Conditions CIN 4 10 pF VIN = 0V COUT 8 12 pF VOUT = 0V Note: 6 1. Typical values for nominal supply voltage. This parameter is only sampled and is not 100% tested. AT27BV1024 AT27BV1024 Programming Waveforms(1) Notes: 1. The Input Timing Reference is 0.8V for VIL and 2.0V for VIH. 2. tOE and tDFP are characteristics of the device but must be accommodated by the programmer. 3. When programming the AT27BV1024 a 0.1 µF capacitor is required across VPP and ground to suppress spurious voltage transients. DC Programming Characteristics TA = 25 ± 5°C, VCC = 6.5 ± 0.25V, VPP = 13.0 ± 0.25V Limits Symbol Parameter Test Conditions ILI Input Load Current VIN = VIL, VIH VIL Input Low Level VIH Input High Level VOL Output Low Voltage IOL = 2.1 mA VOH Output High Voltage IOH = -400 µA ICC2 VCC Supply Current (Program and Verify) IPP2 VPP Supply Current VID A9 Product Identification Voltage Min Max Units ±10 µA -0.6 0.8 V 2.0 VCC + 0.1 V 0.4 V 2.4 CE = PGM = VIL 11.5 V 50 mA 30 mA 12.5 V 7 AC Programming Characteristics TA = 25 ± 5°C, VCC = 6.5 ± 0.25V, VPP = 13.0 ± 0.25V Limits (1) Symbol Parameter tAS Address Setup Time 2 µs tCES CE Setup Time 2 µs tOES OE Setup Time 2 µs tDS Data Setup Time 2 µs tAH Address Hold Time 0 µs tDH Data Hold Time 2 µs tDFP OE High to Output Float Delay(2) tVPS VPP Setup Time tVCS VCC Setup Time tPW PGM Program Pulse Width(3) tOE Data Valid from OE tPRT VPP Pulse Rise Time During Programming Notes: Test Conditions Min Input Rise and Fall Times: (10% to 90%) 20 ns Input Pulse Levels: 0.45V to 2.4V Max 0 Input Timing Reference Level: 0.8V to 2.0V Output Timing Reference Level: 0.8V to 2.0V Units 130 ns 2 µs 2 µs 95 105 µs 150 ns 50 ns 1. VCC must be applied simultaneously or before VPP and removed simultaneously or after VPP. 2. This parameter is only sampled and is not 100% tested. Output Float is defined as the point where data is no longer driven— see timing diagram. 3. Program Pulse width tolerance is 100 µsec ± 5%. Atmel’s 27BV1024 Integrated Product Identification Code(1) Pins Codes Manufacturer A0 O15-O8 O7 O6 O5 O4 O3 O2 O1 O0 Hex Data 0 0 0 0 0 1 1 1 1 0 001E Device Type 1 0 1 1 1 1 0 0 0 1 00F1 Note: 1. The AT27BV1024 has the same Product Identification Code as the AT27C1024. Both are programming compatible. 8 AT27BV1024 AT27BV1024 Rapid Programming Algorithm A 100 µs PGM pulse width is used to program. The address is set to the first location. VCC is raised to 6.5V and VPP is raised to 13.0V. Each address is first programmed with one 100 µs PGM pulse without verification. Then a verification / reprogramming loop is executed for each address. In the event a word fails to pass verification, up to 10 successive 100 µs pulses are applied with a verification after each pulse. If the word fails to verify after 10 pulses have been applied, the part is considered failed. After the word verifies properly, the next address is selected until all have been checked. VPP is then lowered to 5.0V and VCC to 5.0V. All words are read again and compared with the original data to determine if the device passes or fails. 9 Ordering Information ICC (mA) tACC (ns) Active Standby Ordering Code Package 90 8 0.02 AT27BV1024-90JC AT27BV1024-90VC 44J 40V Commercial (0°C to 70°C) 8 0.02 AT27BV1024-90JI AT27BV1024-90VI 44J 40V Industrial (-40°C to 85°C) 8 0.02 AT27BV1024-12JC AT27BV1024-12VC 44J 40V Commercial (0°C to 70°C) 8 0.02 AT27BV1024-12JI AT27BV1024-12VI 44J 40V Industrial (-40°C to 85°C) 8 0.02 AT27BV1024-15JC AT27BV1024-15VC 44J 40V Commercial (0°C to 70°C) 8 0.02 AT27BV1024-15JI AT27BV1024-15VI 44J 40V Industrial (-40°C to 85°C) 120 150 Package Type 44J 44-Lead, Plastic J-Leaded Chip Carrier (PLCC) 40V 40-Lead, Plastic Thin Small Outline Package (VSOP) 10 x 14 mm 10 AT27BV1024 Operation Range AT27BV1024 Packaging Information 44J, 44-Lead, Plastic J-Leaded Chip Carrier (PLCC) Dimensions in Inches and (Millimeters) JEDEC STANDARD MS-018 AC 40V, 40-Lead, Plastic Thin Small Outline Package (VSOP) Dimensions in Millimeters and (Inches) JEDEC OUTLINE MO-142 CA .045(1.14) X 45° PIN NO. 1 IDENTIFY .045(1.14) X 30° - 45° .012(.305) .008(.203) .630(16.0) .590(15.0) .656(16.7) SQ .650(16.5) .032(.813) .026(.660) .695(17.7) SQ .685(17.4) .050(1.27) TYP .500(12.7) REF SQ .021(.533) .013(.330) .043(1.09) .020(.508) .120(3.05) .090(2.29) .180(4.57) .165(4.19) .022(.559) X 45° MAX (3X) 11 Atmel Headquarters Atmel Operations Corporate Headquarters Atmel Colorado Springs 2325 Orchard Parkway San Jose, CA 95131 TEL (408) 441-0311 FAX (408) 487-2600 Europe 1150 E. Cheyenne Mtn. Blvd. Colorado Springs, CO 80906 TEL (719) 576-3300 FAX (719) 540-1759 Atmel Rousset Atmel U.K., Ltd. Coliseum Business Centre Riverside Way Camberley, Surrey GU15 3YL England TEL (44) 1276-686677 FAX (44) 1276-686697 Zone Industrielle 13106 Rousset Cedex, France TEL (33) 4 42 53 60 00 FAX (33) 4 42 53 60 01 Asia Atmel Asia, Ltd. Room 1219 Chinachem Golden Plaza 77 Mody Road Tsimshatsui East Kowloon, Hong Kong TEL (852) 27219778 FAX (852) 27221369 Japan Atmel Japan K.K. Tonetsu Shinkawa Bldg., 9F 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 Japan TEL (81) 3-3523-3551 FAX (81) 3-3523-7581 Fax-on-Demand North America: 1-(800) 292-8635 International: 1-(408) 441-0732 e-mail literature@atmel.com Web Site http://www.atmel.com BBS 1-(408) 436-4309 © Atmel Corporation 1998. Atmel Cor poration makes no warranty for the use of its products, other than those expressly contained in the Company’s standard warranty which is detailed in Atmel’s Terms and Conditions located on the Company’s website. The Company assumes no responsibility for any errors which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without notice, and does not make any commitment to update the information contained herein. No licenses to patents or other intellectual proper ty of Atmel are granted by the Company in connection with the sale of Atmel products, expressly or by implication. Atmel’s products are not authorized for use as critical components in life suppor t devices or systems. Marks bearing ® and/or ™ are registered trademarks and trademarks of Atmel Corporation. Terms and product names in this document may be trademarks of others. Printed on recycled paper. 0631B–10/98/xM
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