ATECC508A
ATECC508A Summary Data Sheet
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Cryptographic Co-processor with Secure Hardware-Based Key Storage
Performs High-Speed Public Key (PKI) Algorithms
– ECDSA: FIPS186-3 Elliptic Curve Digital Signature Algorithm
– ECDH: FIPS SP800-56A Elliptic Curve Diffie-Hellman Algorithm
NIST Standard P256 Elliptic Curve Support
SHA-256 Hash Algorithm with HMAC Option
Host and Client Operations
256-bit Key Length
Storage for up to 16 Keys
Two High-Endurance Monotonic Counters
Guaranteed Unique 72-bit Serial Number
Internal High-Quality FIPS Random Number Generator (RNG)
10 Kb EEPROM Memory for Keys, Certificates, and Data
Multiple Options for Consumption Logging and One-Time Write Information
Intrusion Latch for External Tamper Switch or Power-on Chip Enablement. Multiple I/O Options:
– High-speed Single Pin Interface, with One GPIO Pin
– 1 MHz Standard I2C Interface
2.0V to 5.5V Supply Voltage Range
1.8V to 5.5V IO levels
VCC – 0.4
Sleep Current
ISLEEP
—
30
150
nA
When device is in sleep mode, VCC ≤ 3.6V,
VSDA and VSCL < 0.4V or > VCC – 0.4, TA ≤
+55°C
—
—
2
µA
When device is in sleep mode.
Output Low Voltage
VOL
—
—
0.4
V
When device is in active mode,
VCC = 2.5 – 5.5V
Output Low Current
IOL
—
—
4
mA
When device is in active mode,
VCC = 2.5 – 5.5V, VOL = 0.4V
Theta JA
ƟJA
—
166
—
°C/W SOIC (SSH)
—
173
—
°C/W UDFN (MAH)
—
146
—
°C/W RBH
VIH and VIL Specifications
The input levels of the device will vary dependent on the mode and voltage of the device. The input
voltage thresholds when in sleep or idle mode are dependent on the VCC level as shown in Figure 2-4.
When in sleep or idle mode the TTLenable bit has no effect.
When the device is active (i.e. not in sleep or idle mode), the input voltage thresholds are different
depending upon the state of TTLenable (bit 1) within the ChipMode byte in the Configuration zone of the
EEPROM. If the voltage supplied to the VCC pin of the ATECC508A is different than the system voltage to
which the input pull-up resistor is connected, then the system designer may choose to set TTLenable to
zero, which enables a fixed input threshold shown by curves VIL_ACT and VIH_ACT in Figure 2-4. Table
2-6 which applies only when the device is active, presents the guaranteed levels of operation when
operating in this mode.
Table 2-6. VIL, VIH on All I/O Interfaces (TTLenable = 0)
Parameter
Symbol Min Typ
Max
Unit Conditions
Input Low Voltage
VIL
-0.5
0.5
V
When device is active and TTLenable bit in configuration
memory is zero; otherwise see above.
Input High Voltage
VIH
1.5
VCC + 0.5
V
When device is active and TTLenable bit in configuration
memory is zero; otherwise see above.
© 2017 Microchip Technology Inc.
Datasheet Summary
DS20005928A-page 12
ATECC508A
Electrical Characteristics
Figure 2-4. VIH and VIL in Sleep and Idle Mode or When TTLenable = 0 on All I/O Interfaces
1.6
1.4
1.2
VIN (V)
1
0.8
0.6
0.4
0.2
VIH_sleep
VIL_sleep
VIH_Act
VIL_Act
0
2
2.5
3
3.5
4
4.5
5
5.5
VCC (V)
When a common voltage is used for the ATECC508A VCC pin and the input pull-up resistor, then the
TTLenable bit should be set to a one, which permits the input thresholds to track the supply as shown in
Figure 2-5.
Figure 2-5. VIH and VIL When Active and TTLenable = 1 on All I/O Interfaces
2.9
2.4
VIN (V)
1.9
1.4
0.9
VIH_Act
VIL_Act
0.4
2
2.5
3
3.5
4
4.5
5
5.5
VCC (V)
© 2017 Microchip Technology Inc.
Datasheet Summary
DS20005928A-page 13
ATECC508A
Compatibility
3.
Compatibility
3.1
Microchip ATSHA204A
ATECC508A is fully compatible with the ATSHA204 and ATSHA204A devices. If properly configured, it
can be used in all situations where the ATSHA204 or ATSHA204A is currently employed. Because the
configuration zone is larger, the personalization procedures for the device must be updated when
personalizing the ATSHA204 or ATSHA204A. For proper compatibility, care should be taken with the
KeyType, ReqRandom, and ReqAuth slots containing keys that are used with ATSHA204 or ATSHA204A
sequences.
