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ATA6564-GBQW0

ATA6564-GBQW0

  • 厂商:

    ACTEL(微芯科技)

  • 封装:

    VDFN8

  • 描述:

    IC TRANSCEIVER HALF 1/1 8VDFN

  • 数据手册
  • 价格&库存
ATA6564-GBQW0 数据手册
ATA6564 High-Speed CAN Transceiver with Silent Mode - CAN FD Ready Features General Description • Fully ISO 11898-2, ISO 11898-2: 2016 and SAE J2962-2 Compliant • CAN FD Ready • Communication Speed up to 5 Mbit/s • Low Electromagnetic Emission (EME) and High Electromagnetic Immunity (EMI) • Differential Receiver with Wide Common Mode Range • Compatible to 3.3V and 5V Microcontrollers • Functional Behavior Predictable under all Supply Conditions • Transceiver Disengages from the Bus When Not Powered-Up • RXD Recessive Clamping Detection • High Electrostatic Discharge (ESD) Handling Capability on the Bus Pins • Bus Pins Protected Against Transients in Automotive Environments • Transmit Data (TXD) Dominant Time-out Function • Undervoltage Detection on VCC and VIO Pins • CANH/CANL Short-Circuit and Overtemperature Protected • Fulfills the OEM “Hardware Requirements for LIN, CAN and FlexRay Interfaces in Automotive Applications”, Rev. 1.3 • Qualified According to AEC-Q100 • Two Ambient Temperature Grades: - ATA6564-GAQW1 and ATA6564-GBQW1 up to Tamb = +125°C - ATA6564-GAQW0 and ATA6564-GBQW0 up to Tamb = +150°C • Packages: 8-pin SOIC, 8-pin VDFN with Wettable Flanks (Moisture Sensitivity Level 1) The ATA6564 is a high-speed CAN transceiver that provides an interface between a controller area network (CAN) protocol controller and the physical two-wire CAN bus. The transceiver is designed for high-speed (up to 5 Mbit/s) CAN applications in the automotive industry, providing differential transmit and receive capability to (a microcontroller with) a CAN protocol controller. Applications Classical CAN and CAN FD networks in Automotive, Industrial, Aerospace, Medical and Consumer applications.  2017-2019 Microchip Technology Inc. It offers improved electromagnetic compatibility (EMC) and electrostatic discharge (ESD) performance, as well as features such as: • ideal passive behavior to the CAN bus when the supply voltage is off • direct interfacing to microcontrollers with supply voltages from 3V to 5V Two operating modes together with the dedicated fail-safe features make the ATA6564 an excellent choice for all types of high-speed CAN networks especially in nodes which do not require a Standby mode with wake-up capability via the bus. Package Types ATA6564 8-pin SOIC TXD 1 GND 2 8 S 7 CANH ATA6564 VCC 3 6 CANL RXD 4 5 VIO ATA6564 8-pin VDFN TXD GND VCC RXD ATA6564 S CANH CANL VIO DS20005784C-page 1 ATA6564 ATA6564 Family Members Device Grade 0 ATA6564-GAQW0 x ATA6564-GBQW0 x Grade 1 VDFN8 SOIC8 x x ATA6564-GAQW1 x ATA6564-GBQW1 x Description Silent mode, VIO - pin for compatibility with 3,3V and 5V microcontroller Silent mode, VIO - pin for compatibility with 3,3V and 5V microcontroller x x Silent mode, VIO - pin for compatibility with 3,3V and 5V microcontroller Silent mode, VIO - pin for compatibility with 3,3V and 5V microcontroller Functional Block Diagram VIO VCC 5 3 ATA6564 VCC Temperature Protection VIO 7 CANH TXD TXD Time-OutTimer 1 8 Slope Control and Driver HSC(1) VIO 4 CANL Control Unit S RXD 6 MUX 2 GND Note 1: HSC: High-speed comparator. DS20005784C-page 2  2017-2019 Microchip Technology Inc. ATA6564 1.0 DEVICE OVERVIEW The ATA6564 is a stand-alone high-speed CAN transceiver compliant with the ISO 11898-2, ISO 11898-2: 2016 and SAE J2962-2 CAN standards. It provides very low current consumption in Silent mode. FIGURE 1-1: 1.1 Operating Modes The ATA6564 supports two operating modes: Silent and Normal. These modes can be selected via the S pin. See Figure 1-1 and Table 1-1 for a description of the operating modes. OPERATING MODES VCC < Vuvd(VCC) or VIO < Vuvd(VIO) VCC < Vuvd(VCC) or VIO < Vuvd(VIO) Unpowered Mode VCC > Vuvd(VCC) and VIO > Vuvd(VIO) and S=1 VCC > Vuvd(VCC) and VIO > Vuvd(VIO) and S=0 S = 0 and TXD = 1 and Error = 0 Silent Mode Normal Mode S = 1 or Error = 1 TABLE 1-1: OPERATING MODES Mode 1.1.1 Outputs S Pin TXD CAN Driver Pin RXD x(2) x(2) Recessive Recessive Silent HIGH x(2) Recessive Active(1) Normal LOW LOW Dominant LOW LOW HIGH Recessive HIGH Unpowered Note 1: 2: Inputs LOW if the CAN bus is dominant, HIGH if the CAN bus is recessive. Irrelevant NORMAL MODE A low level on the S pin together with a high level on pin TXD selects the Normal mode. In this mode the transceiver is able to transmit and receive data via the CANH and CANL bus lines (see Section “Functional Block Diagram”). The output driver stage is active and drives data from the TXD input to the CAN bus. The high-speed comparator (HSC) converts the analog data on the bus lines into digital data which is output to pin RXD. The bus biasing is set to VVCC/2 and the undervoltage monitoring of VCC is active. Please note that the device cannot enter Normal mode as long as TXD is at ground level. The slope of the output signals on the bus lines is controlled and optimized in a way that ensures the lowest possible electromagnetic emission (EME). To switch the device in normal operating mode, set the S pin to low and the TXD pin to high (see Table 1-1 and Figure 1-2). The S pin provides a pull-down resistor to GND, thus ensuring a defined level if the pin is open.  2017-2019 Microchip Technology Inc. DS20005784C-page 3 ATA6564 FIGURE 1-2: SWITCHING FROM SILENT MODE TO NORMAL MODE S t TXD t tdel(sil-norm) = 10μs max Operation Mode Silent Mode Normal Mode t 1.1.2 SILENT MODE A high level on the S pin selects Silent mode. This receive-only mode can be used to test the connection of the bus medium. In Silent mode the ATA6564 can still receive data from the bus, but the transmitter is disabled and therefore no data can be sent to the CAN bus. The bus pins are released to recessive state. All other IC functions, including the high-speed comparator (HSC), continue to operate as they do in Normal mode. Silent mode can be used to prevent a faulty CAN controller from disrupting all network communications. 1.2 1.2.1 Fail-safe Features TXD DOMINANT TIME-OUT FUNCTION A TXD dominant time-out timer is started when the TXD pin is set to LOW. If the LOW state on the TXD pin persists for longer than tto(dom)TXD, the transmitter is disabled, releasing the bus lines to recessive state. This function prevents a hardware and/or software application failure from driving the bus lines to a permanent dominant state (blocking all network communications). The TXD dominant time-out timer is reset when the TXD pin is set to high. If the low state on the TXD pin was longer than tto(dom)TXD, then the TXD pin has to be set to high longer 4 µs in order to reset the TXD dominant time-out timer. DS20005784C-page 4 1.2.2 INTERNAL PULL-UP/PULL-DOWN STRUCTURE AT THE TXD AND S INPUT PINS The TXD pin has an internal pull-up resistor to VIO and the S pin an internal pull-down resistor to GND. This ensures a safe, defined state in case one or all of these pins are left floating. 1.2.3 UNDERVOLTAGE DETECTION ON PINS VCC AND VIO If VVCC or VVIO drop below their respective undervoltage detection levels (Vuvd(VCC) and Vuvd(VIO) (see Section TABLE 2-1:, Electrical Characteristics), the transceiver switches off and disengages from the bus until VVCC and VVIO have recovered. The logic state of the S pin is ignored until the VCC voltage or the VIO voltage has recovered. 1.2.4 OVERTEMPERATURE PROTECTION The output drivers are protected against overtemperature conditions. If the junction temperature exceeds the shutdown junction temperature, TJsd, the output drivers are disabled until the junction temperature drops below TJsd and pin TXD is at high level again. This ensures that output driver oscillations due to temperature drift are avoided.  