ATA6629/ATA6631
LIN Bus Transceiver with Integrated Voltage Regulator
DATASHEET
Features
●
●
●
●
●
Supply voltage up to 40V
Operating voltage VS = 5V to 27V
Typically 10µA supply current during sleep mode
Typically 35µA supply current in silent mode
Linear low-drop voltage regulator, 85mA current capability:
●
●
●
●
Normal, fail-safe, and silent mode
Atmel ATA6629: VCC = 3.3V ±2%
Atmel ATA6631: VCC = 5.0V ±2%
Sleep mode: VCC is switched off
● VCC undervoltage detection with reset open drain output NRES (4ms reset time)
●
●
●
●
●
●
●
●
●
Voltage regulator is short-circuit and over-temperature protected
LIN physical layer according to LIN 2.0, 2.1 and SAEJ2602-2
Wake-up capability via LIN bus (90µs dominant)
TXD time-out timer
Bus pin is overtemperature and short-circuit protected versus GND and battery
Advanced EMC and ESD performance
Fulfills the OEM “hardware requirements for LIN in automotive applications rev.1.1”
Interference and damage protection according to ISO7637
Package: SO8
9165F-AUTO-10/14
1.
Description
Atmel® ATA6629/ATA6631 is a fully integrated LIN transceiver, designed according to the LIN specification 2.0, 2.1 and
SAEJ2602-2, with a low-drop voltage regulator (3.3V/5V/85mA). The combination of voltage regulator and bus transceiver
makes it possible to develop simple, but powerful, slave nodes in LIN bus systems. ATA6629/ATA6631 is designed to
handle the low-speed data communication in vehicles (for example, in convenience electronics). Improved slope control at
the LIN driver ensures secure data communication up to 20kBaud. The bus output is designed to withstand high voltage.
Sleep mode and silent mode guarantee minimized current consumption even in the case of a floating or a short circuited
LIN-bus.
Figure 1-1. Block Diagram
Atmel ATA6629/ATA6631
1
VS
4
LIN
8
VCC
7
NRES
VCC
5kΩ
RXD
Normal and
Fail-safe
Mode
Receiver
5
+
RF-filter
VCC
Wake-up bus timer
TXD
EN
6
TXD
Time-out
timer
Slew rate control
2
Control
unit
GND
3
Short-circuit and
overtemperature
protection
Sleep
mode
VCC
switched
off
Normal/Silent/
Fail-safe Mode
3.3V/5V
Undervoltage reset
2
ATA6629/ATA6631 [DATASHEET]
9165F–AUTO–10/14
2.
Pin Configuration
Figure 2-1. Pinning SO8
VS
EN
GND
LIN
Table 2-1.
1
2
3
4
8
7
6
5
VCC
NRES
TXD
RXD
Pin Description
Pin
Symbol
Function
1
VS
Battery supply
2
EN
Enables normal mode if the input is high
3
GND
4
LIN
LIN bus line input/output
5
RXD
Receive data output
6
TXD
Transmit data input
7
NRES
Output undervoltage reset, low at reset
8
VCC
Output voltage regulator 3.3V/5V/50mA
Ground, heat sink
ATA6629/ATA6631 [DATASHEET]
9165F–AUTO–10/14
3
3.
Functional Description
3.1
Physical Layer Compatibility
Since the LIN physical layer is independent from higher LIN layers (e.g., LIN protocol layer), all nodes with a LIN physical
layer according to revision 2.x can be mixed with LIN physical layer nodes, which are according to older versions (i.e., LIN
1.0, LIN 1.1, LIN 1.2, LIN 1.3) without any restrictions.
3.2
Supply Pin (VS)
LIN operating voltage is VS = 5V to 27V. An undervoltage detection is implemented to disable transmission if VS falls below
5V, in order to avoid false bus messages. After switching on VS, the IC starts with the fail-safe mode and the voltage
regulator is switched on.
The supply current in sleep mode is typically 10µA and 35µA in silent mode.
3.3
Ground Pin (GND)
The IC does not affect the LIN bus in the event of GND disconnection. It is able to handle a ground shift up to 11.5% of VS.
3.4
Voltage Regulator Output Pin (VCC)
The internal 3.3V/5V voltage regulator is capable of driving loads up to 85mA, supplying the microcontroller and other ICs on
the PCB and is protected against overload by means of current limitation and overtemperature shut-down. Furthermore, the
output voltage is monitored and will cause a reset signal at the NRES output pin if it drops below a defined threshold Vthun.
3.5
Undervoltage Reset Output (NRES)
If the VCC voltage falls below the undervoltage detection threshold Vthun, NRES switches to low after tres_f
(Figure 6-1 on page 15). Even if VCC = 0V the NRES stays low, because it is internally driven from the VS voltage. If VS
voltage ramps down, NRES stays low until VS < 1.5V and then becomes highly resistant.
The implemented undervoltage delay keeps NRES low for tReset = 4ms after VCC reaches its nominal value.
3.6
Bus Pin (LIN)
A low-side driver with internal current limitation and thermal shutdown as well as an internal pull-up resistor according to LIN
specification 2.x is implemented. The voltage range is from –27V to +40V. This pin exhibits no reverse current from the LIN
bus to VS, even in the event of a GND shift or VBatt disconnection. The LIN receiver thresholds are compatible with the LIN
protocol specification.
The fall time (from recessive to dominant) and the rise time (from dominant to recessive) are slope controlled.
3.7
Input/Output (TXD)
In normal mode the TXD pin is the microcontroller interface to control the state of the LIN output. TXD must be pulled to
ground in order to drive the LIN bus low. If TXD is high or unconnected (internal pull-up resistor), the LIN output transistor is
turned off and the bus is in the recessive state. During fail-safe mode, this pin is used as output and is signalling the fail-safe
source.
