ATBTLC1000-MR110CA

ATBTLC1000-MR110CA ATBTLC1000-MR110CA Ultra-Low Power BLE Module Introduction The ATBTLC1000-MR110CA is an ultra-low power Bluetooth® Low Energy (BLE) module with Integrated Transceiver, Modem, MAC, PA, TR Switch, and Power Management Unit (PMU). It can be used as a Bluetooth Low Energy link controller or data pump with external host MCU. The qualified Bluetooth SIG protocol stack is stored in dedicated ROM. The firmware includes L2CAP service layer protocols, Security Manager, Attribute protocol (ATT), Generic Attribute Profile (GATT), and the Generic Access Profile (GAP). Additionally, application profiles such as Proximity, Thermometer, Heart Rate, Blood pressure and many other SIG-defined profiles. The ATBTLC1000-MR110CA is a fully-certified module that contains the ATBTLC1000A-MU (QFN), ceramic high-gain chip antenna, 26 MHz crystal, and PMU circuit. The module needs an external 32 kHz clock or crystal to power-up. Microchip BluSDK offers a comprehensive set of tools including reference applications for several Bluetooth SIG defined profiles and a custom profile. The BluSDK helps the user to quickly evaluate, design and develop BLE products with ATBTLC1000-MR110CA. The ATBTLC1000-MR110CA module has passed the Bluetooth SIG certification for interoperability with the Bluetooth Low Energy 5.0 specification. Features • Complies with Bluetooth v5.0, FCC CFR47 Part 15, ARIB STD-T66, and TELEC • Bluetooth Certification: – Bluetooth SIG QDID: 117593 https://launchstudio.bluetooth.com/listings/search • 2.4 GHz Transceiver and Modem: – -95 dBm/-93 dBm programmable receiver sensitivity – -55 dBm to +3.5 dBm programmable Tx output power – Integrated T/R switch – Single wire antenna connection • Processor Features: ® ® – ARM Cortex M0 32-bit processor – Single Wire Debug (SWD) interface – Four-channel Direct Memory Access (DMA) controller – Brown-out Detector and Power-on Reset (POR) – Watchdog timer • Memory: – 128 KB embedded RAM(1) © 2019 Microchip Technology Inc. Datasheet DS70005393A-page 1 ATBTLC1000-MR110CA • • • • • • • – 128 KB embedded ROM Hardware Security Accelerators: – Advanced Encryption Standard (AES) - 128 – Secure Hash Algorithm (SHA) - 256 Peripherals: – 12 digital and 1 wake-up GPIO(1) – Two Mixed signal GPIOs(1) – Programmable 96 kOhm pull up or pull-down resistor for each GPIO(1) – Retention capable GPIO pads(1) – One Serial Peripheral Interface (SPI) Master/Slave(1) – Two Inter-Integrated Circuit (I2C) Master/Slave(1) – Two UART(1) – One SPI Flash(1) – Three-axis quadrature decoder(1) – Four Pulse Width Modulation (PWM) channels, three General Purpose Timers, and one Wakeup Timer(1) – 2-channel 11-bit Analog-to-Digital Converter (ADC)(1) Clock: – Integrated 26 MHz oscillator – 26 MHz crystal oscillator (XO) – Fully integrated sleep oscillator – 32 kHz Real Time Clock crystal oscillator (RTC XO) Ultra-Low Power – 2.01 μA sleep current – 3.91 mA peak TX current(2) – 5.24 mA peak RX current – 15.1 μA average advertisement current(3) Integrated Power Management: – 1.8V to 4.3V input range for PMU – 1.62V to 4.3V input range for I/O – Fully integrated Buck DC/DC converter Temperature Range: -40°C to 85°C Package: – 25-pin module package 12.700 mm x 20.152 mm Note:  1. Usage of this feature is not supported by the BluSDK. The datasheet will be updated once the support for this feature is added in BluSDK. 2. TX output power - 0 dBm 3. Advertisement channels - 3; Advertising interval - 1 second; Advertising event type - Connectable undirected; Advertisement data payload size - 31 octets. © 2019 Microchip Technology Inc. Datasheet DS70005393A-page 2 ATBTLC1000-MR110CA Table of Contents Introduction......................................................................................................................1 Features.......................................................................................................................... 1 1. Ordering Information..................................................................................................5 2. Package Information..................................................................................................6 3. Block Diagram........................................................................................................... 7 4. Pinout Information..................................................................................................... 8 4.1. Pin Description............................................................................................................................. 8 5. Device States...........................................................................................................11 5.1. 5.2. Description of Device States...................................................................................................... 11 Controlling the Device States..................................................................................................... 11 6. Host Microcontroller Interface..................................................................................12 7. Clocking...................................................................................................................14 7.1. 7.2. 7.3. 26 MHz Crystal Oscillator (XO).................................................................................................. 14 32.768 kHz RTC Crystal Oscillator (RTC XO)............................................................................15 2 MHz and 26 MHz Integrated RC Oscillators........................................................................... 19 8. Electrical Characteristics......................................................................................... 21 8.1. 8.2. 8.3. 8.4. 8.5. Absolute Maximum Ratings........................................................................................................21 Recommended Operating Conditions........................................................................................ 21 Current Consumption in Device States...................................................................................... 22 Receiver Performance................................................................................................................23 Transmitter Performance............................................................................................................24 9. ATBTLC1000-MR110CA Module Outline Drawing.................................................. 25 10. ATBTLC1000-MR110CA Reference Schematic...................................................... 27 10.1. Reference Schematics............................................................................................................... 27 11. Placement and Routing Guidelines......................................................................... 