ATA6560/1
High-Speed CAN Transceiver with Standby Mode
CAN FD Ready
Features
General Description
• Fully ISO 11898-2, ISO 11898-5, and SAE J2284
Compliant
• CAN FD Ready
• Communication Speed up to 5 Mbps
• Low Electromagnetic Emission (EME) and High
Electromagnetic Immunity (EMI)
• Differential Receiver with Wide Common-Mode
Range
• ATA6560: Silent Mode (Receive Only)
• Remote Wake-Up Capability via CAN Bus
• Functional Behavior Predictable under All Supply
Conditions
• Transceiver Disengages from the Bus when Not
Powered Up
• RXD Recessive Clamping Detection
• High Electrostatic Discharge (ESD) Handling
Capability on the Bus Pins
• Bus Pins Protected Against Transients in
Automotive Environments
• Transmit Data (TXD) Dominant Time-Out
Function
• Undervoltage Detection on VCC and VIO Pins
• CANH/CANL Short-Circuit and Overtemperature
Protected
• Qualified According to AEC-Q100: Only
ATA6560-GAQW, ATA6560-GBQW,
ATA6561-GAQW, and ATA6561-GBQW
• Packages: SOIC8, VDFN8 with Wettable Flanks
(Moisture Sensitivity Level 1)
The ATA6560/1 is a high-speed CAN transceiver that
provides an interface between a Controller Area
Network (CAN) protocol controller and the physical
two-wire CAN bus. The transceiver is designed for
high-speed (up to 5 Mbps) CAN applications in the
automotive industry, providing differential transmit and
receive capability to (a microcontroller with) a CAN
protocol controller.
Applications
Classical CAN and CAN FD networks in the following
applications:
•
•
•
•
•
Automotive
Industrial
Aerospace
Medical
Consumer
2018-2019 Microchip Technology Inc.
It offers improved Electromagnetic Compatibility (EMC)
and ESD performance, as well as features such as:
• Ideal passive behavior to the CAN bus when the
supply voltage is off
• Direct interfacing to microcontrollers with supply
voltages from 3V to 5V (ATA6561)
Three operating modes, together with the dedicated
fail-safe features, make the ATA6560/1 an excellent
choice for all types of high-speed CAN networks,
especially in nodes requiring a Low-Power mode with
wake-up capability via the CAN bus.
Package Types
ATA6560
SOIC
ATA6561
SOIC
TXD 1
8 STBY
TXD 1
8 STBY
GND 2
7 CANH
GND 2
7 CANH
VCC 3
6 CANL
VCC 3
6 CANL
RXD 4
5 NSIL
RXD 4
5 VIO
ATA6561
3 x 3 VDFN* with
wettable flanks
ATA6560
3 x 3 VDFN* with
wettable flanks
TXD
1
8
STBY
TXD
1
8
STBY
GND
2
7
CANH
GND
2
7
CANH
3
6
CANL
4
5
VIO
VCC
3
6
CANL
VCC
RXD
4
5
NSIL
RXD
*Includes Exposed Thermal Pad (EP); see Table 1-2.
DS20005991B-page 1
ATA6560/1
ATA6560/1 FAMILY MEMBERS
Device
VIO Pin
NSIL Pin
ATA6560-GAQW
X
ATA6560-GBQW
X
ATA6561-GAQW
X
ATA6561-GBQW
X
X
X
ATA6561-GBQW-N
X
Note:
AEC-Q100
Qualified
X
X
Standby mode and Silent mode
X
Standby mode and Silent mode
X
Standby mode, VIO - pin for
compatibility with 3.3V and 5V
microcontroller
X
Standby mode, VIO - pin for
compatibility with 3.3V and 5V
microcontroller
X
X
ATA6560-GBQW-N
X
SOIC8
X
ATA6560-GAQW-N
ATA6561-GAQW-N
VDFN8
Description
X
Standby mode and Silent mode
X
Standby mode and Silent mode
X
Standby mode, VIO - pin for
compatibility with 3.3V and 5V
microcontroller
X
Standby mode, VIO - pin for
compatibility with 3.3V and 5V
microcontroller
For ordering information, see the Product Identification System section.
DS20005991B-page 2
2018-2019 Microchip Technology Inc.
ATA6560/1
Functional Block Diagram
VIO
VCC
5(1)
3
ATA6560/1
9&&
Temperature
Protection
VIO(1)
7
CANH
TXD
1
VIO(1)
STBY
TXD
Time-Out
Timer
Slope
Control
and
Driver
6
CANL
8
VIO(1)
Control
Unit
5(1)
NSIL
HSC(2)
VIO(1)
RXD
4
MUX
Wake-Up
Filter
WUC(3)
2
GND
Note 1: Pin 5: ATA6561: VIO
ATA6560: NSIL (the VIO line and the VCC line are internally connected)
2: HSC: High-Speed Comparator
3: Wake-Up Comparator
2018-2019 Microchip Technology Inc.
DS20005991B-page 3
ATA6560/1
1.0
FUNCTIONAL DESCRIPTION
• ATA6561: Pin 5 is the VIO pin and should be
connected to the microcontroller supply voltage.
This allows direct interfacing to microcontrollers
with supply voltages down to 3V and adjusts the
signal levels of the TXD, RXD, and STBY pins to
the I/O levels of the microcontroller. The I/O ports
are supplied by the VIO pin.
The ATA6560/1 is a stand-alone, high-speed CAN
transceiver, compliant with the ISO 11898-2 and
ISO 11898-5 standards. It provides a very low current
consumption in Standby mode and wake-up capability
via the CAN bus. There are two versions available, only
differing in the function of pin 5:
1.1
• ATA6560: Pin 5 is the control input for Silent mode
NSIL, allowing the ATA6560 to only receive data
and not send data via the bus. The output driver
stage is disabled. The VIO line and the VCC line
are internally connected; this sets the signal levels
of the TXD, RXD, STBY, and NSIL pins to levels
compatible with 5V microcontrollers.
