ATA8520D
Single-Chip SIGFOX RF Transceiver
DATASHEET
Features
● Fully integrated, single-chip RF transceiver (SIGFOX™ compliant)
● System-on-chip solution including SIGFOX related protocol handling for modem
operation
● AVR® microcontroller core with embedded firmware, SIGFOX, protocol stack and
ID/PAC
● Supports up- and downlink operation, i.e. transmit and receive of data telegrams
with SIGFOX base stations
● Operating frequencies: for uplink 868.0 to 868.6MHz, for downlink 869.4 to
869.65MHz
● Low current consumption: 32.7mA during transmit and 10.4mA during receive
operation
● Typical OFF mode current: 5nA (maximum 600nA at VS = +3.6V and T = +85°C)
● Data rate: 100bit/s with DBPSK modulation for uplink and 600bit/s with GFSK
modulation for downlink
● SPI interface for data access and transceiver configuration and control
● Event signal indicates the status of the IC to an external microcontroller
● Power-up (typical 10ms OFF mode -> IDLE mode)
● Supply voltage ranges 1.9V to 3.6V and 2.4V to 5.5V (SIGFOX compliant supply
range 3V±5% and 3.3V to 5.5V)
● Temperature range –40°C to +85°C
● ESD protection at all pins (±4kV HBM, ±200V MM, ±750V FCDM)
● Small 55mm QFN32 package/pitch 0.5mm
Applications
SIGFOX compatible modem for long-range, low-power and low-cost applications using the
SIGFOX network
● Home and building automation
● Alarm and security systems
● Smart environment and industrial
● Smart parking
● Tracking
● Metering
9390E-INDCO-11/15
1.
General Description
1.1
Introduction
The Atmel® ATA8520D is a highly integrated, low-power RF transceiver with an integrated AVR® microcontroller for
applications using the wide area SIGFOX™ network
The Atmel ATA8520D is partitioned into three sections: an RF front end, a digital baseband and the low-power 8-bit AVR
microcontroller. The product is designed for the ISM frequency band in the range of 868.0MHz to 868.6MHz and 869.4 to
869.65MHz. The external part count is kept to a minimum due to the very high level of integration in this device. By
combining outstanding RF performance with highly sophisticated baseband signal processing, robust wireless
communication can be easily achieved. The transmit path uses a closed loop fractional-N modulator.
The SPI interface enables external control and device configuration.
1.2
System Overview
Figure 1-1. Circuit Overview
AVCC
VS
DVCC
Supply and Reset
RF Frontend
TX
DSP
RF_OUT
PLL
ID and PAC
RX
SIGFOX
Protocol Stack
ADC
Firmware
Mixer
Peripherals
CPU
RF_IN
DATA BUS
XTO
Port B
Port C
PB[7..0]
(SPI)
PC[5..0]
XTAL
Figure 1-1 shows an overview of the main functional blocks of the Atmel ATA8520D. External control of the Atmel
ATA8520D is performed through the SPI pins SCK, MOSI, MISO, and NSS. The functionality of the device is defined by the
internal firmware and processed by the AVR. SPI commands are used to control the device and to start the data telegram
transmission. The end of the telegram transmission is signaled to an external microcontroller on pin 28 (PB6/EVENT).
It is important to note that all PWRON and NPWRON pins (PC1..5, PB4, PB7) are active in OFF mode. This means that
even if the Atmel ATA8520D is in OFF mode and the DVCC voltage is switched off, the power management circuitry within
the Atmel ATA8520D biases these pins with VS.
The AVR microcontroller ports can be used as button inputs, LED drivers, EVENT pin, general purpose digital inputs, or
wake-up inputs, etc. Functionality of these ports is already implemented in the firmware.
2
ATA8520D [DATASHEET]
9390E–INDCO–11/15
Pinning
NC
NC
NC
AGND
PB7
PB6
PB5
PB4
PB3
Figure 1-2. Pin Diagram
32
31
30
29
28
27
26
25
1
RF_IN
2
SPDT_RX
3
exposed die pad
Atmel
ATA8520D
24
PB2
23
PB1
22
PB0
21
DGND
6
19
PC5
RF_OUT
7
18
PC4
VS_PA
8
17
PC3
9
10
11
12
13
14
15
16
PC2
SPDT_TX
PC1
DVCC
PC0
20
VS
5
AVCC
NC
XTAL2
4
XTAL1
SPDT_ANT
NC
1.3
Note:
The exposed die pad is connected to the internal die.
Table 1-1.
Pin Description
Pin No.
Pin Name
1
NC
Type
Description
Connected to GND
2
RF_IN
Analog
Receiver input
3
SPDT_RX
Analog
Rx switch output (damped signal output)
4
SPDT_ANT
Analog
Antenna input (downlink) and output (uplink) of the SPDT switch
5
NC
6
SPDT_TX
Analog
TX mode input of the SPDT switch
7
RF_OUT
Analog
Power amplifier output
8
VS_PA
Analog
Power amplifier supply. 3V supply: connect to VS. 5V supply:
leave open. Use SPI command “Write System Configuration”
(0x11) to enable 5V supply mode.
9
NC
–
10
XTAL1
Analog
Crystal oscillator pin 1 (input)
11
XTAL2
Analog
Crystal oscillator pin 2 (output)
12
AVCC
Analog
RF front-end supply regulator output
13
VS
Analog
Main supply voltage input
14
PC0
Digital
Main
: NRESET
15
PC1
Digital
Main
Alternate
: AVR Port C1
: NPWRON1
16
PC2
Digital
Main
Alternate
: AVR Port C2
: NPWRON2
17
PC3
Digital
Main
Alternate
: AVR Port C3
: NPWRON3
Leave open
Connected to GND
ATA8520D [DATASHEET]
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3
Table 1-1.
4
Pin Description (Continued)
Pin No.
Pin Name
Type
Description
18
PC4
Digital
Main
Alternate
: AVR Port C4
: NPWRON4
19
PC5
Digital
Main
Alternate
: AVR Port C5
: NPWRON5
20
DVCC
–
Digital supply voltage regulator output
21
DGND
–
Digital ground
22
PB0
Digital
Main
: control Front-End-Module;
='1' enable, ='0' disable
23
PB1
Digital
Main
: SCK
24
PB2
Digital
Main
: MOSI (SPI master out Slave in)
25
PB3
Digital
Main
: MISO (SPI master in Slave out)
26
PB4
Digital
Main
: PWRON
27
PB5
Digital
Main
: NSS
28
PB6
Digital
Main
: EVENT
Main
Alternate
: ='1' TX active, ='0' RX active
: NPWRON6
29
PB7
Digital
30
AGND
–
Analog ground
31
NC
–
Connected to GND
32
NC
–
Connected to GND
GND
–
Ground/backplane on exposed die pad
ATA8520D [DATASHEET]
9390E–INDCO–11/15
1.4
Applications
This section provides application examples for the two supply modes for the Atmel® ATA8520D device. In addition the
recommended PCB design and layout is described to achieve the SIGFOX™ certification.