29 11.1. Power and Ground..................................................................................................................... 30 11.2. Interferers................................................................................................................................... 30 12. Reflow Profile Information....................................................................................... 31 12.1. 12.2. 12.3. 12.4. Storage Condition.......................................................................................................................31 Stencil Design............................................................................................................................ 31 Soldering and Reflow Condition................................................................................................. 31 Baking Conditions...................................................................................................................... 32 © 2019 Microchip Technology Inc. Datasheet DS70005393A-page 3 ATBTLC1000-MR110CA 12.5. Module Assembly Considerations.............................................................................................. 32 13. Regulatory Approval................................................................................................ 33 13.1. 13.2. 13.3. 13.4. United States (FCC)................................................................................................................... 33 Canada (ISED)........................................................................................................................... 34 Japan..........................................................................................................................................36 Other Regulatory Information..................................................................................................... 36 14. Reference Documentation.......................................................................................38 15. Document Revision History..................................................................................... 39 The Microchip Web Site................................................................................................ 41 Customer Change Notification Service..........................................................................41 Customer Support......................................................................................................... 41 Microchip Devices Code Protection Feature................................................................. 41 Legal Notice...................................................................................................................42 Trademarks................................................................................................................... 42 Quality Management System Certified by DNV.............................................................43 Worldwide Sales and Service........................................................................................44 © 2019 Microchip Technology Inc. Datasheet DS70005393A-page 4 ATBTLC1000-MR110CA Ordering Information 1. Ordering Information The following table provides the ATBTLC1000-MR110CA ordering information. Table 1-1. Ordering Details Model No. Ordering Code Package ATBTLC1000-MR110CA ATBTLC1000-MR110CA 12.7 mm x 20.15 mm © 2019 Microchip Technology Inc. Datasheet Description Chip antenna DS70005393A-page 5 ATBTLC1000-MR110CA Package Information 2. Package Information The following table provides the ATBTLC1000-MR110CA package information. Table 2-1. ATBTLC1000-MR110CA Package Information Parameter Value Units Tolerance Package size 12.700 x 20.152 mm - Pad count 25 - - Total thickness 2.0874 Tolerance (maximum pad pitch) 0.9002 Pad width 0.600 Exposed paddle pad size 2.7 x 2.7 ±0.078 mm - Note:  For details on Package drawing, refer to 9. ATBTLC1000-MR110CA Module Outline Drawing. © 2019 Microchip Technology Inc. Datasheet DS70005393A-page 6 ATBTLC1000-MR110CA Block Diagram 3. Block Diagram The following figure illustrates the block diagram of the ATBTLC1000-MR110CA module. Figure 3-1. Block Diagram © 2019 Microchip Technology Inc. Datasheet DS70005393A-page 7 ATBTLC1000-MR110CA Pinout Information 4. Pinout Information The following figure illustrates the top view and pin numbering of the module. Chip_EN RTC_CLKP RTC_CLKN AO_GPIO_0 LP_GPIO_16 17 18 19 20 21 LP_GPIO_18 22 23 Ground 24 VDDIO Ground LP_GPIO_10 LP_GPIO_11 11 10 9 LP_GPIO_12 Ground GPIO_MS1 15 14 13 12 GPIO_MS2 16 LP_GPIO_13 Figure 4-1. ATBTLC1000 Pin Description 8 7 6 5 Paddle Pad - 25 4 3 2 1 BTLC1000-MR110CA MODULE LP_GPIO_9 LP_GPIO_8 VBAT LP_GPIO_3 LP_GPIO_2 LP_GPIO_1 LP_GPIO_0 Ground BTLC1000_MR110CA_REV __ 4.1 Pin Description The following table lists the pin assignments for the ATBTLC1000-MR110CA module. Table 4-1. ATBTLC1000-MR110CA Pin Description ATBTLC1000MR110CA Pin No. Pin Name Pin Type Description/Default Function 1 Ground Power Ground Pin. Connect to PCB ground 2 LP_GPIO_0 Digital I/O SWD clock © 2019 Microchip Technology Inc. Datasheet DS70005393A-page 8 ATBTLC1000-MR110CA Pinout Information ...........continued ATBTLC1000MR110CA Pin No. 3 Pin Name LP_GPIO_1 Pin Type Digital I/O Description/Default Function SWDIO UART RXD 4 LP_GPIO_2 Digital I/O Default function (6-wire mode): UART1_RXD Alternate (4-wire mode): UART1_RXD UART_TXD 5 LP_GPIO_3 Digital I/O Default function (6-wire mode): UART1_TXD Alternate (4-wire mode): UART1_TXD 6 VBAT Power Power supply pin for the DC/DC convertor UART_CTS 7 LP_GPIO_8(1) Digital I/O Default function (6-wire mode): GPIO with Programmable Pull Up/Down Alternate (4-wire mode): UART1_CTS UART_RTS 8 LP_GPIO_9(1) Digital I/O Default function (6-wire mode): GPIO with Programmable Pull Up/Down Alternate (4-wire mode): UART1_RTS 9 GND Ground SPI SCK/SPI Flash SCK 10 LP_GPIO_10 Digital I/O Default function (6-wire mode): UART2_RTS Alternate (4-wire mode): GPIO with Programmable Pull Up/Down SPI MOSI/SPI Flash TXD 11 LP_GPIO_11 Digital I/O Default function (6-wire mode): UART2_CTS Alternate (4-wire mode): GPIO with Programmable Pull Up/Down SPI SSN/SPI Flash SSN 12 LP_GPIO_12 Digital I/O 13 GND Ground © 2019 Microchip Technology Inc. Default function (6-wire mode): UART2_TXD Alternate (4-wire mode): GPIO with Programmable Pull Up/Down - Datasheet DS70005393A-page 9 ATBTLC1000-MR110CA Pinout Information ...........continued ATBTLC1000MR110CA Pin No. Pin Name Pin Type Description/Default Function SPI MISO/SPI Flash RXD Default function (6-wire mode): UART2_RXD 14 LP_GPIO_13 Digital I/O 15 GPIO_MS1 Mixed Signal I/O 16 GPIO_MS2 Mixed Signal I/O GPIO with Programmable Pull Up/Down Alternate (4-wire mode): GPIO with Programmable Pull Up/Down GPIO with Programmable Pull Up/ Down. Default function in BluSDK: Host wake up2 17 Chip_EN Digital Input Can be used to control the state of PMU. High-level enables the module; low-level places module