2017-2019 Microchip Technology Inc. ATA6564 FIGURE 1-3: RELEASE OF TRANSMISSION AFTER OVERTEMPERATURE CONDITION Failure Overtemp OT Overtemperature t TXD 9,2 GND t BUS VDIFF (CANH-CANL) D R D R D R tt RXD 9,2 GND t 1.2.5 SHORT-CIRCUIT PROTECTION OF THE BUS PINS The CANH and CANL bus outputs are short-circuit protected, either against GND or a positive supply voltage. A current-limiting circuit protects the transceiver against damage. If the device is heating up due to a continuous short on CANH or CANL, the internal overtemperature protection switches off the bus transmitter. FIGURE 1-4: 1.2.6 RXD RECESSIVE CLAMPING This fail-safe feature prevents the controller from sending data on the bus if its RXD line is clamped to HIGH (e.g., recessive). That is, if the RXD pin cannot signalize a dominant bus condition because it is e.g, shorted to VCC, the transmitter within ATA6564 is disabled to avoid possible data collisions on the bus. In Normal and Silent mode, the device permanently compares the state of the high-speed comparator (HSC) with the state of the RXD pin. If the HSC indicates a dominant bus state for more than tRC_det without the RXD pin doing the same, a recessive clamping situation is detected and the device is forced into Silent mode. This Fail-safe mode is released by either entering Unpowered mode or if the RXD pin is showing a dominant (e.g., LOW) level again. RXD RECESSIVE CLAMPING DETECTION CAN TXD RXD Operation Mode Normal Silent Normal If the clamping condition is removed and a dominant bus is detected, the transceiver goes back to normal mode.  2017-2019 Microchip Technology Inc. DS20005784C-page 5 ATA6564 1.3 Pin Descriptions The descriptions of the pins are listed in Table 1-2. TABLE 1-2: PIN FUNCTION TABLE Pin Number Pin Name 1 TXD 2 GND Ground supply 3 VCC Supply voltage 4 RXD Receive data output; reads out data from the bus lines 5 VIO Supply voltage for I/O level adapter Note 1: Description Transmit data input 6 CANL Low-level CAN bus line 7 CANH High-level CAN bus line 8 S Silent mode control input 9 EP(1) Exposed Thermal Pad: Heat slug, internally connected to the GND pin. Only for the VDFN package. DS20005784C-page 6  2017-2019 Microchip Technology Inc. ATA6564 1.4 Typical Application 3.3V BAT 12V 100nF Microcontroller 5 TXD RXD GND + 5V 12V VCC VIO VDD S 22μF 100nF (1) 3 7 CANH CANH 8 1 ATA6564 4 6 CANL CANL 2 GND GND (1) The size of this capacitor depends on the used external voltage regulator. Note 1: For VDFN package: Heat slug must always be connected to GND.  2017-2019 Microchip Technology Inc. DS20005784C-page 7 ATA6564 2.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings(†) DC Voltage at CANH and CANL ................................................................................................................ –27V to +42V Transient Voltage on CANH and CANL (ISO 7637 part 2) ..................................................................... –150V to +100V Max. differential bus voltage......................................................................................................................... –5V to +18V DC voltage on all other pins ..................................................................................................................... –0.3V to +5.5V ESD on CANH and CANL pins (IEC 61000-4-2)......................................................................................................±8 kV ESD (HBM following STM 5.1 with 1.5 k/100 pF) (Pins CANH, CANL to GND)................................................... ±6 kV Component Level ESD (HBM according to ANSI/ESD STM 5.1) JESD22-A114, AEC-Q 100 (002) ...................... ±4 kV CDM ESD STM 5.3.1 ............................................................................................................................................. ±750V ESD machine model AEC-Q100-RevF(003) .......................................................................................................... ±200V Virtual Junction Temperature................................................................................................................. –40°C to +175°C Storage Temperature..............................................................................................................................