3V Application Example
Figure 1-3. 3V Application with External Microcontroller
IRQ
NSS
MISO
NC
25
PB3
26
PB4
27
PB5
1
28
PB6
29
PB7
30
NC
NC
L2
31
AGND
32
24
23
RF_IN
22
SPDT_RX
PB0
Atmel
ATA8520D
4
SPDT_ANT
C6
21
DGND
5
20
NC
SPDT_TX
PC5
19
RF_OUT
PC4
18
VS_PA
PC3
17
9
10
11
12
13
14
15
C5
PC2
PC1
PC0
VS
AVCC
C2
XTAL2
C1
XTAL1
7
8
Microcontroller
DVCC
6
L1
SCK
PB1
3
RF Filter
MOSI
PB2
2
C7
NC
1.4.1
16
Wake/Monitor
Q1
C3
C4
VS = 3V
VDD
Figure 1-3 shows a typical application circuit with an external host microcontroller operating from a 3V lithium cell. The Atmel
ATA8520D stays in OFFMode until NPWRON1 (PC1) is used to wake it up. In OFFMode the Atmel ATA8520D draws
typically less than 5nA at 25°C.
In OFFMode all Atmel ATA8520D AVR® ports PB0..PB7 and PC0..PC5 are switched to input. PC0..PC5 and PB7 have
internal pull-up resistors ensuring that the voltage at these ports is VS. PB0..PB6 are tri-state inputs and require additional
consideration. PB1, PB2, and PB5 have defined voltages since they are connected to the output of the external
microcontroller. PB4 is connected to ground to avoid unwanted power-ups. PB0, PB3 and PB6 do not require external
circuitry since the internal circuit avoids transverse currents in OFFMode. The external microcontroller has to tolerate the
floating inputs. Otherwise additional pull-down resistors are required on these floating lines.
Typically, the Atmel ATA8520D wake-up is done by pulling NPWRON1 (pin 15) to ground.
RF_OUT is matched with C1/L1 for 50 antenna connection and RF_IN with the components C7/L2. The internal SPDT
switch uses SPDT_RX for receive and SPDT_TX for transmit connection with SPDT_ANT to be connected to the external
50 antenna. The RF filter is required to suppress unwanted side and spurious emissions. The design of this filter depends
on the final PCB and system layout and is subject to SIGFOX and ETSI certification procedures.
Together with the fractional-N PLL within the Atmel ATA8520D, an external crystal is used to set the Tx and Rx frequency.
Accurate load capacitors for this crystal are integrated to reduce the system part count and cost. Only four supply blocking
capacitors are needed to decouple the different supply voltages AVCC, DVCC, VS, and VS_PA of the Atmel ATA8520D.
The exposed die pad is the RF and analog ground of the Atmel ATA8520D. It is connected directly to AGND via a fused
lead. The Atmel ATA8520D is controlled using specific SPI commands via the SPI interface.
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Figure 1-4. 3V Application with External Microcontroller and Front-End-Module
IRQ
NSS
MISO
NC
PB3
25
PB4
26
PB5
27
PB6
28
PB7
1
24
23
RF_IN
RX Filter
“0”
Front-End
Module
(LNA, Pa,
switch)
22
SPDT_RX
PB0
Atmel
ATA8520D
SPDT_ANT
21
DGND
20
5
NC
“1”
6
SPDT_TX
PC5
19
RF_OUT
PC4
18
VS_PA
PC3
17
9
10
11
12
13
14
15
C5
PC2
PC1
PC0
VS
AVCC
C2
XTAL2
XTAL1
NC
C1
8
Microcontroller
DVCC
7
L1
SCK
PB1
3
4
TX Filter
MOSI
PB2
2
C7
C6
29
AGND
NC
L2
30
NC
31
32
16
Wake/Monitor
Q1
C3
C4
VS = 3V
VDD
Figure 1-4 shows an alternative for the usage of external filter and amplifier components using a front-end-module. This FEM
typically includes an antenna switch, a LNA for the receive direction and a PA for the transmit connection in one device. The
RX and TX filters are additional to increase out-of-band jamming immunity in receive direction and to reduce spurious
emissions in transmit direction. For these filters SAW components are typically used. The pins PB0 and PB7 can be used to
control the FEM or the unused internal SPDT switch which is controlled by the Atmel® ATA8520D for transmit and receive
operation.
Applications which are not using the receive function can connect the antenna to RF_OUT without using the internal SPDT
switch. The receive and SPDT pins are then connected to GND.
6
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5V Application Example
Figure 1-5. 5V Application with External Microcontroller
IRQ
NSS
MISO
NC
PB3
25
PB4
26
PB5
27
PB6
1
28
PB7
29
AGND
NC
L2
30
NC
31
32
24
23
22
SPDT_RX
PB0
Atmel
ATA8520D
4
SPDT_ANT
C6
21
DGND
20
5
6
SPDT_TX
PC5
19
RF_OUT
PC4
18
VS_PA
PC3
17
9
10
11
12
13
14
15
C5
PC2
PC1
PC0
VS
AVCC
C2
XTAL2
C1
XTAL1
7
8
Microcontroller
DVCC
NC
L1
SCK
PB1
RF_IN
3
RF Filter
MOSI
PB2
2
C7
NC
1.4.2
16
Wake/Monitor
Q1
C3
C4
VS = 5V
VDD
Figure 1-5 shows a typical application circuit with an external host microcontroller operating from a 5V supply. This
application differs from the 3V supply mode that VS is not connected to VS_PA. Instead an internal LDO must be activated
using the SPI command “Write System Configuration” (0x11) after powering the device and before transmitting a data
telegram.
ATA8520D [DATASHEET]
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7
2.
System Functional Description
2.1
SPI Command Interface
The SPI command interface requires a timing setup as described in the following section and provides a set of commands to
control the operation of the Atmel® ATA8520D device. The SPI transmission occurs with MSB first.
2.1.1
SPI Timing
The SPI communication requires a special timing to prevent data corruption. The SPI peripheral uses a SCK frequency of
125kHz for the bit transmission and requires timing delays between the CS signals and the start and stop of the SPI
communication as shown in Figure 2-1.
Figure 2-1. SPI Timing Parameters
NSS
MISO/MOSI
CLK
T0
T1
T2
T3
T0 ≥ 65µs, T1 ≥ 40µs, T2 ≥ 100µs, T3 ≥ 50µs, SPI CLK ≤ 125kHz (SPI Mode 0: CPOL = CPHA = 0)
2.1.2
SPI Command Set
The following SPI commands are available to control the Atmel ATA8520D operation from a host microcontroller.
