Features
• High Performance, Low Power 32-Bit Atmel® AVR® Microcontroller
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
– Compact Single-cycle RISC Instruction Set Including DSP Instruction Set
– Read-Modify-Write Instructions and Atomic Bit Manipulation
– Performing 1.49 DMIPS / MHz
Up to 91 DMIPS Running at 66 MHz from Flash (1 Wait-State)
Up to 49 DMIPS Running at 33MHz from Flash (0 Wait-State)
– Memory Protection Unit
Multi-hierarchy Bus System
– High-Performance Data Transfers on Separate Buses for Increased Performance
– 15 Peripheral DMA Channels Improves Speed for Peripheral Communication
Internal High-Speed Flash
– 512K Bytes, 256K Bytes, 128K Bytes Versions
– Single Cycle Access up to 33 MHz
– Prefetch Buffer Optimizing Instruction Execution at Maximum Speed
– 4ms Page Programming Time and 8ms Full-Chip Erase Time
– 100,000 Write Cycles, 15-year Data Retention Capability
– Flash Security Locks and User Defined Configuration Area
Internal High-Speed SRAM, Single-Cycle Access at Full Speed
– 64K Bytes (512KB and 256KB Flash), 32K Bytes (128KB Flash)
External Memory Interface on AT32UC3A0 Derivatives
– SDRAM / SRAM Compatible Memory Bus (16-bit Data and 24-bit Address Buses)
Interrupt Controller
– Autovectored Low Latency Interrupt Service with Programmable Priority
System Functions
– Power and Clock Manager Including Internal RC Clock and One 32KHz Oscillator
– Two Multipurpose Oscillators and Two Phase-Lock-Loop (PLL) allowing
Independant CPU Frequency from USB Frequency
– Watchdog Timer, Real-Time Clock Timer
Universal Serial Bus (USB)
– Device 2.0 Full Speed and On-The-Go (OTG) Low Speed and Full Speed
– Flexible End-Point Configuration and Management with Dedicated DMA Channels
– On-chip Transceivers Including Pull-Ups
Ethernet MAC 10/100 Mbps interface
– 802.3 Ethernet Media Access Controller
– Supports Media Independent Interface (MII) and Reduced MII (RMII)
One Three-Channel 16-bit Timer/Counter (TC)
– Three External Clock Inputs, PWM, Capture and Various Counting Capabilities
One 7-Channel 16-bit Pulse Width Modulation Controller (PWM)
Four Universal Synchronous/Asynchronous Receiver/Transmitters (USART)
– Independant Baudrate Generator, Support for SPI, IrDA and ISO7816 interfaces
– Support for Hardware Handshaking, RS485 Interfaces and Modem Line
Two Master/Slave Serial Peripheral Interfaces (SPI) with Chip Select Signals
One Synchronous Serial Protocol Controller
– Supports I2S and Generic Frame-Based Protocols
One Master/Slave Two-Wire Interface (TWI), 400kbit/s I2C-compatible
One 8-channel 10-bit Analog-To-Digital Converter
16-bit Stereo Audio Bitstream
– Sample Rate Up to 50 KHz
32-Bit Atmel AVR
Microcontroller
AT32UC3A0512
AT32UC3A0256
AT32UC3A0128
AT32UC3A1512
AT32UC3A1256
AT32UC3A1128
Summary
32058KS–AVR32–01/12
AT32UC3A
• On-Chip Debug System (JTAG interface)
– Nexus Class 2+, Runtime Control, Non-Intrusive Data and Program Trace
• 100-pin TQFP (69 GPIO pins), 144-pin LQFP (109 GPIO pins) , 144 BGA (109 GPIO pins)
• 5V Input Tolerant I/Os
• Single 3.3V Power Supply or Dual 1.8V-3.3V Power Supply
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32058KS–AVR32–01/12
AT32UC3A
1. Description
The AT32UC3A is a complete System-On-Chip microcontroller based on the AVR32 UC RISC
processor running at frequencies up to 66 MHz. AVR32 UC is a high-performance 32-bit RISC
microprocessor core, designed for cost-sensitive embedded applications, with particular emphasis on low power consumption, high code density and high performance.
The processor implements a Memory Protection Unit (MPU) and a fast and flexible interrupt controller for supporting modern operating systems and real-time operating systems. Higher
computation capabilities are achievable using a rich set of DSP instructions.
The AT32UC3A incorporates on-chip Flash and SRAM memories for secure and fast access.
For applications requiring additional memory, an external memory interface is provided on
AT32UC3A0 derivatives.
The Peripheral Direct Memory Access controller (PDCA) enables data transfers between peripherals and memories without processor involvement. PDCA drastically reduces processing
overhead when transferring continuous and large data streams between modules within the
MCU.
The PowerManager improves design flexibility and security: the on-chip Brown-Out Detector
monitors the power supply, the CPU runs from the on-chip RC oscillator or from one of external
oscillator sources, a Real-Time Clock and its associated timer keeps track of the time.
The Timer/Counter includes three identical 16-bit timer/counter channels. Each channel can be
independently programmed to perform frequency measurement, event counting, interval measurement, pulse generation, delay timing and pulse width modulation.
The PWM modules provides seven independent channels with many configuration options
including polarity, edge alignment and waveform non overlap control. One PWM channel can
trigger ADC conversions for more accurate close loop control implementations.
The AT32UC3A also features many communication interfaces for communication intensive
applications. In addition to standard serial interfaces like UART, SPI or TWI, other interfaces like
flexible Synchronous Serial Controller, USB and Ethernet MAC are available.
The Synchronous Serial Controller provides easy access to serial communication protocols and
audio standards like I2S.
The Full-Speed USB 2.0 Device interface supports several USB Classes at the same time
thanks to the rich End-Point configuration. The On-The-GO (OTG) Host interface allows device
like a USB Flash disk or a USB printer to be directly connected to the processor.
The media-independent interface (MII) and reduced MII (RMII) 10/100 Ethernet MAC module
provides on-chip solutions for network-connected devices.
AT32UC3A integrates a class 2+ Nexus 2.0 On-Chip Debug (OCD) System, with non-intrusive
real-time trace, full-speed read/write memory access in addition to basic runtime control.
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32058KS–AVR32–01/12
AT32UC3A
2. Configuration Summary
The table below lists all AT32UC3A memory and package configurations:
Device
Flash
SRAM
Ext. Bus Interface
Ethernet
MAC
AT32UC3A0512
512 Kbytes
64 Kbytes
yes
yes
144 pin LQFP
144 pin BGA
AT32UC3A0256
256 Kbytes
64 Kbytes
yes
yes
144 pin LQFP
144 pin BGA
AT32UC3A0128
128 Kbytes
32 Kbytes
yes
yes
144 pin LQFP
144 pin BGA
AT32UC3A1512
512 Kbytes
64 Kbytes
no
yes
100 pin TQFP
AT32UC3A1256
256 Kbytes
64 Kbytes
no
yes
100 pin TQFP
AT32UC3A1128
128 Kbytes
32 Kbytes
no
yes
100 pin TQFP
Package
3. Abbreviations
• GCLK: Power Manager Generic Clock
• GPIO: General Purpose Input/Output
• HSB: High Speed Bus
• MPU: Memory Protection Unit
• OCD: On Chip Debug
• PB: Peripheral Bus
• PDCA: Peripheral Direct Memory Access Controller (PDC) version A
• USBB: USB On-The-GO Controller version B
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32058KS–AVR32–01/12
AT32UC3A
4. Blockdiagram
Blockdiagram
M DC ,
TXD [3..0],
TX_C LK,
TX_EN ,
TX_ER ,
SPEED
DM A
S
M
DM A
M
M
M
M
HIG H SPEED
BUS M ATRIX
S
S
ETHERNET
M AC
M
S
C ON FIGU RATIO N
PB
HS
B
HSB-PB
BRIDG E B
M D IO
REG ISTER S BUS
H SB
PERIPHERAL
DM A
CO NTRO LLER
HSB-PB
BRIDG E A
PB
XIN 32
XO UT32
XIN0
XO U T0
XIN1
XO U T1
32 KHz
O SC
CLO CK
G ENERATO R
O SC0
O SC1
PLL0
PDC
PO W ER
M ANAG ER
SD A10
SD CK
SDC KE
SD CS0
SD W E
PDC
115 kHz
RCO SC
NC S[3..0]
N RD
NW AIT
N W E0
N W E1
N W E3
RAS
CAS
USART0
USART2
USART3
R XD
TXD
CLK
R TS, C TS
PDC
W ATCHDO G
TIM ER
D ATA[15..0]
ADD R[23..0]
SERIAL
PERIPHERAL
INTERFACE 0/1
M ISO , M O SI
NPC S0
NPC S[3..1]
PDC
REAL TIM E
CO UNTER
512 KB
FLASH
USART1
SYNCHRO NO US
SERIAL
CO NTRO LLER
PDC
EXTERNAL
INTERRUPT
CO NTRO LLER
TW O -W IRE
INTERFACE
PDC
EXTIN T[7..0]
KPS[7..0]
N M I_N
64 KB
SRAM
R XD
TXD
CLK
R TS, C TS
D SR, DTR, D CD , RI
PULSE W IDTH
M O DULATIO N
CO NTRO LLER
PDC
INTERRUPT
CO NTRO LLER
PA
PB
PC
PX
S
S
ANALO G TO
DIG ITAL
CO NVERTER
PDC
GENERAL PURPOSE IOs
CO L,
CR S,
R XD[3..0],
R X_CLK,
R X_DV,
RX_ER
DATA
INTERFACE
FAST G PIO
AUDIO
BITSTREAM
DAC
SC K
GENERAL PURPOSE IOs
USB
INTERFACE
ID
VBO F
M EM O RY PRO TEC TIO N U NIT
INSTR
INTERFACE
PBB
VBU S
D+
D-
UC CPU
LOC AL BU S
INTERFACE
FLASH
CONTROLLER
NEXUS
CLASS 2+
O CD
M C KO
M D O[5..0]
M SEO[1..0]
EVTI_N
EVTO_N
MEMORY INTERFACE
JTAG
INTERFACE
EXTERNAL BUS INTERFACE
(SDRAM & STATIC MEMORY
CONTROLLER)
TC K
TDO
TD I
TM S
PBA
Figure 4-1.
PA
PB
PC
PX
TX _C LO C K, TX_FRA ME _SYN C
TX_D ATA
RX _C LO C K, R X_FRA ME _SYN C
R X_D ATA
SC L
SD A
CLO CK
CO NTRO LLER
SLEEP
CO NTRO LLER
PW M [6..0]
PLL1
RESET_N
G CLK[3..0]
A[2..0]
B[2..0]
CLK[2..0]
RESET
CO NTRO LLER
TIM ER /CO UNTER
AD[7..0]
AD VREF
DATA[1..0]
D ATAN [1..0]
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32058KS–AVR32–01/12
AT32UC3A
4.1
4.1.1
Processor and architecture
AVR32 UC CPU
• 32-bit load/store AVR32A RISC architecture.
–
–
–
–
–
15 general-purpose 32-bit registers.
32-bit Stack Pointer, Program Counter and Link Register reside in register file.
Fully orthogonal instruction set.
Privileged and unprivileged modes enabling efficient and secure Operating Systems.
Innovative instruction set together with variable instruction length ensuring industry leading
code density.
– DSP extention with saturating arithmetic, and a wide variety of multiply instructions.
• 3 stage pipeline allows one instruction per clock cycle for most instructions.
– Byte, half-word, word and double word memory access.
– Multiple interrupt priority levels.
• MPU allows for operating systems with memory protection.
4.1.2
Debug and Test system
• IEEE1149.1 compliant JTAG and boundary scan
• Direct memory access and programming capabilities through JTAG interface
• Extensive On-Chip Debug features in compliance with IEEE-ISTO 5001-2003 (Nexus 2.0) Class 2+
•
•
•
•
4.1.3
– Low-cost NanoTrace supported.
Auxiliary port for high-speed trace information
Hardware support for 6 Program and 2 data breakpoints
Unlimited number of software breakpoints supported
Advanced Program, Data, Ownership, and Watchpoint trace supported
Peripheral DMA Controller
• Transfers from/to peripheral to/from any memory space without intervention of the processor.
• Next Pointer Support, forbids strong real-time constraints on buffer management.
• Fifteen channels
–
–
–
–
–
4.1.4
Two for each USART
Two for each Serial Synchronous Controller
Two for each Serial Peripheral Interface
One for each ADC
Two for each TWI Interface
Bus system
• High Speed Bus (HSB) matrix with 6 Masters and 6 Slaves handled
– Handles Requests from the CPU Data Fetch, CPU Instruction Fetch, PDCA, USBB, Ethernet
Controller, CPU SAB, and to internal Flash, internal SRAM, Peripheral Bus A, Peripheral Bus
B, EBI.
– Round-Robin Arbitration (three modes supported: no default master, last accessed default
master, fixed default master)
– Burst Breaking with Slot Cycle Limit
– One Address Decoder Provided per Master
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32058KS–AVR32–01/12
AT32UC3A
• Peripheral Bus A able to run on at divided bus speeds compared to the High Speed Bus
Figure 4-1 gives an overview of the bus system. All modules connected to the same bus use the
same clock, but the clock to each module can be individually shut off by the Power Manager.
The figure identifies the number of master and slave interfaces of each module connected to the
High Speed Bus, and which DMA controller is connected to which peripheral.
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32058KS–AVR32–01/12
AT32UC3A
5. Signals Description
The following table gives details on the signal name classified by peripheral
The signals are multiplexed with GPIO pins as described in ”Peripheral Multiplexing on I/O lines”
on page 31.
Table 5-1.
Signal Description List
Signal Name
Function
Type
Active
Level
Comments
Power
VDDPLL
Power supply for PLL
Power
Input
1.65V to 1.95 V
VDDCORE
Core Power Supply
Power
Input
1.65V to 1.95 V
VDDIO
I/O Power Supply
Power
Input
3.0V to 3.6V
VDDANA
Analog Power Supply
Power
Input
3.0V to 3.6V
VDDIN
Voltage Regulator Input Supply
Power
Input
3.0V to 3.6V
VDDOUT
Voltage Regulator Output
Power
Output
1.65V to 1.95 V
GNDANA
Analog Ground
Ground
GND
Ground
Ground
Clocks, Oscillators, and PLL’s
XIN0, XIN1, XIN32
Crystal 0, 1, 32 Input
Analog
XOUT0, XOUT1,
XOUT32
Crystal 0, 1, 32 Output
Analog
JTAG
TCK
Test Clock
Input
TDI
Test Data In
Input
TDO
Test Data Out
TMS
Test Mode Select
Output
Input
Auxiliary Port - AUX
MCKO
Trace Data Output Clock
Output
MDO0 - MDO5
Trace Data Output
Output
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32058KS–AVR32–01/12
AT32UC3A
Table 5-1.
Signal Description List
Type
Active
Level
Signal Name
Function
MSEO0 - MSEO1
Trace Frame Control
Output
EVTI_N
Event In
Output
Low
EVTO_N
Event Out
Output
Low
Comments
Power Manager - PM
GCLK0 - GCLK3
Generic Clock Pins
RESET_N
Reset Pin
Output
Input
Low
Real Time Counter - RTC
RTC_CLOCK
RTC clock
Output
Watchdog Timer - WDT
WDTEXT
External Watchdog Pin
Output
External Interrupt Controller - EIC
EXTINT0 - EXTINT7
External Interrupt Pins
KPS0 - KPS7
Keypad Scan Pins
NMI_N
Non-Maskable Interrupt Pin
Input
Output
Input
Low
Ethernet MAC - MACB
COL
Collision Detect
Input
CRS
Carrier Sense and Data Valid
Input
MDC
Management Data Clock
MDIO
Management Data Input/Output
RXD0 - RXD3
Receive Data
Input
RX_CLK
Receive Clock
Input
RX_DV
Receive Data Valid
Input
RX_ER
Receive Coding Error
Input
SPEED
Speed
TXD0 - TXD3
Transmit Data
Output
TX_CLK
Transmit Clock or Reference Clock
Output
TX_EN
Transmit Enable
Output
TX_ER
Transmit Coding Error
Output
Output
I/O
9
32058KS–AVR32–01/12
AT32UC3A
Table 5-1.
Signal Description List
Signal Name
Function
Type
Active
Level
Comments
External Bus Interface - HEBI
ADDR0 - ADDR23
Address Bus
Output
CAS
Column Signal
Output
DATA0 - DATA15
Data Bus
NCS0 - NCS3
Chip Select
Output
Low
NRD
Read Signal
Output
Low
NWAIT
External Wait Signal
Input
Low
NWE0
Write Enable 0
Output
Low
NWE1
Write Enable 1
Output
Low
NWE3
Write Enable 3
Output
Low
RAS
Row Signal
Output
Low
SDA10
SDRAM Address 10 Line
Output
SDCK
SDRAM Clock
Output
SDCKE
SDRAM Clock Enable
Output
SDCS0
SDRAM Chip Select
Output
Low
SDWE
SDRAM Write Enable
Output
Low
Low
I/O
General Purpose Input/Output 2 - GPIOA, GPIOB, GPIOC
P0 - P31
Parallel I/O Controller GPIOA
I/O
P0 - P31
Parallel I/O Controller GPIOB
I/O
P0 - P5
Parallel I/O Controller GPIOC
I/O
P0 - P31
Parallel I/O Controller GPIOX
I/O
Serial Peripheral Interface - SPI0, SPI1
MISO
Master In Slave Out
I/O
MOSI
Master Out Slave In
I/O
NPCS0 - NPCS3
SPI Peripheral Chip Select
I/O
SCK
Clock
Low
Output
Synchronous Serial Controller - SSC
RX_CLOCK
SSC Receive Clock
I/O
10
32058KS–AVR32–01/12
AT32UC3A
Table 5-1.
Signal Description List
Signal Name
Function
Type
RX_DATA
SSC Receive Data
Input
RX_FRAME_SYNC
SSC Receive Frame Sync
I/O
TX_CLOCK
SSC Transmit Clock
I/O
TX_DATA
SSC Transmit Data
Output
TX_FRAME_SYNC
SSC Transmit Frame Sync
Active
Level
Comments
I/O
Timer/Counter - TIMER
A0
Channel 0 Line A
I/O
A1
Channel 1 Line A
I/O
A2
Channel 2 Line A
I/O
B0
Channel 0 Line B
I/O
B1
Channel 1 Line B
I/O
B2
Channel 2 Line B
I/O
CLK0
Channel 0 External Clock Input
Input
CLK1
Channel 1 External Clock Input
Input
CLK2
Channel 2 External Clock Input
Input
Two-wire Interface - TWI
SCL
Serial Clock
I/O
SDA
Serial Data
I/O
Universal Synchronous Asynchronous Receiver Transmitter - USART0, USART1, USART2, USART3
CLK
Clock
I/O
CTS
Clear To Send
DCD
Data Carrier Detect
Only USART1
DSR
Data Set Ready
Only USART1
DTR
Data Terminal Ready
Only USART1
RI
Ring Indicator
Only USART1
RTS
Request To Send
RXD
Receive Data
Input
TXD
Transmit Data
Output
Input
Output
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32058KS–AVR32–01/12
AT32UC3A
Table 5-1.
