IC & Module RoHS Certificate of Compliance
May 12, 2022
IC Semiconductors and Module Packaged Products
All Microchip IC product packages are designed to be in conformance with EU-RoHS Directive RoHS 2 Amendment Directive 2015/863/EU / "RoHS 3". Microchip certifies, to the best of its knowledge, its IC semiconductor and module
products are RoHS compliant and do not contain greater than: Lead (0,1%), Mercury (0,1%), Cadmium (0,01%),
Hexavalent chromium (0,1%), Polybrominated biphenyls (PBB) (0,1%), Polybrominated diphenyl ethers (PBDE)
including Deca-BDE or pentaBDE or octaBDE (0,1%), Bis(2-ethylhexyl) phthalate (DEHP) (0,1%), Butyl benzyl
phthalate (BBP)(0,1%), Dibutyl phthalate (DBP) (0,1%), Diisobutyl phthalate (DIBP) (0,1%) and
Hexabromocyclododecane (HBCDD) (0,1%).
EU Exempted Packages
Attachment “A” identifies IC package types that use EU RoHS Exemptions, including the following:
•
RoHS exemptions for PbO commonly used in glass and some ceramics, as well as the thin Pb braze alloy,
required to bond chips to their headers. These are included via RoHS 7(a) and RoHS 7(c)-I exemptions.
•
RoHS exemption for lead in solders to complete a viable electrical connection between the semiconductor die and
carrier within integrated circuit flip chip packages. These are included via RoHS exemption 15(a).
Microchip began working with an electronic industry consortium in June 2013 for extending the listed exemptions
beyond the current expiration date. This working group submitted a renewal application to the European RoHS
Technical Commission and continues to monitor the status of crucial RoHS exemptions. Additional information
concerning the status of exemption requests can be found at: https://ec.europa.eu/environment/topics/waste-andrecycling/rohs-directive/implementation-rohs-directive_en
Substances of Concern:
Effective 1 July 2009, all of Microchip Semiconductor products became qualified as Halogen-Free as defined per IEC
61249-2-21:2003: Bromine (Br) ≤ 900 and Chlorine (Cl) ≤ 900 ppm by homogeneous material weight, with total
Bromine (Br) plus Chlorine (Cl) content ≤ 1,500 ppm by homogeneous material weight. Additionally, Antimony Trioxide
(Sb2O3) is also restricted to less than 1,000 ppm.
The mold compounds used by Microchip and its sub-contract assembly houses to assemble Microchip’s
semiconductor devices do not contain inorganic particulate red phosphorous.
Microchip Development Systems kits/boards, and RF, Bluetooth, and Touch Screen modules may not meet the
requirements of IEC 61249-2-21:2003 listed above.
Please consult the specific Material Content Declaration (MCD) for the estimated substance content.
Page 1 of 7
Microchip Technology Incorporated 2355 West Chandler Blvd. Chandler, AZ 85224‐6199 Main Office 480‐792‐7200 Fax 480‐792‐4005
IC & Module RoHS Certificate of Compliance
May 12, 2022
Packing Materials
To the best of current knowledge and belief, all product shipment materials are compliant with Directive 2013/2/EU
(Amending to EU 94/62/EC: Packaging and Packaging Waste and EU Directive). Dimethyl Fumarate (CAS # 624-49-7
and Einecs No 210-849-0) is not used in Microchip products and is not used in the moisture absorbent pillows
accompanying Microchip products. This information is provided based on reasonable inquiry of Microchip suppliers
and represents current knowledge based on the information provided by those suppliers.
EU Waste of Electrical and Electronic Equipment (WEEE) and Basel Convention
Microchip IC and Module products are classified as piece parts which are not classified as EEE under EU WEEE or the
Basel Convention.
Disposal
Products at the end of their life, as well as any scrap, must be disposed following all local and national legal regulating
provisions.
Microchip Technology Incorporated’s General Statement of Warranty
Microchip Technology Incorporated has taken commercially reasonable steps to provide representative and accurate
material content information. Microchip relies on information provided by third parties and may not have conducted
destructive testing or chemical analysis on incoming materials and chemicals. Supplier information is often protected
from disclosure as trade secrets and some information may not have been provided by subcontractor assemblers and
raw material suppliers. Microchip may periodically update this Certificate of Compliance by posting the updated
version on its website. Microchip does not provide any warranty, express or implied, with respect to the information
provided in this Certificate of Compliance. This Certificate of Compliance does not modify Microchip’s terms and
conditions of sale of its products or the terms of any agreement under which customers purchased Microchip’s
products. Microchip’s terms and conditions of sale or the relevant agreement, as applicable, shall continue to apply.
Ewa Rickey
Ewa Rickey
Senior Manager, ESG Assurance
Microchip Technology Inc.