in Power-Down mode. Connect to a host output that defaults low at power-up. If the host output is tri-stated, add a 1 MOhm pull-down resistor to ensure a low level at power-up 18 RTC_CLKP Analog Crystal pin or External clock supply, see 7.2 32.768 kHz RTC Crystal Oscillator (RTC XO) 19 RTC_CLKN Analog Crystal pin, see 7.2 32.768 kHz RTC Crystal Oscillator (RTC XO) 20 AO_GPIO_0 Always On Digital I/O, Programmable Pull Up/Down Can be used to wake up the device from Ultra_Low_Power mode by the host MCU 21 LP_GPIO_16 Digital I/O GPIO with Programmable Pull Up/Down 22 VDDIO Power supply Power supply pin for the I/O pins. Can be less than or equal to voltage supplied at VBAT 23 LP_GPIO_18 Digital I/O GPIO with Programmable Pull Up/Down 24 GND Ground - 25 Paddle Ground Exposed paddle must be soldered to system ground Note:  1. These GPIO pads are high-drive pads. 2. For more details, see section 6. Host Microcontroller Interface. © 2019 Microchip Technology Inc. Datasheet DS70005393A-page 10 ATBTLC1000-MR110CA Device States 5. Device States This section provides a description of and information about controlling the device states. 5.1 Description of Device States The ATBTLC1000-MR110CA has multiple device states, depending on the state of the ARM processor and BLE subsystem. If the BLE subsystem is active, the ARM must be powered on. • BLE_ON_Transmit – Device actively transmits a BLE signal (irrespective of whether ARM processor is active or not) • BLE_ON_Receive – Device actively receives a BLE signal (irrespective of whether ARM processor is active or not) • Ultra_Low_Power – BLE subsystem and ARM processor are powered down (with or without RAM retention) • Power_Down – Device core supply is powered off 5.2 Controlling the Device States The following pins are used to switch between the main device states: • CHIP_EN – used to enable PMU • VDDIO – I/O supply voltage from external supply • AO_GPIO_0 - used to control the device to enter/exit Ultra_Low_Power mode In Power_Down state, VDDIO must be ON and CHIP_EN must be set low (at GND level). To exit from the Power_Down state, CHIP_EN must change between logic low and logic high (VDDIO voltage level). Once the device is out of the Power_Down state, all other state transitions are controlled by software. When VDDIO is OFF and CHIP_EN is low, the chip is powered OFF with no leakage. When power is not supplied to the device (DC/DC converter output and VDDIO are OFF, at ground potential), a voltage cannot be applied to the ATBTLC1000-MR110CA pins because each pin contains an ESD diode from the pin to supply. This diode turns ON when a voltage higher than one diode-drop is supplied to the pin. If a voltage must be applied to the signal pads while the chip is in a low-power state, the VDDIO supply must be ON, so the Power_Down state is used. Similarly, to prevent the pin-to-ground diode from turning on, do not apply a voltage that is more than one diode-drop below the ground to any pin. The AO_GPIO_0 pin is used to control the device to enter and exit the Ultra_Low_Power mode. When AO_GPIO_0 is maintained in Logic High state, the device does not enter the Ultra_Low_Power mode. When AO_GPIO_0 is maintained in Logic Low state, the device enters the Ultra_Low_Power mode when there are no BLE events to handle. © 2019 Microchip Technology Inc. Datasheet DS70005393A-page 11 ATBTLC1000-MR110CA Host Microcontroller Interface 6. Host Microcontroller Interface This section describes the interface of the ATBTLC1000-MR110CA with the host MCU. The host interface pins depend on the mode of the device. The ATBTLC1000-MR110CA can be interfaced with host MCU in either of the two modes: • 6-wire mode (default) • 4-wire mode To configure the device to function in the 4-wire mode, program the bit 28 of NVM eFuse Bank 5 Block 3. The following figures describe the required hardware interface between host MCU and the ATBTLC1000MR110CA in both the 6-wire mode and 4-wire mode. The interface requires two additional GPIOs and one interrupt pin from the host MCU. Figure 6-1. Host Microcontroller to ATBTLC1000-MR110CA Interface - 4-wire Mode © 2019 Microchip Technology Inc. Datasheet DS70005393A-page 12 ATBTLC1000-MR110CA Host Microcontroller Interface Figure 6-2. Host Microcontroller to ATBTLC1000-MR110CA Interface - 6-wire Mode The host wake-up pin from ATBTLC1000-MR110CA can be connected to any interrupt pin of the host MCU. The host MCU can monitor this pin level and decide to wake up based on events from the ATBTLC1000-MR110CA. The host wake-up pin will be held in logic high ('1') by default and at conditions where there is no pending event data in the ATBTLC1000-MR110CA. The host wake-up pin will be held in logic low ('0') when there is event data available from the ATBTLC1000-MR110CA and the pin will be held in this state until all event data is sent out from the ATBTLC1000-MR110CA. By default in BluSDK, GPIO_MS1 is used as the host wake-up pin. Refer to release notes and API user manual documents available in the BluSDK release package for more details on available options to reconfigure the host wake-up pin from the ATBTLC1000-MR110CA. The UART configuration to be used are as follows: • Baud rate: configurable in the BluSDK during initialization. Refer to release notes and API user manual documents available in the ATBTLC1000-MR110CA BluSDK Release Package, for more details • Parity: None • Stop bits: 1 • Data size: 8 bits © 2019 Microchip Technology Inc. Datasheet DS70005393A-page 13 ATBTLC1000-MR110CA Clocking 7. Clocking The following figure provides an overview of the clock tree and clock management blocks. Figure 7-1. Clock Architecture The BLE Clock is used to drive the BLE subsystem. The ARM clock is used to drive the Cortex-M0 MCU and its interfaces (UART, SPI, and I2C). The recommended MCU clock speed is 26 MHz. The Low Power Clock is used to drive all the low-power applications like the BLE sleep timer, always-on power sequencer, always-on timer, and others. The 26 MHz Crystal Oscillator (XO) is used for the BLE operations or in an event. A very accurate clock is required for the ARM subsystem operations. The 26 MHz integrated RC oscillator is used for most of the general purpose operations on the MCU and its peripherals. In the cases, when the BLE subsystem is not used, the RC oscillator can be used for lower power consumption. The frequency variation of this RC oscillator is up to ±40% over process, voltage, and temperature. The frequency variation of 2 MHz RC oscillator is up to ±50% over process, voltage, and temperature. The 32.768 kHz RTC Crystal Oscillator (RTC XO) is used for BLE operations as it reduces power consumption by providing the best timing for wake-up precision, allowing circuits to be in low-power Sleep mode for as long as possible until they need to wake up and connect during the BLE connection event. 