3.8
Dominant Time-out Function (TXD)
The TXD input has an internal pull-up resistor. An internal timer prevents the bus line from being driven permanently in the
dominant state. If TXD is forced to low longer than tDOM > 27ms, the LIN bus driver is switched to the recessive state.
Nevertheless, when switching to sleep mode, the actual level at the TXD pin is relevant.
To reactivate the LIN bus driver, switch TXD to high (> 10µs).
4
ATA6629/ATA6631 [DATASHEET]
9165F–AUTO–10/14
3.9
Output Pin (RXD)
This pin reports the state of the LIN bus to the microcontroller. LIN high (recessive state) is reported by a high level at RXD;
LIN low (dominant state) is reported by a low level at RXD. The output has an internal pull-up resistor with typically 5kΩ to
VCC. The AC characteristics are measured with an external load capacitor of 20pF.
The output is short-circuit protected. In unpowered mode (that is, VS = 0V), RXD is switched off.
3.10
Enable Input Pin (EN)
The enable input pin controls the operation mode of the device. If EN is high, the circuit is in normal mode, with transmission
paths from TXD to LIN and from LIN to RXD both active. The VCC voltage regulator operates with 3.3V/5V/85mA output
capability.
If EN is switched to low while TXD is still high, the device is forced to silent mode. No data transmission is then possible, and
the current consumption is reduced to IVS typ. 35µA. The VCC regulator has its full functionality.
If EN is switched to low while TXD is low, the device is forced to sleep mode. No data transmission is possible, and the
voltage regulator is switched off.
ATA6629/ATA6631 [DATASHEET]
9165F–AUTO–10/14
5
4.
Modes of Operation
Figure 4-1. Modes of Operation
a: VS > VSthF
Unpowered Mode
(See section 4.5)
b
b: VS < VSthU
c: Bus wake-up event
d: NRES switches to low
a
Fail-safe Mode
b
b
VCC: 3.3V/5V
with undervoltage monitoring
Communication: OFF
d
EN = 1
c or d
EN = 1
or c
Go to silent command
b
EN = 0
Silent Mode
TXD = 1
VCC: 3.3V/5V
with undervoltage monitoring
Communication: OFF
Local wake-up event
Normal Mode
EN = 1
VCC: 3.3V/5V
with undervoltage
monitoring
Go to sleep command
EN = 0
Communication: ON
Sleep Mode
TXD = 0
VCC: switched off
Communication: OFF
Table 4-1.
4.1
Modes of Operation
Modes of Operation
Transceiver
VCC
LIN
Fail safe
OFF
3.3V/5V
Recessive
Normal
ON
3.3V/5V
TXD depending
Silent
OFF
3.3V/5V
Recessive
Sleep
OFF
0V
Recessive
Normal Mode
This is the normal transmitting and receiving mode of the LIN interface, in accordance with LIN specification 2.x. The VCC
voltage regulator operates with a 3.3V/5V output voltage, with a low tolerance of ±2% and a maximum output current of
85mA.
If an undervoltage condition occurs, NRES is switched to low and the IC changes its state to fail-safe mode.
6
ATA6629/ATA6631 [DATASHEET]
9165F–AUTO–10/14
4.2
Silent Mode
A falling edge at EN while TXD is high switches the IC into silent mode. The TXD signal has to be logic high during the mode
select window (Figure 4-3 on page 8). The transmission path is disabled in silent mode. The overall supply current from VBatt
is a combination of the IVSsilent = 35µA plus the VCC regulator output current IVCC.
Figure 4-2. Switch to Silent Mode
Normal Mode
Silent Mode
EN
TXD
Mode select window
td = 3.2μs
NRES
VCC
Delay time silent mode
td_sleep = maximum 20μs
LIN
LIN switches directly to recessive mode
In silent mode the internal slave termination between pin LIN and pin VS is disabled to minimize the current consumption in
case pin LIN is short-circuited to GND. Only a weak pull-up current (typically 10µA) between pin LIN and pin VS is present.
The silent mode can be activated independently from the current level on pin LIN.
If an undervoltage condition occurs, NRES is switched to low and the Atmel® ATA6629/ATA6631 changes its state to
fail-safe mode.
A voltage less than the LIN pre-wake detection VLINL at pin LIN activates the internal LIN receiver and starts the wake-up
detection timer.
ATA6629/ATA6631 [DATASHEET]
9165F–AUTO–10/14
7
A falling edge at the LIN pin followed by a dominant bus level maintained for a certain time period (> tbus) and the following
rising edge at pin LIN (see Figure 4-3) results in a remote wake-up request which is only possible if TXD is high. The device
switches from silent mode to fail-safe mode, then the internal LIN slave termination resistor is switched on. The remote
wake-up request is indicated by a low level at pin RXD and TXD to interrupt the microcontroller (Figure 4-3). EN high can be
used to switch directly to normal mode.
Figure 4-3. LIN Wake-up Waveform Diagram from Silent Mode
Bus wake-up filtering time
tbus
Fail-safe mode
Normal mode
LIN bus
RXD
High
TXD
High
VCC
Low
High
Silent mode 3.3V/5V
Fail-safe mode 3.3V/5V
Normal mode
EN High
EN
NRES
8
ATA6629/ATA6631 [DATASHEET]
9165F–AUTO–10/14
Undervoltage detection active
4.3
Sleep Mode
A falling edge at EN while TXD is low switches the IC into sleep mode. The TXD signal has to be logic low during the mode
select window (Figure 4-5 on page 10).