FIGURE 1-1:
Operating Modes
The ATA6561 supports three operating modes: Unpowered, Standby, and Normal. The ATA6560 has an additional Silent mode. These modes can be selected via
the STBY and NSIL pin. See Figure 1-1 and Table 1-1
for a description of the operating modes.
OPERATING MODES
ATA6560
VCC < Vuvd(VCC)
ATA6561
VCC < Vuvd(VCC)
STBY = 1
Standby
Mode
VCC < Vuvd(VCC) or
VIO < Vuvd(VIO)
Unpowered
Mode
VCC < Vuvd(VCC) or
VIO < Vuvd(VIO)
VCC > Vuvd(VCC)
STBY = 1
STBY = 0 and
(NSIL = 0 or
TXD = 0)
VCC < Vuvd(VCC) or
VIO < Vuvd(VIO)
VCC < Vuvd(VCC)
Unpowered
Mode
VCC > Vuvd(VCC) and
VIO > Vuvd(VIO)
STBY = 1
STBY = 1
Standby
Mode
STBY = 0 and
TXD = 0
STBY = 0 and
NSIL = 1 and
STBY = 0 and
TXD = 1 and
Error = 0
TXD = 1 and
Error = 0
NSIL = 1 and
TXD = 1 and
Error = 0
Error = 0 and
TXD = 1
Silent
Mode
Silent
Mode
Normal
Mode
Normal
Mode
Error = 1
NSIL = 0 or
Error = 1
Note 1: The Silent mode is externally not accessible.
2: For the ATA6561, NSIL is internally set to “1”.
TABLE 1-1:
OPERATING MODES
Mode
Inputs
STBY
(3)
Outputs
NSIL
TXD
CAN Driver
RXD
X(3)
X(3)
Recessive
Recessive
Standby
HIGH
X(3)
X(3)
Recessive
Active(4)
Silent (only for ATA6560)
LOW
LOW
X(3)
Recessive
Active(1)
LOW
HIGH(2)
LOW
Dominant
LOW
LOW
(2)
HIGH
Recessive
HIGH
Unpowered
Normal
Note 1:
2:
3:
4:
X
HIGH
LOW if the CAN bus is dominant, and HIGH if the CAN bus is recessive.
Internally pulled up if not bonded out.
Irrelevant.
Reflects the bus only for wake-up.
DS20005991B-page 4
2018-2019 Microchip Technology Inc.
ATA6560/1
1.1.1
NORMAL MODE
A low level on the STBY pin, together with a high level on
pins TXD and NSIL, selects the Normal mode. In this
mode, the transceiver can transmit and receive data via
the CANH and CANL bus lines (see the “Functional
Block Diagram”). The output driver stage is active and
drives data from the TXD input to the CAN bus. The
High-Speed Comparator (HSC) converts the analog data
on the bus lines into digital data, which is output to pin
RXD. The bus biasing is set to VVCC/2, and the
undervoltage monitoring of VCC is active.
FIGURE 1-2:
The slope of the output signals on the bus lines is
controlled and optimized to ensure the lowest possible
EME.
To switch the device to a normal operating mode, set
the STBY pin to low and the TXD and NSIL pins (if
applicable) to high (see Table 1-1, Figure 1-3, and
Figure 1-3). Both the STBY and the NSIL pins provide
a pull-up resistor to VIO, thus ensuring defined levels if
the pins are open.
The device cannot enter the Normal mode as long as
the TXD is at ground level. ATA6560 only switches to
the Normal mode when all inputs are set accordingly.
SWITCHING FROM STANDBY MODE TO NORMAL MODE (NSIL = HIGH)
STBY
t
TXD
t
tdel(stby-norm) =
47μs max
Operation
Pode
Normal Pode
Standby Pode
t
FIGURE 1-3:
SWITCHING FROM SILENT MODE TO NORMAL MODE
STBY
t
NSIL
t
TXD
t
tdel(sil-norm) =
10μs max
Operation
Pode
Silent Pode
Normal Pode
t
2018-2019 Microchip Technology Inc.
DS20005991B-page 5
ATA6560/1
1.1.2
SILENT MODE (ONLY FOR THE
ATA6560)
A low level on the NSIL pin (available on pin 5) and on
the STBY pin selects the Silent mode. This
receive-only mode can be used to test the connection
of the bus medium. In the Silent mode, the ATA6560
can still receive data from the bus, but the transmitter is
disabled and therefore no data can be sent to the CAN
bus. The bus pins are released to recessive state. All
other IC functions, including the HSC, continue to operate as they do in the Normal mode. The Silent mode
can be used to prevent a faulty CAN controller from
disrupting all network communications.
1.1.3
STANDBY MODE
A high level on the STBY pin selects the Standby
mode. In this mode, the transceiver cannot transmit or
correctly receive data via the bus lines. The transmitter
and the HSC are switched off to reduce current
consumption, and only the low-power Wake-Up
Comparator (WUC) monitors the bus lines for a valid
wake-up signal. A signal change on the bus from
“Recessive” to “Dominant,” followed by a dominant
state longer than twake, switches the RXD pin to low to
signal a wake-up request to the microcontroller.
In the Standby mode, the bus lines are biased to
ground to reduce current consumption to a minimum.
The WUC monitors the bus lines for a valid wake-up
signal. When the RXD pin switches to low to signal a
wake-up request, a transition to the Normal mode is not
triggered until the microcontroller forces back the STBY
pin to low. A bus dominant time-out timer prevents the
device from generating a permanent wake-up request
by switching the RXD pin to high.
