This is a summary document. A
complete document is available under
NDA. For more information, please
contact your local Microchip sales
office.
ATECC608B
CryptoAuthentication™ Device Summary Data Sheet
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
Cryptographic Co-Processor with Secure Hardware-Based Key Storage:
– Protected storage for up to 16 keys, certificates or data
Hardware Support for Asymmetric Sign, Verify, Key Agreement:
– ECDSA: FIPS186-3 Elliptic Curve Digital Signature
– ECDH: FIPS SP800-56A Elliptic Curve Diffie-Hellman
– NIST Standard P256 Elliptic Curve Support
Hardware Support for Symmetric Algorithms:
– SHA-256 & HMAC Hash including off-chip context save/restore
– AES-128: Encrypt/Decrypt, Galois Field Multiply for GCM
Networking Key Management Support:
– Turnkey PRF/HKDF calculation for TLS 1.2 & 1.3
– Ephemeral key generation and key agreement in SRAM
– Small message encryption with keys entirely protected
Secure Boot Support:
– Full ECDSA code signature validation, optional stored digest/signature
– Optional communication key disablement prior to secure boot
– Encryption/Authentication for messages to prevent on-board attacks
Internal High-Quality NIST SP 800-90A/B/C Random Number Generator (RNG)
Two High-Endurance Monotonic Counters
Unique 72-Bit Serial Number
Two Interface Options Available:
– High-Speed Single Wire Interface with One GPIO Pin
– 1 MHz Standard I2C Interface
1.8V to 5.5V IO Levels, 2.0V to 5.5V Supply Voltage
Two Temperature Ranges Available:
– Standard Industrial Temperature Range: -40℃ to +85℃
– Extended Industrial Temperature Range: -40℃ to +100℃
4kV
Charge Device Model(CDM) ESD
>1kV
Note: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at these or any other conditions beyond
those indicated in the operational sections of this specification are not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2.2
Reliability
The ATECC608B is fabricated with Microchip’s high reliability CMOS EEPROM manufacturing technology.
Table 2-1. EEPROM Reliability
Parameter
Min.
Typ.
Max.
Units
400,000
—
—
Write Cycles
Data Retention at +55°C
10
—
—
Years
Data Retention at +35°C
30
50
—
Years
Write Endurance at +85°C (Each Byte)
Read Endurance
2.3
Unlimited
Read Cycles
AC Parameters: All I/O Interfaces
Figure 2-1. AC Timing Diagram: All Interfaces
Wake
Data Comm
tWLO
tWHI
Noise
Suppresion
tLIGNORE
© 2020 Microchip Technology Inc.
tHIGNORE
Summary Datasheet
DS40002239A-page 6
ATECC608B
Electrical Characteristics
Table 2-2. AC Parameters: All I/O Interfaces
Parameter
Sym.
Direction
Min. Typ. Max. Units
Conditions
Power-Up Delay(2)
tPU
To Crypto
Device
100
—
—
µs
Wake Low Duration
tWLO
To Crypto
Device
60
—
—
µs
Wake High Delay to
Data Comm
tWHI
To Crypto
Device
1500
—
—
µs
SDA should be stable high for this entire
duration unless polling is implemented.
SelfTest is not enabled at power-up.
tWHIST
To Crypto
Device
20
—
—
ms
SDA should be stable high for this entire
duration unless polling is implemented.
Wake High Delay
when SelfTest is
Enabled
Minimum time between VCC > VCC min
prior to start of tWLO.
High-Side Glitch
Filter at Active
tHIGNORE_A To Crypto
Device
45(1)
—
—
ns
Pulses shorter than this in width will be
ignored by the device, regardless of its state
when active.
Low-Side Glitch
Filter at Active
tLIGNORE_A To Crypto
Device
45(1)
—
—
ns
Pulses shorter than this in width will be
ignored by the device, regardless of its state
when active.
Low-Side Glitch
Filter at Sleep
tLIGNORE_S To Crypto
Device
15(1)
—
—
µs
Pulses shorter than this in width will be
ignored by the device when in Sleep mode.
Watchdog Time-out
tWATCHDOG To Crypto
Device
0.7
1.3
1.7
s
Time from wake until device is forced into
Sleep mode if Config.ChipMode[2] is 0.
Notes:
1. These parameters are characterized, but not production tested.
2. The power-up delay will be significantly longer if power-on self test is enabled in the Configuration zone.
2.3.1
AC Parameters: Single-Wire Interface
Figure 2-2. AC Timing Diagram: Single-Wire Interface
Logic Ø
tSTART
tZHI
tZLO
tBIT
Logic 1
tSTART
tTURNAROUND
SDA
tSTART
tSTART
Table 2-3. AC Parameters: Single-Wire Interface
Unless otherwise specified, applicable from TA = -40°C to +100°C, VCC = +2.0V to +5.5V, CL = 100 pF.