Figure 4-4. Switch to Sleep Mode
Sleep Mode
Normal Mode
EN
Mode select window
TXD
td = 3.2μs
NRES
VCC
Delay time sleep mode
td_sleep = maximum 20μs
LIN
LIN switches directly to recessive mode
In order to avoid any influence to the LIN-pin during switching into sleep mode it is possible to switch the EN up to 3.2µs
earlier to low than the TXD. Therefore, the best an easiest way are two falling edges at TXD and EN at the same time.
In sleep mode the transmission path is disabled. Supply current from VBatt is typically IVSsleep = 10µA. The VCC regulator is
switched off; NRES and RXD are low. The internal slave termination between pin LIN and pin VS is disabled to minimize the
current consumption in case pin LIN is short-circuited to GND. Only a weak pull-up current (typically 10µA) between pin LIN
and pin VS is present. The sleep mode can be activated independently from the current level on pin LIN.
A voltage less than the LIN pre-wake detection VLINL at pin LIN activates the internal LIN receiver and starts the wake-up
detection timer.
A falling edge at the LIN pin followed by a dominant bus level maintained for a certain time period (> tbus) and a following
rising edge at pin LIN results in a remote wake-up request. The device switches from sleep Mode to fail-safe mode.
The VCC regulator is activated, and the internal LIN slave termination resistor is switched on. The remote wake-up request is
indicated by a low level at RXD and TXD to interrupt the microcontroller (Figure 4-5 on page 10).
EN high can be used to switch directly from sleep/silent to fail-safe mode. If EN is still high after VCC ramp up and
undervoltage reset time, the IC switches to normal mode.
ATA6629/ATA6631 [DATASHEET]
9165F–AUTO–10/14
9
Figure 4-5. LIN Wake-up Diagram from Sleep Mode
Bus wake-up filtering time
tbus
Fail-safe Mode
Low
Low
Normal Mode
LIN bus
RXD
High
TXD
VCC
voltage
regulator
On state
Off state
Regulator wake-up time
EN High
EN
Reset
time
NRES
Low
Microcontroller
start-up time delay
10
ATA6629/ATA6631 [DATASHEET]
9165F–AUTO–10/14
4.4
Sleep or Silent Mode: Behavior at a Floating LIN-bus or a Short Circuited LIN to GND
In sleep or in silent mode the device has a very low current consumption even during short-circuits or floating conditions on
the bus. A floating bus can arise if the master pull-up resistor is missing, e.g., if it is switched off when the LIN- master is in
sleep mode or even if the power supply of the master node is switched off.
In order to minimize the current consumption IVS in sleep or silent mode during voltage levels at the LIN-pin below the LIN
pre-wake threshold, the receiver is activated only for a specific time tmon. If tmon elapses while the voltage at the bus is lower
than pre-wake detection low (VLINL) and higher than the LIN dominant level, the receiver is switched off again and the circuit
changes back to sleep respectively silent mode. The current consumption is then IVSsleep_short or IVSsilent_short (typ. 10µA more
than IVSsleep respectively IVSsilent). If a dominant state is reached on the bus no wake-up will occur. Even if the voltage rises
above the pre-wake detection high (VLINH), the IC will stay in sleep respectively silent mode (see Figure 4-6 on page 11).
This means the LIN-bus must be above the pre-wake detection threshold VLINH for a few microseconds before a new LIN
wake-up is possible.
Figure 4-6. Floating LIN-bus During Sleep or Silent Mode
LIN Pre-wake
VLINL
LIN BUS
LIN dominant state
VBUSdom
tmon
IVSfail
IVS
IVSsleep/silent
Mode of
operation
Int. Pull-up
Resistor
RLIN
Sleep/Silent Mode
IVSsleep_short /
IVSsilent_short
IVSsleep/silent
Wake-up Detection Phase
Sleep/Silent Mode
off (disabled)
If the Atmel® ATA6629/ATA6631 is in sleep or silent mode and the voltage level at the LIN-bus is in dominant state
(VLIN < VBUSdom) for a time period exceeding tmon (during a short circuit at LIN, for example), the IC switches back to sleep
mode respectively silent mode. The VS current consumption then is IVSsleep_short or IVSsilent_short (typ. 10µA more than IVSsleep
respectively IVSsilent). After a positive edge at pin LIN the IC switches directly to fail-safe mode (see Figure 4-7 on page 12).
ATA6629/ATA6631 [DATASHEET]
9165F–AUTO–10/14
11
Figure 4-7. Short Circuit to GND on the LIN bus During Sleep- or Silent Mode
LIN Pre-wake
VLINL
LIN BUS
LIN dominant state
VBUSdom
tmon
tmon
IVSsleep_short/
IVSsilent_short
IVSfail
IVS
Mode of
operation
IVSsleep/silent
Sleep/Silent Mode
Int. Pull-up
Resistor
RLIN
4.5
Wake-up Detection Phase
off (disabled)
Sleep/Silent
Mode
Fail-Safe Mode
on (enabled)
Fail-safe Mode
The device automatically switches to fail-safe mode at system power-up. The voltage regulator is switched on
(see Figure 6-1 on page 15). The NRES output switches to low for tres = 4ms and gives a reset to the microcontroller. LIN
communication is switched off. The IC stays in this mode until EN is switched to high. The IC then changes to normal mode.
A power down of VBatt (VS < VSth) during silent or sleep mode switches the IC into fail-safe mode after power up. A low at
NRES switches the IC into fail-safe mode directly. During fail-safe mode the TXD pin is an output and signals the fail-safe
source.
The LIN SBC can operate in different modes, like normal, silent or sleep mode. The functionality of these modes is described
in Table 4-2.
Table 4-2.