7.1 26 MHz Crystal Oscillator (XO) A 26 MHz crystal oscillator is integrated into the ATBTLC1000-MR110CA to provide the precision clock for the BLE operations. © 2019 Microchip Technology Inc. Datasheet DS70005393A-page 14 ATBTLC1000-MR110CA Clocking 7.2 32.768 kHz RTC Crystal Oscillator (RTC XO) 7.2.1 General Information The ATBTLC1000-MR110CA contains a 32.768 kHz RTC oscillator that is used for Bluetooth Low Energy activities involving connection events. To be compliant with the Bluetooth Low Energy specifications for connection events, the frequency accuracy of this clock has to be within ±500 ppm. Because of the high accuracy of the 32.768 kHz crystal oscillator clock, the power consumption can be minimized by leaving radio circuits in Low-Power Sleep mode for as long as possible, until they need to wake up for the next connection timed event. The block diagram in Figure(a) illustrates how the internal low frequency Crystal Oscillator (XO) is connected to the external crystal. The RTC XO contains: • Programmable internal capacitance with a maximum of 15 pF on each terminal • RTC_CLK_P • RTC_CLK_N When bypassing the crystal oscillator with an external signal, the user can program down the internal capacitance to its minimum value (~1 pF) for easier driving capability. The driving signal is applied to the RTC_CLK_P terminal, as illustrated in Figure (b). The need for external bypass capacitors depends on the chosen crystal characteristics. Typically, the crystal must be chosen with a load capacitance of 7 pF to minimize the oscillator current. Refer to the data sheet of the preferred crystal and take into account the on-chip capacitance. Alternatively, if an external 32.768 kHz clock is available, it can be used to drive the RTC_CLK_P pin, instead of using a crystal. The XO contains 6 pF internal capacitance on the RTC_CLK_P pin. To bypass the crystal oscillator, an external signal capable of driving 6 pF can be applied to the RTC_CLK_P terminal, as illustrated in Figure (b). RTC_CLK_N must be left unconnected when driving an external source into RTC_CLK_P. Refer to the Table 7-2 for the specification of the external clock to be supplied at RTC_CLK_P. © 2019 Microchip Technology Inc. Datasheet DS70005393A-page 15 ATBTLC1000-MR110CA Clocking Figure 7-2. Connections to RTC XO Table 7-1. 32.768 kHz External Clock Specification Parameter Min. Oscillation frequency Typ. Max Unit 32.768 kHz Must be able to drive 6 pF load at desired frequency VinH 0.7 1.2 VinL 0 0.2 Stability – Temperature -250 Comments V High-level input voltage Low-level input voltage +250 ppm Additional internal trimming capacitors (C_onchip) are available. They provide the possibility to tune the frequency output of RTC XO without changing the external load capacitors. Note:  Refer the BluSDK BLE API Software Development Guide for details on how to enable the 32.768 kHz clock output and tune the internal trimming capacitors. Table 7-2. 32.768 kHz XTAL C_onchip Programming Register: pierce_cap_ctrl[3:0] C_onchip [pF] 0000 0.0 0001 1.0 0010 2.0 0011 3.0 0100 4.0 0101 5.0 0110 6.0 © 2019 Microchip Technology Inc. Datasheet DS70005393A-page 16 ATBTLC1000-MR110CA Clocking ...........continued Register: pierce_cap_ctrl[3:0] 7.2.2 C_onchip [pF] 0111 7.0 1000 8.0 1001 9.0 1010 10.0 1011 11.0 1100 12.0 1101 13.0 1110 14.0 1111 15.0 RTC XO Design and Interface Specification The RTC consists of two main blocks: 1. 2. Programmable Gm stage Tuning capacitors The programmable Gm stage is used to guarantee oscillation start-up and to sustain oscillation. Tuning capacitors are used to adjust the XO center frequency and control the XO precision for different crystal models. The output of the XO is driven to the digital domain via a digital buffer stage with a supply voltage of 1.2V. Table 7-3. RTC XO Interface Pin Name Function Register Default Digital control pins - - Pierce_res_ctrl Control feedback resistance value: • 0 is 20 MOhm feedback resistance • 1 is 30 MOhm feedback resistance 0X4000F404=’1’ Pierce_cap_ctrl Control the internal tuning capacitors with step 0X4000F404=”1000” of 700 fF: • 0000 is 700 fF • 1111 is 11.2 pF Refer to crystal data sheet to check for optimum tuning capacitance value. Pierce_gm_ctrl Controls the Gm stage gain for different crystal mode: • 0011 for crystal with shunt cap of 1.2 pF • 1000 for crystal with shunt cap > 3 pF 0X4000F404=”1000” VDD_XO 1.2V - © 2019 Microchip Technology Inc. Datasheet DS70005393A-page 17 ATBTLC1000-MR110CA Clocking 7.2.3 RTC Characterization with Gm Code Variation The following graphs show the RTC total drawn current and the XO accuracy versus different tuning capacitors and different Gm codes, at a supply voltage of 1.2V and temperature at 25°C. Figure 7-3. RTC Drawn Current vs. Tuning Caps at 25°C Figure 7-4. RTC Oscillation Frequency Deviation vs. Tuning Caps at 25°C 7.2.4 RTC Characterization with Supply Variation and Temperature The following graphs show the RTC total drawn current versus different supply voltage and different gm codes, at a temperature of 25°C. © 2019 Microchip Technology Inc. Datasheet DS70005393A-page 18 ATBTLC1000-MR110CA Clocking Figure 7-5. RTC Drawn Current vs. Supply Variation Figure 7-6. RTC Frequency Deviation vs. Supply Voltage 7.3 2 MHz and 26 MHz Integrated RC Oscillators The 2 MHz integrated RC oscillator circuit without calibration has a frequency variation of 50% over process, temperature, and voltage variation. The calibration over process, temperature, and voltage is required to maintain the accuracy of this clock. © 2019 Microchip Technology Inc. Datasheet DS70005393A-page 19 ATBTLC1000-MR110CA Clocking Figure 7-7. 32 kHz RC Oscillator PPM Variation vs. Calibration Time at Room Temperature Figure 7-8. 32 kHz RC Oscillator Frequency Variation over Temperature The 26 MHz integrated RC oscillator circuit has a frequency variation of 50% over process, temperature, and voltage variation. © 2019 Microchip Technology Inc. Datasheet DS70005393A-page 20 ATBTLC1000-MR110CA Electrical Characteristics 8. Electrical Characteristics There are voltage ranges, where different VDDIO levels apply. The reason for this separation is for the IO drivers, whose drive strength is directly proportional to the IO supply voltage. In the ATBTLC1000 products, there is a large gap in the IO supply voltage range (1.8V to 4.3V). A guarantee on drive strength across this voltage range will be intolerable to most vendors, who only use a subsection of the IO supply range. As such, these voltages are segmented into three manageable sections referenced as VDDIOL, VDDIOM, and VDDIOH in tables listed in this document. 