–55°C to +150°C † Notice: Stresses beyond those listed below may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. DS20005784C-page 8  2017-2019 Microchip Technology Inc. ATA6564 TABLE 2-1: ELECTRICAL CHARACTERISTICS Electrical Specifications: Grade 1: Tamb = –40°C to +125°C, Grade 0: Tamb = –40°C to +150°C, TvJ  170°C, VVCC= 4.5V to 5.5V; VVIO = 2.8V to 5.5V; RL = 60, CL = 100 pF, unless otherwise specified. All voltages are defined in relation to ground; positive currents flow into the IC. Parameters Sym. Min. Typ. Max. Units Conditions Supply, Pin VCC Supply Voltage VVCC 4.5 — 5.5 V IVCC_sil 1.9 2.5 3 mA Silent Mode, VTXD = VVIO Supply Current in Normal Mode IVCC_rec IVCC_dom IVCC_short 2 30 5 70 85 mA 50 Recessive, VTXD = VVIO Dominant, VTXD = 0V Short between CANH and CANL(Note 1) Undervoltage Detection Threshold on Pin VCC Vuvd(VCC) 2.75 — 4.5 V Supply Current in Silent Mode I/O Level Adapter Supply, Pin VIO Supply Voltage on Pin VIO VVIO 2.8 — 5.5 V IVIO_rec 10 80 250 µA Normal and Silent Mode recessive, VTXD = VVIO IVIO_dom 50 350 500 µA Normal and Silent Mode dominant, VTXD = 0V Vuvd(VIO) 1.3 — 2.7 V High-Level Input Voltage VIH 0.7  VVIO — VVIO + 0.3 V Low-Level Input Voltage VIL –0.3 — 0.3  VVIO V Pull-Down Resistor to GND Rpd 75 125 175 kΩ VS = VVIO Low-Level Leakage Current IL –2 — +2 µA VS = 0V High-Level Input Voltage VIH 0.7  VVIO — VVIO + 0.3 V Low-Level Input Voltage VIL –0.3 — 0.3  VVIO V Pull-up Resistor to VIO RTXD 20 35 50 kΩ VTXD = 0V High-Level Leakage Current ITDX –2 — +2 µA Normal Mode, VTXD = VVIO Input Capacitance CTXD — 5 10 pF Note 3 Supply Current on Pin VIO Undervoltage Detection Threshold on Pin VIO Mode Control Input, Pin S CAN Transmit Data Input, Pin TXD CAN Receive Data Output, Pin RXD High-Level Output Current IOH –8 — -1 mA VRXD = VVIO – 0.4V, VVIO = VVCC Low-Level Output Current IOL 2 — 12 mA VRXD = 0.4V, Bus Dominant Bus Lines, Pins CANH and CANL Single Ended Dominant Output Voltage V VO(dom) 2.75 0.5 Note 1: 2: 3: 3.5 1.5 4.5 2.25 VTXD = 0V, t < tto(dom)TXD RL = 50 to 65 - pin CANH - pin CANL(Note 1) 100% correlation tested. Characterized on samples. Design parameter.  2017-2019 Microchip Technology Inc. DS20005784C-page 9 ATA6564 TABLE 2-1: ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Specifications: Grade 1: Tamb = –40°C to +125°C, Grade 0: Tamb = –40°C to +150°C, TvJ  170°C, VVCC= 4.5V to 5.5V; VVIO = 2.8V to 5.5V; RL = 60, CL = 100 pF, unless otherwise specified. All voltages are defined in relation to ground; positive currents flow into the IC. Parameters Sym. Min. Typ. Max. Units Conditions Transmitter Voltage Symmetry VSym 0.9 1 1.1 — VSym = (VCANH + VCANL) /VVCC(Note 3) Bus Differential Output Voltage VDiff 1.5 — 3 V VTXD = 0V, t < tto(dom)TXD RL = 45 to 65 1.5 — 3.3 V VTXD = 0V, t < tto(dom)TXD RL = 70 (Note 3) 1.5 — 5 V VTXD = 0V, t < tto(dom)TXD RL = 2240 (Note 3) –50 — +50 mV VVCC = 4.75V to 5.25V VTXD = VVIO, receive, no load Recessive Output Voltage VO(rec) 2 0.5 x VVCC 3 V Normal and Silent Mode, VTXD = VVIO, no load Differential Receiver Threshold Voltage (HSC) Vth(RX)dif 0.5 0.7 0.9 V Normal and Silent Mode, Vcm(CAN) = –27V to +27V Differential Receiver Hysteresis Voltage (HSC) Vhys(RX)dif 50 120 200 mV Normal and Silent Mode, Vcm(CAN) = –27V to +27V Dominant Output Current IIO(dom) –75 35 — –35 75 mA mA VTXD = 0V, t < tto(dom)TXD, VVCC = 5V - pin CANH, VCANH = –5V - pin CANL, VCANL = +40V Recessive Output Current IIO(rec) –5 — +5 mA Normal and Silent Mode, VTXD = VVIO, no load, VCANH = VCANL = –27V to +32V Leakage Current IIO(leak) –5 0 +5 µA VVCC = VVIO = 0V, VCANH = VCANL = 5V IIO(leak) –5 0 +5 µA VCC = VIO connected to GND with 47k VCANH = VCANL = 5V (Note 3) Ri 9 15 28 kΩ VCANH = VCANL = 4V Ri 9 15 28 kΩ –2V ≤ VCANH ≤ +7V, –2V ≤ VCANL ≤ +7V (Note 3) ∆Ri –1 0 +1 % Between CANH and CANL VCANH = VCANL = 4V ∆Ri –1 0 +1 % –2V ≤ VCANH ≤ +7V, –2V ≤ VCANL ≤ +7V (Note 3) Ri(dif) 18 30 56 kΩ VCANH = VCANL = 4V Ri(dif) 18 30 56 kΩ –2V ≤ VCANH ≤ +7V, –2V ≤ VCANL ≤ +7V (Note 3) Common-Mode Input Capacitance Ci(cm) — — 