2355 W. Chandler Blvd., Chandler, AZ 85224
Page 2 of 7
Microchip Technology Incorporated 2355 West Chandler Blvd. Chandler, AZ 85224‐6199 Main Office 480‐792‐7200 Fax 480‐792‐4005
IC & Module RoHS Certificate of Compliance
May 12, 2022
Attachment “A”
Table identifies IC package types that use EU-RoHS Exemptions:
Microchip Package
Package
Pin
Package Width
Package
Description
Type
Count
or Size
Code
9KA
Transistor Outline
TO-263
3
-
External
Solder
Composition
(Terminal
Finish)
Matte Tin
9HA
Transistor Outline
TO-263
7
-
Matte Tin
7.a
F9X
Ceramic Dual-InLine-Pkg glass
seal
Ceramic Dual
Inline Package
System In
Package
CERDIP
8
.300in
SAC
7.c-I
CERDIP
8
.600In
NiAu
7.c-I
SiP
8
22x27x12mm
SAC
7.a, 7.c-I
ZFX
System In
Package
SiP
8
22x39.5x12.5mm
SAC
7.a, 7.c-I
ZGX
System In
Package
SiP
8
22x39x12.5mm
SAC
7.a, 7.c-I
ESX
High-Power Dual
Flatpack No-Lead
High-Power Dual
Flatpack No-Lead
PBC Module With
Shield
Ceramic Dual
Inline Package
Ceramic Dual
Inline Package
Ceramic Dual
Inline Package
PCB Module
PDFN
8
3.3x3.3x0.9mm
Matte Tin
7.a
PDFN
8
5x6x0.9mm
Matte Tin
7.a
MODULE
12
17.78x27.94mm
Au Flash
7.c-I
CERDIP
18
.300In
NiAu
7.c-I
CERDIP
18
22.19x26.08x2.75mm
NiAu
7.c-I
CERDIP
24
.600In
NiAu
7.c-I
MODULE
25
12.7x11mm
Au
7.c-I
Ceramic Dual
Inline Package
Ceramic Dual
Inline Package
CERDIP
28
.300In
NiAu
7.c-I
CERDIP
28
.600In
NiAu
7.c-I
5NB
ZEX
ASX
VDX
5PB
8ZB
8QB
4YX
5QB
5RB
3
EU RoHS
Exemption3
7.a
all the package codes using exemption 15 are no longer produced and are listed for historical reference only.
Page 3 of 7
Microchip Technology Incorporated 2355 West Chandler Blvd. Chandler, AZ 85224‐6199 Main Office 480‐792‐7200 Fax 480‐792‐4005
IC & Module RoHS Certificate of Compliance
May 12, 2022
Microchip
Package
Code
Package
Description
Package
Type
Pin
Count
Package Width
or Size
5SB
Ceramic Dual
Inline Package
Ceramic Quad
Flatpack
Ceramic Dual
Inline Package
Ceramic Dual Flat
Pack
Ceramic Dual
Inline Package
J-Leaded
Ceramic Chip
Carrier
J-Leaded
CERQUAD
'Cerpac' glass
seal
J-Lead
CERQUAD
WINDOWED
FlipChip Ceramic
Ball Grid Array
FlipChip Ceramic
Ball Grid Array
J-Leaded
CERQUAD
'Cerpac' glass
seal
J-Lead
CERQUAD
FlipChip Chip
Scale Package
PCB Module
CERDIP
32
CQFP
FlipChip Chip
Scale Package
FlipChip Ball Grid
Array
CERAMIC QUAD
FLAT PACK
Heat Spreader
FlipChip BGA
DEB
9SB
5JB
5TB
W5X
W4X
WPX
4EC
4GC
X5X
XHX
2GC
LXB
2SC
4YC
DFB
3JC
EU RoHS
Exemption3
.400In
External
Solder
Composition
(Terminal
Finish)
NiAu
32
20.8x10.4x3mm
NiAu
7.a, 7.c-I
CERDIP
32
40.64x10.03x2.84mm
NiAu
7.c-I
CDFP
36
12.19x23.37x2.97mm
NiAu
7.c-I
CERDIP
40
.600In
NiAu
7.c-I
JLCC
68
.950x.950in
Au Flash
7.c-I
CERQUAD
68
.950x.950in
NiPdAu
7.c-I
CERQUAD
68
.950x.950in
NiPdAu
7.c-I
FCCBGA
69
10x10mm
SAC405
15.a
FCCBGA
69
8x8mm
SAC405
15.a
CERQUAD
84
1.15x1.15in
NiPdAu
7.c-I
CERQUAD
84
1.15x1.15in
NiPdAu
7.c-I
FCCSP
121