For ATA6560 only: If the NSIL input pin is set to low in
the Standby mode, the internal pull-up resistor causes
an additional quiescent current from VIO to GND.
Microchip recommends setting the NSIL pin to high in
the Standby mode.
1.2
1.2.1
Fail-Safe Features
1.2.2
INTERNAL PULL-UP STRUCTURE
AT TXD, NSIL, AND STBY INPUT
PINS
The TXD, STBY, and NSIL pins have an internal pull-up
to VIO. This ensures a safe, defined state in case one
or all of these pins are left floating. Pull-up currents flow
in these pins in all states, meaning all pins should be in
a high state during the Standby mode to minimize the
current consumption.
1.2.3
UNDERVOLTAGE DETECTION ON
PINS VCC AND VIO
If VVCC or VVIO drops below its undervoltage detection
level (Vuvd(VCC) and Vuvd(VIO), see Section 2.0 “Electrical Characteristics”), the transceiver switches off and
disengages from the bus until VVCC and VVIO have recovered. The low-power WUC is only switched off during a
VCC or VIO undervoltage. The logic state of the STBY pin
is ignored until the VCC voltage or the VIO voltage has
recovered.
1.2.4
BUS WAKE-UP TIME-OUT
FUNCTION
In the Standby mode, a bus wake-up time-out timer is
started when the CAN bus changes from recessive to
dominant state. If the dominant state on the bus persists
for longer than tto_bus, the RXD pin is switched to high.
This function prevents a clamped dominant bus (due to a
bus short circuit or a failure in one of the other nodes on
the network) from generating a permanent wake-up
request. The bus wake-up time-out timer is reset when
the CAN bus changes from dominant to recessive state.
1.2.5
OVERTEMPERATURE PROTECTION
The output drivers are protected against overtemperature
conditions. If the junction temperature exceeds the
shutdown junction temperature, TJsd, the output drivers
are disabled until the junction temperature drops below
TJsd and pin TXD is at a high level again. The TXD
condition ensures that output driver oscillations due to
temperature drift are avoided.
TXD DOMINANT TIME-OUT
FUNCTION
A TXD dominant time-out timer is started when the
TXD pin is set to low. If the low state on the TXD pin
persists for longer than tto(dom)TXD, the transmitter is
disabled, releasing the bus lines to a recessive state.
This function prevents a hardware failure, software
application failure, or both from driving the bus lines to
a permanent dominant state (blocking all network
communications). The TXD dominant time-out timer is
reset when the TXD pin is set to high (≥ 4 µs).
DS20005991B-page 6
2018-2019 Microchip Technology Inc.
ATA6560/1
FIGURE 1-4:
RELEASE OF TRANSMISSION AFTER OVERTEMPERATURE CONDITION
Failure
Overtemp
OT
Overtemperature
t
TXD
V9,O
GND
t
BUS VDIFF
(CANH-CANL)
D
R
D
R
D
R
tt
RXD
V9,O
GND
t
1.2.6
SHORT-CIRCUIT PROTECTION OF
THE BUS PINS
The CANH and CANL bus outputs are short-circuit
protected, either against GND or a positive supply
voltage. A current-limiting circuit protects the
transceiver against damage. If the device heats up
due to a continuous short on CANH or CANL, the
internal overtemperature protection switches the bus
transmitter off.
1.2.7
RXD RECESSIVE CLAMPING
This fail-safe feature prevents the controller from
sending data on the bus if its RXD line is clamped to
high (for example, recessive). That is, if the RXD pin
cannot signal a dominant bus condition (for example,
because it is shorted to VCC), the transmitter within the
ATA6560/1 is disabled to avoid possible data collisions
on the bus. In Normal and Silent modes (only for the
ATA6560), the device permanently compares the state
of the HSC to the state of the RXD pin.
If the HSC indicates a dominant bus state for more than
tRC_det, without the RXD pin doing the same, a
recessive clamping situation is detected and the device
is forced into the Silent mode. This Fail-Safe mode is
released by entering either the Standby or the
Unpowered mode or if the RXD pin is showing a
dominant (for example, low) level again.
2018-2019 Microchip Technology Inc.
DS20005991B-page 7
ATA6560/1
FIGURE 1-5:
RXD RECESSIVE CLAMPING DETECTION
CAN
TXD
RXD
Operation
Pode
Normal
Silent
Normal
If the clamping condition is removed and a
dominant bus is detected, the transceiver
goes back to 1ormal mode.
1.3
Pin Description
The descriptions of the pins are listed in Table 1-2.
TABLE 1-2:
PIN FUNCTION TABLE
ATA6560
ATA6561
SOIC8 VDFN8 SOIC8 VDFN8
Symbol
Description
1
1
1
1
TXD
Transmit Data Input
2
2
2
2
GND
Ground Supply
3
3
3
3
VCC
Supply Voltage
4
4
4
4
RXD
Receive Data Output; reads out data from the bus lines
—
—
5
5
VIO
Supply Voltage for the I/O Level Adapter; the VIO and VCC lines
are internally connected
5
5
—
—
NSIL
Silent Mode Control Input (low active)
6
6
6
6
CANL
Low-Level CAN Bus Line
7
7
7
7
CANH
High-Level CAN Bus Line
8
8
8
8
STBY
Standby Mode Control Input
—
9
—
9
EP
DS20005991B-page 8
Exposed Thermal Pad; heat slug, internally connected to the GND
pin
2018-2019 Microchip Technology Inc.