Signal Description List
Signal Name
Function
Type
Active
Level
Comments
Analog to Digital Converter - ADC
AD0 - AD7
Analog input pins
Analog
input
ADVREF
Analog positive reference voltage input
Analog
input
2.6 to 3.6V
Pulse Width Modulator - PWM
PWM0 - PWM6
PWM Output Pins
Output
Universal Serial Bus Device - USB
DDM
USB Device Port Data -
Analog
DDP
USB Device Port Data +
Analog
VBUS
USB VBUS Monitor and OTG Negociation
Analog
Input
USBID
ID Pin of the USB Bus
Input
USB_VBOF
USB VBUS On/off: bus power control port
output
Audio Bitstream DAC (ABDAC)
DATA0-DATA1
D/A Data out
Outpu
DATAN0-DATAN1
D/A Data inverted out
Outpu
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32058KS–AVR32–01/12
AT32UC3A
6. Package and Pinout
The device pins are multiplexed with peripheral functions as described in ”Peripheral Multiplexing on I/O lines” on page 31.
Figure 6-1.
TQFP100 Pinout
75
51
76
50
100
26
1
Table 6-1.
25
TQFP100 Package Pinout
1
PB20
26
PA05
51
PA21
76
PB08
2
PB21
27
PA06
52
PA22
77
PB09
3
PB22
28
PA07
53
PA23
78
PB10
4
VDDIO
29
PA08
54
PA24
79
VDDIO
5
GND
30
PA09
55
PA25
80
GND
6
PB23
31
PA10
56
PA26
81
PB11
7
PB24
32
N/C
57
PA27
82
PB12
8
PB25
33
PA11
58
PA28
83
PA29
9
PB26
34
VDDCORE
59
VDDANA
84
PA30
10
PB27
35
GND
60
ADVREF
85
PC02
11
VDDOUT
36
PA12
61
GNDANA
86
PC03
12
VDDIN
37
PA13
62
VDDPLL
87
PB13
13
GND
38
VDDCORE
63
PC00
88
PB14
14
PB28
39
PA14
64
PC01
89
TMS
15
PB29
40
PA15
65
PB00
90
TCK
16
PB30
41
PA16
66
PB01
91
TDO
17
PB31
42
PA17
67
VDDIO
92
TDI
18
RESET_N
43
PA18
68
VDDIO
93
PC04
19
PA00
44
PA19
69
GND
94
PC05
20
PA01
45
PA20
70
PB02
95
PB15
21
GND
46
VBUS
71
PB03
96
PB16
22
VDDCORE
47
VDDIO
72
PB04
97
VDDCORE
13
32058KS–AVR32–01/12
AT32UC3A
Table 6-1.
TQFP100 Package Pinout
23
PA02
48
DM
73
PB05
98
PB17
24
PA03
49
DP
74
PB06
99
PB18
25
PA04
50
GND
75
PB07
100
PB19
Figure 6-2.
LQFP144 Pinout
108
73
109
72
144
37
1
Table 6-2.
36
VQFP144 Package Pinout
1
PX00
37
GND
73
PA21
109
GND
2
PX01
38
PX10
74
PA22
110
PX30
3
PB20
39
PA05
75
PA23
111
PB08
4
PX02
40
PX11
76
PA24
112
PX31
5
PB21
41
PA06
77
PA25
113
PB09
6
PB22
42
PX12
78
PA26
114
PX32
7
VDDIO
43
PA07
79
PA27
115
PB10
8
GND
44
PX13
80
PA28
116
VDDIO
9
PB23
45
PA08
81
VDDANA
117
GND
10
PX03
46
PX14
82
ADVREF
118
PX33
11
PB24
47
PA09
83
GNDANA
119
PB11
12
PX04
48
PA10
84
VDDPLL
120
PX34
13
PB25
49
N/C
85
PC00
121
PB12
14
PB26
50
PA11
86
PC01
122
PA29
15
PB27
51
VDDCORE
87
PX20
123
PA30
16
VDDOUT
52
GND
88
PB00
124
PC02
17
VDDIN
53
PA12
89
PX21
125
PC03
18
GND
54
PA13
90
PB01
126
PB13
19
PB28
55
VDDCORE
91
PX22
127
PB14
20
PB29
56
PA14
92
VDDIO
128
TMS
21
PB30
57
PA15
93
VDDIO
129
TCK
14
32058KS–AVR32–01/12
AT32UC3A
Table 6-2.
VQFP144 Package Pinout
22
PB31
58
PA16
94
GND
130
TDO
23
RESET_N
59
PX15
95
PX23
131
TDI
24
PX05
60
PA17
96
PB02
132
PC04
25
PA00
61
PX16
97
PX24
133
PC05
26
PX06
62
PA18
98
PB03
134
PB15
27
PA01
63
PX17
99
PX25
135
PX35
28
GND
64
PA19
100
PB04
136
PB16
29
VDDCORE
65
PX18
101
PX26
137
PX36
30
PA02
66
PA20
102
PB05
138
VDDCORE
31
PX07
67
PX19
103
PX27
139
PB17
32
PA03
68
VBUS
104
PB06
140
PX37
33
PX08
69
VDDIO
105
PX28
141
PB18
34
PA04
70
DM
106
PB07
142
PX38
35
PX09
71
DP
107
PX29
143
PB19
36
VDDIO
72
GND
108
VDDIO
144
PX39
Figure 6-3.
BGA144 Pinout
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AT32UC3A
Table 6-3.
BGA144 Package Pinout A1..M8
1
2
3
4
5
6
7
8
A
VDDIO
PB07
PB05
PB02
PB03
PB01
PC00
PA28
B
PB08
GND
PB06
PB04
VDDIO
PB00
PC01
VDDPLL
C
PB09
PX33
PA29
PC02
PX28
PX26
PX22
PX21
D
PB11
PB13
PB12
PX30
PX29
PX25
PX24
PX20
E
PB10
VDDIO
PX32
PX31
VDDIO
PX27
PX23
VDDANA
F
PA30
PB14
PX34
PB16
TCK
GND
GND
PX16
G
TMS
PC03
PX36
PX35
PX37
GND
GND
PA16
H
TDO
VDDCORE
PX38
PX39
VDDIO
PA01
PA10
VDDCORE
J
TDI
PB17
PB15
PX00
PX01
PA00
PA03
PA04
K
PC05
PC04
PB19
PB20
PX02
PB29
PB30
PA02
L
PB21
GND
PB18
PB24
VDDOUT
PX04
PB31
VDDIN
M
PB22
PB23
PB25
PB26
PX03
PB27
PB28
RESET_N
Table 6-4.
BGA144 Package Pinout A9..M12
9
10
11
12
A
PA26
PA25
PA24
PA23
B
PA27
PA21
GND
PA22
C
ADVREF
GNDANA
PX19
PA19
D
PA18
PA20
DP
DM
E
PX18
PX17
VDDIO
VBUS
F
PA17
PX15
PA15
PA14
G
PA13
PA12
PA11
NC
H
PX11
PA08
VDDCORE
VDDCORE
J
PX14
PA07
PX13
PA09
K
PX08
GND
PA05
PX12
L
PX06
PX10
GND
PA06
M
PX05
PX07
PX09
VDDIO
Note:
NC is not connected.
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7. Power Considerations
7.1
Power Supplies
The AT32UC3A has several types of power supply pins:
•
•
•
•
•
VDDIO: Powers I/O lines. Voltage is 3.3V nominal.
VDDANA: Powers the ADC Voltage is 3.3V nominal.
VDDIN: Input voltage for the voltage regulator. Voltage is 3.3V nominal.
VDDCORE: Powers the core, memories, and peripherals. Voltage is 1.8V nominal.
VDDPLL: Powers the PLL. Voltage is 1.8V nominal.
The ground pins GND are common to VDDCORE, VDDIO, VDDPLL. The ground pin for
VDDANA is GNDANA.
Refer to ”Power Consumption” on page 44 for power consumption on the various supply pins.
Dual Power Supply
Single Power Supply
3.3V
3.3V
VDDANA
VDDANA
VDDIO
VDDIO
ADVREF
ADVREF
VDDIN
VDDIN
1.8V
1.8V
Regulator
Regulator
VDDOUT
VDDOUT
VDDCORE
VDDPLL
1.8V
VDDCORE
VDDPLL
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AT32UC3A
7.2
7.2.1
Voltage Regulator
Single Power Supply
The AT32UC3A embeds a voltage regulator that converts from 3.3V to 1.8V. The regulator takes
its input voltage from VDDIN, and supplies the output voltage on VDDOUT. VDDOUT should be
externally connected to the 1.8V domains.
Adequate input supply decoupling is mandatory for VDDIN in order to improve startup stability
and reduce source voltage drop. Two input decoupling capacitors must be placed close to the
chip.
Adequate output supply decoupling is mandatory for VDDOUT to reduce ripple and avoid oscillations. The best way to achieve this is to use two capacitors in parallel between VDDOUT and
GND as close to the chip as possible
3.3V
VDDIN
CIN2
CIN1
1.8V
1.8V
Regulator
VDDOUT
COUT2
COUT1
Refer to Section 12.3 on page 42 for decoupling capacitors values and regulator characteristics
7.2.2
Dual Power Supply
In case of dual power supply, VDDIN and VDDOUT should be connected to ground to prevent
from leakage current.
VDDIN
VDDOUT
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7.3
Analog-to-Digital Converter (A.D.C) reference.
The ADC reference (ADVREF) must be provided from an external source. Two decoupling
capacitors must be used to insure proper decoupling.
3.3V
ADVREF
C
VREF2
C
VREF1
Refer to Section 12.4 on page 42 for decoupling capacitors values and electrical characteristics.
In case ADC is not used, the ADVREF pin should be connected to GND to avoid extra
consumption.
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8. I/O Line Considerations
8.1
JTAG pins
TMS, TDI and TCK have pull-up resistors. TDO is an output, driven at up to VDDIO, and has no
pull-up resistor.
8.2
RESET_N pin
The RESET_N pin is a schmitt input and integrates a permanent pull-up resistor to VDDIO. As
the product integrates a power-on reset cell, the RESET_N pin can be left unconnected in case
no reset from the system needs to be applied to the product.
8.3
TWI pins
When these pins are used for TWI, the pins are open-drain outputs with slew-rate limitation and
inputs with inputs with spike-filtering. When used as GPIO-pins or used for other peripherals, the
pins have the same characteristics as PIO pins.
8.4
GPIO pins
All the I/O lines integrate a programmable pull-up resistor. Programming of this pull-up resistor is
performed independently for each I/O line through the GPIO Controllers. After reset, I/O lines
default as inputs with pull-up resistors disabled, except when indicated otherwise in the column
“Reset State” of the GPIO Controller multiplexing tables.
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9. Memories
9.1
Embedded Memories
• Internal High-Speed Flash
– 512 KBytes (AT32UC3A0512, AT32UC3A1512)
– 256 KBytes (AT32UC3A0256, AT32UC3A1256)
– 128 KBytes (AT32UC3A1128, AT32UC3A2128)
- 0 Wait State Access at up to 33 MHz in Worst Case Conditions
- 1 Wait State Access at up to 66 MHz in Worst Case Conditions
- Pipelined Flash Architecture, allowing burst reads from sequential Flash locations, hiding
penalty of 1 wait state access
- Pipelined Flash Architecture typically reduces the cycle penalty of 1 wait state operation
to only 15% compared to 0 wait state operation
- 100 000 Write Cycles, 15-year Data Retention Capability
- 4 ms Page Programming Time, 8 ms Chip Erase Time
- Sector Lock Capabilities, Bootloader Protection, Security Bit
- 32 Fuses, Erased During Chip Erase
- User Page For Data To Be Preserved During Chip Erase
• Internal High-Speed SRAM, Single-cycle access at full speed
– 64 KBytes (AT32UC3A0512, AT32UC3A0256, AT32UC3A1512, AT32UC3A1256)
– 32KBytes (AT32UC3A1128)
9.2
Physical Memory Map
The system bus is implemented as a bus matrix. All system bus addresses are fixed, and they
are never remapped in any way, not even in boot. Note that AVR32 UC CPU uses unsegmented
translation, as described in the AVR32 Architecture Manual. The 32-bit physical address space
is mapped as follows:
Table 9-1.
AT32UC3A Physical Memory Map
Device
Start Address
Size
AT32UC3A0512
AT32UC3A1512
AT32UC3A0256
AT32UC3A1256
AT32UC3A0128
AT32UC3A1128
Embedded SRAM
0x0000_0000
64 Kbyte
64 Kbyte
64 Kbyte
64 Kbyte
32 Kbyte
32 Kbyte
Embedded Flash
0x8000_0000
512 Kbyte
512 Kbyte
256 Kbyte
256 Kbyte
128 Kbyte
128 Kbyte
EBI SRAM CS0
0xC000_0000
16 Mbyte
-
16 Mbyte
-
16 Mbyte
-
EBI SRAM CS2
0xC800_0000
16 Mbyte
-
16 Mbyte
-
16 Mbyte
-
EBI SRAM CS3
0xCC00_0000
16 Mbyte
-
16 Mbyte
-
16 Mbyte
-
EBI SRAM CS1
/SDRAM CS0
0xD000_0000
128 Mbyte
-
128 Mbyte
-
128 Mbyte
-
USB
Configuration
0xE000_0000
64 Kbyte
64 Kbyte
64 Kbyte
64 Kbyte
64 Kbyte
64 Kbyte
HSB-PB Bridge A
0xFFFE_0000
64 Kbyte
64 Kbyte
64 Kbyte
64 Kbyte
64 Kbyte
64 Kbyte
HSB-PB Bridge B
0xFFFF_0000
64 Kbyte
64 Kbyte
64 kByte
64 kByte
64 Kbyte
64 Kbyte
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AT32UC3A
Table 9-2.
9.3
Flash Memory Parameters
Part Number
Flash Size
(FLASH_PW)
Number of pages
(FLASH_P)
Page size
(FLASH_W)
General Purpose
Fuse bits
(FLASH_F)
AT32UC3A0512
512 Kbytes
1024
128 words
32 fuses
AT32UC3A1512
512 Kbytes
1024
128 words
32 fuses
AT32UC3A0256
256 Kbytes
512
128 words
32 fuses
AT32UC3A1256
256 Kbytes
512
128 words
32 fuses
AT32UC3A1128
128 Kbytes
256
128 words
32 fuses
AT32UC3A0128
128 Kbytes
256
128 words
32 fuses
Bus Matrix Connections
Accesses to unused areas returns an error result to the master requesting such an access.
The bus matrix has the several masters and slaves. Each master has its own bus and its own
decoder, thus allowing a different memory mapping per master. The master number in the table
below can be used to index the HMATRIX control registers. For example, MCFG0 is associated
with the CPU Data master interface.
Table 9-3.
High Speed Bus masters
Master 0
CPU Data
Master 1
CPU Instruction
Master 2
CPU SAB
Master 3
PDCA
Master 4
MACB DMA
Master 5
USBB DMA
Each slave has its own arbiter, thus allowing a different arbitration per slave. The slave number
in the table below can be used to index the HMATRIX control registers. For example, SCFG3 is
associated with the Internal SRAM Slave Interface.
Table 9-4.
High Speed Bus slaves
Slave 0
Internal Flash
Slave 1
HSB-PB Bridge 0
Slave 2
HSB-PB Bridge 1
Slave 3
Internal SRAM
Slave 4
USBB DPRAM
Slave 5
EBI
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AT32UC3A
Figure 9-1.
HMatrix Master / Slave Connections
HMATRIX MASTERS
CPU Data
0
CPU
Instruction
1
CPU SAB
2
PDCA
3
MACB
4
USBB DMA
5
Internal Flash
HSB-PB
Bridge 0
HSB-PB
Bridge 1
Internal SRAM
Slave
USBB Slave
EBI
HMATRIX SLAVES
0
1
2
3
4
5
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AT32UC3A
10. Peripherals
10.1
Peripheral address map
Table 10-1.
Peripheral Address Mapping
Address
0xE0000000
0xFFFE0000
0xFFFE1000
0xFFFE1400
0xFFFE1800
0xFFFE1C00
0xFFFE2000
0xFFFF0000
0xFFFF0800
0xFFFF0C00
0xFFFF0D00
0xFFFF0D30
0xFFFF0D80
0xFFFF1000
0xFFFF1400
0xFFFF1800
Peripheral Name
Bus
USBB
USBB Slave Interface - USBB
HSB
USBB
USBB Configuration Interface - USBB
PBB
HMATRIX
HMATRIX Configuration Interface - HMATRIX
PBB
FLASHC
Flash Controller - FLASHC
PBB
MACB Configuration Interface - MACB
PBB
Static Memory Controller Configuration Interface SMC
PBB
SDRAM Controller Configuration Interface SDRAMC
PBB
PDCA
Peripheral DMA Interface - PDCA
PBA
INTC
Interrupt Controller Interface - INTC
PBA
PM
Power Manager - PM
PBA
RTC
Real Time Clock - RTC
PBA
WDT
WatchDog Timer - WDT
PBA
External Interrupt Controller - EIC
PBA
General Purpose IO Controller - GPIO
PBA
USART0
Universal Synchronous Asynchronous Receiver
Transmitter - USART0
PBA
USART1
Universal Synchronous Asynchronous Receiver
Transmitter - USART1
PBA
MACB
SMC
SDRAMC
EIC
GPIO
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AT32UC3A
Table 10-1.
Peripheral Address Mapping (Continued)
Address
0xFFFF1C00
0xFFFF2000
0xFFFF2400
0xFFFF2800
0xFFFF2C00
0xFFFF3000
0xFFFF3400
0xFFFF3800
0xFFFF3C00
10.2
Peripheral Name
Bus
USART2
Universal Synchronous Asynchronous Receiver
Transmitter - USART2
PBA
USART3
Universal Synchronous Asynchronous Receiver
Transmitter - USART3
PBA
SPI0
Serial Peripheral Interface - SPI0
PBA
SPI1
Serial Peripheral Interface - SPI1
PBA
TWI
Two Wire Interface - TWI
PBA
PWM
Pulse Width Modulation Controller - PWM
PBA
SSC
Synchronous Serial Controller - SSC
PBA
Timer/Counter - TC
PBA
Analog To Digital Converter - ADC
PBA
TC
ADC
CPU Local Bus Mapping
Some of the registers in the GPIO module are mapped onto the CPU local bus, in addition to
being mapped on the Peripheral Bus. These registers can therefore be reached both by
accesses on the Peripheral Bus, and by accesses on the local bus.