2.1.2.1 System Reset
This command uses the system internal WDT to do a complete hardware reset of the Atmel ATA8520D. Resetting the
device takes ~10ms.Afterwards the system restarts and generates an event on the EVENT signal after ~10ms. This event
will be cleared with the “Get Status” SPI command (0x0A).
Master
System Reset (0x01)
ATA8520D
Dummy
2.1.2.2 I/O Init
The I/O lines of port C can be used as additional I/O lines for an application. The port C I/O Init command defines the internal
data direction register of output port PORTC (DDRC). Pin PC0 is used as NRESET signal and will always be an input pin,
i.e. bit 0 will be written as 0 to be an input pin.
Master
I/O Init (0x02)
DDRC content
ATA8520D
Dummy
Dummy
2.1.2.3 I/O Write
The I/O write command writes directly to the output port register PORTC to set the I/O pins. Pin PC0 is used as NRESET
signal and will always be an input pin with enabled pull-up, i.e. bit 0 will be written as 1 to enable the internal pull-up resistor.
8
Master
I/O Init (0x03)
PORTC content
ATA8520D
Dummy
Dummy
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2.1.2.4 I/O Read
The I/O read command reads the status of the I/O pins directly from the input port register PINC. Pin PC0 is used as
NRESET signal and will always be read as 1.
Master
I/O Read (0x04)
Dummy
Dummy
ATA8520D
Dummy
Dummy
PINC content
2.1.2.5 OFF Mode
The OFF mode command puts the Atmel® ATA8520D into off mode. To wake up the Atmel ATA8520D device, one of the
power on lines has to be activated, i.e. set PWRON line to high or NPWRONx line to low. To switch the device into OFF
mode the power on lines have to be de-activated before otherwise the device will remain in the on state.
Master
OFF Mode (0x05)
ATA8520D
Dummy
2.1.2.6 Atmel Version
The Atmel version command reads the version information including a major and a minor version number.
Master
Atmel Version (0x06)
Dummy
Dummy
Dummy
ATA8520D
Dummy
Dummy
MajorVers
MinorVers
2.1.2.7 Write TX Buffer
The write TX buffer command fills the TX buffer to be sent with the next SIGFOX™ data frame with payload data of up to 12
bytes. The buffer can hold any number of bytes ranging from 0 to 12 bytes and are not buffered, i.e. a new SPI command will
override the previous data.
Master
Write TX Buffer (0x07)
RF TX Num bytes
RF TX Bytes 0
ATA8520D
Dummy
Dummy
Dummy
..............
RF TX Num
bytes-1
Dummy
2.1.2.8 SIGFOX Version
The SIGFOX version reads the SIGFOX library version information as a text string with N = 11 characters.
2.1.2.9
Master
SIGFOX Version (0x09)
Dummy
Dummy
ATA8520D
Dummy
Dummy
SFX Verinfo[0]
..............
Dummy
SFX Verinfo[N]
Get Status
The get status command reads the internal status of the device. Issuing this command clears the systems event line (PB6)
and the status bytes. The event line is set to low when:
a. System is ready after power-up or reset
b.
Finishes the transmit/receive operation
c.
finishes a temperature and supply measurement
d.
finishes the EEPROM write operation.
ATA8520D [DATASHEET]
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9
The following status information is read after the event line is activated, i.e. polling using the Get Status command is not
necessary:
Hardware SSM status
Atmel® status:
● Bit6: System ready to operate (system ready event)
●
●
●
Bit5: Frame sent (frame ready event)
Bit4 to Bit1: Error code
●
0000: no error
●
0001: command error / not supported
●
0010: generic error
●
0011: frequency error
●
0100: usage error
●
0101: opening error
●
0110: closing error
●
0111: send error
Bit0: PA on/off indication
SIGFOX™ status:
● 0x00: No error
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
0x01: Manufacturer error
0x02: ID or key error
0x03: State machine error
0x04: Frame size error
0x05: Manufacturer send error
0x06: Get voltage/temperature error
0x07: Close issues encountered
0x08: API error indication
0x09: Error getting PN9
0x0A: Error getting frequency
0x0B: Error building frame
0x0C: Error in delay routine
0x0D: callback causes error
0x0E: timing error
0x0F: frequency error
0x10: receiving frame error
Master
Get Status (0x0A)
Dummy
Dummy
Dummy
Dummy
ATA8520D
Dummy
Dummy
SSM status
Atmel status
SIGFOX status
2.1.2.10 Send Single Bit
This command sends a data bit (0/1) within a SIGFOX RF frame as specified by SIGFOX. An event on the EVENT signal is
generated when finished.
10
Master
Send Bit (0x0B)
Bit Status (0/1)
ATA8520D
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2.1.2.11 Send Frame
The send frame command triggers the start of a frame transmit process. The payload data has to be written into the TX
buffer before using the write TX buffer command. The transmit operation will take ~7 seconds and will generate an event on
the EVENT signal when finished. With pins PB0 and PB7 a front-end-module can be controlled (see Section 2.1.4 “System
and Pin Configuration” on page 15).
Master
Send Frame (0x0D)
ATA8520D
Dummy
2.1.2.12 Send/Receive Frame
The send/receive frame command triggers the start of a frame transmit process followed by a receive process. The payload
data has to be written into the TX buffer before using the write TX buffer command. The transmit and receive operation will
take up to 50 seconds and will generate an event on the EVENT signal when finished. The received data bytes can be read
with the SPI command (0x10). With pins PB0 and PB7 a front-end-module can be controlled (see Section 2.1.4 “System and
Pin Configuration” on page 15).
Master
Send/Receive Frame (0x0E)
ATA8520D
Dummy
2.1.2.13 Get PAC
The get PAC command will read the 16 byte PAC information which is used for the device registration process at the
SIGFOX backend. Only the 8 lower bytes (0) .. (7) are used, the remaining 8 upper bytes (8) .. (15) are read as 0.
Master
Get PAC (0x0F)
Dummy
Dummy
ATA8520D
Dummy
Dummy
PAC ID[0]
Dummy
......
PAC ID[15]
2.1.2.14 Read RX Buffer
This command triggers the read out of the received data packet. The packet length is always 8 bytes.
Master
Read RX Buffer (0x10)
Dummy
Dummy
ATA8520D
Dummy
Dummy
RX Byte 0
Dummy
......
RX Byte 7
2.1.2.15 Write System Configuration
The Write System Configuration command writes the configuration data for the port C and the system configuration into the
internal EEPROM. This changes will be applied by performing a system reset. An event on the EVENT signal is generated
when finished. DDRC register defines the data direction for the port C pins (0: input, 1: output). PORTC register defines the
output level for an output pin and enables a pull-up resistor for input pins when set. SysConf is used to configure the supply
voltage and the up-/downlink operation (see Section 2.1.4 “System and Pin Configuration” on page 15).