8.1 Absolute Maximum Ratings This section describes the minimum and maximum ratings the module can tolerate. Table 8-1. ATBTLC1000-MR110CA Absolute Maximum Ratings Symbol Characteristics Min. Max. Unit VDDIO I/O Supply Voltage -0.3 5.0 VBAT Battery Supply Voltage -0.3 5.0 VIN (1) Digital Input Voltage -0.3 VDDIO VAIN (2) Analog Input Voltage -0.3 1.5 VESDHBM (3) ESD Human Body Model -1000, -2000 (see notes below) +1000, +2000 (see notes below) TA Storage Temperature -65 150 - Junction Temperature - 125 V °C Note:  1. VIN corresponds to all the digital pins. 2. VAIN corresponds to the following analog pins: VDDRF_RX, VDDAMS, RFIO, RTC_CLKN, RTC_CLKP, VDD_SXDIG and VDD_VCO. 3. For VESDHBM, each pin is classified as Class 1, or Class 2, or both: – The Class 1 pins include all the pins (both analog and digital) – The Class 2 pins include all digital pins only – VESDHBM is ±1 kV for Class 1 pins. VESDHBM is ±2 kV for Class 2 pins. 8.2 Recommended Operating Conditions The following table provides the recommended operating conditions for the ATBTLC1000-MR110CA. Table 8-2. ATBTLC1000-MR110CA Recommended Operating Conditions Symbol Characteristics Min. Typ. Max. VDDIO I/O Supply Voltage Low Range 1.62 1.80 4.3 VBAT Battery Supply Voltage(1) 1.8 (1) 3.6 4.3 © 2019 Microchip Technology Inc. Datasheet Unit V DS70005393A-page 21 ATBTLC1000-MR110CA Electrical Characteristics ...........continued Symbol Characteristics Min. Operating Temperature Typ. -40 Max. 85 Unit °C Note:  1. VBAT supply must be greater than or equal to VDDIO. 8.3 Current Consumption in Device States The following table provides the current consumption details in different device states. Table 8-3. ATBTLC1000-MR110CA Device State Current Consumption Device State C_EN VDDIO IVBAT+IVDDIO (typical) (2) Power_Down Off On 0.05 μA Ultra_Low_Power with BLE timer, with RTC (1) On On 2.01 μA BLE_On_Receive at channel 37 (2402 MHz) On On 5.24 mA BLE_On_Transmit, 0 dBm output power at channel 37 (2402 MHz) On On 3.91 mA BLE_On_Transmit, 0 dBm output power at channel 39 (2480 MHz) On On 3.78 mA BLE_On_Transmit, 3 dBm output power at Channel 37 (2402 MHz) On On 4.74 mA BLE_On_Transmit, 3 dBm output power at Channel 39 (2480 MHz) On On 4.60 mA Note:  1. Sleep clock derived from external 32.768 kHz crystal specified for CL=7 pF, using the default onchip capacitance only, without using external capacitance. 2. Measurement conditions – VBAT=3.3V – VDDIO=3.3V – Temperature=25°C – Measured with FW version : BluSDK V6.1.7072 © 2019 Microchip Technology Inc. Datasheet DS70005393A-page 22 ATBTLC1000-MR110CA Electrical Characteristics Figure 8-1. ATBTLC1000-MR110CA Average Advertising Current Note:  1. The average advertising current is measured at VBAT = 3.3 V, VDDIO = 3.3 V, TX output power=0 dBm. Temperature=25°C 2. Advertisement data payload size - 31 octets 3. Advertising event type - Connectable Undirected 4. Advertising channels used in 2 channel - 37 and 38 5. Advertising channels used in 1 channel - 37 8.4 Receiver Performance The following table explains the ATBTLC1000-MR110CA BLE receiver performance. Table 8-4. ATBTLC1000-MR110CA Receiver Performance Parameter Min. Typ. Max. Unit Frequency 2,402 - 2,480 MHz Sensitivity with on-chip DC/DC -94.5 -93 - Maximum receive signal level - +5 - © 2019 Microchip Technology Inc. Datasheet dBm DS70005393A-page 23 ATBTLC1000-MR110CA Electrical Characteristics ...........continued Parameter Min. Typ. Max. CCI - 13 - ACI (N±1) - 0 - N+2 Blocker (image) - -20 - N-2 Blocker - -38 - N+3 Blocker (Adj. image) - -35 - N-3 Blocker - -43 - N±4 or greater - -45 - Intermod (N+3, N+6) - -33 - OOB (2 GHz < f < 2.399 GHz) -15 - - OOB (f < 2 GHz) -10 - - Unit dB dBm Note:  All measurements are performed at 3.6V VBAT and 25°C with tests following Bluetooth standard tests. 8.5 Transmitter Performance The following table explains the ATBTLC1000-MR110CA BLE Transmitter performance. Table 8-5. ATBTLC1000-MR110CA Transmitter Performance Parameter Min. Typ. Max. Frequency 2,402 - 2,480 Maximum output power - 3.5(1) - Minimum Output Power -55 - - In-band Spurious (N±2) - -40 - In-band Spurious (N±3) - -50 - 2nd Harmonic Pout - -45 - Frequency Deviation - ±250 - Unit MHz dBm kHz Note:  1. Country-specific transmit power settings (as per the ATBTLC1000-MR110CA Certifications) should be programmed at the host product factory to match the intended destination. Regulatory bodies prohibit exposing the transmit power settings that would configure the transmit power beyond certified limits, to the end user. This requirement needs to be taken care of via host implementation. 2. All measurements are performed at 3.6V VBAT and 25°C, with tests following the Bluetooth standard tests. © 2019 Microchip Technology Inc. Datasheet DS70005393A-page 24 ATBTLC1000-MR110CA ATBTLC1000-MR110CA Module Outline Drawing ATBTLC1000-MR110CA Module Outline Drawing The following figure illustrates the module views and dimensions. Figure 9-1. Module Dimensions (millimeters) 12.700 0.787 ±0.078 1.30 BTLC100 0_MR110CA RE V NOTE: THIS PAD MUST BE SOLDERED TO GND. 0.775 0.775 0.60 TYP 0.70 TYP 4.811 20.157 P1 P24 P1 P24 SHIELD P23 P2 P22 0.900 PITCH 12.45 P3 2.700 P21 P4 P20 P5 P19 P6 2.700 P18 11.15 P17 PCB 0.775 P7 5.746 P8 2.975 SHIELD NOT TO SCALE P9 P10 P11 P12 P14 BOTTOM VIEW SIDE VIEW SCALE: P13 2.087 ±0.078 3.425 TOP VIEW P16 3.224 P15 9. REV. 4 The following figure illustrates the footprint information of the module. © 2019 Microchip Technology Inc. Datasheet DS70005393A-page 25 ATBTLC1000-MR110CA ATBTLC1000-MR110CA Module Outline Drawing Figure 9-2. Customer PCB Footprint NOTE: THIS PAD MUST BE TIED TO GND. 12.700 .050 TYP 1.50 TYP 2.700 0.900 PITCH 2.700 5.189 4.811 5.746 TOP VIEW © 2019 Microchip Technology Inc. 12.500 SCALE: NOT TO SCALE Datasheet 09/08/16 REV. 4 ATMEL BTLC1000 MR110 MODUL E SOLDER PAD FO OTPRINT DS70005393A-page 26 ATBTLC1000-MR110CA ATBTLC1000-MR110CA Reference Schematic 10. ATBTLC1000-MR110CA Reference Schematic This chapter provides the reference schematic for the ATBTLC1000-MR110CA module. The module design information, such as module schematics, can be obtained under an NDA from Microchip. 10.1 Reference Schematics The ATBTLC1000-MR110CA module is fully self-contained. To use the module, power is supplied to VBAT and VDDIO. The following figures illustrate the reference schematic design for the 4-wire and 6wire modes. Figure 10-1. ATBTLC1000-MR110CA Reference Schematic for 4-wire Mode © 2019 Microchip Technology Inc. Datasheet DS70005393A-page 27 ATBTLC1000-MR110CA ATBTLC1000-MR110CA Reference Schematic Figure 10-2. ATBTLC1000-MR110CA Reference Schematic for 6-wire Mode © 2019 Microchip Technology Inc. Datasheet DS70005393A-page 28 ATBTLC1000-MR110CA Placement and Routing Guidelines Placement and Routing Guidelines It is critical to follow the recommendations listed below to achieve the best RF performance for the ATBTLC1000-MR110CA module. The board must have a solid ground plane. The center ground pad of the device must be soldered to the ground plane by using a 3 x 3 grid of vias (refer to 9. ATBTLC1000-MR110CA Module Outline Drawing). Each ground pin of the ATBTLC1000-MR110CA must have a ground via placed either in the pad or right next to the pad going down to the ground plane. 