Mapping these registers on the local bus allows cycle-deterministic toggling of GPIO pins since
the CPU and GPIO are the only modules connected to this bus. Also, since the local bus runs at
CPU speed, one write or read operation can be performed per clock cycle to the local busmapped GPIO registers.
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AT32UC3A
The following GPIO registers are mapped on the local bus:
Table 10-2.
Local bus mapped GPIO registers
Port
Register
Mode
Local Bus
Address
Access
0
Output Driver Enable Register (ODER)
WRITE
0x4000_0040
Write-only
SET
0x4000_0044
Write-only
CLEAR
0x4000_0048
Write-only
TOGGLE
0x4000_004C
Write-only
WRITE
0x4000_0050
Write-only
SET
0x4000_0054
Write-only
CLEAR
0x4000_0058
Write-only
TOGGLE
0x4000_005C
Write-only
Pin Value Register (PVR)
-
0x4000_0060
Read-only
Output Driver Enable Register (ODER)
WRITE
0x4000_0140
Write-only
SET
0x4000_0144
Write-only
CLEAR
0x4000_0148
Write-only
TOGGLE
0x4000_014C
Write-only
WRITE
0x4000_0150
Write-only
SET
0x4000_0154
Write-only
CLEAR
0x4000_0158
Write-only
TOGGLE
0x4000_015C
Write-only
Pin Value Register (PVR)
-
0x4000_0160
Read-only
Output Driver Enable Register (ODER)
WRITE
0x4000_0240
Write-only
SET
0x4000_0244
Write-only
CLEAR
0x4000_0248
Write-only
TOGGLE
0x4000_024C
Write-only
WRITE
0x4000_0250
Write-only
SET
0x4000_0254
Write-only
CLEAR
0x4000_0258
Write-only
TOGGLE
0x4000_025C
Write-only
-
0x4000_0260
Read-only
Output Value Register (OVR)
1
Output Value Register (OVR)
2
Output Value Register (OVR)
Pin Value Register (PVR)
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AT32UC3A
Table 10-2.
Local bus mapped GPIO registers
Port
Register
Mode
Local Bus
Address
Access
3
Output Driver Enable Register (ODER)
WRITE
0x4000_0340
Write-only
SET
0x4000_0344
Write-only
CLEAR
0x4000_0348
Write-only
TOGGLE
0x4000_034C
Write-only
WRITE
0x4000_0350
Write-only
SET
0x4000_0354
Write-only
CLEAR
0x4000_0358
Write-only
TOGGLE
0x4000_035C
Write-only
-
0x4000_0360
Read-only
Output Value Register (OVR)
Pin Value Register (PVR)
10.3
Interrupt Request Signal Map
The various modules may output Interrupt request signals. These signals are routed to the Interrupt Controller (INTC), described in a later chapter. The Interrupt Controller supports up to 64
groups of interrupt requests. Each group can have up to 32 interrupt request signals. All interrupt
signals in the same group share the same autovector address and priority level. Refer to the
documentation for the individual submodules for a description of the semantics of the different
interrupt requests.
The interrupt request signals are connected to the INTC as follows.
Table 10-3.
Interrupt Request Signal Map
Group
Line
0
0
AVR32 UC CPU with optional MPU and
optional OCD
0
External Interrupt Controller
EIC 0
1
External Interrupt Controller
EIC 1
2
External Interrupt Controller
EIC 2
3
External Interrupt Controller
EIC 3
4
External Interrupt Controller
EIC 4
5
External Interrupt Controller
EIC 5
6
External Interrupt Controller
EIC 6
7
External Interrupt Controller
EIC 7
8
Real Time Counter
RTC
9
Power Manager
PM
10
Frequency Meter
FREQM
1
Module
Signal
SYSBLOCK
COMPARE
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AT32UC3A
Table 10-3.
Interrupt Request Signal Map
0
General Purpose Input/Output
GPIO 0
1
General Purpose Input/Output
GPIO 1
2
General Purpose Input/Output
GPIO 2
3
General Purpose Input/Output
GPIO 3
4
General Purpose Input/Output
GPIO 4
5
General Purpose Input/Output
GPIO 5
6
General Purpose Input/Output
GPIO 6
7
General Purpose Input/Output
GPIO 7
8
General Purpose Input/Output
GPIO 8
9
General Purpose Input/Output
GPIO 9
10
General Purpose Input/Output
GPIO 10
11
General Purpose Input/Output
GPIO 11
12
General Purpose Input/Output
GPIO 12
13
General Purpose Input/Output
GPIO 13
0
Peripheral DMA Controller
PDCA 0
1
Peripheral DMA Controller
PDCA 1
2
Peripheral DMA Controller
PDCA 2
3
Peripheral DMA Controller
PDCA 3
4
Peripheral DMA Controller
PDCA 4
5
Peripheral DMA Controller
PDCA 5
6
Peripheral DMA Controller
PDCA 6
7
Peripheral DMA Controller
PDCA 7
8
Peripheral DMA Controller
PDCA 8
9
Peripheral DMA Controller
PDCA 9
10
Peripheral DMA Controller
PDCA 10
11
Peripheral DMA Controller
PDCA 11
12
Peripheral DMA Controller
PDCA 12
13
Peripheral DMA Controller
PDCA 13
14
Peripheral DMA Controller
PDCA 14
4
0
Flash Controller
FLASHC
5
0
Universal Synchronous/Asynchronous
Receiver/Transmitter
USART0
6
0
Universal Synchronous/Asynchronous
Receiver/Transmitter
USART1
7
0
Universal Synchronous/Asynchronous
Receiver/Transmitter
USART2
8
0
Universal Synchronous/Asynchronous
Receiver/Transmitter
USART3
2
3
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AT32UC3A
Table 10-3.
Interrupt Request Signal Map
9
0
Serial Peripheral Interface
SPI0
10
0
Serial Peripheral Interface
SPI1
11
0
Two-wire Interface
TWI
12
0
Pulse Width Modulation Controller
PWM
13
0
Synchronous Serial Controller
SSC
0
Timer/Counter
TC0
1
Timer/Counter
TC1
2
Timer/Counter
TC2
15
0
Analog to Digital Converter
ADC
16
0
Ethernet MAC
MACB
17
0
USB 2.0 OTG Interface
USBB
18
0
SDRAM Controller
19
0
Audio Bitstream DAC
14
10.4
10.4.1
SDRAMC
DAC
Clock Connections
Timer/Counters
Each Timer/Counter channel can independently select an internal or external clock source for its
counter:
Table 10-4.
Timer/Counter clock connections
Source
Name
Connection
Internal
TIMER_CLOCK1
32 KHz Oscillator
TIMER_CLOCK2
PBA clock / 2
TIMER_CLOCK3
PBA clock / 8
TIMER_CLOCK4
PBA clock / 32
TIMER_CLOCK5
PBA clock / 128
XC0
See Section 10.7
External
XC1
XC2
10.4.2
USARTs
Each USART can be connected to an internally divided clock:
Table 10-5.
USART clock connections
USART
Source
Name
Connection
0
Internal
CLK_DIV
PBA clock / 8
1
2
3
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AT32UC3A
10.4.3
SPIs
Each SPI can be connected to an internally divided clock:
Table 10-6.
SPI clock connections
SPI
Source
Name
Connection
0
Internal
CLK_DIV
PBA clock or
PBA clock / 32
1
10.5
Nexus OCD AUX port connections
If the OCD trace system is enabled, the trace system will take control over a number of pins, irrespectively of the PIO configuration. Two different OCD trace pin mappings are possible,
depending on the configuration of the OCD AXS register. For details, see the AVR32 UC Technical Reference Manual.
Table 10-7.
10.6
Nexus OCD AUX port connections
Pin
AXS=0
AXS=1
EVTI_N
PB19
PA08
MDO[5]
PB16
PA27
MDO[4]
PB14
PA26
MDO[3]
PB13
PA25
MDO[2]
PB12
PA24
MDO[1]
PB11
PA23
MDO[0]
PB10
PA22
EVTO_N
PB20
PB20
MCKO
PB21
PA21
MSEO[1]
PB04
PA07
MSEO[0]
PB17
PA28
PDC handshake signals
The PDC and the peripheral modules communicate through a set of handshake signals. The following table defines the valid settings for the Peripheral Identifier (PID) in the PDC Peripheral
Select Register (PSR).
Table 10-8.
PDC Handshake Signals
PID Value
Peripheral module & direction
0
ADC
1
SSC - RX
2
USART0 - RX
3
USART1 - RX
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Table 10-8.
10.7
PDC Handshake Signals
PID Value
Peripheral module & direction
4
USART2 - RX
5
USART3 - RX
6
TWI - RX
7
SPI0 - RX
8
SPI1 - RX
9
SSC - TX
10
USART0 - TX
11
USART1 - TX
12
USART2 - TX
13
USART3 - TX
14
TWI - TX
15
SPI0 - TX
16
SPI1 - TX
17
ABDAC
Peripheral Multiplexing on I/O lines
Each GPIO line can be assigned to one of 3 peripheral functions; A, B or C. The following table
define how the I/O lines on the peripherals A, B and C are multiplexed by the GPIO.
Table 10-9.
GPIO Controller Function Multiplexing
TQFP100
VQFP144
PIN
GPIO Pin
Function A
Function B
Function C
19
25
PA00
GPIO 0
USART0 - RXD
TC - CLK0
20
27
PA01
GPIO 1
USART0 - TXD
TC - CLK1
23
30
PA02
GPIO 2
USART0 - CLK
TC - CLK2
24
32
PA03
GPIO 3
USART0 - RTS
EIM - EXTINT[4]
DAC - DATA[0]
25
34
PA04
GPIO 4
USART0 - CTS
EIM - EXTINT[5]
DAC - DATAN[0]
26
39
PA05
GPIO 5
USART1 - RXD
PWM - PWM[4]
27
41
PA06
GPIO 6
USART1 - TXD
PWM - PWM[5]
28
43
PA07
GPIO 7
USART1 - CLK
PM - GCLK[0]
SPI0 - NPCS[3]
29
45
PA08
GPIO 8
USART1 - RTS
SPI0 - NPCS[1]
EIM - EXTINT[7]
30
47
PA09
GPIO 9
USART1 - CTS
SPI0 - NPCS[2]
MACB - WOL
31
48
PA10
GPIO 10
SPI0 - NPCS[0]
EIM - EXTINT[6]
33
50
PA11
GPIO 11
SPI0 - MISO
USB - USB_ID
36
53
PA12
GPIO 12
SPI0 - MOSI
USB - USB_VBOF
37
54
PA13
GPIO 13
SPI0 - SCK
39
56
PA14
GPIO 14
SSC TX_FRAME_SYNC
SPI1 - NPCS[0]
EBI - NCS[0]
40
57
PA15
GPIO 15
SSC - TX_CLOCK
SPI1 - SCK
EBI - ADDR[20]
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Table 10-9.
GPIO Controller Function Multiplexing
41
58
PA16
GPIO 16
SSC - TX_DATA
SPI1 - MOSI
EBI - ADDR[21]
42
60
PA17
GPIO 17
SSC - RX_DATA
SPI1 - MISO
EBI - ADDR[22]
43
62
PA18
GPIO 18
SSC - RX_CLOCK
SPI1 - NPCS[1]
MACB - WOL
44
64
PA19
GPIO 19
SSC RX_FRAME_SYNC
SPI1 - NPCS[2]
45
66
PA20
GPIO 20
EIM - EXTINT[8]
SPI1 - NPCS[3]
51
73
PA21
GPIO 21
ADC - AD[0]
EIM - EXTINT[0]
USB - USB_ID
52
74
PA22
GPIO 22
ADC - AD[1]
EIM - EXTINT[1]
USB - USB_VBOF
53
75
PA23
GPIO 23
ADC - AD[2]
EIM - EXTINT[2]
DAC - DATA[1]
54
76
PA24
GPIO 24
ADC - AD[3]
EIM - EXTINT[3]
DAC - DATAN[1]
55
77
PA25
GPIO 25
ADC - AD[4]
EIM - SCAN[0]
EBI - NCS[0]
56
78
PA26
GPIO 26
ADC - AD[5]
EIM - SCAN[1]
EBI - ADDR[20]
57
79
PA27
GPIO 27
ADC - AD[6]
EIM - SCAN[2]
EBI - ADDR[21]
58
80
PA28
GPIO 28
ADC - AD[7]
EIM - SCAN[3]
EBI - ADDR[22]
83
122
PA29
GPIO 29
TWI - SDA
USART2 - RTS
84
123
PA30
GPIO 30
TWI - SCL
USART2 - CTS
65
88
PB00
GPIO 32
MACB - TX_CLK
USART2 - RTS
USART3 - RTS
66
90
PB01
GPIO 33
MACB - TX_EN
USART2 - CTS
USART3 - CTS
70
96
PB02
GPIO 34
MACB - TXD[0]
DAC - DATA[0]
71
98
PB03
GPIO 35
MACB - TXD[1]
DAC - DATAN[0]
72
100
PB04
GPIO 36
MACB - CRS
USART3 - CLK
73
102
PB05
GPIO 37
MACB - RXD[0]
DAC - DATA[1]
74
104
PB06
GPIO 38
MACB - RXD[1]
DAC - DATAN[1]
75
106
PB07
GPIO 39
MACB - RX_ER
76
111
PB08
GPIO 40
MACB - MDC
77
113
PB09
GPIO 41
MACB - MDIO
78
115
PB10
GPIO 42
MACB - TXD[2]
USART3 - RXD
EBI - SDCK
81
119
PB11
GPIO 43
MACB - TXD[3]
USART3 - TXD
EBI - SDCKE
82
121
PB12
GPIO 44
MACB - TX_ER
TC - CLK0
EBI - RAS
87
126
PB13
GPIO 45
MACB - RXD[2]
TC - CLK1
EBI - CAS
88
127
PB14
GPIO 46
MACB - RXD[3]
TC - CLK2
EBI - SDWE
95
134
PB15
GPIO 47
MACB - RX_DV
96
136
PB16
GPIO 48
MACB - COL
USB - USB_ID
EBI - SDA10
98
139
PB17
GPIO 49
MACB - RX_CLK
USB - USB_VBOF
EBI - ADDR[23]
99
141
PB18
GPIO 50
MACB - SPEED
ADC - TRIGGER
PWM - PWM[6]
100
143
PB19
GPIO 51
PWM - PWM[0]
PM - GCLK[0]
EIM - SCAN[4]
1
3
PB20
GPIO 52
PWM - PWM[1]
PM - GCLK[1]
EIM - SCAN[5]
2
5
PB21
GPIO 53
PWM - PWM[2]
PM - GCLK[2]
EIM - SCAN[6]
3
6
PB22
GPIO 54
PWM - PWM[3]
PM - GCLK[3]
EIM - SCAN[7]
6
9
PB23
GPIO 55
TC - A0
USART1 - DCD
EBI - NCS[3]
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32058KS–AVR32–01/12
AT32UC3A
Table 10-9.
GPIO Controller Function Multiplexing
7
11
PB24
GPIO 56
TC - B0
USART1 - DSR
8
13
PB25
GPIO 57
TC - A1
USART1 - DTR
9
14
PB26
GPIO 58
TC - B1
USART1 - RI
10
15
PB27
GPIO 59
TC - A2
PWM - PWM[4]
14
19
PB28
GPIO 60
TC - B2
PWM - PWM[5]
15
20
PB29
GPIO 61
USART2 - RXD
PM - GCLK[1]
EBI - NCS[2]
16
21
PB30
GPIO 62
USART2 - TXD
PM - GCLK[2]
EBI - SDCS
17
22
PB31
GPIO 63
USART2 - CLK
PM - GCLK[3]
EBI - NWAIT
63
85
PC00
GPIO 64
64
86
PC01
GPIO 65
85
124
PC02
GPIO 66
86
125
PC03
GPIO 67
93
132
PC04
GPIO 68
94
133
PC05
GPIO 69
1
PX00
GPIO 100
EBI - DATA[10]
USART0 - RXD
2
PX01
GPIO 99
EBI - DATA[9]
USART0 - TXD
4
PX02
GPIO 98
EBI - DATA[8]
USART0 - CTS
10
PX03
GPIO 97
EBI - DATA[7]
USART0 - RTS
12
PX04
GPIO 96
EBI - DATA[6]
USART1 - RXD
24
PX05
GPIO 95
EBI - DATA[5]
USART1 - TXD
26
PX06
GPIO 94
EBI - DATA[4]
USART1 - CTS
31
PX07
GPIO 93
EBI - DATA[3]
USART1 - RTS
33
PX08
GPIO 92
EBI - DATA[2]
USART3 - RXD
35
PX09
GPIO 91
EBI - DATA[1]
USART3 - TXD
38
PX10
GPIO 90
EBI - DATA[0]
USART2 - RXD
40
PX11
GPIO 109
EBI - NWE1
USART2 - TXD
42
PX12
GPIO 108
EBI - NWE0
USART2 - CTS
44
PX13
GPIO 107
EBI - NRD
USART2 - RTS
46
PX14
GPIO 106
EBI - NCS[1]
59
PX15
GPIO 89
EBI - ADDR[19]
USART3 - RTS
TC - B0
61
PX16
GPIO 88
EBI - ADDR[18]
USART3 - CTS
TC - A1
63
PX17
GPIO 87
EBI - ADDR[17]
TC - B1
65
PX18
GPIO 86
EBI - ADDR[16]
TC - A2
67
PX19
GPIO 85
EBI - ADDR[15]
EIM - SCAN[0]
TC - B2
87
PX20
GPIO 84
EBI - ADDR[14]
EIM - SCAN[1]
TC - CLK0
89
PX21
GPIO 83
EBI - ADDR[13]
EIM - SCAN[2]
TC - CLK1
91
PX22
GPIO 82
EBI - ADDR[12]
EIM - SCAN[3]
TC - CLK2
95
PX23
GPIO 81
EBI - ADDR[11]
EIM - SCAN[4]
97
PX24
GPIO 80
EBI - ADDR[10]
EIM - SCAN[5]
TC - A0
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32058KS–AVR32–01/12
AT32UC3A
Table 10-9.