TXD, RXD Depending from Operation Modes
Different Modes
12
TXD
RXD
Fail-safe Mode
Signalling fail-safe sources (see Table 4-3)
Normal Mode
Follows data transmission
Silent Mode
High
High
Sleep Mode
Low
Low
ATA6629/ATA6631 [DATASHEET]
9165F–AUTO–10/14
A wake-up event from either silent or sleep mode will be signalled to the microcontroller using the two pins RXD and TXD.
The coding is shown in Table 4-3.
A wake-up event will lead the IC to the fail-safe mode.
Table 4-3.
Fail-safe Sources
TXD
RXD
LIN wake up (pin LIN)
Low
Low
VSth (battery) undervoltage detection
High
Low
Unpowered Mode
If you connect battery voltage to the application circuit, the voltage at the VS pin increases according to the block capacitor
(see Figure 6-1 on page 15). After VS is higher than the VS undervoltage threshold VSth, the IC mode changes from
unpowered mode to fail-safe mode. The VCC output voltage reaches its nominal value after tVCC. This time, tVCC, depends
on the VCC capacitor and the load.
The NRES is low for the reset time delay treset. During this time, treset, no mode change is possible.
IF VS drops below VSth, then the IC switches to unpowered mode. The behaviour of VCC, NRES and LIN is shown in
Figure 4-8.
Figure 4-8. VCC versus VS for the VCC = 3.3V Regulator
6.0
5.5
5.0
Regulator drop voltage VD
4.5
4.0
V in V
4.6
Signalling Fail-safe Sources
LIN
3.5
3.0
2.5
VS
2.0
NRES
1.5
VCC
1.0
0.5
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
VS in V
ATA6629/ATA6631 [DATASHEET]
9165F–AUTO–10/14
13
5.
14
Fail-safe Features
●
During a short-circuit at LIN to VBattery , the output limits the output current to IBUS_LIM. Due to the power dissipation, the
chip temperature exceeds TLINoff and the LIN output is switched off. The chip cools down and after a hysteresis of Thys,
switches the output on again. RXD stays on high because LIN is high. During LIN overtemperature switch-off, the VCC
regulator is working independently.
●
During a short-circuit from LIN to GND the IC can be switched into sleep or Silent mode and even in this case the
current consumption is lower than 30µA in sleep mode and lower than 70µA in silent mode. If the short-circuit
disappears, the IC starts with a remote wake-up.
●
Sleep or silent mode: During a floating condition on the bus the IC switches back to sleep mode/silent mode
automatically and thereby the current consumption is lower than 30µA/70µA.
●
The reverse current is < 2µA at pin LIN during loss of VBatt . This is optimal behavior for bus systems where some
slave nodes are supplied from battery or ignition.
●
During a short circuit at VCC, the output limits the output current to IVCClim. Because of undervoltage, NRES switches
to low and sends a reset to the microcontroller. The IC switches into fail-safe mode. If the chip temperature exceeds
the value TVCCoff, the VCC output switches off. The chip cools down and after a hysteresis of Thys, switches the output
on again. Because of fail-safe mode, the VCC voltage will switch on again although EN is switched off from the
microcontroller.The microcontroller can then start with normal operation.
●
●
●
●
Pin EN provides a pull-down resistor to force the transceiver into recessive mode if EN is disconnected.
●
If TXD is short-circuited to GND, it is possible to switch to sleep mode via ENABLE after t > tdom.
Pin RXD is set floating if VBatt is disconnected.
Pin TXD provides a pull-up resistor to force the transceiver into recessive mode if TXD is disconnected.
After switching the IC into normal mode the TXD pin must be pulled to high longer than 10µs in order to activate the
LIN driver. This feature prevents the bus from being driven into dominant state when the IC is switched into normal
mode and TXD is low.
ATA6629/ATA6631 [DATASHEET]
9165F–AUTO–10/14
Voltage Regulator
Figure 6-1. VCC Voltage Regulator: Ramp Up and Undervoltage
VS
12V
5.5V/3.8V
VCC
5V/3.3V
Vthun
tVCC
tReset
tres_f
NRES
5V/3.3V
The voltage regulator needs an external capacitor for compensation and to smooth the disturbances from the
microcontroller. It is recommended to use an electrolytic capacitor with C > 1.8µF and a ceramic capacitor with C = 100nF.
The values of these capacitors can be varied by the customer, depending on the application.
With this special SO8 package (fused lead frame to pin 3) an Rthja of 80K/W is achieved.
Therefore, it is recommended to connect pin 3 with a wide GND plate on the printed board to get a good heat sink.
The main power dissipation of the IC is created from the VCC output current IVCC, which is needed for the application.
Figure 6-2 shows the safe operating area of the Atmel® ATA6631.
Figure 6-2. Power Dissipation: Safe Operating Area: VCC Output Current versus Supply Voltage VS at Different
Ambient Temperatures Due to Rthja = 80K/W
90
80
70
IVCC (mA)
6.
60
50
Tamb = 85°C
40
Tamb = 95°C
Tamb = 105°C
30
Tamb = 115°C
20
10
0
5
6
7
8
9
10
11
12
13
14
15
16
17
18
VS (V)
For programming purposes of the microcontroller, it is potentionally necessary to supply the VCC output via an external
power supply while the VS Pin of the system basis chip is disconnected. This will not affect the system basis chip.
ATA6629/ATA6631 [DATASHEET]
9165F–AUTO–10/14
15
7.
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating
only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Parameters
Symbol
Min.
Supply voltage VS
VS
–0.3
Pulse time ≤ 500ms
Ta = 25°C
Output current IVCC ≤ 85mA
Pulse time ≤ 2 min
Ta = 25°C
Output current IVCC ≤ 85mA
Max.