1. 2. 3. 4. When the module is placed on the customer PCB design, a provision for the antenna must be made. There must be nothing under the portion of the module, which contains the antenna. This means the antenna must not be placed directly on top of the customer PCB as illustrated in the following figure (a). This can be accomplished by, for example, placing the module at the edge of the board, such that the module edge with the antenna extends beyond the customer PCB edge by 6.5 mm as illustrated in figure (b). Alternatively, a cutout in the customer PCB can be provided under the antenna. The cutout must be at least 22 mm x 6.5 mm (see Figure 11-1 and Figure 11-2. If the cutout method is used, ATBTLC1000-MR110CA must be centered in the cutout. The ATBTLC1000-MR110CA must have ground vias spaced 2.5 mm apart that must be placed all around the perimeter of the cutout. No large components must be placed near the antenna. Keep large metal objects as far away as possible from the antenna, to avoid electromagnetic field blocking. Do not enclose the antenna within a metal shield. Keep any components that may radiate noise or signals within the 2.4 GHz to 2.5 GHz frequency band far away from the antenna or better yet, shield the components that are generating the noise. Any noise radiated from the customer PCB in this frequency band degrades the sensitivity of the ATBTLC1000-MR110CA module. Microchip Microchip Poor Case Microchip Figure 11-1. ATBTLC1000-MR110CA Placement Examples Microchip Best Case (b) Acceptable Case (c) Microchip Microchip Microchip 11. Microchip System Ground Plane © 2019 Microchip Technology Inc. Worst Case (a) Datasheet DS70005393A-page 29 ATBTLC1000-MR110CA Placement and Routing Guidelines Figure 11-2. No PCB/GND Cut Out Area No PCB ar ea 22 mm 6.5 mm Module Device 11.1 Power and Ground Dedicate one layer as a ground plane. Make sure that this ground plane does not get broken up by routes. Power can route on all layers except the ground layer. Power supply routes should be heavy copper fill planes to ensure the lowest possible inductance. The power pins of the module should have a via directly to the power plane as close to the pin as possible. Decoupling capacitors should have a via right next to the capacitor pin and this via should go directly down to the power plane – that is to say, the capacitor should not route to the power plane through a long trace. The ground side of the decoupling capacitor should have a via right next to the pad which goes directly down to the ground plane. Each decoupling capacitor should have its own via directly to the ground plane and directly to the power plane right next to the pad. The decoupling capacitors should be placed as close to the pin that it is filtering as possible. 11.2 Interferers One of the biggest problems with RF receivers is poor performance due to interferers on the board radiating noise into the antenna or coupling into the RF traces going to input LNA. Care must be taken to make sure that no noisy circuit is placed anywhere near the antenna or the RF traces. All noise generating circuits must also be shielded, so they do not radiate noise that is picked up by the antenna. Also, make sure that no traces route underneath any of the RF traces from the antenna to the ATBTLC1000-MR110CA input. This applies to all layers. Even if there is a ground plane on a layer between the RF route and another signal, the ground return current will flow on the ground plane and couple into the RF traces. © 2019 Microchip Technology Inc. Datasheet DS70005393A-page 30 ATBTLC1000-MR110CA Reflow Profile Information 12. Reflow Profile Information This chapter provides guidelines for the reflow processes in soldering the ATBTLC1000-MR110CA to the customer’s design. 12.1 Storage Condition 12.1.1 Moisture Barrier Bag Before Opening A moisture barrier bag must be stored in a temperature of less than 30°C with humidity under 85% RH. The calculated shelf life for the dry-packed product shall be 12 months from the date the bag is sealed. 12.1.2 Moisture Barrier Bag Open Humidity indicator cards must be blue, 10% • SIPs need to be baked for 8 hours at 125°C 12.5 Module Assembly Considerations The ATBTLC1000-MR110CA modules are assembled with an EMI shield to ensure compliance with EMI emission and immunity rules. The EMI shield is made of a tin-plated steel (SPTE) and is not hermetically sealed. Solutions like IPA and similar solvents can be used to clean the ATBTLC1000-MR110CA module. However, cleaning solutions containing acid must never be used on the module. The Microchip ATBTLC1000-MR110CA modules are manufactured without any conformal coating applied. It is the customer’s responsibility if a conformal coating is specified and applied to the ATBTLC1000-MR110CA module. © 2019 Microchip Technology Inc. Datasheet DS70005393A-page 32 ATBTLC1000-MR110CA Regulatory Approval 13. Regulatory Approval The ATBTLC1000-MR110CA has received the regulatory approval for the following countries: • United States/FCC ID: 2ADHKBTLC1000 • Canada/ISED – IC: 20266-BTLC1000MR – HVIN: ATBTLC1000-MR110CA – PMN: ATBTLC1000-MR110CA • Japan/MIC: 007-AD0208 13.1 United States (FCC) The ATBTLC1000-MR110CA module has received Federal Communications Commission (FCC) CFR47 Telecommunications, Part 15 Subpart C “Intentional Radiators” modular approval in accordance with Part 15.212 Modular Transmitter approval. Modular approval allows the end user to integrate the ATBTLC1000-MR110CA module into a finished product without obtaining subsequent and separate FCC approvals for intentional radiation, provided no changes or modifications are made to the module circuitry. Changes or modifications could void the user’s authority to operate the equipment. The user must comply with all of the instructions provided by the Grantee, which indicate the installation and/or operating conditions necessary for compliance. The finished product is required to comply with all applicable FCC equipment authorization regulations, requirements and equipment functions that are not associated with the transmitter module portion. For example, compliance must be demonstrated: to regulations for other transmitter components within a host product; to requirements for unintentional radiators (Part 15 Subpart B), such as digital devices, computer peripherals, radio receivers, etc.; and to additional authorization requirements for the nontransmitter functions on the transmitter module (i.e., Verification or Declaration of Conformity) as ® appropriate (e.g., Bluetooth and Wi-Fi transmitter modules may also contain digital logic functions). 