10.8
GPIO Controller Function Multiplexing
99
PX25
GPIO 79
EBI - ADDR[9]
EIM - SCAN[6]
101
PX26
GPIO 78
EBI - ADDR[8]
EIM - SCAN[7]
103
PX27
GPIO 77
EBI - ADDR[7]
SPI0 - MISO
105
PX28
GPIO 76
EBI - ADDR[6]
SPI0 - MOSI
107
PX29
GPIO 75
EBI - ADDR[5]
SPI0 - SCK
110
PX30
GPIO 74
EBI - ADDR[4]
SPI0 - NPCS[0]
112
PX31
GPIO 73
EBI - ADDR[3]
SPI0 - NPCS[1]
114
PX32
GPIO 72
EBI - ADDR[2]
SPI0 - NPCS[2]
118
PX33
GPIO 71
EBI - ADDR[1]
SPI0 - NPCS[3]
120
PX34
GPIO 70
EBI - ADDR[0]
SPI1 - MISO
135
PX35
GPIO 105
EBI - DATA[15]
SPI1 - MOSI
137
PX36
GPIO 104
EBI - DATA[14]
SPI1 - SCK
140
PX37
GPIO 103
EBI - DATA[13]
SPI1 - NPCS[0]
142
PX38
GPIO 102
EBI - DATA[12]
SPI1 - NPCS[1]
144
PX39
GPIO 101
EBI - DATA[11]
SPI1 - NPCS[2]
Oscillator Pinout
The oscillators are not mapped to the normal A,B or C functions and their muxings are controlled
by registers in the Power Manager (PM). Please refer to the power manager chapter for more
information about this.
Table 10-10. Oscillator pinout
10.9
TQFP100 pin
VQFP144 pin
Pad
Oscillator pin
85
124
PC02
xin0
93
132
PC04
xin1
63
85
PC00
xin32
86
125
PC03
xout0
94
133
PC05
xout1
64
86
PC01
xout32
USART Configuration
Table 10-11. USART Supported Mode
SPI
RS485
ISO7816
IrDA
Modem
Manchester
Encoding
USART0
Yes
No
No
No
No
No
USART1
Yes
Yes
Yes
Yes
Yes
Yes
USART2
Yes
No
No
No
No
No
USART3
Yes
No
No
No
No
No
34
32058KS–AVR32–01/12
AT32UC3A
10.10 GPIO
The GPIO open drain feature (GPIO ODMER register (Open Drain Mode Enable Register)) is
not available for this device.
10.11 Peripheral overview
10.11.1
External Bus Interface
• Optimized for Application Memory Space support
• Integrates Two External Memory Controllers:
– Static Memory Controller
– SDRAM Controller
• Optimized External Bus:
– 16-bit Data Bus
– 24-bit Address Bus, Up to 16-Mbytes Addressable
– Optimized pin multiplexing to reduce latencies on External Memories
• 4 SRAM Chip Selects, 1SDRAM Chip Select:
– Static Memory Controller on NCS0
– SDRAM Controller or Static Memory Controller on NCS1
– Static Memory Controller on NCS2
– Static Memory Controller on NCS3
10.11.2
Static Memory Controller
10.11.3
• 4 Chip Selects Available
• 64-Mbyte Address Space per Chip Select
• 8-, 16-bit Data Bus
• Word, Halfword, Byte Transfers
• Byte Write or Byte Select Lines
• Programmable Setup, Pulse And Hold Time for Read Signals per Chip Select
• Programmable Setup, Pulse And Hold Time for Write Signals per Chip Select
• Programmable Data Float Time per Chip Select
• Compliant with LCD Module
• External Wait Request
• Automatic Switch to Slow Clock Mode
• Asynchronous Read in Page Mode Supported: Page Size Ranges from 4 to 32 Bytes
SDRAM Controller
• Numerous Configurations Supported
– 2K, 4K, 8K Row Address Memory Parts
– SDRAM with Two or Four Internal Banks
– SDRAM with 16-bit Data Path
• Programming Facilities
– Word, Half-word, Byte Access
– Automatic Page Break When Memory Boundary Has Been Reached
– Multibank Ping-pong Access
– Timing Parameters Specified by Software
– Automatic Refresh Operation, Refresh Rate is Programmable
• Energy-saving Capabilities
– Self-refresh, Power-down and Deep Power Modes Supported
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32058KS–AVR32–01/12
AT32UC3A
– Supports Mobile SDRAM Devices
• Error Detection
– Refresh Error Interrupt
• SDRAM Power-up Initialization by Software
• CAS Latency of 1, 2, 3 Supported
• Auto Precharge Command Not Used
10.11.4
USB Controller
10.11.5
• USB 2.0 Compliant, Full-/Low-Speed (FS/LS) and On-The-Go (OTG), 12 Mbit/s
• 7 Pipes/Endpoints
• 960 bytes of Embedded Dual-Port RAM (DPRAM) for Pipes/Endpoints
• Up to 2 Memory Banks per Pipe/Endpoint (Not for Control Pipe/Endpoint)
• Flexible Pipe/Endpoint Configuration and Management with Dedicated DMA Channels
• On-Chip Transceivers Including Pull-Ups
Serial Peripheral Interface
• Supports communication with serial external devices
– Four chip selects with external decoder support allow communication with up to 15
peripherals
– Serial memories, such as DataFlash and 3-wire EEPROMs
– Serial peripherals, such as ADCs, DACs, LCD Controllers, CAN Controllers and Sensors
– External co-processors
• Master or slave serial peripheral bus interface
– 8- to 16-bit programmable data length per chip select
– Programmable phase and polarity per chip select
– Programmable transfer delays between consecutive transfers and between clock and data
per chip select
– Programmable delay between consecutive transfers
– Selectable mode fault detection
• Very fast transfers supported
– Transfers with baud rates up to Peripheral Bus A (PBA) max frequency
– The chip select line may be left active to speed up transfers on the same device
10.11.6
Two-wire Interface
•
•
•
•
10.11.7
High speed up to 400kbit/s
Compatibility with standard two-wire serial memory
One, two or three bytes for slave address
Sequential read/write operations
USART
• Programmable Baud Rate Generator
• 5- to 9-bit full-duplex synchronous or asynchronous serial communications
–
–
–
–
–
–
–
–
–
1, 1.5 or 2 stop bits in Asynchronous Mode or 1 or 2 stop bits in Synchronous Mode
Parity generation and error detection
Framing error detection, overrun error detection
MSB- or LSB-first
Optional break generation and detection
By 8 or by-16 over-sampling receiver frequency
Hardware handshaking RTS-CTS
Receiver time-out and transmitter timeguard
Optional Multi-drop Mode with address generation and detection
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32058KS–AVR32–01/12
AT32UC3A
– Optional Manchester Encoding
• RS485 with driver control signal
• ISO7816, T = 0 or T = 1 Protocols for interfacing with smart cards
– NACK handling, error counter with repetition and iteration limit
• IrDA modulation and demodulation
– Communication at up to 115.2 Kbps
• Test Modes
– Remote Loopback, Local Loopback, Automatic Echo
• SPI Mode
– Master or Slave
– Serial Clock Programmable Phase and Polarity
– SPI Serial Clock (SCK) Frequency up to Internal Clock Frequency PBA/4
• Supports Connection of Two Peripheral DMA Controller Channels (PDC)
– Offers Buffer Transfer without Processor Intervention
10.11.8
Serial Synchronous Controller
• Provides serial synchronous communication links used in audio and telecom applications (with
CODECs in Master or Slave Modes, I2S, TDM Buses, Magnetic Card Reader, etc.)
• Contains an independent receiver and transmitter and a common clock divider
• Offers a configurable frame sync and data length
• Receiver and transmitter can be programmed to start automatically or on detection of different
event on the frame sync signal
• Receiver and transmitter include a data signal, a clock signal and a frame synchronization signal
10.11.9
Timer Counter
• Three 16-bit Timer Counter Channels
• Wide range of functions including:
– Frequency Measurement
– Event Counting
– Interval Measurement
– Pulse Generation
– Delay Timing
– Pulse Width Modulation
– Up/down Capabilities
• Each channel is user-configurable and contains:
– Three external clock inputs
– Five internal clock inputs
– Two multi-purpose input/output signals
• Two global registers that act on all three TC Channels
10.11.10 Pulse Width Modulation Controller
• 7 channels, one 20-bit counter per channel
• Common clock generator, providing Thirteen Different Clocks
– A Modulo n counter providing eleven clocks
– Two independent Linear Dividers working on modulo n counter outputs
• Independent channel programming
– Independent Enable Disable Commands
– Independent Clock
– Independent Period and Duty Cycle, with Double Bufferization
– Programmable selection of the output waveform polarity
– Programmable center or left aligned output waveform
37
32058KS–AVR32–01/12
AT32UC3A
10.11.11 Ethernet 10/100 MAC
•
•
•
•
•
•
•
•
•
•
•
•
Compatibility with IEEE Standard 802.3
10 and 100 Mbits per second data throughput capability
Full- and half-duplex operations
MII or RMII interface to the physical layer
Register Interface to address, data, status and control registers
DMA Interface, operating as a master on the Memory Controller
Interrupt generation to signal receive and transmit completion
28-byte transmit and 28-byte receive FIFOs
Automatic pad and CRC generation on transmitted frames
Address checking logic to recognize four 48-bit addresses
Support promiscuous mode where all valid frames are copied to memory
Support physical layer management through MDIO interface control of alarm and update
time/calendar data
10.11.12 Audio Bitstream DAC
• Digital Stereo DAC
• Oversampled D/A conversion architecture
– Oversampling ratio fixed 128x
– FIR equalization filter
– Digital interpolation filter: Comb4
– 3rd Order Sigma-Delta D/A converters
• Digital bitstream outputs
• Parallel interface
• Connected to Peripheral DMA Controller for background transfer without CPU intervention
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32058KS–AVR32–01/12
AT32UC3A
11. Boot Sequence
This chapter summarizes the boot sequence of the AT32UC3A. The behaviour after power-up is
controlled by the Power Manager. For specific details, refer to Section 13. ”Power Manager
(PM)” on page 53.
11.1
Starting of clocks
After power-up, the device will be held in a reset state by the Power-On Reset circuitry, until the
power has stabilized throughout the device. Once the power has stabilized, the device will use
the internal RC Oscillator as clock source.
On system start-up, the PLLs are disabled. All clocks to all modules are running. No clocks have
a divided frequency, all parts of the system recieves a clock with the same frequency as the
internal RC Oscillator.
11.2
Fetching of initial instructions
After reset has been released, the AVR32 UC CPU starts fetching instructions from the reset
address, which is 0x8000_0000. This address points to the first address in the internal Flash.
The code read from the internal Flash is free to configure the system to use for example the
PLLs, to divide the frequency of the clock routed to some of the peripherals, and to gate the
clocks to unused peripherals.
39
32058KS–AVR32–01/12
AT32UC3A
12. Electrical Characteristics
12.1
Absolute Maximum Ratings*
Operating Temperature......................................-40⋅C to +85⋅C
Storage Temperature ..................................... -60°C to +150°C
Voltage on Input Pin
with respect to Ground except for PC00, PC01, PC02, PC03,
PC04, PC05..........................................................-0.3V to 5.5V
Voltage on Input Pin
with respect to Ground for PC00, PC01, PC02, PC03, PC04,
PC05.....................................................................-0.3V to 3.6V
*NOTICE:
Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or
other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect
device reliability.
Maximum Operating Voltage (VDDCORE, VDDPLL) ..... 1.95V
Maximum Operating Voltage (VDDIO, VDDIN, VDDANA).3.6V
Total DC Output Current on all I/O Pin
for TQFP100 package ................................................. 370 mA
for LQGP144 package ................................................. 470 mA
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32058KS–AVR32–01/12
AT32UC3A
12.2
DC Characteristics
The following characteristics are applicable to the operating temperature range: TA = -40°C to 85°C, unless otherwise specified and are certified for a junction temperature up to TJ = 100°C.
Table 12-1.
DC Characteristics
Symbol
Parameter
VVDDCOR
DC Supply Core
VVDDPLL
Condition
Min.
Typ.
Max
Units
1.65
1.95
V
DC Supply PLL
1.65
1.95
V
VVDDIO
DC Supply Peripheral I/Os
3.0
3.6
V
VREF
Analog reference voltage
2.6
3.6
V
VIL
Input Low-level Voltage
-0.3
+0.8
V
All GPIOS except for PC00, PC01, PC02,
PC03, PC04, PC05.
2.0
5.5V
V
PC00, PC01, PC02, PC03, PC04, PC05.
2.0
3.6V
V
IOL=-4mA for PA0-PA20, PB0, PB4-PB9,
PB11-PB18, PB24-PB26, PB29-PB31,
PX0-PX39
0.4
V
IOL=-8mA for PA21-PA30, PB1-PB3,
PB10, PB19-PB23, PB27-PB28, PC0PC5
0.4
V
E
VIH
VOL
Input High-level Voltage
Output Low-level Voltage
IOH=4mA for PA0-PA20, PB0, PB4-PB9,
PB11-PB18, PB24-PB26, PB29-PB31,
PX0-PX39
VOH
IOH
ILEAK
V
VVDDIO0.4
V
Output High-level Voltage
IOH=8mA for PA21-PA30, PB1-PB3,
PB10, PB19-PB23, PB27-PB28, PC0PC5
IOL
VVDDIO0.4
PA0-PA20, PB0, PB4-PB9, PB11-PB18,
PB24-PB26, PB29-PB31, PX0-PX39
-4
mA
PA21-PA30, PB1-PB3, PB10, PB19PB23, PB27-PB28, PC0-PC5
-8
mA
PA0-PA20, PB0, PB4-PB9, PB11-PB18,
PB24-PB26, PB29-PB31, PX0-PX39
4
mA
PA21-PA30, PB1-PB3, PB10, PB19PB23, PB27-PB28, PC0-PC5
8
mA
Pullup resistors disabled
1
µA
Output Low-level Current
Output HIgh-level Current
Input Leakage Current
CIN
Input Capacitance
TQFP100 Package
7
pF
LQFP144 Package
7
pF
RPULLUP
All GPIO and RESET_N pin.
15K
Ohm
Pull-up Resistance
10K
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32058KS–AVR32–01/12
AT32UC3A
12.3
Regulator characteristics
Table 12-2.
Symbol
Parameter
VVDDIN
Supply voltage (input)
VVDDOUT
Supply voltage (output)
IOUT
ISCR
Electrical characteristics
Condition
Min.
Typ.
Max.
Units
3
3.3
3.6
V
1.81
1.85
1.89
V
Maximum DC output current with VVDDIN = 3.3V
100
mA
Maximum DC output current with VVDDIN = 2.7V
90
mA
Low Power mode (stop, deep stop
or static) at TA =25°C
Static Current of internal regulator
Table 12-3.
Symbol
Parameter
CIN1
10
µA
Decoupling requirements
Typ.
Techno.
Units
Input Regulator Capacitor 1
1
NPO
nF
CIN2
Input Regulator Capacitor 2
4.7
X7R
uF
COUT1
Output Regulator Capacitor 1
470
NPO
pF
COUT2
Output Regulator Capacitor 2
2.2
X7R
uF
12.4
Condition
Analog characteristics
Table 12-4.
Symbol
Parameter
VADVREF
Analog voltage reference (input)
Condition
Table 12-5.
Min.
Typ.
Max.
Units
3.6
V
2.6
Decoupling requirements
Typ.
Techno
.
Units
Voltage reference Capacitor 1
10
-
nF
Voltage reference Capacitor 2
1
-
uF
Symbol
Parameter
CVREF1
CVREF2
12.4.1
Electrical characteristics
Condition
BOD
Table 12-6.
BODLEVEL Values
BODLEVEL Value
Typ.
Typ.
Typ.
Units.
00 0000b
1.40
1.47
1.55
V
01 0111b
1.45
1.52
1.6
V
01 1111b
1.55
1.6
1.65
V
10 0111b
1.65
1.69
1.75
V
The values in Table 12-6 describes the values of the BODLEVEL in the flash FGPFR register.
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32058KS–AVR32–01/12
AT32UC3A
Table 12-7.
12.4.2
BOD Timing
Symbol
Parameter
Test Conditions
Typ.
Max.
Units.
TBOD
Minimum time with
VDDCORE < VBOD to
detect power failure
Falling VDDCORE
from 1.8V to 1.1V
300
800
ns
POR
Table 12-8.
Electrical Characteristic
Symbol
Parameter
Test Conditions
VDDRR
VDDCORE rise rate to ensure power-on-reset
0.01
VSSFR
VDDCORE fall rate to ensure power-on-reset
0.01
VPOR+
Rising threshold voltage: voltage up to which
device is kept under reset by POR on rising
VDDCORE
VPOR-
Falling threshold voltage: voltage when POR
resets device on falling VDDCORE
VRESTART
On falling VDDCORE, voltage must go down to
this value before supply can rise again to ensure
reset signal is released at VPOR+
Falling VDDCORE:
1.8V -> VRESTART
TPOR
Minimum time with VDDCORE < VPOR-
Falling VDDCORE:
1.8V -> 1.1V
TRST
Time for reset signal to be propagated to system
Rising VDDCORE:
VRESTART -> VPOR+
Falling VDDCORE:
1.8V -> VPOR+
Min.
Typ.
Max.
Units.
V/ms
400
V/ms
1.35
1.5
1.6
V
1.25
1.3
1.4
V
0.5
V
-0.1
15
200
us
400
us
43
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12.5
Power Consumption
The values in Table 12-9 and Table 12-10 on page 46 are measured values of power consumption with operating conditions as follows:
•VDDIO = 3.3V
•VDDCORE = VDDPLL = 1.8V
•TA = 25°C, TA = 85°C
•I/Os are configured in input, pull-up enabled.
Figure 12-1. Measurement setup
VDDANA
VDDIO
Amp0
VDDIN
Internal
Voltage
Regulator
VDDOUT
Amp1
VDDCORE
VDDPLL
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These figures represent the power consumption measured on the power supplies.
Table 12-9.
Power Consumption for Different Modes
Mode
Conditions
Active
Typ : Ta =25 °C
CPU running from flash (1).
VDDIN=3.3 V. VDDCORE =1.8V.
CPU clocked from PLL0 at f MHz
Voltage regulator is on.
XIN0 : external clock. (1)
XIN1 stopped. XIN32 stopped
PLL0 running
All peripheral clocks activated.
GPIOs on internal pull-up.
JTAG unconnected with ext pull-up.
Idle
Frozen
Standby
Typ.
Unit
f = 12 MHz
9
mA
f = 24 MHz
15
mA
f = 36MHz
20
mA
f = 50 MHz
28
mA
f = 66 MHz
36.3
mA
Typ : Ta = 25 °C
CPU running from flash (1).