ATA6560/1
1.4
Typical Application
ATA6560 Typical Application
5V
22μF(1)
+
BAT
12V
100nF
VCC
VDD
STBY
8
NSIL
Microcontroller
3
7
CANH
CANH
5
ATA6560
TXD
1
RXD
6
4
GND
CANL
CANL
2
GND
GND
Note 1: The size of this capacitor depends on the external voltage regulator used.
2: For the VDFN package: the heat slug must always be connected to GND.
ATA6561 Typical Application
3.3V
BAT
12V
100nF
VIO
Microcontroller
TXD
RXD
GND
5V
12V
VCC
5
VDD
STBY
22μF(1)
100nF
+
3
7
CANH
CANH
8
1
ATA6561
4
6
CANL
CANL
2
GND
GND
Note 1: The size of this capacitor depends on the external voltage regulator used.
2: For the VDFN package: the heat slug must always be connected to GND.
2018-2019 Microchip Technology Inc.
DS20005991B-page 9
ATA6560/1
2.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
DC Voltage at CANH, CANL (VCANH, VCANL) ................................................................................................–27 to +42V
Transient Voltage at CANH, CANL (according to ISO 7637 part 2) (VCANH, VCANL) .................................–150 to +100V
DC Voltage on all other pins (VX) .................................................................................................................–0.3 to +5.5V
ESD according to IBEE CAN EMC - Test specification following IEC 61000-4-2 — Pin CANH, CANL ..................±8 kV
ESD (HBM following STM5.1 with 1.5 kΩ/100 pF) - Pins CANH, CANL to GND .................................................... ±6 kV
Component-Level ESD (HBM according to ANSI/ESD STM5.1, JESD22-A114, AEC-Q100 (002) ........................±4 kV
CDM ESD STM 5.3.1 ..............................................................................................................................................±750V
ESD Machine Model AEC-Q100-RevF(003) ...........................................................................................................±200V
Virtual Junction Temperature (TvJ) .............................................................................................................–40 to +150°C
Storage Temperature Range (Tstg) ............................................................................................................ –55 to +150°C
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at these or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
Electrical Specifications: TvJ = –40°C to +150°C; VVCC = 4.5V to 5.5V; VVIO = 2.8V to 5.5V; RL = 60, CL = 100 pF,
unless otherwise; all voltages are defined in relation to ground; positive currents flow into the IC.
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Supply, Pin VCC
Supply Voltage
VVCC
4.5
—
5.5
V
Supply Current in Silent Mode
IVCC_sil
1.9
2.5
3.2
mA
Silent mode,
VTXD = VVIO
Supply Current in Normal
Mode
IVCC_rec
2
—
5
mA
Recessive,
VTXD = VVIO
IVCC_dom
20
50
70
mA
Dominant, VTXD = 0V
IVCC_STBY
—
—
12
µA
VVCC = VVIO,
VTXD = VNSIL = VVIO
IVCC_STBY
—
7
—
µA
Ta = +25°C (Note 3)
Vuvd(VCC)
2.75
—
4.5
V
Supply Current in Standby
Mode
Undervoltage Detection
Threshold on Pin VCC
I/O Level Adapter Supply, Pin VIO (only for the ATA6561)
Supply Voltage on Pin VIO
VVIO
2.8
—
5.5
V
Supply Current on Pin VIO
IIO_rec
10
80
250
µA
Normal and Silent
modes
Recessive,
VTXD = VVIO
IIO_rdom
50
350
500
µA
Normal and Silent
modes
Dominant, VTXD = 0V
Standby mode
Undervoltage Detection
Threshold on Pin VIO
Note 1:
2:
3:
IIO_STBY
—
—
1
µA
Vuvd(VIO)
1.3
—
2.7
V
This parameter is 100% correlation tested.
This parameter is ensured by characterization on samples.
This parameter is ensured by design.
DS20005991B-page 10
2018-2019 Microchip Technology Inc.
ATA6560/1
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Specifications: TvJ = –40°C to +150°C; VVCC = 4.5V to 5.5V; VVIO = 2.8V to 5.5V; RL = 60, CL = 100 pF,
unless otherwise; all voltages are defined in relation to ground; positive currents flow into the IC.
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Mode Control Input, Pin NSIL and STBY
High-Level Input Voltage
VIH
0.7 x VVIO
—
VVIO + 0.3
V
Low-Level Input Voltage
VIL
–0.3
—
0.3 x VVIO
V
Pull-Up Resistor to VIO
Rpu
75
125
175
kΩ
VSTBY = 0V, VNSIL = 0V
IL
–2
—
+2
µA
VSTBY = VVIO,
VNSIL = VVIO
High-Level Leakage Current
CAN Transmit Data Input, Pin TXD
High-Level Input Voltage
VIH
0.7 x VVIO
—
VVIO + 0.3
V
Low-Level Input Voltage
VIL
–0.3
—
0.3 x VVIO
V
Pull-Up Resistor to VIO
RTXD
20
35
50
kΩ
VTXD = 0V
High-Level Leakage Current
ITXD
–2
—
+2
µA
Normal mode,
VTXD = VVIO
Input Capacitance
CTXD
—
5
10
pF
Note 3
CAN Receive Data Output, Pin RXD
High-Level Output Current
IOH
–8
—
–1
mA
Normal mode,
VRXD = VVIO – 0.4V,
VVIO = VVCC
Low-Level Output Current
IOL
2
—
12
mA
Normal mode,
VRXD = 0.4V,
bus dominant
IIO
2.75
3.5
4.5
V
VTXD = 0V,
t < tto(dom)TXD
pin CANH
0.5
1.5
2.25
V
VTXD = 0V,
t < tto(dom)TXD
pin CANL
Bus Lines, Pins CANH and CANL
Dominant Output Voltage
Transmitter Dominant Voltage
Symmetry
Vdom(TX)sym
0.9 x VVCC
—
1.1 x VVCC
V
Vdom(TX)sym = VCANH +
VCANL (Note 1)
Bus Differential Output Voltage
VO(diff)bus
1.5
—
3
V
VTXD = 0V,
t < tto(dom)TXD
RL = 45Ω to 65Ω
–50
—
+50
mV
2
0.5 x VVCC
3
V
Normal and Silent
modes,
VTXD = VVIO, no load
–0.1
—
+0.1
V
Standby mode,
VTXD = VVIO, no load
Recessive Output Voltage
Note 1:
2:
3:
VO(rec)
VVCC = 4.75V to 5.25V
VTXD = VVIO, receive,
no load
This parameter is 100% correlation tested.