12x12mm
SAC305
15.a
MODULE
188
40.8x40.8x3.3mm
NiAu
7.a, 7.c-I
FCCSP
196
15x15mm
SAC305
15.a
FCBGA
196
15x15mm
SAC305
15.a
CQFP
256
36x36x4.03mm
NiAu
7.a, 7.c-I
HFCBGA
324
19x19mm
SAC305
15.a
7.c-I
Page 4 of 7
Microchip Technology Incorporated 2355 West Chandler Blvd. Chandler, AZ 85224‐6199 Main Office 480‐792‐7200 Fax 480‐792‐4005
IC & Module RoHS Certificate of Compliance
May 12, 2022
Microchip
Package
Code
Package
Description
Package
Type
Pin
Count
Package Width
or Size
9QB
Ceramic Land
Grid Array
Ceramic Land
Grid Array
Ceramic Land
Grid Array
Ceramic Land
Grid Array
Ceramic Land
Grid Array
Ceramic Land
Grid Array
Ceramic Land
Grid Array
Ceramic Land
Grid Array
Ceramic Land
Grid Array
Ceramic Land
Grid Array
Ceramic Land
Grid Array
Heat Spreader
FlipChip BGA
Heat Spreader
FlipChip BGA
Heat Spreader
FlipChip BGA
Ceramic Land
Grid Array
Ceramic Land
Grid Array
Ceramic Land
Grid Array
Ceramic Land
Grid Array
Ceramic Land
Grid Array
Ceramic Land
Grid Array
Ceramic Land
Grid Array
CLGA
349
CLGA
WMB
8WB
8UB
X3B
X4B
4DB
5ZB
8XB
9RB
X7B
3RC
3WC
3XC
9LB
5WB
5XB
5YB
DDB
4ZB
8VB
EU RoHS
Exemption3
25x25x2.96mm
External
Solder
Composition
(Terminal
Finish)
NiAu
349
25x25x2.96mm
NiAu
7.a, 7.c-I
CLGA
472
22x22x2.96mm
NiAu
7.a, 7.c-I
CLGA
472
29x29x1.27mm
NiAu
7.a, 7.c-I
CLGA
472
29X29X2.73mm
NiAu
7.a, 7.c-I
CLGA
472
29X29X2.77mm
NiAu
7.a, 7.c-I
CLGA
472
29x29x3.09mm
NiAu
7.a, 7.c-I
CLGA
472
29x29x3.09mm
NiAu
7.a, 7.c-I
CLGA
472
29x29x3.09mm
NiAu
7.a, 7.c-I
CLGA
472
29x29x3.09mm
NiAu
7.a, 7.c-I
CLGA
472
29x29x4.03
NiAu
7.a, 7.c-I
HFCBGA
484
23x23mm
SAC305
15.a
HFCBGA
613
33x33mm
SAC305
15.a
HFCBGA
613
33x33mm
SAC305
15.a
CLGA
625
29x29x2.52mm
NiAu
7.a, 7.c-I
CLGA
625
29x29x2.96mm
NiAu
7.a, 7.c-I
CLGA
625
29x29x2.96mm
NiAu
7.a, 7.c-I
CLGA
625
29x29x2.96mm
NiAu
7.a, 7.c-I
CLGA
625
29x29x2.96mm
NiAu
7.a, 7.c-I
CLGA
625
29x29x3.8mm
NiAu
7.a, 7.c-I
CLGA
625
29x29x3.8mm
NiAu
7.a, 7.c-I
7.a, 7.c-I
Page 5 of 7
Microchip Technology Incorporated 2355 West Chandler Blvd. Chandler, AZ 85224‐6199 Main Office 480‐792‐7200 Fax 480‐792‐4005
IC & Module RoHS Certificate of Compliance
May 12, 2022
Microchip
Package
Code
Package
Description
Package
Type
Pin
Count
Package Width
or Size
6AB
Ceramic Land
Grid Array
FlipChip Ball Grid
Array
FlipChip Ball Grid
Array
FlipChip Ball Grid
Array
Heat Spreader
Ball Grid Array
FlipChip Ball Grid
Array
FlipChip Ball Grid
Array
FlipChip Ball Grid
Array
FlipChip Ball Grid
Array
Ceramic Land
Grid Array
FlipChip Ball Grid
Array
Thick Fine Pitch
Ball Grid Array
FlipChip Ball Grid
Array
Fine Pitch Ball
Grid Array
Heat Spreader
FlipChip BGA
FlipChip Ball Grid
Array
Heat Spreader
Thick Fine Pitch
Ball Grid Array
Thick Ball Grid
Array
Ceramic Land
Grid Array
Ceramic Land
Grid Array
Ceramic Land
Grid Array
CLGA
625
FCBGA
ATC
BTC
BVC
9WC
AAC
ASC
BCC
CDC
D8B
6DC
6FC
BHC
BGC
2DC
BKC
BLC
BPC
6BB
6CB