Master
Write Sys Conf (0x11)
DDRC
PORTC
0x02
SysConf
ATA8520D
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2.1.2.16 Get ID
The get ID command will read the 4 byte ID information which is used for the device registration process at the SIGFOX™
backend.
Master
Get ID (0x12)
Dummy
Dummy
ATA8520D
Dummy
Dummy
UID[3]
......
Dummy
UID[0]
2.1.2.17 Read Supply Temperature
This command triggers the read out of the measured supply voltage in idle and active mode and the device temperature. To
trigger a measurement the SPI command (0x14) has to be used. The return voltage level is in mV and the temperature value
has to be calculated as T = (TM – 500)/10 in °C. All values are of type 16 bit unsigned integer (with high and low byte).
Master
Read Supply
Temperature (0x13)
Dummy
Dummy
Dummy
ATA8520D
Dummy
Dummy
VH idle
VL idle
Dummy
Dummy
VH active VL active
Dummy
Dummy
TMH
TML
2.1.2.18 Start Measurement
This command triggers the measurement of the supply voltages and the temperature value. An event on the EVENT signal
is triggered when finished which is cleared by reading the supply and temperature values.
Master
Trigger Measurement (0x14)
ATA8520D
Dummy
2.1.2.19 Trigger TX Test
This command triggers the uplink test procedure defined by SIGFOX. An event on the EVENT signal is generated when
finished.
The command parameter are:
● FRL, FRH: number of frames to be send. Each frame is send 3 times [0...32768, –1 for infinite].
●
CHL, CHH: Channel number used for transmission [0...480, –1 is for hopping deactivation].
Master
Trigger TX Test (0x15)
FRL
FRH
CHL
CHH
ATA8520D
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Dummy
Dummy
Dummy
Dummy
2.1.2.20 Trigger RX Test
This command triggers the downlink test procedure defined by SIGFOX. An event on the EVENT signal is generated when
finished.
The command parameter are:
● CHL, CHH: Channel number used for reception [0...480].
●
12
SQL, SQH: sequence number for permanent reception.
Master
Trigger RX Test (0x16)
SQL
SQH
CHL
CHH
ATA8520D
Dummy
Dummy
Dummy
Dummy
Dummy
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2.1.2.21 Send CW
This command triggers the transmission of a continuous carrier on the programmed RF frequency as defined by SIGFOX.
Master
Send CW (0x17)
On=0x11/Off=0x00
ATA8520D
Dummy
Dummy
2.1.2.22 Set TX Frequency
Set TX center frequency temporarily for testing purposes. This settings are lost after reset or when switching the device off.
The frequency value is an unsigned 32-bit integer within the range [868.000.000Hz to 868.600.000Hz]. Default is
868.130.000Hz.
Master
TX Frequency (0x1B)
TX[31:24]
TX[23:16]
TX[15:8]
TX[7:0]
ATA8520D
Dummy
Dummy
Dummy
Dummy
Dummy
2.1.2.23 Set RX Frequency
Set RX center frequency temporarily for testing purposes. This settings are lost after reset or when switching the device off.
The frequency value is an unsigned 32-bit integer within the range [869.400.000Hz to 869.650.000Hz]. Default is
869.525.000Hz.
Master
RX Frequency (0x1C)
RX[31:24]
RX[23:16]
RX[15:8]
RX[7:0]
ATA8520D
Dummy
Dummy
Dummy
Dummy
Dummy
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2.1.3
Command Table Overview
Table 2-1.
14
Command Table Overview
CMD
Index
Write Data
Read Data
System reset
0x01
None
None
I/O Init
0x02
DDRC register setting
None
I/O Write
0x03
PORTC register setting
None
I/O Read
0x04
None
PINC register setting
OFF mode
0x05
None
None
Atmel version
0x06
None
Major / minor
Write TX buffer
0x07
Data written to TX buffer
None
Reserved
0x08
-
-
SIGFOX™ version
0x09
None
Version L-H
Get status
0x0A
None
SSM / Atmel® FW / SIGFOX library
Send bit
0x0B
Bit status
None
Reserved
0x0C
-
-
Send frame
0x0D
None
None
Send/receive frame
0x0E
None
None
Get PAC
0x0F
None
PAC[0], PAC[1] …. PAC[15]
Read RX buffer
0x10
None
RX buffer data
Write Sys Conf
0x11
DDRC, PORTC, SysConf
None
Get ID
0x12
None
ID[3] … ID[0]
Read supply temperature
0x13
None
Vidle, Vactive, temperature
Trigger measurement
0x14
None
None
Trigger TX test
0x15
Frame, channel
None
Trigger RX test
0x16
Channel, sequence
None
Send CW
0x17
On/off
None
Reserved
0x18
-
-
Reserved
0x19
-
-
Reserved
0x1A
-
-
Set TX frequency
0x1B
TX frequency
None
Set RX frequency
0x1C
RX frequency
None
ATA8520D [DATASHEET]
9390E–INDCO–11/15
2.1.4
System and Pin Configuration
This section specifies the system configuration settings used in the SPI RF transmit command (0x11). This system
configuration has to be set after the system issues a system ready event and before using any other SPI command. The
settings are stored in the internal EEPROM and will be applied after a system reset. This settings are typically applied at the
EOL testing in the factory. Table 2-2 summarizes the configuration settings.
Table 2-2.
System Configuration
Function
Bit No.
Settings
None
7 to 4
Supply voltage
3
:0, 5V supply
:1, 3V supply (default)
Rx/TX select
2
:0, up-/downlink enabled
:1, uplink only enabled (default)
None
1 to 0
:1111 (default)
:11 (default)
For an additional front-end-module, which includes an antenna switch, a low-noise amplifier for downlink operation and a
power amplifier for uplink operation, two control signals are available at the port pins PB0 and PB7. These pins are
controlled by the Atmel® ATA8520D device during transmission and reception of a RF data telegram. Table 2-3 summarizes
the function of these pins.
Table 2-3.
FEM Control Pins
Function/Pin
PB0
PB7
FEM disabled
0
X
Uplink active
1
1
Downlink active
1
0
In case the internal SPDT switch is not used for RF control this switch can be used in addition to control an external FEM.
During uplink operation the path between pins SPDT_ANT and SPDT_TX is closed and for downlink operation the path
between pins SPDT_ANT and SPDT_RX is closed.
Caution:
2.2
The device is delivered with default configuration, i.e. with 3V supply mode enabled. When using the device
with 5V supply it has to be ensured that before using the RF transmit operation the 5V supply mode is
configured!
Operating Modes Overview
This section gives an overview of the operating modes supported by the Atmel ATA8520D.