This parameter is ensured by characterization on samples.
This parameter is ensured by design.
2018-2019 Microchip Technology Inc.
DS20005991B-page 11
ATA6560/1
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Specifications: TvJ = –40°C to +150°C; VVCC = 4.5V to 5.5V; VVIO = 2.8V to 5.5V; RL = 60, CL = 100 pF,
unless otherwise; all voltages are defined in relation to ground; positive currents flow into the IC.
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Differential Receiver Threshold
Voltage
Vth(RX)dif
0.5
0.7
0.9
V
Normal and Silent
modes (HSC),
Vcm(CAN) = –27V to
+27V
0.4
0.7
1
V
Standby mode (WUC),
Vcm(CAN) = –27V to
+27V (Note 1)
Differential Receiver
Hysteresis Voltage (HSC)
Vhys(RX)dif
50
120
200
mV
Normal and Silent
modes (HSC),
Vcm(CAN) = –27V to
+27V (Note 1)
Dominant Output Current
IIO(dom)
–100
—
–35
mA
VTXD = 0V,
t < tto(dom)TXD,
VVCC = 5V
pin CANH, VCANH = 0V
35
—
100
mA
VTXD = 0V,
t < tto(dom)TXD,
VVCC = 5V
pin CANL,
VCANL = 5V/40V
Recessive Output Current
IIO(rec)
–5
—
+5
mA
Normal and Silent
modes,
VTXD = VVIO, no load,
VCANH = VCANL = –27V
to +32V
Leakage Current
IIO(rec)
–5
0
+5
µA
VVCC = VVIO = 0V,
VCANH = VCANL = 5V
Input Resistance
Ri
9
15
28
kΩ
Input Resistance Deviation
∆Ri
–1
0
+1
%
Differential Input Resistance
Ri(dif)
19
30
56
kΩ
Ri(dif)
20
30
56
kΩ
TvJ < +125°C
Common-Mode Input
Capacitance
Ci(cm)
—
—
20
pF
Note 3
Differential Input Capacitance
Ci(dif)
—
—
10
pF
Note 3
Between VCANH and
VCANL
Transceiver Timing, Pins CANH, CANL, TXD, and RXD, see Figure 2-1 and Figure 2-2
Delay Time from TXD to Bus
Dominant
td(TXD-busdom)
40
—
130
ns
Normal mode (Note 2)
Delay Time from TXD to Bus
Recessive
td(TXD-busrec)
40
—
130
ns
Normal mode (Note 2)
Delay Time from Bus Dominant td(busdom-RXD)
to RXD
20
—
100
ns
Normal and Silent
modes (Note 2)
Delay Time from Bus
Recessive to RXD
20
—
100
ns
Normal and Silent
modes (Note 2)
Note 1:
2:
3:
td(busrec-RXD)
This parameter is 100% correlation tested.
This parameter is ensured by characterization on samples.
This parameter is ensured by design.
DS20005991B-page 12
2018-2019 Microchip Technology Inc.
ATA6560/1
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Specifications: TvJ = –40°C to +150°C; VVCC = 4.5V to 5.5V; VVIO = 2.8V to 5.5V; RL = 60, CL = 100 pF,
unless otherwise; all voltages are defined in relation to ground; positive currents flow into the IC.
Parameters
Propagation Delay from TXD
to RXD
Sym.
Min.
Typ.
Max.
Units
tPD(TXD-RXD)
40
—
210
ns
Normal mode, Rising
edge at pin TXD
40
—
200
ns
Normal mode, Falling
edge at pin TXD
—
—
300
ns
Normal mode, Rising
edge at pin TXD
RL = 120Ω,
CL = 200 pF (Note 3)
—
—
300
ns
Normal mode, Falling
edge at pin TXD
RL = 120Ω, CL = 200pF
(Note 3)
tPD(TXD-RXD)
Conditions
TXD Dominant Time-Out Time
tto(dom)TXD
0.8
—
3
ms
VTXD = 0V, Normal
mode
Bus Wake-Up Time-Out Time
tto_bus
0.8
—
3
ms
Standby mode
Minimum Dominant/Recessive
Bus Wake-Up Time
twake
0.75
3
5
µs
Standby mode
Delay Time for Standby Mode
to Normal Mode Transition
tdel(stby-norm)
—
—
47
µs
Falling edge at pin
STBY
NSIL = HIGH
Delay Time for Normal Mode to
Standby Mode Transition
tdel(norm-stby)
—
—
5
µs
Rising edge at pin
STBY
NSIL = HIGH (Note 3)
Delay Time for Normal Mode to
Silent Mode Transition
tdel(norm-sil)
—
—
10
µs
Falling edge at pin
NSIL
STBY = LOW (Note 3)
Delay Time for Silent Mode to
Normal Mode Transition
tdel(sil-norm)
—
—
10
µs
Rising edge at pin NSIL
STBY = LOW (Note 3)
Delay Time for Silent Mode to
Standby Mode Transition
tdel(sil-stby)
—
—
5
µs
Rising edge at pin
STBY
NSIL = LOW (Note 3)
Delay Time for Standby Mode
to Silent Mode Transition
tdel(stby-sil)
—
—
47
µs
Rising edge at pin
STBY
NSIL = LOW (Note 3)
tRC_det
—
90
—
ns
V(CANH-CANL) > 900 mV
RXD = HIGH (Note 3)
Debouncing Time for
Recessive Clamping State
Detection
Transceiver Timing for higher Bit Rates, Pins CANH, CANL, TXD, and RXD, see Figure 2-1 and Figure 2-3
Recessive Bit Time on Pin
RXD
Note 1:
2:
3:
tBit(RXD)
400
—
550
ns
Normal mode,
tBit(TXD) = 500 ns
(Note 3)
120
—
220
ns
Normal mode,
tBit(TXD) = 200 ns
This parameter is 100% correlation tested.