13.1.1 Labeling And User Information Requirements The ATBTLC1000-MR110CA module has been labeled with its own FCC identifier number, and if the FCC ID is not visible when the module is installed inside another device, then the outside of the finished product into which the module is installed must display a label referring to the enclosed module. This exterior label should use the following wording: For the ATBTLC1000-MR110CA: Contains Transmitter Module FCC ID: 2ADHKBTLC1000 or Contains FCC ID: 2ADHKBTLC1000 This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation The user’s manual for the product should include the following statement: © 2019 Microchip Technology Inc. Datasheet DS70005393A-page 33 ATBTLC1000-MR110CA Regulatory Approval This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy, and if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • Reorient or relocate the receiving antenna • Increase the separation between the equipment and receiver • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected • Consult the dealer or an experienced radio/TV technician for help Additional information on labeling and user information requirements for Part 15 devices can be found in KDB Publication 784748, which is available at the FCC Office of Engineering and Technology (OET) Laboratory Division Knowledge Database (KDB) https://apps.fcc.gov/oetcf/kdb/index.cfm 13.1.2 RF Exposure All transmitters regulated by FCC must comply with RF exposure requirements. KDB 447498 General RF Exposure Guidance provides guidance in determining whether proposed or existing transmitting facilities, operations or devices comply with limits for human exposure to Radio Frequency (RF) fields adopted by the Federal Communications Commission (FCC). From the FCC Grant: Output power listed is conducted. The antenna(s) used with this transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. 13.1.3 Helpful Websites Federal Communications Commission (FCC): http://www.fcc.gov FCC Office of Engineering and Technology (OET) Laboratory Division Knowledge Database (KDB): https://apps.fcc.gov/oetcf/kdb/index.cfm 13.2 Canada (ISED) The ATBTLC1000-MR110CA module has been certified for use in Canada under Innovation, Science, and Economic Development (ISED, formerly Industry Canada) Radio Standards Procedure (RSP) RSP-100, Radio Standards Specification (RSS) RSS-Gen and RSS-247. Modular approval permits the installation of a module in a host device without the need to recertify the device. 13.2.1 Labeling and User Information Requirements Labeling Requirements (from RSP-100 - Issue 10, Section 3): The host device shall be properly labeled to identify the module within the host device. The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host device. Therefore, the host product must be labeled to display the Innovation, Science and Economic Development Canada certification number of the module, preceded by the word “Contains” or similar wording expressing the same meaning, as follows: © 2019 Microchip Technology Inc. Datasheet DS70005393A-page 34 ATBTLC1000-MR110CA Regulatory Approval For the ATBTLC1000-MR110CA: Contains IC: 20266-BTLC1000MR User Manual Notice for License-Exempt Radio Apparatus (from Section 8.4 RSS-Gen, Issue 5, April 2018): User manuals for license-exempt radio apparatus shall contain the following or equivalent notice in a conspicuous location in the user manual or alternatively on the device or both: This device contains licence-exempt transmitter(s)/receiver(s) that comply with Innovation, Science and Economic Development Canada’s licence-exempt RSS(s). Operation is subject to the following two conditions: 1. This device may not cause interference. 2. This device must accept any interference, including interference that may cause undesired operation of the device. L’émetteur/récepteur exempt de licence contenu dans le présent appareil est conforme aux CNR d’Innovation, Sciences et Développement économique Canada applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux deux conditions suivantes: 1. L’appareil ne doit pas produire de brouillage 2. L’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d’en compromettre le fonctionnement. See RSS-GEN Section 8.4(http://www.ic.gc.ca/eic/site/smt-gst.nsf/fra/sf08449.html#s8). Transmitter Antenna (From Section 6.8 RSS-GEN, Issue 5, April 2018): User manuals, for transmitters shall display the following notice in a conspicuous location: This radio transmitter [IC: 20266-BTLC1000MR] has been approved by Innovation, Science and Economic Development Canada to operate with the antenna types listed below, with the maximum permissible gain indicated. Antenna types not included in this list that have a gain greater than the maximum gain indicated for any type listed are strictly prohibited for use with this device. Le présent émetteur radio [IC: 20266-BTLC1000MR] a été approuvé par Innovation, Sciences et Développement économique Canada pour fonctionner avec les types d'antenne énumérés ci‑dessous et ayant un gain admissible maximal. Les types d'antenne non inclus dans cette liste, et dont le gain est supérieur au gain maximal indiqué pour tout type figurant sur la liste, sont strictement interdits pour l'exploitation de l'émetteur. Immediately following the above notice, the manufacturer shall provide a list of all antenna types which can be used with the transmitter, indicating the maximum permissible antenna gain (in dBi) and the required impedance for each antenna type. 13.2.2 RF Exposure All transmitters regulated by Innovation, Science and Economic Development Canada (ISED) must comply with RF exposure requirements listed in RSS-102 - Radio Frequency (RF) Exposure Compliance of Radiocommunication Apparatus (All Frequency Bands). This transmitter is restricted for use with a specific antenna tested in this application for certification, and must not be co-located or operating in conjunction with any other antenna or transmitters within a host device, except in accordance with Canada multi-transmitter product procedures. © 2019 Microchip Technology Inc. Datasheet DS70005393A-page 35 ATBTLC1000-MR110CA Regulatory Approval The device operates at an output power level which is within ISED SAR test exemption limits at any user distance. 