3.2
Microchip ATECC108A
ATECC508A is designed to be fully compatible with the ATECC108 and ATECC108A devices. If properly
configured, it can be used in all situations where ATECC108 is currently employed. In many situations,
the ATECC508A can also be used in an ATECC108 application without change. The new revisions
provide significant advantages as outlined below:
•
Additional Features in ATECC508A vs. ATECC108A
– ECDH Command
–
–
•
High Endurance Monotonic Counters
Public Key Invalidation via Certificate
Minor Changes
– The GenDig command verifies that a random nonce is used when generating transport keys
–
The Info command DevRev mode now returns 0x1005 for ATECC108A and 0x5000 for
ATECC508A. This value should not be used in the software as it will vary with each minor
revision.
© 2017 Microchip Technology Inc.
Datasheet Summary
DS20005928A-page 14
ATECC508A
Package Marking Information
4.
Package Marking Information
As part of Microchip’s overall security features, the part mark for all crypto devices is intentionally vague.
The marking on the top of the package does not provide any information as to the actual device type or
the manufacturer of the device. The alphanumeric code on the package provides manufacturing
information and will vary with the assembly lot. The packaging mark should not be used as part of any
incoming inspection procedure.
© 2017 Microchip Technology Inc.
Datasheet Summary
DS20005928A-page 15
ATECC508A
Package Drawings
R
5.
Package Drawings
5.1
8-lead SOIC
8-Lead Plastic Small Outline - Narrow, 3.90 mm (.150 In.) Body [SOIC]
Atmel Legacy
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2X
0.10 C A–B
D
A
D
NOTE 5
N
E
2
E1
2
E1
E
NOTE 1
2
1
e
B
NOTE 5
NX b
0.25
C A–B D
TOP VIEW
0.10 C
C
A A2
SEATING
PLANE
8X
A1
SIDE VIEW
0.10 C
h
R0.13
h
R0.13
H
SEE VIEW C
VIEW A–A
0.23
L
(L1)
VIEW C
Microchip Technology Drawing No. C04-057-Atmel Rev D Sheet 1 of 2
© 2017 Microchip Technology Inc.
© 2017 Microchip Technology Inc.
Datasheet Summary
DS20005928A-page 16
R
ATECC508A
Package Drawings
8-Lead Plastic Small Outline - Narrow, 3.90 mm (.150 In.) Body [SOIC]
Atmel Legacy
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
Number of Pins
N
e
Pitch
Overall Height
A
Molded Package Thickness
A2
§
Standoff
A1
Overall Width
E
Molded Package Width
E1
Overall Length
D
Chamfer (Optional)
h
Foot Length
L
Footprint
L1
Foot Angle
c
Lead Thickness
b
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
MIN
1.25
0.10
0.25
0.40
0°
0.17
0.31
5°
5°
MILLIMETERS
NOM
8
1.27 BSC
6.00 BSC
3.90 BSC
4.90 BSC
1.04 REF
-
MAX
1.75
0.25
0.50
1.27
8°
0.25
0.51
15°
15°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed 0.15mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
5. Datums A & B to be determined at Datum H.
Microchip Technology Drawing No. C04-057-OA Rev D Sheet 2 of 2
© 2017 Microchip Technology Inc.
© 2017 Microchip Technology Inc.
Datasheet Summary
DS20005928A-page 17
R
ATECC508A
Package Drawings
8-Lead Plastic Small Outline - Narrow, 3.90 mm (.150 In.) Body [SOIC]
Atmel Legacy
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
SILK SCREEN
C
Y1
X1
E
RECOMMENDED LAND PATTERN
Units
Dimension Limits
Contact Pitch
E
Contact Pad Spacing
C
Contact Pad Width (X8)
X1
Contact Pad Length (X8)
Y1
MIN
MILLIMETERS
NOM
1.27 BSC
5.40
MAX
0.60
1.55
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-2057-M6B Rev B
© 2017 Microchip Technology Inc.
© 2017 Microchip Technology Inc.
Datasheet Summary
DS20005928A-page 18
ATECC508A
Package Drawings
5.2
8-pad UDFN
8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (Q4B) - 2x3 mm Body [UDFN]
Atmel Legacy YNZ Package
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
N
(DATUM A)
E
(DATUM B)
NOTE 1
2X
0.10 C
1
2X
0.10 C
C
SEATING
PLANE
2
TOP VIEW
A1
0.10 C
A
8X
(A3)
0.10
SIDE VIEW
0.08 C
C A B
D2
e
2
1 2
0.10
E2
C A B
K
N
L
8X b
e
BOTTOM VIEW
0.10
0.05
C A B
C
Microchip Technology Drawing C04-21355-Q4B Rev A Sheet 1 of 2
© 2017 Microchip Technology Inc.