This parameter is ensured by characterization on samples.
This parameter is ensured by design.
2018-2019 Microchip Technology Inc.
DS20005991B-page 13
ATA6560/1
TEMPERATURE SPECIFICATIONS
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
8-Lead SOIC
Thermal Resistance Virtual Junction to Ambient
RthvJA
—
145
—
K/W
TJsd
150
175
195
°C
Thermal Resistance Virtual Junction to Heat Slug
RthvJC
—
10
—
K/W
Thermal Resistance Virtual Junction to Ambient,
where Heat Slug is Soldered to PCB According to
JEDEC
RthvJA
—
50
—
K/W
TJsd
150
175
195
°C
Thermal Shutdown of Bus Drivers
8-Lead VDFN
Thermal Shutdown of Bus Drivers
FIGURE 2-1:
TIMING TEST CIRCUIT FOR THE ATA6560/1 CAN TRANSCEIVER
+5V
+
22μF
100nF
5
VIO/NSIL
1
TXD
3
VCC
CANH
7
RL
4
15pF
RXD
GND
2
DS20005991B-page 14
CANL
CL
6
STBY
8
2018-2019 Microchip Technology Inc.
ATA6560/1
FIGURE 2-2:
CAN TRANSCEIVER TIMING DIAGRAM
HIGH
TXD
LOW
CANH
CANL
dominant
0.9V
VO(dif) (bus)
0.5V
recessive
HIGH
0.7V9,O
RXD
0.3V9,O
LOW
td(TXD-busdom)
td(TXD-busrec)
td(busdom-RXD)
tPD(TXD-RXD)
FIGURE 2-3:
td(busrec-RXD)
tPD(TXD-RXD)
CAN TRANSCEIVER TIMING DIAGRAM FOR LOOP DELAY SYMMETRY
70%
TXD
30%
30%
5 x tBit(TXD)
tBit(TXD)
tLoop
falling edge
70%
RXD
30%
tLoop
tBit(RXD)
rising edge
Note:
The bit time of a recessive bit after five dominant bits is measured on the RXD pin.
2018-2019 Microchip Technology Inc.
DS20005991B-page 15
ATA6560/1
3.0
PACKAGING INFORMATION
3.1
Package Marking Information
8-Lead SOIC
Example ATA6560
810
ATA6560
1810256
YWW
XXXXXXXX
YYWWNNN
Example ATA6560
Industrial type
810
6560-N
1810256
8-Lead 3 x 3 mm VDFN
Example ATA6560
6566
256
ZZZ
6560
Example ATA6560
Industrial type
6566
256
ZZZ
6560-N
Legend: XX...X
Y
YY
WW
NNN
* e3
Note:
DS20005991B-page 16
Example ATA6561
810
ATA6561
1810256
Example ATA6561
Industrial type
810
6561-N
1810256
Example ATA6561
6566
ZZZ
6561
256
Example ATA6561
Industrial type
6566
ZZZ
6561-N
256
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( )
e3
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
2018-2019 Microchip Technology Inc.
ATA6560/1
8-Lead Plastic Small Outline (OA) - Narrow, 3.90 mm (.150 In.) Body [SOIC]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2X
0.10 C A–B
D
A
D
NOTE 5
N
E
2
E1
2
E1
E
NOTE 1
2
1
e
B
NX b
0.25
C A–B D
NOTE 5
TOP VIEW
0.10 C
C
A A2
SEATING
PLANE
8X
A1
SIDE VIEW
0.10 C
h
R0.13
h
R0.13
H
SEE VIEW C
VIEW A–A
0.23
L
(L1)
VIEW C
Microchip Technology Drawing No. C04-057-OA Rev E Sheet 1 of 2
2018-2019 Microchip Technology Inc.
DS20005991B-page 17
ATA6560/1
8-Lead Plastic Small Outline (OA) - Narrow, 3.90 mm (.150 In.) Body [SOIC]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
Number of Pins
N
e
Pitch
Overall Height
A
Molded Package Thickness
A2
§
Standoff
A1
Overall Width
E
Molded Package Width
E1
Overall Length
D
Chamfer (Optional)
h
Foot Length
L
Footprint
L1
Foot Angle
c
Lead Thickness
b
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
MIN
1.25
0.10
0.25
0.40
0°
0.17
0.31
5°
5°
MILLIMETERS
NOM
8
1.27 BSC
6.00 BSC
3.90 BSC
4.90 BSC
1.04 REF
-
MAX
1.75
0.25
0.50
1.27
8°
0.25
0.51
15°
15°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed 0.15mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
5. Datums A & B to be determined at Datum H.
Microchip Technology Drawing No. C04-057-OA Rev E Sheet 2 of 2
DS20005991B-page 18
2018-2019 Microchip Technology Inc.