VDDIN=3.3 V. VDDCORE =1.8V.
CPU clocked from PLL0 at f MHz
Voltage regulator is on.
XIN0 : external clock.
XIN1 stopped. XIN32 stopped
PLL0 running
All peripheral clocks activated.
GPIOs on internal pull-up.
JTAG unconnected with ext pull-up.
f = 12 MHz
5
mA
f = 24 MHz
10
mA
f = 36MHz
14
mA
f = 50 MHz
19
mA
f = 66 MHz
25.5
mA
Typ : Ta = 25 °C
CPU running from flash (1).
CPU clocked from PLL0 at f MHz
Voltage regulator is on.
XIN0 : external clock.
XIN1 stopped. XIN32 stopped
PLL0 running
All peripheral clocks activated.
GPIOs on internal pull-up.
JTAG unconnected with ext pull-up.
f = 12 MHz
3
mA
f = 24 MHz
6
mA
f = 36MHz
9
mA
f = 50 MHz
13
mA
f = 66 MHz
16.8
mA
f = 12 MHz
1
mA
f = 24 MHz
2
mA
f = 36MHz
3
mA
f = 50 MHz
4
mA
f = 66 MHz
4.8
mA
Typ : Ta = 25 °C
CPU running from flash (1).
CPU clocked from PLL0 at f MHz
Voltage regulator is on.
XIN0 : external clock.
XIN1 stopped. XIN32 stopped
PLL0 running
All peripheral clocks activated.
GPIOs on internal pull-up.
JTAG unconnected with ext pull-up.
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AT32UC3A
Table 12-9.
Power Consumption for Different Modes
Mode
Conditions
Stop
Typ : Ta = 25 °C.
CPU is in stop mode
GPIOs on internal pull-up.
All peripheral clocks de-activated.
DM and DP pins connected to ground.
XIN0,Xin1 and XIN2 are stopped
Deepstop
Static
1.
Typ.
Unit
on Amp0
47
uA
on Amp1
40
uA
Typ : Ta = 25 °C.CPU is in deepstop mode
GPIOs on internal pull-up.
All peripheral clocks de-activated.
DM and DP pins connected to ground.
XIN0,Xin1 and XIN2 are stopped
on Amp0
36
uA
on Amp1
28
uA
Typ : Ta = 25 °C. CPU is in static mode
GPIOs on internal pull-up.
All peripheral clocks de-activated.
DM and DP pins connected to ground.
XIN0,Xin1 and XIN2 are stopped
on Amp0
25
uA
on Amp1
14
uA
Core frequency is generated from XIN0 using the PLL so that 140 MHz < fpll0 < 160 MHz and 10 MHz < fxin0
< 12MHz
Table 12-10. Power Consumption by Peripheral in Active Mode
Peripheral
Typ.
GPIO
37
SMC
10
SDRAMC
4
ADC
18
EBI
31
INTC
25
TWI
14
MACB
45
PDCA
30
PWM
36
RTC
7
SPI
13
SSC
13
TC
10
USART
35
USB
45
Unit
µA/MHz
12.6
Clock Characteristics
These parameters are given in the following conditions:
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• VDDCORE = 1.8V
• Ambient Temperature = 25°C
12.6.1
CPU/HSB Clock Characteristics
Table 12-11. Core Clock Waveform Parameters
Symbol
Parameter
1/(tCPCPU)
CPU Clock Frequency
tCPCPU
CPU Clock Period
12.6.2
Conditions
Min
Max
Units
66
MHz
15,15
ns
PBA Clock Characteristics
Table 12-12. PBA Clock Waveform Parameters
Symbol
Parameter
1/(tCPPBA)
PBA Clock Frequency
tCPPBA
PBA Clock Period
12.6.3
Conditions
Min
Max
Units
66
MHz
15,15
ns
PBB Clock Characteristics
Table 12-13. PBB Clock Waveform Parameters
Symbol
Parameter
1/(tCPPBB)
PBB Clock Frequency
tCPPBB
PBB Clock Period
12.7
Conditions
Min
Max
Units
66
MHz
15,15
ns
Crystal Oscillator Characteristis
The following characteristics are applicable to the operating temperature range: TA = -40°C to 85°C and worst case of
power supply, unless otherwise specified.
12.7.1
32 KHz Oscillator Characteristics
Table 12-14. 32 KHz Oscillator Characteristics
Symbol
Parameter
1/(tCP32KHz)
Crystal Oscillator Frequency
CL
Equivalent Load Capacitance
Conditions
Max
Unit
32 768
Hz
12.5
pF
600
1200
ms
Active mode
1.8
µA
Standby mode
0.1
µA
6
(1)
tST
Startup Time
IOSC
Current Consumption
Note:
Min
CL = 6pF
CL = 12.5pF(1)
Typ
1. CL is the equivalent load capacitance.
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12.7.2
Main Oscillators Characteristics
Table 12-15. Main Oscillator Characteristics
Symbol
Parameter
1/(tCPMAIN)
Crystal Oscillator Frequency
CL1, CL2
Internal Load Capacitance
(CL1 = CL2)
Conditions
Min
Typ
0.45
Unit
16
MHz
12
Duty Cycle
40
tST
Startup Time
1/(tCPXIN)
XIN Clock Frequency
tCHXIN
XIN Clock High Half-period
0.4 x
tCPXIN
tCLXIN
XIN Clock Low Half-period
0.4 x
tCPXIN
CIN
XIN Input Capacitance
50
External clock
12.7.3
Max
Crystal
0.45
pF
60
%
TBD
ms
50
MHz
16
MHz
0.6 x
tCPXIN
0.6 x
tCPXIN
7
pF
PLL Characteristics
Table 12-16. Phase Lock Loop Characteristics
Symbol
Parameter
FOUT
Output Frequency
FIN
Input Frequency
IPLL
Current Consumption
Conditions
Min
Typ
Max
Unit
80
240
MHz
4
16
MHz
active mode (Fout=80Mhz)
250
µA
active mode (Fout=240Mhz)
600
µA
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12.8
ADC Characteristics
Table 12-17. Channel Conversion Time and ADC Clock
Parameter
Conditions
ADC Clock Frequency
ADC Clock Frequency
Startup Time
Min
Max
Units
10-bit resolution mode
5
MHz
8-bit resolution mode
8
MHz
Return from Idle Mode
20
µs
Track and Hold Acquisition Time
Typ
600
Conversion Time
ADC Clock = 5 MHz
ns
2
µs
Conversion Time
ADC Clock = 8 MHz
1.25
µs
Throughput Rate
ADC Clock = 5 MHz
384(1)
kSPS
Throughput Rate
ADC Clock = 8 MHz
533(2)
kSPS
Notes:
1. Corresponds to 13 clock cycles at 5 MHz: 3 clock cycles for track and hold acquisition time and 10 clock cycles for
conversion.
2. Corresponds to 15 clock cycles at 8 MHz: 5 clock cycles for track and hold acquisition time and 10 clock cycles for
conversion.
Table 12-18. External Voltage Reference Input
Parameter
Conditions
Min
ADVREF Input Voltage Range
ADVREF Average Current
Typ
2.6
On 13 samples with ADC Clock = 5 MHz
200
Current Consumption on VDDANA
Note:
Max
Units
VDDANA
V
250
µA
1.25
mA
ADVREF should be connected to GND to avoid extra consumption in case ADC is not used.
Table 12-19. Analog Inputs
Parameter
Min
Input Voltage Range
Typ
0
Max
Input Leakage Current
1
Input Capacitance
Units
VADVREF
17
µA
pF
Table 12-20. Transfer Characteristics in 8-bit mode
Parameter
Conditions
Min
Resolution
Absolute Accuracy
Integral Non-linearity
Differential Non-linearity
Typ
Max
8
Units
Bit
f=5MHz
0.8
LSB
f=8MHz
1.5
LSB
f=5MHz
0.35
0.5
LSB
f=8MHz
0.5
1.0
LSB
f=5MHz
0.3
0.5
LSB
f=8MHz
0.5
1.0
LSB
Offset Error
f=5MHz
-0.5
0.5
LSB
Gain Error
f=5MHz
-0.5
0.5
LSB
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Table 12-21. Transfer Characteristics in 10-bit mode
Parameter
Conditions
Min
Resolution
Typ
Max
10
Units
Bit
Absolute Accuracy
f=5MHz
Integral Non-linearity
f=5MHz
1.5
2
LSB
f=5MHz
1
2
LSB
0.6
1
LSB
Differential Non-linearity
3
f=2.5MHz
LSB
Offset Error
f=5MHz
-2
2
LSB
Gain Error
f=5MHz
-2
2
LSB
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12.9
EBI Timings
These timings are given for worst case process, T = 85⋅C, VDDCORE = 1.65V, VDDIO = 3V and 40 pF load capacitance.
Table 12-22. SMC Clock Signal.
Symbol
Parameter
1/(tCPSMC)
SMC Controller Clock Frequency
Note:
Max(1)
Units
1/(tcpcpu)
MHz
1. The maximum frequency of the SMC interface is the same as the max frequency for the HSB.
Table 12-23. SMC Read Signals with Hold Settings
Symbol
Parameter
Min
Units
NRD Controlled (READ_MODE = 1)
SMC1
Data Setup before NRD High
SMC2
Data Hold after NRD High
12
0
SMC3
NRD High to NBS0/A0 Change
SMC4
NRD High to NBS1 Change(1)
(1)
nrd hold length * tCPSMC - 1.3
nrd hold length * tCPSMC - 1.3
SMC5
NRD High to NBS2/A1 Change
SMC6
NRD High to NBS3 Change(1)
(1)
nrd hold length * tCPSMC - 1.3
ns
nrd hold length * tCPSMC - 1.3
SMC7
NRD High to A2 - A25 Change
SMC8
NRD High to NCS Inactive(1)
SMC9
NRD Pulse Width
(1)
nrd hold length * tCPSMC - 1.3
(nrd hold length - ncs rd hold length) * tCPSMC - 2.3
nrd pulse length * tCPSMC - 1.4
NRD Controlled (READ_MODE = 0)
SMC10
Data Setup before NCS High
SMC11
Data Hold after NCS High
11.5
0
SMC12
NCS High to NBS0/A0 Change
(1)
ncs rd hold length * tCPSMC - 2.3
SMC13
NCS High to NBS0/A0 Change(1)
ncs rd hold length * tCPSMC - 2.3
SMC14
NCS High to NBS2/A1 Change
(1)
ncs rd hold length * tCPSMC - 2.3
SMC15
NCS High to NBS3 Change(1)
SMC16
NCS High to A2 - A25 Change
SMC17
NCS High to NRD Inactive(1)
SMC18
NCS Pulse Width
Note:
ns
ncs rd hold length * tCPSMC - 2.3
(1)
ncs rd hold length * tCPSMC - 4
ncs rd hold length - nrd hold length)* tCPSMC - 1.3
ncs rd pulse length * tCPSMC - 3.6
1. hold length = total cycle duration - setup duration - pulse duration. “hold length” is for “ncs rd hold length” or “nrd hold length”.
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Table 12-24. SMC Read Signals with no Hold Settings
Symbol
Parameter
Min
Units
NRD Controlled (READ_MODE = 1)
SMC19
Data Setup before NRD High
SMC20
Data Hold after NRD High
13.7
ns
1
NRD Controlled (READ_MODE = 0)
SMC21
Data Setup before NCS High
SMC22
Data Hold after NCS High
13.3
ns
0
Table 12-25. SMC Write Signals with Hold Settings
Symbol
Parameter
Min
Units
NRD Controlled (READ_MODE = 1)
SMC23
Data Out Valid before NWE High
(nwe pulse length - 1) * tCPSMC - 0.9
SMC24
Data Out Valid after NWE High(1)
nwe hold length * tCPSMC - 6
SMC25
NWE High to NBS0/A0 Change
SMC26
NWE High to NBS1 Change(1)
NWE High to NBS2/A1 Change
SMC30
NWE High to NBS3 Change(1)
NWE High to A2 - A25 Change
SMC32
NWE High to NCS Inactive(1)
SMC33
NWE Pulse Width
nwe hold length * tCPSMC - 1.9
nwe hold length * tCPSMC - 1.9
SMC29
SMC31
(1)
(1)
nwe hold length * tCPSMC - 1.9
ns
nwe hold length * tCPSMC - 1.9
(1)
nwe hold length * tCPSMC - 1.7
(nwe hold length - ncs wr hold length)* tCPSMC - 2.9
nwe pulse length * tCPSMC - 0.9
NRD Controlled (READ_MODE = 0)
SMC34
Data Out Valid before NCS High
(ncs wr pulse length - 1)* tCPSMC - 4.6
SMC35
Data Out Valid after NCS High(1)
ncs wr hold length * tCPSMC - 5.8
SMC36
Note:
(1)
NCS High to NWE Inactive
ns
(ncs wr hold length - nwe hold length)* tCPSMC - 0.6
1. hold length = total cycle duration - setup duration - pulse duration. “hold length” is for “ncs wr hold length” or “nwe hold
length"
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Table 12-26. SMC Write Signals with No Hold Settings (NWE Controlled only).
Symbol
Parameter
Min
SMC37
NWE Rising to A2-A25 Valid
5.4
SMC38
NWE Rising to NBS0/A0 Valid
5
SMC39
NWE Rising to NBS1 Change
5
SMC40
NWE Rising to A1/NBS2 Change
5
SMC41
NWE Rising to NBS3 Change
5
SMC42
NWE Rising to NCS Rising
SMC43
Data Out Valid before NWE Rising
SMC44
Data Out Valid after NWE Rising
SMC45
NWE Pulse Width
Units
ns
5.1
(nwe pulse length - 1) * tCPSMC - 1.2
5
nwe pulse length * tCPSMC - 0.9
Figure 12-2. SMC Signals for NCS Controlled Accesses.
SMC16
SMC16
SMC16
SMC12
SMC13
SMC14
SMC15
SMC12
SMC13
SMC14
SMC15
A2-A25
SMC12
SMC13
SMC14
SMC15
A0/A1/NBS[3:0]
NRD
SMC17
SMC17
NCS
SMC21
SMC18
SMC18
SMC18
SMC22
SMC10
SMC11
SMC34
SMC35
D0 - D15
SMC36
NWE
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Figure 12-3. SMC Signals for NRD and NRW Controlled Accesses.
SMC37
SMC7
SMC7
SMC31
A2-A25
SMC25
SMC26
SMC29
SMC30
SMC3
SMC4
SMC5
SMC6
SMC38
SMC39
SMC40
SMC41
SMC3
SMC4
SMC5
SMC6
A0/A1/NBS[3:0]
SMC42
SMC32
SMC8
NCS
SMC8
SMC9
SMC9
NRD
SMC19
SMC20
SMC43
SMC44
SMC1
SMC23
SMC2
SMC24
D0 - D15
SMC45
SMC33
NWE
12.9.1
SDRAM Signals
These timings are given for 10 pF load on SDCK and 40 pF on other signals.
Table 12-27. SDRAM Clock Signal.
Symbol
Parameter
1/(tCPSDCK)
SDRAM Controller Clock Frequency
Note:
Max(1)
Units
1/(tcpcpu)
MHz
1. The maximum frequency of the SDRAMC interface is the same as the max frequency for the
HSB.
Table 12-28. SDRAM Clock Signal.
Symbol
Parameter
Min
Units
SDRAMC1
SDCKE High before SDCK Rising Edge
7.4
ns
SDRAMC2
SDCKE Low after SDCK Rising Edge
3.2
SDRAMC3
SDCKE Low before SDCK Rising Edge
SDRAMC4
SDCKE High after SDCK Rising Edge
2.9
SDRAMC5
SDCS Low before SDCK Rising Edge
7.5
SDRAMC6
SDCS High after SDCK Rising Edge
1.6
SDRAMC7
RAS Low before SDCK Rising Edge
7.2
SDRAMC8
RAS High after SDCK Rising Edge
2.3
SDRAMC9
SDA10 Change before SDCK Rising Edge
7.6
SDRAMC10
SDA10 Change after SDCK Rising Edge
1.9
7
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Table 12-28. SDRAM Clock Signal.
Symbol
Parameter
Min
SDRAMC11
Address Change before SDCK Rising Edge
6.2
SDRAMC12
Address Change after SDCK Rising Edge
2.2
SDRAMC13
Bank Change before SDCK Rising Edge
6.3
SDRAMC14
Bank Change after SDCK Rising Edge
2.4
SDRAMC15
CAS Low before SDCK Rising Edge
7.4
SDRAMC16
CAS High after SDCK Rising Edge
1.9
SDRAMC17
DQM Change before SDCK Rising Edge
6.4
SDRAMC18
DQM Change after SDCK Rising Edge
2.2
SDRAMC19
D0-D15 in Setup before SDCK Rising Edge
9
SDRAMC20
D0-D15 in Hold after SDCK Rising Edge
0
SDRAMC23
SDWE Low before SDCK Rising Edge
7.6
SDRAMC24
SDWE High after SDCK Rising Edge
1.8
SDRAMC25
D0-D15 Out Valid before SDCK Rising Edge
7.1
SDRAMC26
D0-D15 Out Valid after SDCK Rising Edge
1.5
Units
ns
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Figure 12-4. SDRAMC Signals relative to SDCK.