After connecting the supply voltage to the VS pin, the Atmel ATA8520D always starts in OFF mode. All internal circuits are
disconnected from the power supply. Therefore, no SPI communication is supported. The Atmel ATA8520D can be woken
up by activating the PWRON pin or one of the NPWRONx pins. This triggers the power-on sequence which will set the event
line PB6 to low. After the system initialization the Atmel ATA8520D reaches the IDLE Mode.
The IDLE Mode is the basic system mode supporting SPI communication and transitions to the other operating modes.
The transmit mode (TX Mode) starts the data transmission using the payload data which has to be previously written into the
TX buffer with the SPI command “Write TX Buffer”. The data transmission is started with the SPI command “Send Frame”.
After transmitting the data frame, the end of the transmission is indicated when the event pin PB6 switches to low and the
device enters the IDLE Mode again.
Reading the device status with the “Get Status” SPI command clears the PB6 event line, setting it to high level again.
The transmit/receive mode (TX/RX Mode) will send at first a data telegram in uplink direction and then enter receive mode
for downlink direction. The downlink request is captured by the SIGFOX™ backend and processed. After transmission of the
uplink frame the device will wait for 20 seconds before entering the receive mode. This receive mode will take up to
30 seconds and will end with an event on pin PB6. This event is cleared when reading the device status with the SPI
command “Get Status”. If no error occurs during the downlink operation (Atmel status error code = 0000), the received data
telegram of 8 bytes can be read with the SPI command “Read RX Buffer”.
ATA8520D [DATASHEET]
9390E–INDCO–11/15
15
2.2.1
Power-up Sequence
This section describes the power-up sequence for the device as described in Figure 2-2. The device is usually in OFF mode
were the signals NPWRONx, PWRON and NRESET are inactive but VS is supplied with power. Switching the NRESET
signal active or sending the SPI command System Reset (0x01) will have no effect in OFF mode. Switching one of the
power-on pins active will wake-up the device and an internal power-on reset is performed. In addition the external NRESET
line can be used to keep the device in reset state when waking-up the device. The minimum activation time for the
NPWRONx, PWRON and NRESET signals is 10µs.
Figure 2-2. Power-up Sequence
NPWRONx
PWRON
NRESET
EVENT
1
2
3
4
5
6
After applying the reset signal NRESET one of the power-up signals NPWRON1...6 or PWRON is applied at timing point T1.
At timing point T2 (~10µs after T1) the external reset signal is removed and the device starts its internal power-up sequence.
This internal sequence is finished at timing point T3 (~10ms after T2) and is signaled with the event line. Reading the device
status with the SPI command (0x0A) “Get status” will clear the event line at timing point T4. The device is now in idle mode
and operational even if the NPWRONx and PWRON signals are deactivated.
To shutdown the device into OFF mode the power-up signals NPWRON1...6 or PWRON have to be deactivated at first
(shown in timing point T5). The shutdown into OFF mode is then performed by sending the SPI command (0x05) “OFF
mode” to the device.
2.2.2
Application Example
The software to control the device and to transmit only a data frame (without reception) has to perform the following steps:
1. Initialize device as shown in Figure 2-2 for the power-up sequence
16
2.
Check for the startup event and read the device status with SPI command (0x0A) “Get status” to clear this event
3.
Load the transmit buffer with up to 12 bytes using the SPI command (0x07) “Write TX Buffer”
4.
Start the data transmit with SPI command (0x0D) “Send Frame”
5.
Wait until the event signal appears (this takes about 7-8 seconds)
6.
Read the device status with SPI command (0x0A) “Get status” to clear this event
7.
Switch off the power-on signals as shown in Figure 2-2
8.
Send the SPI command (0x05) “OFF mode” to the shutdown the device
ATA8520D [DATASHEET]
9390E–INDCO–11/15
The software to control the device and to transmit and receive a data frame has to perform the following steps:
1. Initialize device as shown in Figure 2-2 for the power-up sequence
2.
Check for the startup event and read the device status with SPI command (0x0A) “Get status” to clear this event
3.
Load the transmit buffer with up to 12 bytes using the SPI command (0x07) “Write TX Buffer”
4.
Start the data transmit with SPI command (0x0E) “Send/Receive Frame”
5.
Wait until the event signal appears (this takes about 20-50 seconds)
6.
Read the device status with SPI command (0x0A) “Get status” to clear this event
7.
Read the receive buffer with SPI command (0x10) “Read RX Buffer” for the 8 data bytes
8.
Process received data, etc.
9.
Switch off the power-on signals as shown in Figure 2-2
10. Send the SPI command (0x05) “OFF mode” to the shutdown the device
For the SPI communication it is important to keep the timing as shown in Figure 2-1 on page 8. With the SPI commands
(0x0F) „Get PAC” and (0x12) „Get ID” the SIGFOX™ registration information can be read to register the device in the
SIGFOX cloud.
ATA8520D [DATASHEET]
9390E–INDCO–11/15
17
3.
Electrical Characteristics
3.1
ESD Protection Circuits
GND is the exposed die pad of the Atmel® which is internally connected to AGND (pin 30). All Zener diodes shown in
Figure 3-1 (marked as power clamps) are realized with dynamic clamping circuits and not physical Zener diodes. Therefore,
DC currents are not clamped to the shown voltages.
Figure 3-1. Atmel ESD Protection Circuit
RF_IN
(Pin 2)
XTAL1
(Pin 10)
XTAL2
(Pin 11)
AVCC
(Pin 12)
VS
(Pin 13)
Power
Clamp
1.8V
AGND
(Pin 30)
GND
GND
GND
VS_PA (Pin 8)
SPDT_RX
(Pin 3)
VS (Pin 13)
SPDT_ANT
(Pin 4)
SPDT_TX
(Pin 6)
Power
Clamp
3.3V
RF_OUT
(Pin 7)
GND
VS (Pin 13)
DVCC (Pin 20)
Power
Clamp
1.8V
PC0 to PC5
(Pin 14 to Pin 19)
DGND
(Pin 21)
18
ATA8520D [DATASHEET]
9390E–INDCO–11/15
PB0 to PB7
(Pin 22 to Pin 29)
Power
Clamp
5.5V
GND
3.2
Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating
only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Parameters
Symbol
Min.
Max.
Unit
+150
°C
Junction temperature
Tj
Storage temperature
Tstg
–55
+125
°C
Ambient temperature
Tamb
–40
+85
°C
VVS
–0.3
+6.0
V
VVS_PA
–0.3
+4.0
V
ESD (human body model) all pins
HBM
–4
+4
kV
ESD (machine model) all pins
MM
–200
+200
V
FCDM
–750
+750
V
Supply voltage
Supply voltage PA (1.9 to 3.6V application)
ESD (field induced charged device model) all pins
Maximum peak voltage at pin 4 (SPDT_ANT)
(1)
SPDTANT
SPDTTX
Maximum peak voltage at pin 6 (SPDT_TX)(1)
Notes: 1. The customer application needs to be properly designed.