20 pF f = 500 kHz, CANH and CANL referred to GND (Note 3) Differential Input Capacitance Ci(dif) — — 10 pF f = 500 kHz, between CANH and CANL (Note 3) Input Resistance Input Resistance Deviation Differential Input Resistance Note 1: 2: 3: 100% correlation tested. Characterized on samples. Design parameter. DS20005784C-page 10  2017-2019 Microchip Technology Inc. ATA6564 TABLE 2-1: ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Specifications: Grade 1: Tamb = –40°C to +125°C, Grade 0: Tamb = –40°C to +150°C, TvJ  170°C, VVCC= 4.5V to 5.5V; VVIO = 2.8V to 5.5V; RL = 60, CL = 100 pF, unless otherwise specified. All voltages are defined in relation to ground; positive currents flow into the IC. Parameters Sym. Min. Typ. Max. Units Conditions Differential Bus Voltage Range for RECESSIVE State Detection VDiff_rec –3 — +0.5 V Normal and Silent Mode (Note 3) –27V ≤ VCANH ≤ +27V, –27V ≤ VCANL ≤ +27V Differential Bus Voltage Range for DOMINANT State Detection VDiff_dom 0.9 — 8 V Normal and Silent Mode (Note 3) -27V ≤ VCANH ≤ +27V, -27V ≤ VCANL ≤ +27V Transceiver Timing, Pins CANH, CANL, TXD, and RXD, see Figure Figure 2-1 and Figure 2-2 Delay Time from TXD to Bus Dominant td(TXD-busdom) 40 — 130 ns Normal Mode (Note 2) Delay Time from TXD to Bus Recessive td(TXD-busrec) 40 — 130 ns Normal Mode (Note 2) Delay Time from Bus Dominant to RXD td(busdom-RXD) 20 — 100 ns Normal and Silent Mode (Note 2) Delay Time from Bus Recessive to RXD td(busrec-RXD) 20 — 100 ns Normal and Silent Mode (Note 2) Propagation Delay from TXD to RXD tPD(TXD-RXD) ns ns Normal Mode RL = 60, CL = 100 pF Rising Edge at Pin TXD Falling Edge at Pin TXD 40 40 — — 210 200 tPD(TXD-RXD) — — — — 300 300 ns ns Normal Mode RL = 150, CL = 100 pF Rising Edge at Pin TXD (Note 3) Falling Edge at Pin TXD (Note 3) TXD Dominant Time-out Time tto(dom)TXD 0.8 — 3 ms VTXD = 0V, Normal Mode Delay Time for Normal Mode to Silent Mode Transition tdel(norm-sil) — — 10 µs Rising at Pin S (Note 3) Delay Time for Silent Mode to Normal Mode Transition tdel(sil-norm) — — 10 µs Falling at Pin S (Note 3) Debouncing Time for Recessive Clamping State Detection tRC_det — 90 — ns V(CANH-CANL) > 900 mV RXD = HIGH (Note 3) Transceiver Timing for Higher Bit Rates, Pins CANH, CANL, TXD, and RXD, see Figure 2-1 and Figure 2-3, External Capacitor on the RXD Pin CRXD ≤ 20 pF Recessive Bit Time on Pin RXD Recessive Bit Time on the Bus Note 1: 2: 3: tBit(RXD) 400 — 550 ns Normal Mode, tBit(TXD) = 500 ns (Note 1) RL = 60, CL = 100 pF tBit(RXD) 120 — 220 ns Normal Mode, tBit(TXD) = 200 ns RL = 60, CL = 100 pF tBit(Bus) 435 — 530 ns Normal Mode, tBit(TXD) = 500 ns (Note 1) RL = 60, CL = 100 pF tBit(Bus) 155 — 210 ns Normal Mode, tBit(TXD) = 200 ns RL = 60, CL = 100 pF 100% correlation tested. Characterized on samples. Design parameter.  2017-2019 Microchip Technology Inc. DS20005784C-page 11 ATA6564 TABLE 2-1: ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Specifications: Grade 1: Tamb = –40°C to +125°C, Grade 0: Tamb = –40°C to +150°C, TvJ  170°C, VVCC= 4.5V to 5.5V; VVIO = 2.8V to 5.5V; RL = 60, CL = 100 pF, unless otherwise specified. All voltages are defined in relation to ground; positive currents flow into the IC. Parameters Receiver Timing Symmetry Note 1: 2: 3: Sym. Min. Typ. Max. Units Conditions tRec –65 — +40 ns Normal mode, tBit(TXD) = 500ns tRec = tBit(RXD)–tBit(Bus) (Note 1) RL = 60, CL = 100 pF tRec –45 — +15 ns Normal mode, tBit(TXD) = 200ns tRec = tBit(RXD)–tBit(Bus) RL = 60, CL = 100 pF 100% correlation tested. Characterized on samples. Design parameter. TABLE 2-2: TEMPERATURE SPECIFICATIONS Parameters Sym. Min. Typ. Max. Units Thermal Resistance Virtual Junction to Ambient RthvJA — 145 — K/W Thermal Shutdown of the Bus Drivers for ATA6564-GAQW1 (Grade 1) TvJsd 150 — 195 °C Thermal Shutdown of the Bus Drivers for ATA6564-GAQW0 (Grade 0) TvJsd 170 — 195 °C TvJsd_hys — 15 — °C Thermal Resistance Virtual Junction to Heat Slug RthvJC — 10 — K/W Thermal Resistance Virtual Junction to Ambient, where Heat Slug is soldered to