Unit
+40
V
VS
+40
V
VS
27
V
+5.5
V
+2
mA
Logic pins (RxD, TxD, EN, NRES)
Output current NRES
Typ.
–0.3
INRES
LIN
- DC voltage
–27
+40
V
VCC
- DC voltage
–0.3
+5.5
V
ESD according to IBEE LIN EMC
Test specification 1.0 following IEC 61000-4-2
- Pin VS, LIN to GND
±8
KV
ESD HBM following STM5.1
with 1.5 kΩ/100 pF
- Pin VS, LIN to GND
±6
KV
±3
KV
CDM ESD STM 5.3.1
±750
V
Machine model ESD
AEC-Q100-RevF(003)
±200
V
HBM ESD
ANSI/ESD-STM5.1
JESD22-A114
AEC-Q100 (002)
Junction temperature
Tj
–40
+150
°C
Storage temperature
Ts
–55
+150
°C
8.
Thermal Characteristics
Parameters
Symbol
Thermal resistance junction to ambient
(free air)
Rthja
Special heat sink at GND (pin 3) on PCB
Rthja
Min.
Typ.
Max.
Unit
145
K/W
80
K/W
Thermal shutdown of VCC regulator
TVCCoff
150
160
170
°C
Thermal shutdown of LIN output
TLINoff
150
160
170
°C
Thermal shutdown hysteresis
16
ATA6629/ATA6631 [DATASHEET]
9165F–AUTO–10/14
Thys
10
°C
9.
Electrical Characteristics
5V < VS < 27V, –40°C < Tj < 150°C; unless otherwise specified all values refer to GND pins.
No.
Pin
Symbol
Min.
Typ.
Max.
Unit
Type*
VS
VS
5
13.5
27
V
A
Sleep mode
VLIN > VS – 0.5V
VS < 14V
VS
IVSsleep
2
10
14
µA
A
Sleep mode, VLIN = 0V
Bus shorted to GND
VS < 14V
VS
IVSsleep_short
3
20
30
µA
A
Bus recessive
VS < 14V
Without load at VCC
VS
IVSsilent
20
35
50
µA
A
Silent mode
VS < 14V
Bus shorted to GND
Without load at VCC
VS
IVSsilent_short
25
45
70
µA
A
1.4
Bus recessive
Supply current in normal
VS < 14V
mode
Without load at VCC
VS
IVSrec
0.3
0.8
mA
A
1.5
Bus dominant
Supply current in normal
VS < 14V
mode
VCC load current 50mA
VS
IVSdom
50
53
mA
A
1.6
Bus recessive
Supply current in fail-safe
VS < 14V
mode
Without load at VCC
VS
IVSfail
0.35
0.53
mA
A
1.7
VS undervoltage
threshold
Switch to unpowered mode
VS
VSthU
3.7
4.2
4.7
V
A
Switch to fail-safe mode
VS
VSthF
4.0
4.5
5
V
A
1.8
VS undervoltage
hysteresis
VS
VSth_hys
V
A
2
RXD output pin
RXD
IRXD
8
mA
A
0.4
V
A
7
kΩ
A
1
1.1
1.2
1.3
Parameters
Test Conditions
Vs pin
Nominal DC voltage
range
Supply current in sleep
mode
Supply current in silent
mode
2.1
Low level output sink
current
2.2
Low level output voltage IRXD = 1mA
RXD
VRXDL
2.3
Internal resistor to VCC
RXD
RRXD
3
TXD
VTXDL
–0.3
+0.8
V
A
VCC +
0.3V
V
A
400
kΩ
A
+3
µA
A
8
mA
A
3
3.1
Normal Mode
VLIN = 0V, VRXD = 0.4V
0.3
1.3
2.5
5
TXD input/output pin
Low level voltage input
3.2
High level voltage input
TXD
VTXDH
2
3.3
Pull-up resistor
VTXD = 0V
TXD
RTXD
125
3.4
High level leakage
current
VTXD = VCC
TXD
ITXD
–3
3.5
Fail-safe Mode
Low level output sink
V = VS
current at local wake-up LIN
VWAKE = 0V
request
VTXD = 0.4V
TXD
ITXDwake
2
250
2.5
*) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
ATA6629/ATA6631 [DATASHEET]
9165F–AUTO–10/14
17
9.
Electrical Characteristics (Continued)
5V < VS < 27V, –40°C < Tj < 150°C; unless otherwise specified all values refer to GND pins.
No.
Parameters
4
EN input pin
4.1
Low level voltage input
4.2
High level voltage input
4.3
Pull-down resistor
4.4
Low level input current
5
Test Conditions
Pin
Symbol
Min.
EN
VENL
Max.
Unit
Type*
–0.3
+0.8
V
A
VCC +
0.3V
V
A
200
kΩ
A
+3
µA
A
VNRESL
0.14
V
A
0.2
V
A
6
ms
A
EN
VENH
2
VEN = VCC
EN
REN
50
VEN = 0V
EN
IEN
–3
Typ.