ATA6560/1
8-Lead Plastic Small Outline (OA) - Narrow, 3.90 mm Body [SOIC]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
SILK SCREEN
C
Y1
X1
E
RECOMMENDED LAND PATTERN
Units
Dimension Limits
E
Contact Pitch
Contact Pad Spacing
C
Contact Pad Width (X8)
X1
Contact Pad Length (X8)
Y1
MIN
MILLIMETERS
NOM
1.27 BSC
5.40
MAX
0.60
1.55
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-2057-OA Rev E
2018-2019 Microchip Technology Inc.
DS20005991B-page 19
ATA6560/1
8-Lead Very Thin Plastic Dual Flat, No Lead Package (Q8B) - 3x3 mm Body [VDFN]
With 2.40x1.60 mm Exposed Pad and Stepped Wettable Flanks; Atmel Legacy YCL
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
N
(DATUM A)
(DATUM B)
E
NOTE 1
2X
0.10 C
1
2
2X
TOP VIEW
0.10 C
0.10 C
C
A
A1
SEATING
PLANE
8X
0.08 C
SIDE VIEW
(A3)
0.10
C A B
D2
1
A
2
NOTE 1
0.10
A
C A B
E2
K
N
L
8X b
e
BOTTOM VIEW
0.10
0.05
C A B
C
Microchip Technology Drawing C04-21358 Rev C Sheet 1 of 2
DS20005991B-page 20
2018-2019 Microchip Technology Inc.
ATA6560/1
8-Lead Very Thin Plastic Dual Flat, No Lead Package (Q8B) - 3x3 mm Body [VDFN]
With 2.40x1.60 mm Exposed Pad and Stepped Wettable Flanks; Atmel Legacy YCL
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A4
PARTIALLY
PLATED
E3
SECTION A–A
Units
Dimension Limits
Number of Terminals
N
e
Pitch
Overall Height
A
Standoff
A1
Terminal Thickness
A3
Overall Length
D
Exposed Pad Length
D2
Overall Width
E
Exposed Pad Width
E2
b
Terminal Width
Terminal Length
L
K
Terminal-to-Exposed-Pad
Wettable Flank Step Cut Depth
A4
E3
Wettable Flank Step Cut Width
MIN
0.80
0.00
2.30
1.50
0.25
0.35
0.20
0.10
-
MILLIMETERS
MAX
NOM
8
0.65 BSC
1.00
0.90
0.05
0.035
0.203 REF
3.00 BSC
2.40
2.50
3.00 BSC
1.70
1.60
0.35
0.30
0.45
0.40
0.19
0.085
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-21358 Rev C Sheet 2 of 2
2018-2019 Microchip Technology Inc.
DS20005991B-page 21
ATA6560/1
8-Lead Very Thin Plastic Dual Flat, No Lead Package (Q8B) - 3x3 mm Body [VDFN]
With 2.40x1.60 mm Exposed Pad and Stepped Wettable Flanks
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Y2
EV
8
ØV
C X2
EV
CH
G1
Y1
1
2
SILK SCREEN
X1
G2
E
RECOMMENDED LAND PATTERN
Units
Dimension Limits
Contact Pitch
E
Optional Center Pad Width
X2
Optional Center Pad Length
Y2
Contact Pad Spacing
C
Contact Pad Width (X8)
X1
Contact Pad Length (X8)
Y1
Contact Pad to Center Pad (X8)
G1
Contact Pad to Contact Pad (X6)
G2
Pin 1 Index Chamfer
CH
Thermal Via Diameter
V
Thermal Via Pitch
EV
MIN
MILLIMETERS
NOM
0.65 BSC
MAX
1.70
2.50
3.00
0.35
0.80
0.20
0.20
0.20
0.33
1.20
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
Microchip Technology Drawing C04-23358 Rev C
DS20005991B-page 22
2018-2019 Microchip Technology Inc.
ATA6560/1
APPENDIX A:
REVISION HISTORY
Revision B (November 2019)
• Updated the Supply Current in Silent Mode
parameter in the Electrical Characteristics table.
• Various typographical edits.
Revision A (April 2018)
• Original release of this document.
• This document replaces Atmel 9288J-AUTO-04/15.
• Added Industrial types.
• Added table ATA6560/1 Family Members.
2018-2019 Microchip Technology Inc.
DS20005991B-page 23
ATA6560/1
NOTES:
DS20005991B-page 24
2018-2019 Microchip Technology Inc.
ATA6560/1
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
PART NO. –
Device
[X](1)
XX
Package
X
Tape and Reel
Option
–
Examples:
a) ATA6560-GAQW:
ATA6560, 8-Lead SOIC,
Qualified according to
AEC-Q100, Tape and Reel,
Package according to RoHS
b) ATA6560-GBQW:
ATA6560, 8-Lead VDFN,
Qualified according to
AEC-Q100, Tape and Reel,
Package according to RoHS
c) ATA6561-GAQW:
ATA6561, 8-Lead SOIC,
Qualified according to
AEC-Q100, Tape and Reel,
Package according to RoHS
d) ATA6561-GBQW:
ATA6561, 8-Lead VDFN,
Qualified according to
AEC-Q100, Tape and Reel,
Package according to RoHS
e) ATA6560-GAQW-N:
ATA6560, 8-Lead SOIC,
Tape and Reel, Package
according to RoHS,
Industrial type
f) ATA6560-GBQW-N:
ATA6560, 8-Lead VDFN,
Tape and Reel, Package
according to RoHS,
Industrial type
g) ATA6561-GAQW-N:
ATA6561, 8-Lead SOIC,
Tape and Reel, Package
according to RoHS,
Industrial type
h) ATA6561-GBQW-N:
ATA6561, 8-Lead VDFN,
Tape and Reel, Package
according to RoHS,
Industrial type
Package Directives Device
Variant
Classification
Device:
ATA6560/1:
Package:
GA =
GB =
8-Lead SOIC
8-Lead VDFN
Tape and Reel
Option:
Q
=
330 mm diameter Tape and Reel
Package
Directives
Classification:
W
=
Package according to RoHS(2)
Device Variant
N
=
X
High-Speed CAN Transceiver with Standby
Mode – CAN FD Ready
Device Variant N (Industrial type)
Note 1:
2:
2018-2019 Microchip Technology Inc.