2.
3.3
–0.3
VS_PA
+ 0.3
V
–0.3
VS_PA(2) + 0.3
V
VS_PA is the voltage applied to pin 8.
Thermal Resistance
Parameters
Thermal resistance, junction ambient, soldered in
compliance with JEDEC
3.4
(2)
Symbol
Value
Unit
Rth_JA
35
K/W
Supply Voltages and Current Consumption
All parameters refer to GND (backplane) and are valid for Tamb = –40°C to +85°C, VVS = 1.9V to 3.6V across all process tolerances
unless otherwise specified. Typical values are given at VVS = 3V, Tamb = 25°C, and for a typical process unless otherwise specified.
Crystal oscillator frequency fXTO = 24.305MHz.
No.
Parameters
Test Conditions
Pin
Symbol
Min.
Typ.
Max.
Unit
Type*
3V application
13
VVS
1.9
3.0
3.6
V
A
5V application
13
VVS
2.4
5.0
5.5
V
A
3V application
Supply voltage for
1.01 SIGFOX™ compliance
5V application
13
VVS
2.9
3.0
3.1
V
13
VVS
3.3
5.0
5.5
V
13
VVS_rise
1
V/µs
D
3V application
8
VVS_PA
3.6
V
A
5V application
8
VVS_PA
3
V
A
SIGFOX compliant
8
VVS_PA
3
V
8, 13
IOFFMode_3V
5
Supply voltage
1.00 range VS
Supply voltage rise
1.05 time
Supply voltage range
1.10 VS_PA
OFF mode
1.20 Current consumption
Tamb = 25°C
Tamb = 85°C
1.9
3
150
600
nA
nA
B
B
*) Type means: A = 100% tested, B = 100% correlation tested, C = characterized on samples, D = design parameter
Pin numbers in brackets mean they are measured matched to 50 on the application board.
ATA8520D [DATASHEET]
9390E–INDCO–11/15
19
3.4
Supply Voltages and Current Consumption (Continued)
All parameters refer to GND (backplane) and are valid for Tamb = –40°C to +85°C, VVS = 1.9V to 3.6V across all process tolerances
unless otherwise specified. Typical values are given at VVS = 3V, Tamb = 25°C, and for a typical process unless otherwise specified.
Crystal oscillator frequency fXTO = 24.305MHz.
No.
Parameters
Test Conditions
Pin
Symbol
Idle Mode current
1.30 consumption
Temperature range
–40°C to +65°C
13
RX Mode current
1.80 consumption
fRF = 869.5MHz
TX mode current
2.00 consumption
Min.
Typ.
Max.
Unit
Type*
IIdleMode
50
90
µA
B
13
IRXMode
10.4
14.6
mA
A
Pout = +14dBm
fRF = 868.3MHz
(7), 8,
13
ITXMode
32.7
45
mA
B
SIGFOX™ TX mode
2.05 current consumption
Tamb = 25°C,
3V application
(7), 8,
13
ISIGFOXMode
31.8
40.1
mA
B
SIGFOX TX mode
2.06 current consumption
Tamb = 85°C,
3V application
(7), 8,
13
ISIGFOXMode
32.7
41.1
mA
B
*) Type means: A = 100% tested, B = 100% correlation tested, C = characterized on samples, D = design parameter
Pin numbers in brackets mean they are measured matched to 50 on the application board.
3.5
RF Receive Characteristics
All parameters refer to GND (backplane) and are valid for Tamb = –40°C to +85°C, VVS = 1.9V to 3.6V across all process tolerances
unless otherwise specified. Typical values are given at VVS = 3V, Tamb = 25°C, and for a typical process unless otherwise specified.
Crystal oscillator frequency fXTO = 24.305MHz.
No.
Parameters
Test Conditions
Pin
Symbol
Min.
4.50 Frequency range
Defined by SIGFOX
protocol
(2)
fRX
869.40
4.90 Sensitivity level
FSK at 25kHz IF
bandwidth Tamb = 25°C
0.75Kbit/s ±0.75kHz
17, 19
SFSK
–1.5dB
7.30 Blocking
FSK at 25kHz IF
bandwidth, Tamb = 25°C
2.4Kbit/s ±2.4kHz
(2)
fdist. ≥ 50kHz
fdist. ≥ 100kHz
fdist. ≥ 225kHz
fdist. ≥ 450kHz
fdist. ≥ 1MHz
fdist. ≥ 4MHz
fdist.>10MHz
7.70 Image rejection
Large disturber applied
before useful signal
(2)
IMRED
7.80 Blocking 3fLO, 5fLO
3 fLO – fIF
5 fLO + fIF
(2)
BLNfLO
2
Zin
(3, 4)
ILSwitch_RX
(2), 4
RSSIABS_ACCU
(2), 4
RSSIRES
9.00 RSSI accuracy
Measured on application
board, RC parallel
equivalent circuit
Sensitivity matching
RF_IN with SPDT to 50
compared to matching
RF_IN directly to 50
PRFIN = –70dBm
9.20 RSSI resolution
DSP property
8.50 Input impedance
8.70
SPDT switch RX
insertion loss
Typ.
Max.
Unit
869.65
MHz
+1.5dB
dBm
B
34
40
52
58
67
75
75
dBc
C
C
C
C
C
C
C
47
dB
A
39
45
dB
C
C
–121.5
38
–20%
340
1.4
+20%
pF
C
1.0
1.4
dB
C
+5.5
dB
B
dB/ value
D
–5.5
0.5
*) Type means: A = 100% tested, B = 100% correlation tested, C = characterized on samples, D = design parameter
Pin numbers in brackets mean they are measured matched to 50 on the application board.
20
ATA8520D [DATASHEET]
9390E–INDCO–11/15
Type*
3.6
RF Transmit Characteristics
All parameters refer to GND (backplane) and are valid for Tamb = –40°C to +85°C, VVS = 1.9V to 3.6V across all process tolerances
unless otherwise specified. Typical values are given at VVS = 3V, Tamb = 25°C, and for a typical process unless otherwise specified.
Crystal oscillator frequency fXTO = 24.305MHz.
No.
Parameters
10.00 Output power range
Test Conditions
Pin
Symbol
Min.
Tamb = 25°C
(7)
PRange
(7)
PSIGFOX
13.5
(7)
PSIGFOX
13.1
Defined by SIGFOX
protocol
(7)
fTX
868.0
(7)
Pout_14dBm
–1.5dB
(7)
HM214dBm
(7)
HM314dBm
Typ.
Max.