125
NRES open drain output pin
5.1
Low level output voltage
VS ≥ 5.5V
INRES = 1mA
NRES
5.2
Low level output low
10 kΩ to 5V
VCC = 0V
NRES
VNRESLL
5.3
Undervoltage reset time
VVS ≥ 5.5V
CNRES = 20pF
NRES
tReset
2
5.4
Reset debounce time for VVS ≥ 5.5V
falling edge
CNRES = 20pF
NRES
tres_f
1.5
10
µs
A
5.5
Switch off leakage
current
NRES
–3
+3
µA
A
6
6.1
VNRES = 5.5V
4
VCC Voltage Regulator Atmel ATA6629
Output voltage VCC
4V < VS < 18V
(0mA to 50mA)
VCC
VCCnor
3.234
3.366
V
A
4.5V < VS < 18V
(0mA to 85mA)
VCC
VCCnor
3.234
3.366
V
C
VVS –
VDrop
3.366
V
A
200
mV
A
6.2
Output voltage VCC at
low VS
3V < VS < 4V
VCC
VCClow
6.3
Regulator drop voltage
VS > 3V, IVCC = –15mA
VCC
VD1
6.4
Regulator drop voltage
VS > 3V, IVCC = –50mA
VCC
VD2
500
700
mV
A
6.5
Line regulation maximum 4V < VS < 18V
VCC
VCCline
0.1
0.2
%
A
6.6
Load regulation
maximum
5 mA < IVCC < 50mA
VCC
VCCload
0.1
0.5
%
A
6.7
Power supply ripple
rejection
10 Hz to 100kHz
CVCC = 10µF
VS = 14V, IVCC = –15mA
dB
D
6.8
Output current limitation VS > 4V
mA
A
µF
D
V
A
mV
A
µs
A
6.9
External load capacity
0.2Ω < ESR < 5Ω at
100kHz
for phase margin ≥ 60°
50
VCC
IVCCs
–240
–160
VCC
Cload
1.8
10
2.8
–85
ESR < 0.2Ω at 100kHz
for phase margin ≥ 30°
6.10
VCC undervoltage
threshold
Referred to VCC
VS > 4V
VCC
VthunN
6.11
Hysteresis of
undervoltage threshold
Referred to VCC
VS > 4V
VCC
Vhysthun
150
6.12
Ramp up time VS > 4V to CVCC = 2.2µF
VCC = 3.3V
Iload = –5mA at VCC
VCC
tVCC
320
3.2
500
*) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
18
ATA6629/ATA6631 [DATASHEET]
9165F–AUTO–10/14
9.
Electrical Characteristics (Continued)
5V < VS < 27V, –40°C < Tj < 150°C; unless otherwise specified all values refer to GND pins.
No.
7
7.1
Parameters
Test Conditions
Pin
Symbol
Min.
5.5V < VS < 18V
(0mA to 50mA)
VCC
VCCnor
6V < VS < 18V
(0mA to 85mA)
VCC
Typ.
Max.
Unit
Type*
4.9
5.1
V
A
VCCnor
4.9
5.1
V
C
VVS – VD
5.1
V
A
250
mV
A
600
mV
A
VCC voltage regulator Atmel ATA6631
Output voltage VCC
7.2
Output voltage VCC at
low VS
4V < VS < 5.5V
VCC
VCClow
7.3
Regulator drop voltage
VS > 4V, IVCC = –20mA
VCC
VD1
7.4
Regulator drop voltage
VS > 4V, IVCC = –50mA
VCC
VD2
7.5
Regulator drop voltage
VS > 3.3V, IVCC = –15mA
VCC
VD3
200
mV
A
7.6
Line regulation maximum 5.5V < VS < 18V
VCC
VCCline
0.1
0.2
%
A
7.7
Load regulation
maximum
5 mA < IVCC < 50mA
VCC
VCCload
0.1
0.5
%
A
7.8
Power supply ripple
rejection
10Hz to 100kHz
CVCC = 10µF
VS = 14V, IVCC = –15mA
dB
D
7.9
Output current limitation VS > 5.5V
mA
A
µF
D
V
A
mV
A
µs
A
7.10
External load capacity
0.2Ω < ESR < 5Ω at
100kHz
for phase margin ≥ 60°
400
50
VCC
IVCCs
–240
–160
VCC
Cload
1.8
10
4.2
–85
ESR < 0.2Ω at 100kHz
for phase margin ≥ 30°
7.11
VCC undervoltage
threshold
Referred to VCC
VS > 5.5V
VCC
VthunN
7.12
Hysteresis of
undervoltage threshold
Referred to VCC
VS > 5.5V
VCC
Vhysthun
250
7.13
Ramp up time VS > 5.5V CVCC = 2.2µF
to VCC = 5V
Iload = –5mA at VCC
VCC
TVCC
320
8
4.8
500
LIN bus driver: bus load conditions:
load 1 (Small): 1nF, 1kΩ; load 2 (large): 10nF, 500Ω; internal pull-up RRXD = 5kΩ ; CRXD = 20pF, Load 3 (medium): 6.8nF,
660Ω characterized on samples
10.7 and 10.8 specifies the timing parameters for proper operation at 20kBit/s and 10.9 and 10.10 at 10.4kBit/s
8.1
Driver recessive output
voltage
Load1/load2
LIN
VBUSrec
8.2
Driver dominant voltage
VVS = 7V
Rload = 500Ω
LIN
8.3
Driver dominant voltage
VVS = 18V
Rload = 500Ω
8.4
Driver dominant voltage
8.5
8.6
0.9 × VS
VS
V
A
V_LoSUP
1.2
V
A
LIN
V_HiSUP
2
V
A
VVS = 7V
Rload = 1000Ω
LIN
V_LoSUP_1k
0.6
V
A
Driver dominant voltage
VVS = 18V
Rload = 1000Ω
LIN
V_HiSUP_1k
0.8
V
A
Pull–up resistor to VS
The serial diode is
mandatory
LIN
RLIN
20
kΩ
A
30
47
*) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
ATA6629/ATA6631 [DATASHEET]
9165F–AUTO–10/14
19
9.
Electrical Characteristics (Continued)
5V < VS < 27V, –40°C < Tj < 150°C; unless otherwise specified all values refer to GND pins.
No.
Parameters
8.7
Pin
Symbol
Min.