Tape and Reel identifier only appears in the
catalog part number description. This identifier is
used for ordering purposes and is not printed on
the device package. Check with your Microchip
Sales Office for package availability with the Tape
and Reel option.
RoHS compliant; maximum concentration value
of 0.09% (900 ppm) for Bromine (Br) and
Chlorine (Cl) and less than 0.15% (1500 ppm)
total Bromine (Br) and Chlorine (Cl) in any
homogeneous material. Maximum concentration
value of 0.09% (900 ppm) for Antimony (Sb) in
any homogeneous material.
DS20005991B-page 25
ATA6560/1
NOTES:
DS20005991B-page 26
2018-2019 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, Adaptec,
AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, chipKIT,
chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex,
flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck,
LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi,
Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer,
PackeTime, PIC, picoPower, PICSTART, PIC32 logo, PolarFire,
Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST,
SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon,
TempTrackr, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA
are registered trademarks of Microchip Technology Incorporated in
the U.S.A. and other countries.
APT, ClockWorks, The Embedded Control Solutions Company,
EtherSynch, FlashTec, Hyper Speed Control, HyperLight Load,
IntelliMOS, Libero, motorBench, mTouch, Powermite 3, Precision
Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet-Wire,
SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub,
TimePictra, TimeProvider, Vite, WinPath, and ZL are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BlueSky, BodyCom, CodeGuard,
CryptoAuthentication, CryptoAutomotive, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker,
KleerNet, KleerNet logo, memBrain, Mindi, MiWi, MPASM, MPF,
MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple
Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI,
SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC,
USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and
ZENA are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
The Adaptec logo, Frequency on Demand, Silicon Storage
Technology, and Symmcom are registered trademarks of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany
II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in
other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2018-2019, Microchip Technology Incorporated, All Rights
Reserved.
For information regarding Microchip’s Quality Management Systems,
please visit www.microchip.com/quality.
2018-2019 Microchip Technology Inc.
ISBN: 978-1-5224-5307-9
DS20005991B-page 27
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Australia - Sydney
Tel: 61-2-9868-6733
India - Bangalore
Tel: 91-80-3090-4444
China - Beijing
Tel: 86-10-8569-7000
India - New Delhi
Tel: 91-11-4160-8631
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
China - Chengdu
Tel: 86-28-8665-5511
India - Pune
Tel: 91-20-4121-0141
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
China - Chongqing
Tel: 86-23-8980-9588
Japan - Osaka
Tel: 81-6-6152-7160
Finland - Espoo
Tel: 358-9-4520-820
China - Dongguan
Tel: 86-769-8702-9880
Japan - Tokyo
Tel: 81-3-6880- 3770
China - Guangzhou
Tel: 86-20-8755-8029
Korea - Daegu
Tel: 82-53-744-4301
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
China - Hangzhou
Tel: 86-571-8792-8115
Korea - Seoul
Tel: 82-2-554-7200
China - Hong Kong SAR
Tel: 852-2943-5100
Malaysia - Kuala Lumpur
Tel: 60-3-7651-7906
China - Nanjing
Tel: 86-25-8473-2460
Malaysia - Penang
Tel: 60-4-227-8870
China - Qingdao
Tel: 86-532-8502-7355
Philippines - Manila
Tel: 63-2-634-9065
China - Shanghai
Tel: 86-21-3326-8000
Singapore
Tel: 65-6334-8870
China - Shenyang
Tel: 86-24-2334-2829
Taiwan - Hsin Chu
Tel: 886-3-577-8366
China - Shenzhen
Tel: 86-755-8864-2200
Taiwan - Kaohsiung
Tel: 886-7-213-7830
China - Suzhou
Tel: 86-186-6233-1526
Taiwan - Taipei
Tel: 886-2-2508-8600
China - Wuhan
Tel: 86-27-5980-5300
Thailand - Bangkok
Tel: 66-2-694-1351
China - Xian
Tel: 86-29-8833-7252
Vietnam - Ho Chi Minh
Tel: 84-28-5448-2100
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Austin, TX
Tel: 512-257-3370
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Novi, MI
Tel: 248-848-4000
Houston, TX
Tel: 281-894-5983
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Tel: 317-536-2380
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Tel: 951-273-7800
Raleigh, NC
Tel: 919-844-7510
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Tel: 408-436-4270
Canada - Toronto
Tel: 905-695-1980
Fax: 905-695-2078
DS20005991B-page 28
China - Xiamen
Tel: 86-592-2388138
China - Zhuhai
Tel: 86-756-3210040
Germany - Garching
Tel: 49-8931-9700
Germany - Haan
Tel: 49-2129-3766400
Germany - Heilbronn
Tel: 49-7131-72400
Germany - Karlsruhe
Tel: 49-721-625370
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Germany - Rosenheim
Tel: 49-8031-354-560
Israel - Ra’anana
Tel: 972-9-744-7705
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Italy - Padova
Tel: 39-049-7625286
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Norway - Trondheim
Tel: 47-7288-4388
Poland - Warsaw
Tel: 48-22-3325737
Romania - Bucharest
Tel: 40-21-407-87-50
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Gothenberg
Tel: 46-31-704-60-40
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
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05/14/19
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