SDCK
SDRAMC1
SDRAMC2
SDRAMC3
SDRAMC4
SDCKE
SDRAMC5
SDRAMC6
SDRAMC7
SDRAMC8
SDRAMC5
SDRAMC6
SDRAMC5
SDRAMC6
SDCS
RAS
SDRAMC15 SDRAMC16
SDRAMC15 SDRAMC16
CAS
SDRAMC23 SDRAMC24
SDWE
SDRAMC9 SDRAMC10
SDRAMC9 SDRAMC10
SDRAMC9 SDRAMC10
SDRAMC11 SDRAMC12
SDRAMC11 SDRAMC12
SDRAMC11 SDRAMC12
SDRAMC13 SDRAMC14
SDRAMC13 SDRAMC14
SDRAMC13 SDRAMC14
SDRAMC17 SDRAMC18
SDRAMC17 SDRAMC18
SDA10
A0 - A9,
A11 - A13
BA0/BA1
DQM0 DQM3
SDRAMC19 SDRAMC20
D0 - D15
Read
SDRAMC25 SDRAMC26
D0 - D15
to Write
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12.10 JTAG Timings
12.10.1
JTAG Interface Signals
Table 12-29. JTAG Interface Timing specification
Symbol
JTAG0
JTAG1
JTAG2
JTAG3
JTAG4
JTAG5
JTAG6
JTAG7
JTAG8
JTAG9
JTAG10
Note:
Parameter
Conditions
Min
TCK Low Half-period
(1)
Max
6
ns
TCK High Half-period
(1)
3
ns
TCK Period
(1)
9
ns
TDI, TMS Setup before TCK High
(1)
1
ns
TDI, TMS Hold after TCK High
(1)
0
ns
TDO Hold Time
(1)
4
ns
TCK Low to TDO Valid
(1)
Device Inputs Setup Time
(1)
ns
Device Inputs Hold Time
(1)
ns
Device Outputs Hold Time
(1)
ns
TCK to Device Outputs Valid
(1)
ns
6
Units
ns
1. VVDDIO from 3.0V to 3.6V, maximum external capacitor = 40pF
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Figure 12-5. JTAG Interface Signals
JTAG2
TCK
JTAG
JTAG1
0
TMS/TDI
JTAG3
JTAG4
JTAG7
JTAG8
TDO
JTAG5
JTAG6
Device
Inputs
Device
Outputs
JTAG9
JTAG10
12.11 SPI Characteristics
Figure 12-6. SPI Master mode with (CPOL = NCPHA = 0) or (CPOL= NCPHA= 1)
SPCK
SPI0
SPI1
MISO
SPI2
MOSI
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Figure 12-7. SPI Master mode with (CPOL=0 and NCPHA=1) or (CPOL=1 and NCPHA=0)
SPCK
SPI3
SPI4
MISO
SPI5
MOSI
Figure 12-8. SPI Slave mode with (CPOL=0 and NCPHA=1) or (CPOL=1 and NCPHA=0)
SPCK
SPI6
MISO
SPI7
SPI8
MOSI
Figure 12-9. SPI Slave mode with (CPOL = NCPHA = 0) or (CPOL= NCPHA= 1)
SPCK
SPI9
MISO
SPI10
SPI11
MOSI
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Table 12-30. SPI Timings
Symbol
SPI0
Parameter
MISO Setup time before SPCK rises (master)
SPI1
MISO Hold time after SPCK rises (master)
SPI2
SPCK rising to MOSI Delay (master)
Conditions
(1)
3.3V domain
3.3V domain
(1)
(1)
3.3V domain
SPI4
MISO Hold time after SPCK falls (master)
3.3V domain (1)
SPI5
SPCK falling to MOSI Delay (master)
3.3V domain (1)
SPI7
MOSI Setup time before SPCK rises (slave)
SPI8
MOSI Hold time after SPCK rises (slave)
SPI9
SPCK rising to MISO Delay (slave)
SPI10
MOSI Setup time before SPCK falls (slave)
SPI11
Notes:
MOSI Hold time after SPCK falls (slave)
Units
22 + (tCPMCK)/2
ns
0
ns
3.3V domain
MISO Setup time before SPCK falls (master)
SPCK falling to MISO Delay (slave)
Max
(2)
(1)
SPI3
SPI6
Min
7
ns
(2)
22 + (tCPMCK)/2
ns
0
ns
7
ns
26.5
ns
3.3V domain
(1)
3.3V domain
(1)
0
ns
3.3V domain
(1)
1.5
ns
3.3V domain
(1)
3.3V domain
(1)
0
ns
3.3V domain
(1)
1
ns
27
ns
1. 3.3V domain: VVDDIO from 3.0V to 3.6V, maximum external capacitor = 40 pF.
2. tCPMCK: Master Clock period in ns.
12.12 MACB Characteristics
Table 12-31. Ethernet MAC Signals
Symbol
Parameter
Conditions
EMAC1
Setup for EMDIO from EMDC rising
Load: 20pF
EMAC2
Hold for EMDIO from EMDC rising
Load: 20pF(2)
EMAC3
EMDIO toggling from EMDC falling
Load: 20pF(2)
Notes:
Min (ns)
Max (ns)
Min (ns)
Max (ns)
(2)
1. f: MCK frequency (MHz)
2. VVDDIO from 3.0V to 3.6V, maximum external capacitor = 20 pF
Table 12-32. Ethernet MAC MII Specific Signals
Symbol
EMAC4
EMAC5
Parameter
Setup for ECOL from ETXCK rising
Hold for ECOL from ETXCK rising
Conditions
Load: 20pF
(1)
3
Load: 20pF
(1)
0
(1)
3
0
EMAC6
Setup for ECRS from ETXCK rising
Load: 20pF
EMAC7
Hold for ECRS from ETXCK rising
Load: 20pF (1)
EMAC8
EMAC9
ETXER toggling from ETXCK rising
ETXEN toggling from ETXCK rising
Load: 20pF
(1)
15
Load: 20pF
(1)
15
(1)
15
EMAC10
ETX toggling from ETXCK rising
Load: 20pF
EMAC11
Setup for ERX from ERXCK
Load: 20pF (1)
1
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Table 12-32. Ethernet MAC MII Specific Signals
Symbol
EMAC12
EMAC13
Parameter
Conditions
Hold for ERX from ERXCK
Setup for ERXER from ERXCK
Min (ns)
Load: 20pF
(1)
1.5
Load: 20pF
(1)
1
(1)
0.5
EMAC14
Hold for ERXER from ERXCK
Load: 20pF
EMAC15
Setup for ERXDV from ERXCK
Load: 20pF (1)
1.5
EMAC16
Hold for ERXDV from ERXCK
Load: 20pF (1)
1
Note:
Max (ns)
1. VVDDIO from 3.0V to 3.6V, maximum external capacitor = 20 pF
Figure 12-10. Ethernet MAC MII Mode
EMDC
EMAC1
EMAC3
EMAC2
EMDIO
EMAC4
EMAC5
EMAC6
EMAC7
ECOL
ECRS
ETXCK
EMAC8
ETXER
EMAC9
ETXEN
EMAC10
ETX[3:0]
ERXCK
EMAC11
EMAC12
ERX[3:0]
EMAC13
EMAC14
EMAC15
EMAC16
ERXER
ERXDV
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Table 12-33. Ethernet MAC RMII Specific Signals
Symbol
Parameter
Min (ns)
Max (ns)
EMAC21
ETXEN toggling from EREFCK rising
7
14.5
EMAC22
ETX toggling from EREFCK rising
7
14.7
EMAC23
Setup for ERX from EREFCK
1.5
EMAC24
Hold for ERX from EREFCK
0
EMAC25
Setup for ERXER from EREFCK
1.5
EMAC26
Hold for ERXER from EREFCK
0
EMAC27
Setup for ECRSDV from EREFCK
1.5
EMAC28
Hold for ECRSDV from EREFCK
0
Figure 12-11. Ethernet MAC RMII Mode
EREFCK
EMAC21
ETXEN
EMAC22
ETX[1:0]
EMAC23
EMAC24
ERX[1:0]
EMAC25
EMAC26
EMAC27
EMAC28
ERXER
ECRSDV
12.13 Flash Characteristics
The following table gives the device maximum operating frequency depending on the field FWS
of the Flash FSR register. This field defines the number of wait states required to access the
Flash Memory.
Table 12-34.
Flash Wait States
FWS
Read Operations
Maximum Operating Frequency (MHz)
0
1 cycle
33
1
2 cycles
66
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Table 12-35.
Programming Time
Temperature Operating Range
Part
Page Programming Time (ms)
Chip Erase Time (ms)
Industrial
4
4
Automotive
16
16
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13. Mechanical Characteristics
13.1
13.1.1
Thermal Considerations
Thermal Data
Table 13-1 summarizes the thermal resistance data depending on the package.
Table 13-1.
13.1.2
Thermal Resistance Data
Symbol
Parameter
Condition
Package
Typ
θJA
Junction-to-ambient thermal resistance
Still Air
TQFP100
43.4
θJC
Junction-to-case thermal resistance
TQFP100
5.5
θJA
Junction-to-ambient thermal resistance
LQFP144
39.8
θJC
Junction-to-case thermal resistance
LQFP144
8.9
Still Air
Unit
⋅C/W
⋅C/W
Junction Temperature
The average chip-junction temperature, TJ, in °C can be obtained from the following:
1.
T J = T A + ( P D × θ JA )
2.
T J = T A + ( P D × ( θ HEATSINK + θ JC ) )
where:
• θJA = package thermal resistance, Junction-to-ambient (°C/W), provided in Table 13-1 on page
64.
• θJC = package thermal resistance, Junction-to-case thermal resistance (°C/W), provided in
Table 13-1 on page 64.
• θHEAT SINK = cooling device thermal resistance (°C/W), provided in the device datasheet.
• PD = device power consumption (W) estimated from data provided in the section ”Power
Consumption” on page 44.
• TA = ambient temperature (°C).
From the first equation, the user can derive the estimated lifetime of the chip and decide if a
cooling device is necessary or not. If a cooling device is to be fitted on the chip, the second
equation should be used to compute the resulting average chip-junction temperature TJ in °C.
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13.2
Package Drawings
Figure 13-1. TQFP-100 package drawing
Table 13-2.
Device and Package Maximum Weight
500
Table 13-3.
mg
Package Characteristics
Moisture Sensitivity Level
Table 13-4.
Jdec J-STD0-20D - MSL 3
Package Reference
JEDEC Drawing Reference
MS-026
JESD97 Classification
E3
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Figure 13-2. LQFP-144 package drawing
Table 13-5.
Device and Package Maximum Weight
1300
Table 13-6.
mg
Package Characteristics
Moisture Sensitivity Level
Table 13-7.
Jdec J-STD0-20D - MSL 3
Package Reference
JEDEC Drawing Reference
MS-026
JESD97 Classification
E3
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Figure 13-3. FFBGA-144 package drawing
Table 13-8.
Device and Package Maximum Weight
1300
Table 13-9.
mg
Package Characteristics
Moisture Sensitivity Level
MSL3
Table 13-10. Package Reference
JEDEC Drawing Reference
MS-026
JESD97 Classification
E3
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13.3
Soldering Profile
Table 13-11 gives the recommended soldering profile from J-STD-20.
Table 13-11. Soldering Profile
Profile Feature
Green Package
Average Ramp-up Rate (217°C to Peak)
3°C/sec
Preheat Temperature 175°C ±25°C
Min. 150 °C, Max. 200 °C
Time Maintained Above 217°C
60-150 sec
Time within 5⋅C of Actual Peak Temperature
30 sec
Peak Temperature Range
260 °C
Ramp-down Rate
6 °C/sec
Time 25⋅C to Peak Temperature
Max. 8 minutes
Note:
It is recommended to apply a soldering temperature higher than 250°C.
A maximum of three reflow passes is allowed per component.
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14. Ordering Information
Table 14-1.
Ordering Information
Device
AT32UC3A0512
AT32UC3A0256
AT32UC3A0128
AT32UC3A1512
AT32UC3A1256
AT32UC3A1128
14.1
Ordering Code
Package
Conditioning
Temperature Operating Range
AT32UC3A0512-ALUT
144 LQFP
Tray
Industrial (-40⋅C to 85⋅C)
AT32UC3A0512-ALUR
144 LQFP
Reel
Industrial (-40⋅C to 85⋅C)
AT32UC3A0512-ALTR
144 LQFP
Reel
Automotive (-40⋅C to 85⋅C)
AT32UC3A0512-ALTT
144 LQFP
Tray
Automotive (-40⋅C to 85⋅C)
AT32UC3A0512-ALTES
144 LQFP
Tray
Automotive (-40⋅C to 85⋅C) samples
AT32UC3A0512-CTUT
144 FFBGA
Tray
Industrial (-40⋅C to 85⋅C)
AT32UC3A0512-CTUR
144 FFBGA
Reel
Industrial (-40⋅C to 85⋅C)
AT32UC3A0256-ALUT
144 LQFP
Tray
Industrial (-40⋅C to 85⋅C)
AT32UC3A0256-ALUR
144 LQFP
Reel
Industrial (-40⋅C to 85⋅C)
AT32UC3A0256-CTUT
144 FFBGA
Tray
Industrial (-40⋅C to 85⋅C)
AT32UC3A0256-CTUR
144 FFBGA
Reel
Industrial (-40⋅C to 85⋅C)
AT32UC3A0128-ALUT
144 LQFP
Tray
Industrial (-40⋅C to 85⋅C)
AT32UC3A0128-ALUR
144 LQFP
Reel
Industrial (-40⋅C to 85⋅C)
AT32UC3A0128-CTUT
144 FFBGA
Tray
Industrial (-40⋅C to 85⋅C)
AT32UC3A0128-CTUR
144 FFBGA
Reel
Industrial (-40⋅C to 85⋅C)
AT32UC3A1512-AUT
100 TQFP
Tray
Industrial (-40⋅C to 85⋅C)
AT32UC3A1512-AUR
100 TQFP
Reel
Industrial (-40⋅C to 85⋅C)
AT32UC3A1256-AUT
100 TQFP
Tray
Industrial (-40⋅C to 85⋅C)
AT32UC3A1256-AUR
100 TQFP
Reel
Industrial (-40⋅C to 85⋅C)
AT32UC3A1128-AUT
100 TQFP
Tray
Industrial (-40⋅C to 85⋅C)
AT32UC3A1128-AUR
100 TQFP
Reel
Industrial (-40⋅C to 85⋅C)
Automotive Quality Grade
The AT32UC3A have been developed and manufactured according to the most stringent
requirements of the international standard ISO-TS-16949. This data sheet will contain limit values extracted from the results of extensive characterization (Temperature and Voltage). The
quality and reliability of the AT32UC3A is verified during regular product qualification as per
AEC-Q100 grade 3.
As indicated in the ordering information paragraph, the product is available in only one temperature grade T: -40°C / + 85°C.
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15. Errata
All industrial parts labelled with -UES (engineering samples) are revision E parts.
15.1
15.1.1
Rev. K, L, M
PWM
1. PWM channel interrupt enabling triggers an interrupt
When enabling a PWM channel that is configured with center aligned period (CALG=1), an
interrupt is signalled.
Fix/Workaround
When using center aligned mode, enable the channel and read the status before channel
interrupt is enabled.
2. PWM counter restarts at 0x0001
The PWM counter restarts at 0x0001 and not 0x0000 as specified. Because of this the first
PWM period has one more clock cycle.
Fix/Workaround
- The first period is 0x0000, 0x0001, ..., period
- Consecutive periods are 0x0001, 0x0002, ..., period
3. PWM update period to a 0 value does not work
It is impossible to update a period equal to 0 by the using the PWM update register
(PWM_CUPD).
Fix/Workaround
Do not update the PWM_CUPD register with a value equal to 0.
15.1.2
ADC
1. Sleep Mode activation needs additional A to D conversion
If the ADC sleep mode is activated when the ADC is idle the ADC will not enter sleep mode
before after the next AD conversion.
Fix/Workaround
Activate the sleep mode in the mode register and then perform an AD conversion.
15.1.3
SPI
1. SPI Slave / PDCA transfer: no TX UNDERRUN flag
There is no TX UNDERRUN flag available, therefore in SPI slave mode, there is no way to
be informed of a character lost in transmission.
Fix/Workaround
For PDCA transfer: none.
2. SPI FDIV option does not work
Selecting clock signal using FDIV = 1 does not work as specified.
Fix/Workaround
Do not set FDIV = 1.
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3. SPI Bad Serial Clock Generation on 2nd chip_select when SCBR = 1, CPOL=1 and
NCPHA=0
When multiple CS are in use, if one of the baudrate equals to 1 and one of the others doesn't
equal to 1, and CPOL=1 and CPHA=0, then an aditional pulse will be generated on SCK.
Fix/workaround
When multiple CS are in use, if one of the baudrate equals 1, the other must also equal 1 if
CPOL=1 and CPHA=0.
4. SPI Glitch on RXREADY flag in slave mode when enabling the SPI or during the first
transfer
In slave mode, the SPI can generate a false RXREADY signal during enabling of the SPI or
during the first transfer.
Fix/Workaround
1. Set slave mode, set required CPOL/CPHA.
2. Enable SPI.
3. Set the polarity CPOL of the line in the opposite value of the required one.
4. Set the polarity CPOL to the required one.
5. Read the RXHOLDING register.
Transfers can now befin and RXREADY will now behave as expected.
5. SPI Disable does not work in Slave mode
Fix/workaround
Read the last received data then perform a Software reset.
15.1.4
Power Manager
1. If the BOD level is higher than VDDCORE, the part is constantly under reset
If the BOD level is set to a value higher than VDDCORE and enabled by fuses, the part will
be in constant reset.
Fix/Workaround
Apply an external voltage on VDDCORE that is higher than the BOD level and is lower than
VDDCORE max and disable the BOD.
15.1.5
PDCA
1. Wrong PDCA behavior when using two PDCA channels with the same PID.
Fix/Workaround
The same PID should not be assigned to more than one channel.
15.1.6
TWI
1. The TWI RXRDY flag in SR register is not reset when a software reset is performed.
Fix/Workaround
After a Software Reset, the register TWI RHR must be read.
15.1.7
USART
15.1.8
1. ISO7816 info register US_NER cannot be read
The NER register always returns zero.
Fix/Workaround
None
Processor and Architecture
1. LDM instruction with PC in the register list and without ++ increments Rp
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For LDM with PC in the register list: the instruction behaves as if the ++ field is always set, ie
the pointer is always updated. This happens even if the ++ field is cleared. Specifically, the
increment of the pointer is done in parallel with the testing of R12.
Fix/Workaround
None.
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15.2
15.2.1
Rev. J
PWM
1. PWM channel interrupt enabling triggers an interrupt
When enabling a PWM channel that is configured with center aligned period (CALG=1), an
interrupt is signalled.
Fix/Workaround
When using center aligned mode, enable the channel and read the status before channel
interrupt is enabled.
2. PWM counter restarts at 0x0001
The PWM counter restarts at 0x0001 and not 0x0000 as specified. Because of this the first
PWM period has one more clock cycle.
Fix/Workaround
- The first period is 0x0000, 0x0001, ..., period
- Consecutive periods are 0x0001, 0x0002, ..., period
3. PWM update period to a 0 value does not work
It is impossible to update a period equal to 0 by the using the PWM update register
(PWM_CUPD).
Fix/Workaround
Do not update the PWM_CUPD register with a value equal to 0.
15.2.2
ADC
1. Sleep Mode activation needs additional A to D conversion
If the ADC sleep mode is activated when the ADC is idle the ADC will not enter sleep mode
before after the next AD conversion.
Fix/Workaround
Activate the sleep mode in the mode register and then perform an AD conversion.
15.2.3
SPI
1. SPI Slave / PDCA transfer: no TX UNDERRUN flag
There is no TX UNDERRUN flag available, therefore in SPI slave mode, there is no way to
be informed of a character lost in transmission.
Fix/Workaround
For PDCA transfer: none.
2. SPI FDIV option does not work
Selecting clock signal using FDIV = 1 does not work as specified.