© 2017 Microchip Technology Inc.
Datasheet Summary
DS20005928A-page 19
ATECC508A
Package Drawings
8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (Q4B) - 2x3 mm Body [UDFN]
Atmel Legacy YNZ Package
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
Number of Terminals
N
e
Pitch
A
Overall Height
Standoff
A1
Terminal Thickness
A3
Overall Length
D
Exposed Pad Length
D2
Overall Width
E
Exposed Pad Width
E2
b
Terminal Width
Terminal Length
L
Terminal-to-Exposed-Pad
K
MIN
0.50
0.00
1.40
1.20
0.18
0.35
0.20
MILLIMETERS
NOM
8
0.50 BSC
0.55
0.02
0.152 REF
2.00 BSC
1.50
3.00 BSC
1.30
0.25
0.40
-
MAX
0.60
0.05
1.60
1.40
0.30
0.45
-
Notes :
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-21355-Q4B Rev A Sheet 2 of 2
© 2017 Microchip Technology Inc.
© 2017 Microchip Technology Inc.
Datasheet Summary
DS20005928A-page 20
ATECC508A
Package Drawings
8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (Q4B) - 2x3 mm Body [UDFN]
Atmel Legacy YNZ Package
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
X2
EV
G2
8
ØV
C
Y2
G1
Y1
SILK SCREEN
1
2
X1
E
RECOMMENDED LAND PATTERN
Units
Dimension Limits
E
Contact Pitch
Optional Center Pad Width
X2
Optional Center Pad Length
Y2
Contact Pad Spacing
C
Contact Pad Width (X8)
X1
Contact Pad Length (X8)
Y1
Contact Pad to Center Pad (X8)
G1
Contact Pad to Contact Pad (X6)
G2
Thermal Via Diameter
V
Thermal Via Pitch
EV
MIN
MILLIMETERS
NOM
0.50 BSC
MAX
1.60
1.40
2.90
0.30
0.85
0.20
0.33
0.30
1.00
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
Microchip Technology Drawing C04-21355-Q4B Rev A
© 2017 Microchip Technology Inc.
© 2017 Microchip Technology Inc.
Datasheet Summary
DS20005928A-page 21
ATECC508A
Package Drawings
5.3
3-lead CONTACT
3-Lead Contact Package (LAB) - 6.54x2.5 mm Body [Contact]
Atmel Legacy Global Package Code RHB
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
(DATUM A)
(DATUM B)
E
NOTE 1
2X
0.10 C
2X
0.10 C
TOP VIEW
0.10 C
C
A1
A
SEATING
PLANE
3X
0.08 C
SIDE VIEW
f
(K)
(K)
NOTE 1
3X L
1
2
3
g
3X b
0.10
e
C A B
BOTTOM VIEW
Microchip Technology Drawing C04-21303 Rev A Sheet 1 of 2
© 2017 Microchip Technology Inc.
© 2017 Microchip Technology Inc.
Datasheet Summary
DS20005928A-page 22
ATECC508A
Package Drawings
3-Lead Contact Package (LAB) - 6.54x2.5 mm Body [Contact]
Atmel Legacy Global Package Code RHB
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
Number of Terminals
N
e
Pitch
Overall Height
A
Standoff
A1
Overall Length
D
Overall Width
E
b
Terminal Width
Terminal Length
L
Terminal-to-Terminal Spacing
K
Package Edge to Terminal Edge
f
g
Package Edge to Terminal Edge
MIN
0.45
0.00
1.60
2.10
0.30
0.05
MILLIMETERS
NOM
3
2.00 BSC
0.50
0.02
6.50 BSC
2.50 BSC
1.70
2.20
0.30 REF
0.40
0.15
MAX
0.55
0.05
1.80
2.30
0.50
0.25
Notes :
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-21303 Rev A Sheet 2 of 2
© 2017 Microchip Technology Inc.
© 2017 Microchip Technology Inc.
Datasheet Summary
DS20005928A-page 23
ATECC508A
Revision History
6.
Revision History
Revision A (December 2017)
Original release of the document
This version replaces Atmel Document Revision 8923FX from 03.08.2016
© 2017 Microchip Technology Inc.