Unit
Type*
+14.5
dBm
B
13.8
14.0
dBm
B
13.8
14.7
dBm
B
868.6
MHz
+1.5dB
dBm
B
–24
dBc
C
–50
dBc
C
+2
dB
C
C
Tamb = 25°C, VVS = 2.9V to
10.01
Output power for
3.1V, 3V application
SIGFOX™ compliance (for 5V applications see
no. 11.50)
Tamb = –45°C to +85°C,
Output power for
10.02
SIGFOX compliance
10.05 Frequency range
VVS = 3.0V, 3V application
(for 5V applications see
no. 11.50)
11.00
Output power
at 14dBm
Tamb = 25°C
11.10
Output 2nd harmonic
at 14dBm
Tamb = 25°C
11.20
Output 3rd harmonic
at 14dBm
Tamb = 25°C
using 14dBm matching
using 14dBm matching
using 14dBm matching
14
Output power change
11.50 full temperature and
supply voltage range
For 13.8dBm
VVS_PA = 3.0V +-0.3V
P = Pout + P
(7)
PTambVs2
11.60 Spurious emission
at ±fXTO
at ±fAVR (fXTO / 4)
at ±fCLK_OUT (fXTO / 6)
(7)
SPTX
–72
–85
–78
–60
–60
–60
dBc
B
C
C
(4, 6)
ILSwitch_TX
0.7
1.2
dB
C
Maximum peak voltage
on SPDT_ANT (pin 4)
4
VPEAK_SPDT_
–0.3
VS_PA +
0.3
V
D
Maximum peak voltage
on SPDT_TX (pin 6)
6
–0.3
VS_PA +
0.3
V
D
Transmitted power using
matching RF_OUT with
12.40 SPDT insertion loss TX SPDT to 50 compared to
matching RF_OUT directly
to 50
12.45
12.50
–3.5
ANT
VPEAK_SPDT_ TX
*) Type means: A = 100% tested, B = 100% correlation tested, C = characterized on samples, D = design parameter
Pin numbers in brackets mean they are measured matched to 50 on the application board.
ATA8520D [DATASHEET]
9390E–INDCO–11/15
21
3.7
RF Transmit Characteristics
All parameters refer to GND (backplane) and are valid for Tamb = –40°C to +85°C, VVS = 1.9V to 3.6V over all process tolerances,
quartz parameters Cm = 4fF and C0 = 1pF unless otherwise specified. Typical values are given at VVS = 3V, Tamb = 25°C, and for a
typical process unless otherwise specified. Crystal oscillator frequency fXTO = 24.305MHz.
No.
Parameters
Test Conditions
Pin
Symbol
Min.
Typ.
Max.
Unit
Type*
13.30 XTO frequency range
10, 11
fxto
KDS: 1C324305AB0B
NDK: NX3225SA
XTO frequency for
13.35
EXS00A-CS08559
™
SIGFOX compliance
NX2016SA
EXS00A-CS08560
24.305
MHz
C
10, 11
fSIGFOX_XTO
24.305
MHz
XTO pulling due to
13.40 internal capacitance
and XTO tolerance
Cm = 4fF, Tamb = 25°C
10, 11
FXTO1
–10
+10
ppm
B
XTO pulling due to
13.50 temperature and
supply voltage
Cm = 4fF
Tamb = –40°C to +85°C
10, 11
FXTO2
–4
+4
ppm
B
13.60 Maximum C0 of XTAL
XTAL parameter
10, 11
C0_max
1
2
pF
D
XTAL parameter
10, 11
Cm
4
10
fF
D
13.70
XTAL, Cm motional
capacitance
13.80
XTAL, real part of XTO
Cm = 4fF, C0 = 1pF
impedance at start-up
10, 11
Rm_start1
950
B
13.90
XTAL, real part of XTO Cm = 4fF, C0 = 1pF,
impedance at start-up Tamb < 85°C
10, 11
Re_start2
1100
B
14.00
XTAL, maximum Rm
after start-up
10, 11
Rm_max
110
D
CL1, CL2
13.3
pF
B
XTAL parameter
Including ESD and
package capacitance.
XTAL has to be specified
14.10 Internal load capacitors
10, 11
for 7.5pF load capacitance
(incl. 1pF PCB
capacitance per pin)
14
14.7
*) Type means: A = 100% tested, B = 100% correlation tested, C = characterized on samples, D = design parameter
Pin numbers in brackets mean they are measured matched to 50 on the application board.
22
ATA8520D [DATASHEET]
9390E–INDCO–11/15
3.8
I/O Characteristics for Ports PB0 to PB7 and PC0 to PC5
All parameters refer to GND (backplane) and are valid for Tamb = –40°C to +85°C, VVS = 1.9V to 3.6V over all process tolerances
unless otherwise specified. Typical values are given at VVS = 3V, Tamb = 25°C, and for a typical process unless otherwise specified.
Crystal oscillator frequency fXTO = 24.305MHz.
No.
Pin
Symbol
Min.
15.00 Input low voltage
PC0 to PC5
PB0 to PB7
14-19
22-29
Max.
Unit
Type*
VIL
–0.3
0.2 VVS
V
A
Input low leakage
current I/O pin
PC0 to PC5
PB0 to PB7
14-19
22-29
IIL
–1
µA
A
15.10 Input high voltage
PC0 to PC5
PB0 to PB7
14-19
22-29
VIH
VVS + 0.3
V
A
Input high leakage
current I/O pin
PC0 to PC5
PB0 to PB7
14-19
22-29
IIH
1
µA
A
15.20 Output low voltage
IOL = 0.2mA
14-19
22-29
VOL_3V
0.1 VVS
V
A
15.30 Output high voltage
IOH = –0.2mA
14-19
22-29
VOH_3V
0.9 VVS
V
A
15.40 I/O pin pull-up resistor
OFF mode:
see port B and port C
14-19
22-29
RPU
30
50
70
k
A
CLoad = 10pF
14-19
22-29
Tdel_rise_3V
13.6
17.5
22.4
ns
D
I/O pin rise time
16.20 (0.1 VVS to
0.9 VVS)
CLoad = 10pF
14-19
22-29
Trise_3V
20.7
23.9
28.4
ns
D
16.30
I/O pin slew rate
(rising edge)
CLoad = 10pF
14-19
22-29
Tsr_rise_3V
0.115
0.100
0.084
V/ns
D
16.40
I/O pin output delay
time (falling edge)
CLoad = 10pF
14-19
22-29
Tdel_fall_3V
13.7
17.4
22.7
ns
D
CLoad = 10pF
14-19
22-29
Tfall_3V
16.2
19.2
22.5
ns
D
CLoad = 10pF
14-19
22-29
Tsr_fall_3V
0.148
0.125
0.106
V/ns
D
15.05
15.15
16.10
Parameters
I/O pin output delay
time (rising edge)
I/O pin fall time
16.50 (0.9 VVS to
0.1 VVS)
16.60
I/O pin slew rate
(falling edge)
Test Conditions
Typ.