Fix/Workaround
Do not set FDIV = 1.
3. SPI Bad Serial Clock Generation on 2nd chip_select when SCBR = 1, CPOL=1 and
NCPHA=0
When multiple CS are in use, if one of the baudrate equals to 1 and one of the others doesn't
equal to 1, and CPOL=1 and CPHA=0, then an aditional pulse will be generated on SCK.
Fix/workaround
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When multiple CS are in use, if one of the baudrate equals 1, the other must also equal 1 if
CPOL=1 and CPHA=0.
4. SPI Glitch on RXREADY flag in slave mode when enabling the SPI or during the first
transfer
In slave mode, the SPI can generate a false RXREADY signal during enabling of the SPI or
during the first transfer.
Fix/Workaround
1. Set slave mode, set required CPOL/CPHA.
2. Enable SPI.
3. Set the polarity CPOL of the line in the opposite value of the required one.
4. Set the polarity CPOL to the required one.
5. Read the RXHOLDING register.
Transfers can now befin and RXREADY will now behave as expected.
5. SPI Disable does not work in Slave mode
Fix/workaround
Read the last received data then perform a Software reset.
15.2.4
Power Manager
1. If the BOD level is higher than VDDCORE, the part is constantly under reset
If the BOD level is set to a value higher than VDDCORE and enabled by fuses, the part will
be in constant reset.
Fix/Workaround
Apply an external voltage on VDDCORE that is higher than the BOD level and is lower than
VDDCORE max and disable the BOD.
15.2.5
PDCA
1. Wrong PDCA behavior when using two PDCA channels with the same PID.
Fix/Workaround
The same PID should not be assigned to more than one channel.
15.2.6
TWI
1. The TWI RXRDY flag in SR register is not reset when a software reset is performed.
Fix/Workaround
After a Software Reset, the register TWI RHR must be read.
15.2.7
SDRAMC
1.
Code execution from external SDRAM does not work
Code execution from SDRAM does not work.
Fix/Workaround
Do not run code from SDRAM.
15.2.8
GPIO
1. PA29 (TWI SDA) and PA30 (TWI SCL) GPIO VIH (input high voltage) is 3.6V max
instead of 5V tolerant
The following GPIOs are not 5V tolerant : PA29 and PA30.
Fix/Workaround
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None.
15.2.9
USART
15.2.10
1. ISO7816 info register US_NER cannot be read
The NER register always returns zero.
Fix/Workaround
None
Processor and Architecture
1. LDM instruction with PC in the register list and without ++ increments Rp
For LDM with PC in the register list: the instruction behaves as if the ++ field is always set, ie
the pointer is always updated. This happens even if the ++ field is cleared. Specifically, the
increment of the pointer is done in parallel with the testing of R12.
Fix/Workaround
None.
2. RETE instruction does not clear SREG[L] from interrupts.
The RETE instruction clears SREG[L] as expected from exceptions.
Fix/Workaround
When using the STCOND instruction, clear SREG[L] in the stacked value of SR before
returning from interrupts with RETE.
3.
Exceptions when system stack is protected by MPU
RETS behaves incorrectly when MPU is enabled and MPU is configured so that
system stack is not readable in unprivileged mode.
Fix/Woraround
Workaround 1: Make system stack readable in unprivileged mode,
or
Workaround 2: Return from supervisor mode using rete instead of rets. This
requires :
1. Changing the mode bits from 001b to 110b before issuing the instruction.
Updating the mode bits to the desired value must be done using a single mtsr
instruction so it is done atomically. Even if this step is described in general
as not safe in the UC technical reference guide, it is safe in this very
specific case.
2. Execute the RETE instruction.
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15.3
15.3.1
Rev. I
PWM
1. PWM channel interrupt enabling triggers an interrupt
When enabling a PWM channel that is configured with center aligned period (CALG=1), an
interrupt is signalled.
Fix/Workaround
When using center aligned mode, enable the channel and read the status before channel
interrupt is enabled.
2. PWM counter restarts at 0x0001
The PWM counter restarts at 0x0001 and not 0x0000 as specified. Because of this the first
PWM period has one more clock cycle.
Fix/Workaround
- The first period is 0x0000, 0x0001, ..., period
- Consecutive periods are 0x0001, 0x0002, ..., period
3. PWM update period to a 0 value does not work
It is impossible to update a period equal to 0 by the using the PWM update register
(PWM_CUPD).
Fix/Workaround
Do not update the PWM_CUPD register with a value equal to 0.
15.3.2
ADC
1. Sleep Mode activation needs additional A to D conversion
If the ADC sleep mode is activated when the ADC is idle the ADC will not enter sleep mode
before after the next AD conversion.
Fix/Workaround
Activate the sleep mode in the mode register and then perform an AD conversion.
15.3.3
SPI
1. SPI Slave / PDCA transfer: no TX UNDERRUN flag
There is no TX UNDERRUN flag available, therefore in SPI slave mode, there is no way to
be informed of a character lost in transmission.
Fix/Workaround
For PDCA transfer: none.
2. SPI FDIV option does not work
Selecting clock signal using FDIV = 1 does not work as specified.
Fix/Workaround
Do not set FDIV = 1.
3. SPI Bad Serial Clock Generation on 2nd chip_select when SCBR = 1, CPOL=1 and
NCPHA=0
When multiple CS are in use, if one of the baudrate equals to 1 and one of the others doesn't
equal to 1, and CPOL=1 and CPHA=0, then an aditional pulse will be generated on SCK.
Fix/workaround
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When multiple CS are in use, if one of the baudrate equals 1, the other must also equal 1 if
CPOL=1 and CPHA=0.
4. SPI Glitch on RXREADY flag in slave mode when enabling the SPI or during the first
transfer
In slave mode, the SPI can generate a false RXREADY signal during enabling of the SPI or
during the first transfer.
Fix/Workaround
1. Set slave mode, set required CPOL/CPHA.
2. Enable SPI.
3. Set the polarity CPOL of the line in the opposite value of the required one.
4. Set the polarity CPOL to the required one.
5. Read the RXHOLDING register.
Transfers can now befin and RXREADY will now behave as expected.
5. SPI Disable does not work in Slave mode
Fix/workaround
Read the last received data then perform a Software reset.
15.3.4
Power Manager
1. If the BOD level is higher than VDDCORE, the part is constantly under reset
If the BOD level is set to a value higher than VDDCORE and enabled by fuses, the part will
be in constant reset.
Fix/Workaround
Apply an external voltage on VDDCORE that is higher than the BOD level and is lower than
VDDCORE max and disable the BOD.
15.3.5
Flashc
1. On AT32UC3A0512 and AT32UC3A1512, corrupted read in flash after FLASHC WP,
EP, EA, WUP, EUP commands may happen
- After a FLASHC Write Page (WP) or Erase Page (EP) command applied to a page in a
given half of the flash (first or last 256 kB of flash), reading (data read or code fetch) the
other half of the flash may fail. This may lead to an exception or to other errors derived from
this corrupted read access.
- After a FLASHC Erase All (EA) command, reading (data read or code fetch) the flash may
fail. This may lead to an exception or to other errors derived from this corrupted read access.
- After a FLASHC Write User Page (WUP) or Erase User Page (EUP) command, reading
(data read or code fetch) the second half (last 256 kB) of the flash may fail. This may lead to
an exception or to other errors derived from this corrupted read access.
Fix/Workaround
Flashc WP, EP, EA, WUP, EUP commands: these commands must be issued from RAM or
through the EBI. After these commands, read twice one flash page initialized to 00h in each
half part of the flash.
15.3.6
PDCA
1. Wrong PDCA behavior when using two PDCA channels with the same PID.
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Workaround/fix
The same PID should not be assigned to more than one channel.
15.3.7
GPIO
1. Some GPIO VIH (input high voltage) are 3.6V max instead of 5V tolerant
Only 11 GPIOs remain 5V tolerant (VIHmax=5V):PB01, PB02, PB03, PB10, PB19, PB20,
PB21, PB22, PB23, PB27, PB28.
Workaround/fix
None.
15.3.8
USART
1. ISO7816 info register US_NER cannot be read
The NER register always returns zero.
Fix/Workaround
None.
15.3.9
TWI
1. The TWI RXRDY flag in SR register is not reset when a software reset is performed.
Fix/Workaround
After a Software Reset, the register TWI RHR must be read.
15.3.10
SDRAMC
1.
15.3.11
Code execution from external SDRAM does not work
Code execution from SDRAM does not work.
Fix/Workaround
Do not run code from SDRAM.
Processor and Architecture
1. LDM instruction with PC in the register list and without ++ increments Rp
For LDM with PC in the register list: the instruction behaves as if the ++ field is always set, ie
the pointer is always updated. This happens even if the ++ field is cleared. Specifically, the
increment of the pointer is done in parallel with the testing of R12.
Fix/Workaround
None.
2. RETE instruction does not clear SREG[L] from interrupts.
The RETE instruction clears SREG[L] as expected from exceptions.
Fix/Workaround
When using the STCOND instruction, clear SREG[L] in the stacked value of SR before
returning from interrupts with RETE.
3.
Exceptions when system stack is protected by MPU
RETS behaves incorrectly when MPU is enabled and MPU is configured so that
system stack is not readable in unprivileged mode.
Fix/Woraround
Workaround 1: Make system stack readable in unprivileged mode,
or
Workaround 2: Return from supervisor mode using rete instead of rets. This
requires :
1. Changing the mode bits from 001b to 110b before issuing the instruction.
Updating the mode bits to the desired value must be done using a single mtsr
instruction so it is done atomically. Even if this step is described in general
as not safe in the UC technical reference guide, it is safe in this very
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specific case.
2. Execute the RETE instruction.
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15.4
15.4.1
Rev. H
PWM
1. PWM channel interrupt enabling triggers an interrupt
When enabling a PWM channel that is configured with center aligned period (CALG=1), an
interrupt is signalled.
Fix/Workaround
When using center aligned mode, enable the channel and read the status before channel
interrupt is enabled.
2. PWM counter restarts at 0x0001
The PWM counter restarts at 0x0001 and not 0x0000 as specified. Because of this the first
PWM period has one more clock cycle.
Fix/Workaround
- The first period is 0x0000, 0x0001, ..., period
- Consecutive periods are 0x0001, 0x0002, ..., period
3. PWM update period to a 0 value does not work
It is impossible to update a period equal to 0 by the using the PWM update register
(PWM_CUPD).
Fix/Workaround
Do not update the PWM_CUPD register with a value equal to 0.
15.4.2
ADC
1. Sleep Mode activation needs additional A to D conversion
If the ADC sleep mode is activated when the ADC is idle the ADC will not enter sleep mode
before after the next AD conversion.
Fix/Workaround
Activate the sleep mode in the mode register and then perform an AD conversion.
15.4.3
SPI
1. SPI Slave / PDCA transfer: no TX UNDERRUN flag
There is no TX UNDERRUN flag available, therefore in SPI slave mode, there is no way to
be informed of a character lost in transmission.
Fix/Workaround
For PDCA transfer: none.
2. SPI FDIV option does not work
Selecting clock signal using FDIV = 1 does not work as specified.
Fix/Workaround
Do not set FDIV = 1
3. SPI disable does not work in SLAVE mode.
Fix/Workaround
Read the last received data, then perform a Software Reset.
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4. SPI Bad Serial Clock Generation on 2nd chip_select when SCBR = 1, CPOL=1 and
NCPHA=0
When multiple CS are in use, if one of the baudrate equals to 1 and one of the others doesn't
equal to 1, and CPOL=1 and CPHA=0, then an aditional pulse will be generated on SCK.
Fix/workaround
When multiple CS are in use, if one of the baudrate equals 1, the other must also equal 1 if
CPOL=1 and CPHA=0.
5. SPI Glitch on RXREADY flag in slave mode when enabling the SPI or during the first
transfer
In slave mode, the SPI can generate a false RXREADY signal during enabling of the SPI or
during the first transfer.
Fix/Workaround
1. Set slave mode, set required CPOL/CPHA.
2. Enable SPI.
3. Set the polarity CPOL of the line in the opposite value of the required one.
4. Set the polarity CPOL to the required one.
5. Read the RXHOLDING register.
Transfers can now befin and RXREADY will now behave as expected.
15.4.4
6. SPI Disable does not work in Slave mode
Fix/workaround
Read the last received data then perform a Software reset.
Power Manager
1. Wrong reset causes when BOD is activated
Setting the BOD enable fuse will cause the Reset Cause Register to list BOD reset as the
reset source even though the part was reset by another source.
Fix/Workaround
Do not set the BOD enable fuse, but activate the BOD as soon as your program starts.
2. If the BOD level is higher than VDDCORE, the part is constantly under reset
If the BOD level is set to a value higher than VDDCORE and enabled by fuses, the part will
be in constant reset.
Fix/Workaround
Apply an external voltage on VDDCORE that is higher than the BOD level and is lower than
VDDCORE max and disable the BOD.
15.4.5
FLASHC
1. On AT32UC3A0512 and AT32UC3A1512, corrupted read in flash after FLASHC WP,
EP, EA, WUP, EUP commands may happen
- After a FLASHC Write Page (WP) or Erase Page (EP) command applied to a page in a
given half of the flash (first or last 256 kB of flash), reading (data read or code fetch) the
other half of the flash may fail. This may lead to an exception or to other errors derived from
this corrupted read access.
- After a FLASHC Erase All (EA) command, reading (data read or code fetch) the flash may
fail. This may lead to an exception or to other errors derived from this corrupted read access.
- After a FLASHC Write User Page (WUP) or Erase User Page (EUP) command, reading
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(data read or code fetch) the second half (last 256 kB) of the flash may fail. This may lead to
an exception or to other errors derived from this corrupted read access.
Fix/Workaround
Flashc WP, EP, EA, WUP, EUP commands: these commands must be issued from RAM or
through the EBI. After these commands, read twice one flash page initialized to 00h in each
half part of the flash.
15.4.6
PDCA
1. Wrong PDCA behavior when using two PDCA channels with the same PID.
Workaround/fix
The same PID should not be assigned to more than one channel.
15.4.7
TWI
1. The TWI RXRDY flag in SR register is not reset when a software reset is performed.
Fix/Workaround
After a Software Reset, the register TWI RHR must be read.
15.4.8
SDRAMC
1.
Code execution from external SDRAM does not work
Code execution from SDRAM does not work.
Fix/Workaround
Do not run code from SDRAM.
15.4.9
GPIO
1. Some GPIO VIH (input high voltage) are 3.6V max instead of 5V tolerant
Only 11 GPIOs remain 5V tolerant (VIHmax=5V):PB01, PB02, PB03, PB10, PB19, PB20,
PB21, PB22, PB23, PB27, PB28.
Workaround/fix
None.
15.4.10
USART
15.4.11
1. ISO7816 info register US_NER cannot be read
The NER register always returns zero.
Fix/Workaround
None.
Processor and Architecture
1. LDM instruction with PC in the register list and without ++ increments Rp
For LDM with PC in the register list: the instruction behaves as if the ++ field is always set, ie
the pointer is always updated. This happens even if the ++ field is cleared. Specifically, the
increment of the pointer is done in parallel with the testing of R12.
Fix/Workaround
None.
2. RETE instruction does not clear SREG[L] from interrupts.
The RETE instruction clears SREG[L] as expected from exceptions.
Fix/Workaround
When using the STCOND instruction, clear SREG[L] in the stacked value of SR before
returning from interrupts with RETE.
3.
Exceptions when system stack is protected by MPU
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RETS behaves incorrectly when MPU is enabled and MPU is configured so that
system stack is not readable in unprivileged mode.
Fix/Woraround
Workaround 1: Make system stack readable in unprivileged mode,
or
Workaround 2: Return from supervisor mode using rete instead of rets. This
requires :
1. Changing the mode bits from 001b to 110b before issuing the instruction.
Updating the mode bits to the desired value must be done using a single mtsr
instruction so it is done atomically. Even if this step is described in general
as not safe in the UC technical reference guide, it is safe in this very
specific case.
2. Execute the RETE instruction.
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15.5
Rev. E
15.5.1
SPI
1. SPI FDIV option does not work
Selecting clock signal using FDIV = 1 does not work as specified.
Fix/Workaround
Do not set FDIV = 1.
2. SPI Slave / PDCA transfer: no TX UNDERRUN flag
There is no TX UNDERRUN flag available, therefore in SPI slave mode, there is no way to
be informed of a character lost in transmission.
Fix/Workaround
For PDCA transfer: none.
3. SPI Bad serial clock generation on 2nd chip select when SCBR=1, CPOL=1 and
CNCPHA=0
When multiple CS are in use, if one of the baudrate equals to 1 and one of the others
doesn’t equal to 1, and CPOL=1 and CPHA=0, then an additional pulse will be generated on
SCK.
Fix/Workaround
When multiple CS are in use, if one of the baudrate equals to 1, the other must also equal 1
if CPOL=1 and CPHA=0.
4. SPI Glitch on RXREADY flag in slave mode when enabling the SPI or during the first
transfer
In slave mode, the SPI can generate a false RXREADY signal during enabling of the SPI or
during the first transfer.
Fix/Workaround
1. Set slave mode, set required CPOL/CPHA.
2. Enable SPI.
3. Set the polarity CPOL of the line in the opposite value of the required one.
4. Set the polarity CPOL to the required one.
5. Read the RXHOLDING register.
Transfers can now befin and RXREADY will now behave as expected.
5. SPI CSNAAT bit 2 in register CSR0...CSR3 is not available.
Fix/Workaround
Do not use this bit.
6. SPI disable does not work in SLAVE mode.
Fix/Workaround
Read the last received data, then perform a Software Reset.
7. SPI Bad Serial Clock Generation on 2nd chip_select when SCBR = 1, CPOL=1 and
NCPHA=0
When multiple CS are in use, if one of the baudrate equals to 1 and one of the others doesn't
equal to 1, and CPOL=1 and CPHA=0, then an aditional pulse will be generated on SCK.
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Fix/workaround
When multiple CS are in use, if one of the baudrate equals 1, the other must also equal 1 if
CPOL=1 and CPHA=0.
15.5.2
PWM
1. PWM counter restarts at 0x0001
The PWM counter restarts at 0x0001 and not 0x0000 as specified. Because of this the first
PWM period has one more clock cycle.
Fix/Workaround
- The first period is 0x0000, 0x0001, ..., period
- Consecutive periods are 0x0001, 0x0002, ..., period
2. PWM channel interrupt enabling triggers an interrupt
When enabling a PWM channel that is configured with center aligned period (CALG=1), an
interrupt is signalled.
Fix/Workaround
When using center aligned mode, enable the channel and read the status before channel
interrupt is enabled.