PCB according to JEDEC RthvJA — 50 — K/W Thermal Shutdown of the Bus Drivers for ATA6564-GBQW1 (Grade 1) TvJsd 150 — 195 °C Thermal Shutdown of the Bus Drivers for ATA6564-GBQW0 (Grade 0) TvJsd 170 — 195 °C TvJsd_hys — 15 — °C Conditions 8-Pin SOIC Thermal Shutdown Hysteresis 8-Pin VDFN Thermal Shutdown Hysteresis DS20005784C-page 12  2017-2019 Microchip Technology Inc. ATA6564 FIGURE 2-1: TIMING TEST CIRCUIT FOR THE ATA6564 CAN TRANSCEIVER +5V + 22μF 100nF 5 VIO 1 TXD 3 VCC 7 CANH RL 4 15pF RXD GND 6 CANL S 2 FIGURE 2-2: CL 8 CAN TRANSCEIVER TIMING DIAGRAM 1 HIGH TXD LOW CANH CANL dominant 0.9V VDiff 0.5V recessive HIGH 0.7VIO RXD 0.3VIO LOW td(TXD-busdom) td(TXD-busrec) td(busdom-RXD) tPD(TXD-RXD)  2017-2019 Microchip Technology Inc. td(busrec-RXD) tPD(TXD-RXD) DS20005784C-page 13 ATA6564 FIGURE 2-3: CAN TRANSCEIVER TIMING DIAGRAM 2 70% TXD 30% 5 x tBit(TXD) tBit(TXD) VDiff 900mV 500mV tBit(Bus) RXD 70% 30% tBit(RXD) DS20005784C-page 14  2017-2019 Microchip Technology Inc. ATA6564 3.0 PACKAGING INFORMATION 3.1 Package Marking Information 8-Lead SOIC Example Grade 1 Grade 0 Atmel 721 Atmel 721 ATA6564H ATA6564 1729256 1729256 Example 8-Lead VDFN 3 X 3 mm Grade 0 Legend: XX...X Y YY WW NNN e3 * Note: Grade 1 6564H 6564 256 256 Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.  2017-2019 Microchip Technology Inc. DS20005784C-page 15 ATA6564 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2X 0.10 C A–B D A D NOTE 5 N E 2 E1 2 E1 E NOTE 1 2 1 e B NX b 0.25 C A–B D NOTE 5 TOP VIEW 0.10 C C A A2 SEATING PLANE 8X A1 SIDE VIEW 0.10 C h R0.13 h R0.13 H SEE VIEW C VIEW A–A 0.23 L (L1) VIEW C Microchip Technology Drawing No. C04-057-SN Rev D Sheet 1 of 2 DS20005784C-page 16  2017-2019 Microchip Technology Inc. ATA6564 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units Dimension Limits Number of Pins N e Pitch Overall Height A Molded Package Thickness A2 § Standoff A1 Overall Width E Molded Package Width E1 Overall Length D Chamfer (Optional) h Foot Length L Footprint L1 Foot Angle c Lead Thickness b Lead Width Mold Draft Angle Top Mold Draft Angle Bottom MIN 1.25 0.10 0.25 0.40 0° 0.17 0.31 5° 5° MILLIMETERS NOM 8 1.27 BSC 6.00 BSC 3.90 BSC 4.90 BSC 1.04 REF - MAX 1.75 0.25 0.50 1.27 8° 0.25 0.51 15° 15° Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. § Significant Characteristic 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm per side. 4. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. 5. Datums A & B to be determined at Datum H. Microchip Technology Drawing No. C04-057-SN Rev D Sheet 2 of 2  2017-2019 Microchip Technology Inc. DS20005784C-page 17 ATA6564 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging SILK SCREEN C Y1 X1 E RECOMMENDED LAND PATTERN Units Dimension Limits E Contact Pitch Contact Pad Spacing C Contact Pad Width (X8) X1 Contact Pad Length (X8) Y1 MIN MILLIMETERS NOM 1.27 BSC 5.40 MAX 0.60 1.55 Notes: 1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-2057-SN Rev B DS20005784C-page 18  2017-2019 Microchip Technology Inc. ATA6564 8-Lead Very Thin Plastic Dual Flat, No Lead Package (Q8B) - 3x3 mm Body [VDFN] With 2.40x1.60 mm Exposed Pad and Stepped Wettable Flanks Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A B N (DATUM A) (DATUM B) E NOTE 1 2X 0.10 C 1 2 2X TOP VIEW 0.10 C 0.10 C C A A1 SEATING PLANE 8X (A3) 0.08 C SIDE VIEW 0.10 C A B D2 1 A 2 NOTE 1 0.10 A C A B E2 K N L 8X b e BOTTOM VIEW 0.10 0.05 C A B C Microchip Technology Drawing C04-21358 Rev B Sheet 1 of 2  2017-2019 Microchip Technology Inc. DS20005784C-page 19 ATA6564 8-Lead Very Thin Plastic Dual Flat, No Lead Package (Q8B) - 3x3 mm Body [VDFN] With 2.40x1.60 mm Exposed Pad and Stepped Wettable Flanks Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging A4 PARTIALLY PLATED E3 SECTION A–A Units Dimension Limits Number of Terminals N e Pitch Overall Height A Standoff A1 Terminal Thickness A3 Overall Length D Exposed Pad Length D2 Overall Width E Exposed Pad Width E2 b Terminal Width Terminal Length L K Terminal-to-Exposed-Pad Wettable Flank Step Cut Depth A4 E3 Wettable Flank Step Cut Width MIN 0.80 0.00 2.30 1.50 0.25 0.35 0.20 0.10 - MILLIMETERS NOM 8 0.65 BSC 0.85 0.03 0.203 REF 3.00 BSC 2.40 3.00 BSC 1.60 0.30 0.40 0.13 - MAX 0.90 0.05 2.50 1.70 0.35 0.45 0.15 0.04 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package is saw singulated 3. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-21358 Rev B Sheet 2 of 2 DS20005784C-page 20  2017-2019 Microchip Technology Inc. ATA6564 8-Lead Very Thin Plastic Dual Flat, No Lead Package (Q8B) - 3x3 mm Body [VDFN] With 2.40x1.60 mm Exposed Pad and Stepped Wettable Flanks Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Y2 EV 8 ØV C X2 EV CH G1 Y1 1 2 SILK SCREEN X1 G2 E RECOMMENDED LAND PATTERN Units Dimension Limits Contact Pitch E Optional Center Pad Width X2 Optional Center Pad Length Y2 Contact Pad Spacing C Contact Pad Width (X8) X1 Contact Pad Length (X8) Y1 Contact Pad to Center Pad (X8) G1 Contact Pad to Contact Pad (X6) G2 Pin 1 Index Chamfer CH Thermal Via Diameter V Thermal Via Pitch EV MIN MILLIMETERS NOM 0.65 BSC MAX 1.70 2.50 3.00 0.35 0.80 0.20 0.20 0.20 0.33 1.20 Notes: 1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. 2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process Microchip Technology Drawing C04-23358 Rev B  2017-2019 Microchip Technology Inc. DS20005784C-page 21 ATA6564 NOTES: DS20005784C-page 22  2017-2019 Microchip Technology Inc. ATA6564 APPENDIX A: REVISION HISTORY Revision C (August 2019) The following is the list of modifications: 1. 2. Updated TABLE 2-2: “Temperature Specifications”. Added test conditions at several parameters in TABLE 2-1: “Electrical Characteristics”. Revision B (July 2017) The following is the list of modifications: 3. 4. 5. 6. 7. 8. 9. Added the new device ATA6564-GBQW0 and updated the related information across the document. Updated ATA6564 Family Members Table. Corrected TABLE 2-1: Electrical Characteristics. Updated TABLE 2-2: Temperature Specifications. Updated the VDFN8 package drawing and added a Grade 0 package example to Section 3.1, Package Marking Information. Added a ATA6564-GBQW0 example to “Product Identification System” section. Various typographical edits. Revision A (June 2017) • Original release of this document.  2017-2019 Microchip Technology Inc. DS20005784C-page 23 ATA6564 NOTES: DS20005784C-page 24  2017-2019 Microchip Technology Inc. ATA6564 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office. PART NO. Device [X](1) XX X X Examples: a) ATA6564-GAQW0: Package Tape and Reel Package directives Temperature Option classification Range Device: ATA6564: Package: GA GB = = High-speed CAN Transceiver with Silent Mode CAN FD Ready 8-Lead SOIC 8-Lead VDFN Tape and Reel Option: Q = 330 mm diameter Tape and Reel Package directives classification: W = Package according to RoHS(2) Temperature Range: 0 1 = = Temperature Grade 0 (-40°C to +150°C) Temperature Grade 1 (-40°C to +125°C) according to RoHS, Temperature Grade 0 b) ATA6564-GBQW0: ATA6564, 8-Lead VDFN, Tape and Reel, package according to RoHS, Temperature Grade 0 c) ATA6564-GAQW1: ATA6564, 8-Lead SOIC, Tape and Reel, package according to RoHS, Temperature Grade 1 d)  2017-2019 Microchip Technology Inc. ATA6564, 8-Lead SOIC, Tape and Reel, package ATA6564-GBQW1: ATA6564, 8-Lead VDFN, Tape and Reel, package according to RoHS, Temperature Grade 1 Note 1: Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. 2: RoHS compliant, Maximum concentration value of 0.09% (900 ppm) for Bromine (Br) and Chlorine (Cl) and less than 0.15% (1500 ppm) total Bromine (Br) and Chlorine (Cl) in any homogeneous material. Maximum concentration value of 0.09% (900 ppm) for Antimony (Sb) in any homogeneous material. DS20005784C-page 25 ATA6564 NOTES: DS20005784C-page 26  2017-2019 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks The Microchip name and logo, the Microchip logo, Adaptec, AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, chipKIT, chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi, Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer, PackeTime, PIC, picoPower, PICSTART, PIC32 