9BB
EU RoHS
Exemption3
35x35x7.64mm
External
Solder
Composition
(Terminal
Finish)
NiAu
773
23x23mm
SAC305
15.a
FCBGA
773
23x23mm
SAC305
15.a
FCBGA
773
23x23mm
SAC305
15.a
HBGA
896
31x31mm
SAC305
15.a
FCBGA
896
31x31mm
SAC305
15.a
FCBGA
896
31x31mm
SAC305
15.a
FCBGA
896
31x31mm
SAC305
15.a
FCBGA
896
31x31mm
SAC305
15.a
CLGA
896
31x31x3.8mm
NiAu
7.a, 7.c-I
FCBGA
1022
27x27mm
SAC305
15.a
BFBGA
1022
27x27mm
SAC305
7.c-I
FCBGA
1071
27x27mm
SAC305
15.a
FBGA
1071
27x27x2.17mm
SAC305
15.a
HFCBGA
1072
45x45mm
SAC305
15.a
FCBGA
1073
27x27mm
SAC305
15.a
HBFBGA
1408
31x31mm
SAC305
15.a
BBGA
1517
40x40x3.22mm
SAC305
15.a
CLGA
1752
45x45x6mm
NiAu
7.a, 7.c-I
CLGA
1752
45x45x6mm
NiAu
7.a, 7.c-I
CLGA
1752
45x45x6mm
NiAu
7.a, 7.c-I
7.a, 7.c-I
Page 6 of 7
Microchip Technology Incorporated 2355 West Chandler Blvd. Chandler, AZ 85224‐6199 Main Office 480‐792‐7200 Fax 480‐792‐4005
IC & Module RoHS Certificate of Compliance
May 12, 2022
Microchip
Package
Code
Package
Description
Package
Type
Pin
Count
Package Width
or Size
2NC
Heat Spreader
FlipChip BGA
Thick Ball Grid
Array
HFCBGA
1760
BBGA
1932
7KC
EU RoHS
Exemption3
42.5x42.5mm
External
Solder
Composition
(Terminal
Finish)
SAC305
45x45mm
SAC305
7.c-I
7.c-I
MSCC FPGA-SoC Packages with Pb ... Not yet integrated
Package Description NOTE:
ITEMS IN BLUE ARE DISCONTINUED
Plastic Ball Grid Array
Fine Pitch Ball Grid Array
Package
Type
BG
FG
Very Fine Pitch Ball Grid Array
Chip Scale Package
VF
CS
Fine Pitch Chip Scale Package
Ultra‐Thin Chip Scale Package
Flip Chip Ball Grid Array
Fine Pitch Flip Chip Ball Grid Array
Ceramic Quad Flat Pack
Ceramic Pin Grid Array
Ceramic Column Grid Array
FCS
UC/UCS
FC
FCV
CQFP
CPGA
CCGA
Quad Flat Pack
Plastic Quad Flat Pack
Thin Quad Flat Pack
Very Thin Quad Flat Pack
Plastic Leaded Chip Carrier
Plastic Quad Flat Pack‐Exposed Heatsink
Ceramic Quad Flat Pack
QN
PQ
TQ
VQ
PL
RQ
CQFP
Ceramic Pin Grid Array
Ceramic Land Grid Array
CPGA
CLGA
Ceramic Chip Carrier Land Grid Array
CCLG
Pin Count
272 / 329 / 456
144 / 256 / 324 / 484 / 676 /
896 / 1152
256 / 400
49 / 81 / 121 / 128 / 180 / 196 /
201 / 281 / 288 / 289 / 325
158 / 325 / 536
36 / 81
484 / 784 / 1152 / 1657
484
84 / 172
84 / 132 / 176 / 207 / 257
484 / 624 / 896 / 1152 / 1272 /
1657
48 / 68 / 100 / 132 / 180
100 / 144 / 160 / 208 / 240
64 / 100 / 144 / 176
80 / 100 / 128 / 176
44 / 68 / 84
208 / 240
84 / 132 / 172 / 196 / 208 / 256
/ 352
84 / 132 / 176 / 207 / 257
484 / 624 / 896 / 1152 / 1272 /
1657
256
External Solder
Composition:
(Terminal Finish)
Sn63/Pb37
Sn63/Pb37
Sn63/Pb37
Sn63/Pb37
Sn63/Pb37
Sn63/Pb37
Sn63/Pb37
Sn63/Pb37
Sn63/Pb37
Sn63/Pb37
Sn63/Pb37
85%Sn/15%Pb
85%Sn/15%Pb
85%Sn/15%Pb
85%Sn/15%Pb
85%Sn/15%Pb
85%Sn/15%Pb
NiAu
NiAu
NiAu
NiAu
Page 7 of 7
Microchip Technology Incorporated 2355 West Chandler Blvd. Chandler, AZ 85224‐6199 Main Office 480‐792‐7200 Fax 480‐792‐4005