Voltage drop at the serial In pull-up path with Rslave
diodes
ISerDiode = 10mA
LIN
VSerDiode
0.4
8.8
LIN current limitation
VBUS = VBatt_max
LIN
IBUS_LIM
40
120
8.9
Input leakage current at
the receiver including
pull-up resistor as
specified
Input leakage current
driver off
VBUS = 0V
VBatt = 12V
LIN
IBUS_PAS_dom
–1
–0.35
8.10
Leakage current LIN
recessive
Driver off
8V < VBatt < 18V
8V < VBUS < 18V
VBUS ≥ VBatt
LIN
IBUS_PAS_rec
8.11
Leakage current when
control unit disconnected
GNDDevice = VS
from ground.
V = 12V
loss of local ground must Batt
0V < VBUS < 18V
not affect communication
in the residual network
LIN
IBUS_NO_gnd
8.12
Leakage current at
disconnected battery.
Node has to sustain the VBatt disconnected
VSUP_Device = GND
current that can flow
under this condition. Bus 0V < VBUS < 18V
must remain operational
under this condition.
LIN
IBUS_NO_bat
8.13
Capacitance on pin LIN
to GND
LIN
CLIN
LIN
VBUS_CNT
0.475 ×
VS
9
Test Conditions
–10
Typ.
Max.
Unit
Type*
1.0
V
D
200
mA
A
mA
A
10
20
µA
A
+0.5
+10
µA
A
0.1
2
µA
A
20
pF
D
0.525 ×
VS
V
A
LIN bus receiver
VBUS_CNT =
(Vth_dom + Vth_rec)/2
0.5 ×
VS
9.1
Center of receiver
threshold
9.2
Receiver dominant state VEN = 5V
LIN
VBUSdom
–27
0.4 × VS
V
A
9.3
Receiver recessive state VEN = 5V
LIN
VBUSrec
0.6 × VS
40
V
A
9.4
Receiver input hysteresis Vhys = Vth_rec – Vth_dom
LIN
VBUShys
0.028 ×
VS
0.175 ×
VS
V
A
9.5
Pre-wake detection LIN
High level input voltage
LIN
VLINH
VS – 2V
VS + 0.3V
V
A
9.6
Pre-wake detection LIN
Low level input voltage
LIN
VLINL
–27
VS – 3.3V
V
A
10
Internal Timers
Activates the LIN receiver
0.1 x VS
10.1
Dominant time for wake–
VLIN = 0V
up via LIN bus
LIN
tbus
30
90
150
µs
A
10.2
Time delay for mode
change from fail-safe into VEN = 5V
normal mode via pin EN
EN
tnorm
5
15
20
µs
A
*) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
20
ATA6629/ATA6631 [DATASHEET]
9165F–AUTO–10/14
9.
Electrical Characteristics (Continued)
5V < VS < 27V, –40°C < Tj < 150°C; unless otherwise specified all values refer to GND pins.
No.
Parameters
Pin
Symbol
Min.
Typ.
Max.
Unit
Type*
10.3
Time delay for mode
change from normal
V = 0V
mode to sleep mode via EN
pin EN
EN
tsleep
8
16
25
µs
A
10.4
TXD dominant time out
time
TXD
tdom
27
55
70
ms
A
10.5
Time delay for mode
change from silent mode VEN = 5V
into normal mode via EN
EN
ts_n
5
15
40
µs
A
10.6
Monitoring time for wakeup over LIN bus
LIN
tmon
6
10
15
ms
A
Duty cycle 1
THRec(max) = 0.744 × VS
THDom(max) = 0.581 × VS
VS = 7.0V to 18V
tBit = 50µs
D1 = tbus_rec(min)/(2 × tBit)
LIN
D1
0.396
Duty cycle 2
THRec(min) = 0.422 × VS
THDom(min) = 0.284 × VS
VS = 7.6V to 18V
tBit = 50µs
D2 = tbus_rec(max)/(2 × tBit)
LIN
D2
Duty cycle 3
THRec(max) = 0.778 × VS
THDom(max) = 0.616 × VS
VS = 7.0V to 18V
tBit = 96µs
D3 = tbus_rec(min)/(2 × tBit)
LIN
D3
10.10 Duty cycle 4
THRec(min) = 0.389 × VS
THDom(min) = 0.251 × VS
VS = 7.6V to 18V
tBit = 96µs
D4 = tbus_rec(max)/(2 × tBit)
LIN
D4
VS = 7.0V to 18V
LIN
tSLOPE_fall
tSLOPE_rise
10.7
10.8
10.9
10.11
11
Slope time falling and
rising edge at LIN
Test Conditions
VTXD = 0V
A
0.581
A
0.417
A
0.590
3.5
A
22.5
µs
A
6
µs
A
+2
µs
A
Receiver electrical AC parameters of the LIN physical layer
LIN receiver, RXD load conditions: internal pull-up; CRXD = 20pF
11.1
Propagation delay of
receiver
Figure 9-1 on page 22
11.2
Symmetry of receiver
V = 7.0V to 18V
propagation delay rising S
trx_sym = trx_pdr – trx_pdf
edge minus falling edge
VS = 7.0V to 18V
trx_pd = max(trx_pdr , trx_pdf)
RXD
trx_pd
RXD
trx_sym
–2
*) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter
ATA6629/ATA6631 [DATASHEET]
9165F–AUTO–10/14
21
Figure 9-1. Definition of Bus Timing Characteristics
tBit
tBit
tBit
TXD
(Input to transmitting node)
tBus_dom(max)
tBus_rec(min)
Thresholds of
receiving node1
THRec(max)
VS
(Transceiver supply
of transmitting node)
THDom(max)
LIN Bus Signal
Thresholds of
receiving node2
THRec(min)
THDom(min)
tBus_dom(min)
tBus_rec(max)
RXD
(Output of receiving node1)
trx_pdf(1)
trx_pdr(1)
RXD
(Output of receiving node2)
trx_pdr(2)
22
ATA6629/ATA6631 [DATASHEET]
9165F–AUTO–10/14
trx_pdf(2)
Figure 9-2. Application Circuit
VCC
Atmel ATA6629/31
1
VBAT
VS
VCC
+
5kΩ
RXD 5
Normal and
Fail-safe
Mode
Receiver
+
100nF
22μF
1k
4
LIN-BUS
LIN
RF filter
220pF
VCC
Microcontroller
Wake-up bus timer
TXD
EN
GND
6
2
3
TXD
Time-out
timer
Short circuit and
overtemperature
protection
Slew rate control
Control
unit
Sleep
mode
VCC
switched
off
Normal/Silent/
Fail-safe mode
3.3V/5V
8
VCC
7
NRES
10kΩ
Undervoltage reset
100nF
10μF
GND
ATA6629/ATA6631 [DATASHEET]
9165F–AUTO–10/14
23
10.