logo, PolarFire, Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon, TempTrackr, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. APT, ClockWorks, The Embedded Control Solutions Company, EtherSynch, FlashTec, Hyper Speed Control, HyperLight Load, IntelliMOS, Libero, motorBench, mTouch, Powermite 3, Precision Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet-Wire, SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub, TimePictra, TimeProvider, Vite, WinPath, and ZL are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BlueSky, BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. The Adaptec logo, Frequency on Demand, Silicon Storage Technology, and Symmcom are registered trademarks of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2019, Microchip Technology Incorporated, All Rights Reserved. For information regarding Microchip’s Quality Management Systems, please visit www.microchip.com/quality.  2017-2019 Microchip Technology Inc. ISBN: 978-1-5224-4978-2 DS20005784C-page 27 Worldwide Sales and Service AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/ support Web Address: www.microchip.com Australia - Sydney Tel: 61-2-9868-6733 India - Bangalore Tel: 91-80-3090-4444 China - Beijing Tel: 86-10-8569-7000 India - New Delhi Tel: 91-11-4160-8631 Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 China - Chengdu Tel: 86-28-8665-5511 India - Pune Tel: 91-20-4121-0141 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 China - Chongqing Tel: 86-23-8980-9588 Japan - Osaka Tel: 81-6-6152-7160 Finland - Espoo Tel: 358-9-4520-820 China - Dongguan Tel: 86-769-8702-9880 Japan - Tokyo Tel: 81-3-6880- 3770 China - Guangzhou Tel: 86-20-8755-8029 Korea - Daegu Tel: 82-53-744-4301 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 China - Hangzhou Tel: 86-571-8792-8115 Korea - Seoul Tel: 82-2-554-7200 China - Hong Kong SAR Tel: 852-2943-5100 Malaysia - Kuala Lumpur Tel: 60-3-7651-7906 China - Nanjing Tel: 86-25-8473-2460 Malaysia - Penang Tel: 60-4-227-8870 China - Qingdao Tel: 86-532-8502-7355 Philippines - Manila Tel: 63-2-634-9065 China - Shanghai Tel: 86-21-3326-8000 Singapore Tel: 65-6334-8870 China - Shenyang Tel: 86-24-2334-2829 Taiwan - Hsin Chu Tel: 886-3-577-8366 China - Shenzhen Tel: 86-755-8864-2200 Taiwan - Kaohsiung Tel: 886-7-213-7830 China - Suzhou Tel: 86-186-6233-1526 Taiwan - Taipei Tel: 886-2-2508-8600 China - Wuhan Tel: 86-27-5980-5300 Thailand - Bangkok Tel: 66-2-694-1351 China - Xian Tel: 86-29-8833-7252 Vietnam - Ho Chi Minh Tel: 84-28-5448-2100 Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Austin, TX Tel: 512-257-3370 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Novi, MI Tel: 248-848-4000 Houston, TX Tel: 281-894-5983 Indianapolis Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 Tel: 317-536-2380 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Tel: 951-273-7800 Raleigh, NC Tel: 919-844-7510 New York, NY Tel: 631-435-6000 San Jose, CA Tel: 408-735-9110 Tel: 408-436-4270 Canada - Toronto Tel: 905-695-1980 Fax: 905-695-2078 DS20005784C-page 28 China - Xiamen Tel: 86-592-2388138 China - Zhuhai Tel: 86-756-3210040 Germany - Garching Tel: 49-8931-9700 Germany - Haan Tel: 49-2129-3766400 Germany - Heilbronn Tel: 49-7131-72400 Germany - Karlsruhe Tel: 49-721-625370 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Germany - Rosenheim Tel: 49-8031-354-560 Israel - Ra’anana Tel: 972-9-744-7705 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Italy - Padova Tel: 39-049-7625286 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Norway - Trondheim Tel: 47-7288-4388 Poland - Warsaw Tel: 48-22-3325737 Romania - Bucharest Tel: 40-21-407-87-50 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 Sweden - Gothenberg Tel: 46-31-704-60-40 Sweden - Stockholm Tel: 46-8-5090-4654 UK - Wokingham Tel: 44-118-921-5800 Fax: 44-118-921-5820  2017-2019 Microchip Technology Inc. 05/14/19
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