0.8 VVS
*) Type means: A = 100% tested at voltage and temperature limits, B = 100% correlation tested, C = characterized on samples,
D = design parameter
3.9
Hardware Timings
All parameters refer to GND (backplane) and are valid for Tamb = –40°C to + 85°C, VVS =1.9V to 3.6V over all process tolerances.
Typical values are given at VVS = 3V, Tamb = 25°C, and for a typical process unless otherwise specified. Crystal oscillator frequency
fXTO = 24.305MHz.
No.
Parameters
17.50 Startup time
Test Conditions
PWRON = ‘1’ or
NPWRON = ‘0’ to
EVENT generation
Pin
Symbol
13, 20
TSTARTUP
Min.
Typ.
10
Max.
Unit
Type*
ms
C
*) Type means: A = 100% tested at voltage and temperature limits, B = 100% correlation tested, C = characterized on samples,
D = design parameter
ATA8520D [DATASHEET]
9390E–INDCO–11/15
23
3.10
Hardware SPI Timing Characteristics
Timing shown for CPHA=0 and CPOL=0 in Figure 3-2, timing is valid for all CPHA and CPOL configurations. See also Section 2.1
“SPI Command Interface” on page 8 for functional SPI description and for firmware limitations on SPI data transfer.
All parameters refer to GND (backplane) and are valid for Tamb = –40°C to +85°C, VVS = 1.9V to 3.6V (3V Application) and 4.5V to
5.5V (5V Application) over all process tolerances. Typical values are given at VVS = 5V, Tamb = 25°C, and for a typical process unless
otherwise specified. Crystal oscillator frequency fXTO = 24.305MHz.
No.
Parameters
Test Conditions
Pin
Symbol
Min.
49.10 SCK cycle time
23
TSCK_periode
8
49.20 SCK high or low time
23
TSCK_high_low
330
49.30 SCK rise or fall time
23
TSCK_rise_fall
Typ.
Max.
100
Unit
Type*
µs
D
ns
D
ns
D
49.40
MOSI setup time to
active edge of SCK
23, 24
TSetup
80
ns
D
49.50
MOSI hold time to
active edge of SCK
23, 24
THold
245
ns
D
23, 25
TSCK_out
ns
D
23, 27
TSCK_NSS_high
µs
D
25, 27
TNSS_high_tristate
ns
D
23, 27
TNSS_low_SCK
µs
D
Time periode active
49.60 edge of SCK to data
out at MISO
49.70
Time periode SCK
inactive to NSS high
49.80
Time periode NSS
high to MISO tristate
49.90
Time periode NSS low
to active edge SCK
CLOAD_MISO = 10pF
CLOAD_MISO = 10pF
250
100
250
65
*) Type means: A = 100% tested at voltage and temperature limits, B = 100% correlation tested, C = characterized on samples,
D = design parameter
Figure 3-2. SPI Interface Timing Requirements
TNSS_high_tristate
NSS
TNSS_low_SCK
TSCK_out
TSCK_periode
TSCK_NSS_high
SCK
(CPOL = 0)
THold
TSCK_high_low
TSetup
MOSI
(Data Input)
MISO
(Data Output)
24
ATA8520D [DATASHEET]
9390E–INDCO–11/15
MSB
MSB
TSCK_rise_fall
LSB
LSB
Ordering Information
Extended Type Number
Package
ATA8520D-GHQW
5mm 5mm, Pb-free, 6k, taped and reeled
QFN32
Package Information
Top View
D
32
1
E
technical drawings
according to DIN
specifications
PIN 1 ID
Dimensions in mm
8
A1
Two Step Singulation process
A
Side View
Partially Plated Surface
Bottom View
D2
9
16
17
8
COMMON DIMENSIONS
E2
(Unit of Measure = mm)
1
SYMBOL
MIN
NOM
MAX
A
0.8
0.85
0.9
A1
A3
0
0.16
0.035
0.21
0.05
0.26
24
32
Z
25
e
Z 10:1
L
5.
Remarks
A3
4.
D
4.9
5
5.1
D2
3.5
3.6
3.7
E
4.9
5
5.1
E2
3.5
3.6
3.7
L
0.35
0.4
0.45
b
0.2
0.25
0.3
e
NOTE
0.5
b
10/18/13
TITLE
Package Drawing Contact:
packagedrawings@atmel.com
Package: VQFN_5x5_32L
Exposed pad 3.6x3.6
GPC
DRAWING NO.
REV.
6.543-5124.03-4
1
ATA8520D [DATASHEET]
9390E–INDCO–11/15
25
6.
Disclaimer
Atmel® components and materials in the Product comply with Atmel data sheet and the Product has achieved SIGFOXcompliant certification. Apart from these warranties, the customer acknowledges that no express or implied warranties are
given in relation to the Product and, in particular, no warranties are given in relation to the quality or suitability of any third
party software or materials incorporated into the Product.
Atmel does not warrant that the Product will be error-free and the Customer acknowledges that it has not been developed to
meet the Customer's individual requirements. Accordingly, Atmel accepts no liability or responsibility with regard to any third
party software or materials incorporated into the Product and in no event shall Atmel be liable for any direct, indirect or
consequential loss (of whatever nature) caused by the use or possession of any third party software or material.
Without prejudice to the remainder of this Agreement, in no circumstances will Atmel's liability to the Customer for any direct
loss or damage arising out of use or possession of the Product (if any) exceed the price payable for the relevant Order
relating to the defective Product. In no circumstances will Atmel be liable for any indirect or consequential loss or for any loss
of profits or revenue caused by the Product being defective.
7.
Revision History
Please note that the following page numbers referred to in this section refer to the specific revision mentioned, not to this
document.
Revision No.
History
9390E-INDCO-11/15
Section 2.1.4 “System and Pin Configuration” on page 15 updated
9390D-INDCO-11/15
Table 1-1 “Pin Description” on page 3 updated
Section 1.4 “Applications” on pages 5 to 7 updated
Section 1.4.3 “Recommended PCB Design and Layout” removed
9390C-INDCO-09/15
Section 3.4 “Supply Voltages and Current Consumption” on page 20 updated
Section 3.6 “RF Transmit Characteristics” on page 21 updated
Section 1.4.3 “Recommended PCB Design and Layout” on page 8 updated
9390B-INDCO-08/15
Section 2.1 “SPI Command Interface” on pages 9 to 13 updated
Section 2.2 “Operating Modes Overview” on pages 16 to 17 updated
Section 3.10 “Hardware SPI Timing Characteristics” on page 25 added
26
ATA8520D [DATASHEET]
9390E–INDCO–11/15
XXXXXX
Atmel Corporation
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© 2015 Atmel Corporation. / Rev.: 9390E–INDCO–11/15
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