13.2.3 Helpful Websites Innovation, Science and Economic Development Canada (ISED): http://www.ic.gc.ca/ 13.3 Japan The ATBTLC1000-MR110CA module has received type certification and is labeled with its own technical conformity mark and certification number as required to conform to the technical standards regulated by the Ministry of Internal Affairs and Communications (MIC) of Japan pursuant to the Radio Act of Japan. Integration of this module into a final product does not require additional radio certification provided installation instructions are followed and no modifications of the module are allowed. Additional testing may be required: • If the host product is subject to electrical appliance safety (for example, powered from an AC mains), the host product may require Product Safety Electrical Appliance and Material (PSE) testing. The integrator must contact their conformance laboratory to determine if this testing is required. • There is a voluntary Electromagnetic Compatibility (EMC) test for the host product administered by VCCI: http://www.vcci.jp/vcci_e/index.html. 13.3.1 Labeling and User Information Requirements The label on the final product which contains the ATBTLC1000-MR110CA module must follow Japan marking requirements. The integrator of the module must refer to the labeling requirements for Japan available at the Ministry of Internal Affairs and Communications (MIC) website. On the ATBTLC1000-MR110CA module, due to a limited module size, the technical conformity logo and ID is displayed in the data sheet and/or packaging label and cannot be displayed on the module label. The final product in which this module is being used must have a label referring to the type certified module inside: 007-AD0208 13.3.2 Helpful Websites • Ministry of Internal Affairs and Communications (MIC): http://www.tele.soumu.go.jp/e/index.html. • Association of Radio Industries and Businesses (ARIB): http://www.arib.or.jp/english/. 13.4 Other Regulatory Information • For information about other countries' jurisdictions not covered here, refer to http:// www.microchip.com/design-centers/wireless-connectivity © 2019 Microchip Technology Inc. Datasheet DS70005393A-page 36 ATBTLC1000-MR110CA Regulatory Approval • Should other regulatory jurisdiction certifications be required by the customer, or the customer needs to recertify the module for other reasons, contact Microchip for the required utilities and documentation. © 2019 Microchip Technology Inc. Datasheet DS70005393A-page 37 ATBTLC1000-MR110CA Reference Documentation 14. Reference Documentation Microchip offers a set of collateral documentation to ease integration and device ramp. The following list of documents available on the Microchip website or integrated into development tools. Table 14-1. Reference Documents Title Content ATBTLC1000 SOC Datasheet Data sheet for the ATBTLC1000 SOC contained on this module. ATBTLC1000 ATBLTC1000 hardware design guide with references for placement and routing, BluSDK: external RTC, restrictions on power states and type of information. Hardware Design Guidelines ATBTLC1000 This package contains the software development kit and all the necessary BluSDK Release documentation including getting started guides for interacting with different hardware Package devices, device drivers, and API call references. ATBTLC1000 Platform Porting Guide This document guides the user to port the Application Peripheral Interface (API) into a new platform. ATBTLC1000 BluSDK BLE API SW Development Guide This user guide details the functional description of Bluetooth Low Energy (BLE) Application Peripheral Interface (API) programming model. This also provides the example code to configure an API for Generic Access Profile (GAP), Generic Attribute (GATT) Profile, and other services using the ATBTLC1000. For a complete list of development support tools and documentation, visit http://www.microchip.com, or contact the nearest Microchip field representative. © 2019 Microchip Technology Inc. Datasheet DS70005393A-page 38 ATBTLC1000-MR110CA Document Revision History 15. Document Revision History Revision Date Section A 04/2019 Document Description • Change of document style. • Change the name to incorporate all the ATBTLC1000 devices. • New Microchip document number, DS70005393. • Various editorial changes to match the new document style. Rev E - 08/2016 Section Changes Document • Replaced KHz with kHz • Details in Errata section incorporated into the Electrical Characteristics section. Description • Revised product Description content. Pinout Information • Correct module pad width. Electrical Specification • Revised Note 2 Vain in Absolute Max Power Ratings table. • Revised VDDIO Maximum Voltage value in Max Power Ratings table. • Updated RTC Example drawings. – Revised Current values in Recommended Operating Conditions table. Characteristics • Revised Receive Current rate in Devices States table. • Revised Receive performance number in Receiver Performance table. • Added tolerance to Frequency Dev in Transmitter Performance table. Reflow Profile Information • Added Module Assembly Considerations section. © 2019 Microchip Technology Inc. Datasheet DS70005393A-page 39 ATBTLC1000-MR110CA Document Revision History Rev D – 03/2016 Section Changes Package Information • Corrected package table ground pad size in Module Information table. Pinout Information • Updated Module POD figure. Reflow Profile Information • Corrected Reflow recurrence iterations. Errata • Corrected errata to point to correct table (Module Device States). Rev C – 12/2015 Section Changes Document • Added clearer diagrams. Ordering Information • Corrected Package size value in Ordering Information table. Pinout Information • Updated Module POD figure. Characteristics • Updated performance numbers. Schematic Information • Revised Schematic content. • Added UART Flow control. Certification • Added Agency Certification section. Reflow Profile • Added Reflow Profile section. Errata • Added Errata Rev B – 07/2015 Section Document Changes • Updated For Rev B Silicon Rev A – 04/2015 Section Changes Document Initial Release © 2019 Microchip Technology Inc. Datasheet DS70005393A-page 40 ATBTLC1000-MR110CA The Microchip Web Site Microchip provides online support via our web site at http://www.microchip.com/. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives Customer Change Notification Service Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at http://www.microchip.com/. Under “Support”, click on “Customer Change Notification” and follow the registration instructions. Customer Support Users of Microchip products can receive assistance through several channels: • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Customers should contact their distributor, representative or Field Application Engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://www.microchip.com/support Microchip Devices Code Protection Feature Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. © 2019 Microchip Technology Inc. Datasheet DS70005393A-page 41 ATBTLC1000-MR110CA • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Legal Notice Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. 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Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2019 Microchip Technology Inc. Datasheet DS70005393A-page 42 ATBTLC1000-MR110CA © 2019, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 978-1-5224-4429-9 Quality Management System Certified by DNV ISO/TS 16949 Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California ® ® and India. The Company’s quality system processes and procedures are for its PIC MCUs and dsPIC ® DSCs, KEELOQ code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. © 2019 Microchip Technology Inc. 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