Datasheet Summary
DS20005928A-page 24
ATECC508A
The Microchip Web Site
Microchip provides online support via our web site at http://www.microchip.com/. This web site is used as
a means to make files and information easily available to customers. Accessible by using your favorite
Internet browser, the web site contains the following information:
•
•
•
Product Support – Data sheets and errata, application notes and sample programs, design
resources, user’s guides and hardware support documents, latest software releases and archived
software
General Technical Support – Frequently Asked Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant program member listing
Business of Microchip – Product selector and ordering guides, latest Microchip press releases,
listing of seminars and events, listings of Microchip sales offices, distributors and factory
representatives
Customer Change Notification Service
Microchip’s customer notification service helps keep customers current on Microchip products.
Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata
related to a specified product family or development tool of interest.
To register, access the Microchip web site at http://www.microchip.com/. Under “Support”, click on
“Customer Change Notification” and follow the registration instructions.
Customer Support
Users of Microchip products can receive assistance through several channels:
•
•
•
•
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Customers should contact their distributor, representative or Field Application Engineer (FAE) for support.
Local sales offices are also available to help customers. A listing of sales offices and locations is included
in the back of this document.
Technical support is available through the web site at: http://www.microchip.com/support
© 2017 Microchip Technology Inc.
Datasheet Summary
DS20005928A-page 25
ATECC508A
Product Identification System
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Device:
ATECC508A: Cryptographic Co-processor with Secure Hardwarebased Key Storage
Package Options
SSH
= 8S1, 8-Lead (0.150” Wide
Body), Plastic Gull Wing Small
Outline (JEDEC SOIC)
MAH
= 8MA2, 8-Pad 2 x 3 x 0.6 mm
Body, Thermally Enhanced
Plastic Ultra Thin Dual Flat NoLead Package (UDFN)
RBH
= 3RB, 3-Lead 2.5 x 6.5 mm
Body, 2.0 mm pitch, CONTACT
Package (Sawn).
CZ
= Single Wire Interface
DA
= I2C Interface
B
= Tube
T
= Large Reel (Size varies by
package type)
S
= Small Reel (Only available for
MAH)
I/O Type
Tape and Reel Options
Examples:
•
ATECC508A-SSHCZ-T: Single-Wire, Tape and Reel, 4,000 per Reel, 8-Lead SOIC package
•
ATECC508A-SSHCZ-B: Single-Wire, Tube, 100 per Tube, 8-Lead SOIC package
•
ATECC508A-SSHDA-T: I2C, Tape and Reel, 4,000 per Reel, 8-Lead SOIC package
•
ATECC508A-SSHDA-B: I2C, Tube, 100 per Tube, 8-Lead SOIC package
•
ATECC508A-MAHCZ-T: Single-Wire, Tape and Reel, 15,000 per Reel, 8-Pad UDFN package
•
ATECC508A-MAHDA-T: I2C, Tape and Reel, 15,000 per Reel, 8-Pad UDFN package
•
ATECC508A-MAHCZ-S: Single-Wire, Tape and Reel, 3,000 per Reel, 8-Pad UDFN package
•
ATECC508A-MAHDA-S: I2C, Tape and Reel, 3,000 per Reel, 8-Pad UDFN package
•
ATECC508A-RBHCZ-T: Single-Wire, Tape and Reel, 5,000 per Reel, 3-Lead Contact Package
•
ATECC508A-RBHCZ-B: Single-Wire, Tube, 56 per Tube, 3-Lead Contact Package
Note:
1. Tape and Reel identifier only appears in the catalog part number description. This identifier is used
for ordering purposes and is not printed on the device package. Check with your Microchip Sales
Office for package availability with the Tape and Reel option.
© 2017 Microchip Technology Inc.
Datasheet Summary
DS20005928A-page 26
ATECC508A
2.
Small form-factor packaging options may be available. Please check http://www.microchip.com/
packaging for small-form factor package availability, or contact your local Sales Office.
Microchip Devices Code Protection Feature
Note the following details of the code protection feature on Microchip devices:
•
•
•
•
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the
market today, when used in the intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of
these methods, to our knowledge, require using the Microchip products in a manner outside the
operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is
engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their
code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the
code protection features of our products. Attempts to break Microchip’s code protection feature may be a
violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software
or other copyrighted work, you may have a right to sue for relief under that Act.
Legal Notice
Information contained in this publication regarding device applications and the like is provided only for
your convenience and may be superseded by updates. It is your responsibility to ensure that your
application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY
OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS
CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE.
Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life
support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend,
indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting
from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual
property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate, AVR, AVR logo, AVR Freaks, BeaconThings,
BitCloud, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq, KeeLoq logo,
Kleer, LANCheck, LINK MD, maXStylus, maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch, RightTouch, SAM-BA,
SpyNIC, SST, SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered trademarks of
Microchip Technology Incorporated in the U.S.A. and other countries.
ClockWorks, The Embedded Control Solutions Company, EtherSynch, Hyper Speed Control, HyperLight
Load, IntelliMOS, mTouch, Precision Edge, and Quiet-Wire are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
© 2017 Microchip Technology Inc.
Datasheet Summary
DS20005928A-page 27
ATECC508A
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom,
chipKIT, chipKIT logo, CodeGuard, CryptoAuthentication, CryptoCompanion, CryptoController,
dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, Mindi, MiWi,
motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient
Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, QMatrix, RightTouch logo, REAL
ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are
trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their respective companies.
©
2017, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.
ISBN: 978-1-5224-2485-7
Quality Management System Certified by DNV
ISO/TS 16949
Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer
fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California
®
®
and India. The Company’s quality system processes and procedures are for its PIC MCUs and dsPIC
®
DSCs, KEELOQ code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design and manufacture of development
systems is ISO 9001:2000 certified.
© 2017 Microchip Technology Inc.
Datasheet Summary
DS20005928A-page 28
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Austin, TX
Tel: 512-257-3370
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Novi, MI
Tel: 248-848-4000
Houston, TX
Tel: 281-894-5983
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Tel: 317-536-2380
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Tel: 951-273-7800
Raleigh, NC
Tel: 919-844-7510
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Tel: 408-436-4270
Canada - Toronto
Tel: 905-695-1980
Fax: 905-695-2078
Australia - Sydney
Tel: 61-2-9868-6733
China - Beijing
Tel: 86-10-8569-7000
China - Chengdu
Tel: 86-28-8665-5511
China - Chongqing
Tel: 86-23-8980-9588
China - Dongguan
Tel: 86-769-8702-9880
China - Guangzhou
Tel: 86-20-8755-8029
China - Hangzhou
Tel: 86-571-8792-8115
China - Hong Kong SAR
Tel: 852-2943-5100
China - Nanjing
Tel: 86-25-8473-2460
China - Qingdao
Tel: 86-532-8502-7355
China - Shanghai
Tel: 86-21-3326-8000
China - Shenyang
Tel: 86-24-2334-2829
China - Shenzhen
Tel: 86-755-8864-2200
China - Suzhou
Tel: 86-186-6233-1526
China - Wuhan
Tel: 86-27-5980-5300
China - Xian
Tel: 86-29-8833-7252
China - Xiamen
Tel: 86-592-2388138
China - Zhuhai
Tel: 86-756-3210040
India - Bangalore
Tel: 91-80-3090-4444
India - New Delhi
Tel: 91-11-4160-8631
India - Pune
Tel: 91-20-4121-0141
Japan - Osaka
Tel: 81-6-6152-7160
Japan - Tokyo
Tel: 81-3-6880- 3770
Korea - Daegu
Tel: 82-53-744-4301
Korea - Seoul
Tel: 82-2-554-7200
Malaysia - Kuala Lumpur
Tel: 60-3-7651-7906
Malaysia - Penang
Tel: 60-4-227-8870
Philippines - Manila
Tel: 63-2-634-9065
Singapore
Tel: 65-6334-8870
Taiwan - Hsin Chu
Tel: 886-3-577-8366
Taiwan - Kaohsiung
Tel: 886-7-213-7830
Taiwan - Taipei
Tel: 886-2-2508-8600
Thailand - Bangkok
Tel: 66-2-694-1351
Vietnam - Ho Chi Minh
Tel: 84-28-5448-2100
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
Finland - Espoo
Tel: 358-9-4520-820
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Germany - Garching
Tel: 49-8931-9700
Germany - Haan
Tel: 49-2129-3766400
Germany - Heilbronn
Tel: 49-7131-67-3636
Germany - Karlsruhe
Tel: 49-721-625370
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Germany - Rosenheim
Tel: 49-8031-354-560
Israel - Ra’anana
Tel: 972-9-744-7705
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Italy - Padova
Tel: 39-049-7625286
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Norway - Trondheim
Tel: 47-7289-7561
Poland - Warsaw
Tel: 48-22-3325737
Romania - Bucharest
Tel: 40-21-407-87-50
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Gothenberg
Tel: 46-31-704-60-40
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
© 2017 Microchip Technology Inc.
Datasheet Summary
DS20005928A-page 29
工商网监
湘ICP备2023018690号