11.
Ordering Information
Extended Type Number
Package
Remarks
ATA6629-GAQW
SO8
3.3V LIN system basis chip, Pb-free, 4k, taped and reeled
ATA6631-GAQW
SO8
5V LIN system basis chip, Pb-free, 4k, taped and reeled
Package Information
E1
L
A
b
A2
A1
C
D
e
8
E
5
technical drawings
according to DIN
specifications
Dimensions in mm
1
4
COMMON DIMENSIONS
Pin 1 identity
(Unit of Measure = mm)
Symbol
MIN
NOM
MAX
A
1.5
1.65
1.8
A1
0.1
0.15
0.25
A2
1.4
1.47
1.55
D
4.8
4.9
5
E
5.8
6
6.2
E1
3.8
3.9
4
L
0.4
0.65
0.9
C
0.15
0.2
0.25
b
0.3
0.4
0.5
e
NOTE
1.27 BSC
05/08/14
TITLE
Package Drawing Contact:
packagedrawings@atmel.com
24
Package: SO8
ATA6629/ATA6631 [DATASHEET]
9165F–AUTO–10/14
GPC
DRAWING NO.
REV.
6.543-5185.01-4
1
12.
Revision History
Please note that the following page numbers referred to in this section refer to the specific revision mentioned, not to this
document.
Revision No.
History
• Put datasheet in the latest template
9165F-AUTO-10/14
• Section 10 “Ordering Information” on page 24 updated
• Section 11 “Package Information” on page 25 updated
9165E-AUTO-04/14
• Put datasheet in the latest template
• Features on page 1 changed
• Section 1 “Description” on pages 1 to 2 changed
• Section 3 “Functional Description” on pages 3 to 4 changed
9165D-AUTO-03/11
• Section 4 “Modes of Operation” on pages 5 to 12 changed
• Section 5 “Fail-safe Features” on page 13 changed
• Section 6 “Voltage Regulator” on pages 14 to 15 changed
• Section 7 “Absolute Maximum Ratings” on page 16 changed
• Section 9 “Electrical Characteristics” on pages 17 to 23 changed
9165C-AUTO-10/10
• Section 9 “Electrical Characteristics” numbers 1.7 on page 17 and 10.3 on page 20
changed
• Features on page 1 changed
•Text under heading 3.3 changed
•Text under heading 4.2 changed
9165B-AUTO-05/10
•Abs.Max.Rat.Table -> Values in row “ESD HBM following....” changed
• El.Char.Table -> rows changed: 1.2, 1.3, 5.1, 5.2, 6.5, 6.6, 6.7, 6.8, 6.12, 7.6, 7.7, 7.8, 7.9,
7.13
• El.Char.Table -> row 8.13 added
ATA6629/ATA6631 [DATASHEET]
9165F–AUTO–10/14
25
XXXXXX
Atmel Corporation
1600 Technology Drive, San Jose, CA 95110 USA
T: (+1)(408) 441.0311
F: (+1)(408) 436.4200
|
www.atmel.com
© 2014 Atmel Corporation. / Rev.: 9165F–AUTO–10/14
Atmel®, Atmel logo and combinations thereof, Enabling Unlimited Possibilities®, and others are registered trademarks or trademarks of Atmel Corporation or its
subsidiaries. Other terms and product names may be trademarks of others.
DISCLAIMER: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right
is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN THE ATMEL TERMS AND CONDITIONS OF SALES LOCATED ON THE
ATMEL WEBSITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT
SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES
FOR LOSS AND PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no representations or warranties with respect to the accuracy or completeness of the contents of this
document and reserves the right to make changes to specifications and products descriptions at any time without notice. Atmel does not make any commitment to update the information
contained herein. Unless specifically provided otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel products are not intended,
authorized, or warranted for use as components in applications intended to support or sustain life.
SAFETY-CRITICAL, MILITARY, AND AUTOMOTIVE APPLICATIONS DISCLAIMER: Atmel products are not designed for and will not be used in connection with any applications where
the failure of such products would reasonably be expected to result in significant personal injury or death (“Safety-Critical Applications”) without an Atmel officer's specific written
consent. Safety-Critical Applications include, without limitation, life support devices and systems, equipment or systems for the operation of nuclear facilities and weapons systems.
Atmel products are not designed nor intended for use in military or aerospace applications or environments unless specifically designated by Atmel as military-grade. Atmel products are
not designed nor intended for use in automotive applications unless specifically designated by Atmel as automotive-grade.
工商网监
湘ICP备2023018690号