3. PWM update period to a 0 value does not work
It is impossible to update a period equal to 0 by the using the PWM update register
(PWM_CUPD).
Fix/Workaround
Do not update the PWM_CUPD register with a value equal to 0.
4.
PWM channel status may be wrong if disabled before a period has elapsed
Before a PWM period has elapsed, the read channel status may be wrong. The CHIDx-bit
for a PWM channel in the PWM Enable Register will read '1' for one full PWM period even if
the channel was disabled before the period elapsed. It will then read '0' as expected.
Fix/Workaround
Reading the PWM channel status of a disabled channel is only correct after a PWM period
has elapsed.
15.5.3
SSC
1. SSC does not trigger RF when data is low
The SSC cannot transmit or receive data when CKS = CKDIV and CKO = none, in TCMR or
RCMR respectively.
Fix/Workaround
Set CKO to a value that is not "none" and bypass the output of the TK/RK pin with the PIO.
2. SSC Data is not sent unless clock is set as output
The SSC cannot transmit or receive data when CKS = CKDIV and CKO = none, in TCMR or
RCMR respectively.
Fix/Workaround
Set CKO to a value that is not "none" and bypass the output of the TK/RK pin with the PIO.
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15.5.4
USB
1.
USB No end of host reset signaled upon disconnection
In host mode, in case of an unexpected device disconnection whereas a usb reset is being
sent by the usb controller, the UHCON.RESET bit may not been cleared by the hardware at
the end of the reset.
Fix/Workaround
A software workaround consists in testing (by polling or interrupt) the disconnection
(UHINT.DDISCI == 1) while waiting for the end of reset (UHCON.RESET == 0) to avoid
being stuck.
2. USBFSM and UHADDR1/2/3 registers are not available.
Do not use USBFSM register.
Fix/Workaround
Do not use USBFSM register and use HCON[6:0] field instead for all the pipes.
15.5.5
Processor and Architecture
1. Incorrect Processor ID
The processor ID reads 0x01 and not 0x02 as it should.
Fix/Workaround
None.
2. Bus error should be masked in Debug mode
If a bus error occurs during debug mode, the processor will not respond to debug commands through the DINST register.
Fix/Workaround
A reset of the device will make the CPU respond to debug commands again.
3. Read Modify Write (RMW) instructions on data outside the internal RAM does not
work.
Read Modify Write (RMW) instructions on data outside the internal RAM does not work.
Fix/Workaround
Do not perform RMW instructions on data outside the internal RAM.
4.
CRC calculation of a locked device will calculate CRC for 512 kB of flash memory,
even though the part has less flash.
Fix/Workaround
The flash address space is wrapping, so it is possible to use the CRC value by calculating
CRC of the flash content concatenated with itself N times. Where N is 512 kB/flash size.
5.
Need two NOPs instruction after instructions masking interrupts
The instructions following in the pipeline the instruction masking the interrupt through SR
may behave abnormally.
Fix/Workaround
Place two NOPs instructions after each SSRF or MTSR instruction setting IxM or GM in SR.
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6. CPU Cycle Counter does not reset the COUNT system register on COMPARE match.
The device revision E does not reset the COUNT system register on COMPARE match. In
this revision, the COUNT register is clocked by the CPU clock, so when the CPU clock
stops, so does incrementing of COUNT.
Fix/Workaround
None.
7. Memory Protection Unit (MPU) is non functional.
Fix/Workaround
Do not use the MPU.
8. The following alternate GPIO function C are not available in revE
MACB-WOL on GPIO9 (PA09), MACB-WOL on GPIO18 (PA18), USB-USB_ID on GPIO21
(PA21), USB-USB_VBOF on GPIO22 (PA22), and all function B and C on GPIO70 to
GPIO101 (PX00 to PX39).
Fix/Workaround
Do not use these alternate B and C functions on the listed GPIO pins.
9.
Clock connection table on Rev E
Here is the table of Rev E
Figure 15-1. Timer/Counter clock connections on RevE
Source
Name
Connection
Internal
TIMER_CLOCK1
32 KHz Oscillator
TIMER_CLOCK2
PBA Clock / 4
TIMER_CLOCK3
PBA Clock / 8
TIMER_CLOCK4
PBA Clock / 16
TIMER_CLOCK5
PBA Clock / 32
External
XC0
XC1
XC2
10. Local Bus fast GPIO not available in RevE.
Fix/Workaround
Do not use on this silicon revision.
11. Spurious interrupt may corrupt core SR mode to exception
If the rules listed in the chapter `Masking interrupt requests in peripheral modules' of the
AVR32UC Technical Reference Manual are not followed, a spurious interrupt may occur. An
interrupt context will be pushed onto the stack while the core SR mode will indicate an
exception. A RETE instruction would then corrupt the stack..
Fix/Workaround
Follow the rules of the AVR32UC Technical Reference Manual. To increase software
robustness, if an exception mode is detected at the beginning of an interrupt handler,
change the stack interrupt context to an exception context and issue a RETE instruction.
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12. CPU cannot operate on a divided slow clock (internal RC oscillator)
Fix/Workaround
Do not run the CPU on a divided slow clock.
13. LDM instruction with PC in the register list and without ++ increments Rp
For LDM with PC in the register list: the instruction behaves as if the ++ field is always set, ie
the pointer is always updated. This happens even if the ++ field is cleared. Specifically, the
increment of the pointer is done in parallel with the testing of R12.
Fix/Workaround
None.
14. RETE instruction does not clear SREG[L] from interrupts.
The RETE instruction clears SREG[L] as expected from exceptions.
Fix/Workaround
When using the STCOND instruction, clear SREG[L] in the stacked value of SR before
returning from interrupts with RETE.
15. Exceptions when system stack is protected by MPU
RETS behaves incorrectly when MPU is enabled and MPU is configured so that
system stack is not readable in unprivileged mode.
Fix/Woraround
Workaround 1: Make system stack readable in unprivileged mode,
or
Workaround 2: Return from supervisor mode using rete instead of rets. This
requires :
1. Changing the mode bits from 001b to 110b before issuing the instruction.
Updating the mode bits to the desired value must be done using a single mtsr
instruction so it is done atomically. Even if this step is described in general
as not safe in the UC technical reference guide, it is safe in this very
specific case.
2. Execute the RETE instruction.
15.5.6
SDRAMC
1.
Code execution from external SDRAM does not work
Code execution from SDRAM does not work.
Fix/Workaround
Do not run code from SDRAM.
2.
SDRAM SDCKE rise at the same time as SDCK while exiting self-refresh mode
SDCKE rise at the same time as SDCK while exiting self-refresh mode.
Fix/Workaround
None.
15.5.7
USART
1.
USART Manchester Encoder Not Working
Manchester encoding/decoding is not working.
Fix/Workaround
Do not use manchester encoding.
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2.
USART RXBREAK problem when no timeguard
In asynchronous mode the RXBREAK flag is not correctly handled when the timeguard is 0
and the break character is located just after the stop bit.
Fix/Workaround
If the NBSTOP is 1, timeguard should be different from 0.
3.
USART Handshaking: 2 characters sent / CTS rises when TX
If CTS switches from 0 to 1 during the TX of a character, if the Holding register is not empty,
the TXHOLDING is also transmitted.
Fix/Workaround
None.
4.
USART PDC and TIMEGUARD not supported in MANCHESTER
Manchester encoding/decoding is not working.
Fix/Workaround
Do not use manchester encoding.
5. USART SPI mode is non functional on this revision.
Fix/Workaround
Do not use the USART SPI mode.
6. DCD is active High instead of Low.
In modem mode the DCD signal is assumed to be active high by the USART, butshould
have been active low.
Fix/Workaround
Add an external inverter to the DCD line.
15.5.8
7. ISO7816 info register US_NER cannot be read
The NER register always returns zero.
Fix/Workaround
None.
Power Manager
1.
Voltage regulator input and output is connected to VDDIO and VDDCORE inside the
device
The voltage regulator input and output is connected to VDDIO and VDDCORE respectively
inside the device.
Fix/Workaround
Do not supply VDDCORE externally, as this supply will work in paralell with the regulator.
2. Wrong reset causes when BOD is activated
Setting the BOD enable fuse will cause the Reset Cause Register to list BOD reset as the
reset source even though the part was reset by another source.
Fix/Workaround
Do not set the BOD enable fuse, but activate the BOD as soon as your program starts.
3. PLL0/1 Lock control does not work
Lock Control does not work for PLL0 and PLL1.
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Fix/Workaround
In PLL0/1 Control register, the bit 7 should be set in order to prevent unexpected behaviour.
4. Peripheral Bus A maximum frequency is 33MHz instead of 66MHz.
Fix/Workaround
Do not set PBA frequency higher than 33 MHz.
5.
PCx pins go low in stop mode
In sleep mode stop all PCx pins will be controlled by GPIO module instead of oscillators.
This can cause drive contention on the XINx in worst case.
Fix/Workaround
Before entering stop mode set all PCx pins to input and GPIO controlled.
6.
On some rare parts, the maximum HSB and CPU speed is 50MHz instead of 66MHz.
Fix/Workaround
Do not set the HSB/CPU speed higher than 50MHz when the firmware generate exceptions.
7. If the BOD level is higher than VDDCORE, the part is constantly under reset
If the BOD level is set to a value higher than VDDCORE and enabled by fuses, the part will
be in constant reset.
Fix/Workaround
Apply an external voltage on VDDCORE that is higher than the BOD level and is lower than
VDDCORE max and disable the BOD.
8. System Timer mask (Bit 16) of the PM CPUMASK register is not available.
Fix/Workaround
Do not use this bit.
15.5.9
HMatrix
1. HMatrix fixed priority arbitration does not work
Fixed priority arbitration does not work.
Fix/Workaround
Use Round-Robin arbitration instead.
15.5.10
ADC
1.
ADC possible miss on DRDY when disabling a channel
The ADC does not work properly when more than one channel is enabled.
Fix/Workaround
Do not use the ADC with more than one channel enabled at a time.
2.
ADC OVRE flag sometimes not reset on Status Register read
The OVRE flag does not clear properly if read simultaneously to an end of conversion.
Fix/Workaround
None.
3. Sleep Mode activation needs additional A to D conversion
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If the ADC sleep mode is activated when the ADC is idle the ADC will not enter sleep mode
before after the next AD conversion.
Fix/Workaround
Activate the sleep mode in the mode register and then perform an AD conversion.
15.5.11
ABDAC
1. Audio Bitstream DAC is not functional.
Fix/Workaround
Do not use the ABDAC on revE.
15.5.12
FLASHC
1. The address of Flash General Purpose Fuse Register Low (FGPFRLO) is 0xFFFE140C
on revE instead of 0xFFFE1410.
Fix/Workaround
None.
2. The command Quick Page Read User Page(QPRUP) is not functional.
Fix/Workaround
None.
3. PAGEN Semantic Field for Program GP Fuse Byte is WriteData[7:0], ByteAddress[1:0]
on revision E instead of WriteData[7:0], ByteAddress[2:0].
Fix/Workaround
None.
4. On AT32UC3A0512 and AT32UC3A1512, corrupted read in flash after FLASHC WP,
EP, EA, WUP, EUP commands may happen
- After a FLASHC Write Page (WP) or Erase Page (EP) command applied to a page in a
given half of the flash (first or last 256 kB of flash), reading (data read or code fetch) the
other half of the flash may fail. This may lead to an exception or to other errors derived from
this corrupted read access.
- After a FLASHC Erase All (EA) command, reading (data read or code fetch) the flash may
fail. This may lead to an exception or to other errors derived from this corrupted read access.
- After a FLASHC Write User Page (WUP) or Erase User Page (EUP) command, reading
(data read or code fetch) the second half (last 256 kB) of the flash may fail. This may lead to
an exception or to other errors derived from this corrupted read access.
Fix/Workaround
Flashc WP, EP, EA, WUP, EUP commands: these commands must be issued from RAM or
through the EBI. After these commands, read twice one flash page initialized to 00h in each
half part of the flash.
15.5.13
RTC
1. Writes to control (CTRL), top (TOP) and value (VAL) in the RTC are discarded if the
RTC peripheral bus clock (PBA) is divided by a factor of four or more relative to the
HSB clock.
Fix/Workaround
Do not write to the RTC registers using the peripheral bus clock (PBA) divided by a factor of
four or more relative to the HSB clock.
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2. The RTC CLKEN bit (bit number 16) of CTRL register is not available.
Fix/Workaround
Do not use the CLKEN bit of the RTC on Rev E.
15.5.14
OCD
1. Stalled memory access instruction writeback fails if followed by a HW breakpoint.
Consider the following assembly code sequence:
A
B
If a hardware breakpoint is placed on instruction B, and instruction A is a memory access
instruction, register file updates from instruction A can be discarded.
Fix/Workaround
Do not place hardware breakpoints, use software breakpoints instead.
Alternatively, place a hardware breakpoint on the instruction before the memory
access instruction and then single step over the memory access instruction.
15.5.15
PDCA
1. Wrong PDCA behavior when using two PDCA channels with the same PID.
Workaround/fix
The same PID should not be assigned to more than one channel.
15.5.16
TWI
1. The TWI RXRDY flag in SR register is not reset when a software reset is performed.
Fix/Workaround
After a Software Reset, the register TWI RHR must be read.
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16. Datasheet Revision History
Please note that the referring page numbers in this section are referred to this document. The
referring revision in this section are referring to the document revision.
16.1
16.2
16.3
16.4
16.5
Rev. K – 01/12
1.
Update ”Errata” on page 70.
2.
Update eletrical characteristic in ”DC Characteristics” on page 41.
3.
Remove Preliminary from first page.
1.
Update ”Errata” on page 70.
2.
Update GPIO eletrical characteristic in ”DC Characteristics” on page 41.
1.
Add revision J to ”Errata” on page 70.
2.
Update DMIPS number in ”Features” on page 1.
1.
Open Drain Mode removed from ”General-Purpose Input/Output Controller (GPIO)”
on page 151.
1.
Updated ”Signal Description List” on page 8. Removed RXDN and TXDN from
USART section.
2.
Updated ”Errata” on page 70. Rev G replaced by rev H.
Rev. G – 01/09
Rev. F – 08/08
Rev. E – 04/08
Rev. D – 04/08
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16.6
16.7
16.8
Rev. C – 10/07
1.
Updated ”Signal Description List” on page 8. Removed RXDN and TXDN from
USART section.
2.
Updated ”Errata” on page 70. Rev G replaced by rev H.
1.
Updated ”Features” on page 1.
2.
Update ”Blockdiagram” on page 4 with local bus.
3.
Updated ”Peripherals” on page 34 with local bus.
4.
Add SPI feature in ”Universial Synchronous/Asynchronous Receiver/Transmitter
(USART)” on page 315.
5.
Updated ”USB On-The-Go Interface (USBB)” on page 517.
6.
Updated ”JTAG and Boundary Scan” on page 750 with programming procedure .
7.
Add description for silicon Rev G.
1.
Initial revision.
Rev. B – 10/07
Rev. A – 03/07
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Table of Contents
1
Description ............................................................................................... 3
2
Configuration Summary .......................................................................... 4
3
Abbreviations ........................................................................................... 4
4
Blockdiagram ........................................................................................... 5
4.1Processor and architecture .......................................................................................6
5
Signals Description ................................................................................. 8
6
Package and Pinout ............................................................................... 13
7
Power Considerations ........................................................................... 17
7.1Power Supplies .......................................................................................................17
7.2Voltage Regulator ....................................................................................................18
7.3Analog-to-Digital Converter (A.D.C) reference. .......................................................19
8
I/O Line Considerations ......................................................................... 20
8.1JTAG pins ................................................................................................................20
8.2RESET_N pin ..........................................................................................................20
8.3TWI pins ..................................................................................................................20
8.4GPIO pins ................................................................................................................20
9
Memories ................................................................................................ 21
9.1Embedded Memories ..............................................................................................21
9.2Physical Memory Map .............................................................................................21
9.3Bus Matrix Connections ..........................................................................................22
10 Peripherals ............................................................................................. 24
10.1Peripheral address map ........................................................................................24
10.2CPU Local Bus Mapping .......................................................................................25
10.3Interrupt Request Signal Map ................................................................................27
10.4Clock Connections ................................................................................................29
10.5Nexus OCD AUX port connections .......................................................................30
10.6PDC handshake signals ........................................................................................30
10.7Peripheral Multiplexing on I/O lines .......................................................................31
10.8Oscillator Pinout ....................................................................................................34
10.9USART Configuration ............................................................................................34
10.10GPIO ...................................................................................................................35
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10.11Peripheral overview .............................................................................................35
11 Boot Sequence ....................................................................................... 39
11.1Starting of clocks ...................................................................................................39
11.2Fetching of initial instructions ................................................................................39
12 Electrical Characteristics ...................................................................... 40
12.1Absolute Maximum Ratings* .................................................................................40
12.2DC Characteristics ................................................................................................41
12.3Regulator characteristics .......................................................................................42
12.4Analog characteristics ...........................................................................................42
12.5Power Consumption ..............................................................................................44
12.6Clock Characteristics .............................................................................................46
12.7Crystal Oscillator Characteristis ............................................................................47
12.8ADC Characteristics ..............................................................................................49
12.9EBI Timings ...........................................................................................................51
12.10JTAG Timings ......................................................................................................57
12.11SPI Characteristics ..............................................................................................58
12.12MACB Characteristics .........................................................................................60
12.13Flash Characteristics ...........................................................................................62
13 Mechanical Characteristics ................................................................... 64
13.1Thermal Considerations ........................................................................................64
13.2Package Drawings ................................................................................................65
13.3Soldering Profile ....................................................................................................68
14 Ordering Information ............................................................................. 69
14.1Automotive Quality Grade .....................................................................................69
15 Errata ....................................................................................................... 70
15.1Rev. K,L,M..............................................................................................................70
15.2Rev. J ....................................................................................................................73
15.3Rev. I .....................................................................................................................76
15.4Rev. H ...................................................................................................................80
15.5Rev. E ....................................................................................................................84
16 Datasheet Revision History .................................................................. 93
16.1Rev. K – 01/12 ........................................................................................................93
16.1Rev. H – 03/09 ......................................................................................................93
16.2Rev. G – 01/09 ......................................................................................................93
16.3Rev. F – 08/08 .......................................................................................................93
AT32UC3A
16.4Rev. E – 04/08 .......................................................................................................93
16.5Rev. D – 04/08 ......................................................................................................93
16.6Rev. C – 10/07 ......................................................................................................94
16.7Rev. B – 10/07 .......................................................................................................94
16.8Rev. A – 03/07 .......................................................................................................94
III
32058KS–AVR32–01/12
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