© 2020 Microchip Technology Inc.
Summary Datasheet
DS40002239A-page 7
ATECC608B
Electrical Characteristics
Parameter
Start Pulse Duration
Symbol
tSTART
Conditions
4.10 4.34 4.56
µs
—
From Crypto
Device
4.60
8.60
µs
—
To Crypto Device
4.10 4.34 4.56
µs
—
From Crypto
Device
4.60
8.60
µs
—
To Crypto Device
4.10 4.34 4.56
µs
—
From Crypto
Device
4.60
6
8.60
µs
—
To Crypto Device
37
39
—
µs
If the bit time exceeds tTIMEOUT,
ATECC608B may enter Sleep mode.
From Crypto
Device
41
54
78
µs
—
tTURNAROUND From Crypto
Device
64
96
131
µs
ATECC608B will initiate the first low
going transition after this time interval
following the initial falling edge of the
start pulse of the last bit of the transmit
flag.
To Crypto Device
93
—
—
µs
After ATECC608B transmits the last bit
of a group, the system must wait this
interval before sending the first bit of a
flag. It is measured from the falling
edge of the start pulse of the last bit
transmitted by ATECC608B.
To Crypto Device
45
65
85
ms
ATECC608B may transition to the
Sleep mode if the bus is inactive
longer than this duration.
tZHI
Zero Transmission
Low Pulse
tZLO
Bit Time(1)
tBIT
IO Timeout
Min. Typ. Max. Unit
To Crypto Device
Zero Transmission
High Pulse
Turn Around Delay
Direction
tTIMEOUT
6
6
Note:
1. tSTART, tZLO, tZHI and tBIT are designed to be compatible with a standard UART running at 230.4 kBaud for both
transmit and receive. The UART must be set to seven data bits, no parity and one Stop bit.
© 2020 Microchip Technology Inc.
Summary Datasheet
DS40002239A-page 8
ATECC608B
Electrical Characteristics
2.3.2
AC Parameters: I2C Interface
Figure 2-3. I2C Synchronous Data Timing
tHIGH
tF
tR
tLOW
SCL
tSU.STA
tLOW
tHD.STA
tHD.DAT
tSU.DAT
tSU.STO
SDA IN
tAA
tDH
tBUF
SDA OUT
Table 2-4. AC Characteristics of I2C Interface(2)
Unless otherwise specified, applicable over recommended operating range from TA = -40°C to +100°C, VCC = +2.0V to +5.5V, CL
= 1 TTL Gate and 100 pF.
Parameter
Sym.
Min.
Max.
Units
SCL Clock Frequency
fSCL
0
1
MHz
SCL High Time
tHIGH
400
—
ns
SCL Low Time
tLOW
400
—
ns
Start Setup Time
tSU.STA
250
—
ns
Start Hold Time
tHD.STA
250
—
ns
Stop Setup Time
tSU.STO
250
—
ns
Data In Setup Time
tSU.DAT
100
—
ns
Data In Hold Time
tHD.DAT
0
—
ns
Input Rise Time1
tR
—
300
ns
Input Fall Time1
tF
—
100
ns
Clock Low to Data Out Valid
tAA
50
550
ns
Data Out Hold Time
tDH
50
—
ns
tTIMEOUT
25
75
ms
tBUF
500
—
ns
SMBus Time-Out Delay
Time bus must be free before a new transmission can start1
Notes:
1. Values are based on characterization and are not tested.
2. AC measurement conditions:
– RL (connects between SDA and VCC): 1.2 kΩ (for VCC = +2.0V to +5.0V)
– Input pulse voltages: 0.3VCC to 0.7VCC
– Input rise and fall times: ≤ 50 ns
– Input and output timing reference voltage: 0.5VCC
© 2020 Microchip Technology Inc.
Summary Datasheet
DS40002239A-page 9
ATECC608B
Electrical Characteristics
2.4
DC Parameters: All I/O Interfaces
Table 2-5. DC Parameters on All I/O Interfaces
Parameter
Ambient Operating
Temperature
TA
Min. Typ. Max. Units
Conditions
-40
—
+85
°C
Standard Industrial Temperature Range
-40
—
+100
°C
Extended Industrial Temperature Range
—
Power Supply Voltage
VCC
2.0
—
5.5
V
Active Power Supply
Current
ICC
—
2
3
mA
Waiting for I/O during I/O transfers or execution of non-ECC
commands. Independent of Clock Divider value.
—
—
14
mA
During ECC command execution. Clock divider = 0x0
—
—
6
mA
During ECC command execution. Clock divider = 0x5
—
—
3
mA
During ECC command execution. Clock divider = 0xD
IIDLE
—
800
—
µA
When device is in Idle mode,
VSDA and VSCL < 0.4V or > VCC – 0.4
ISLEEP
—
30
150
nA
When device is in Sleep mode, VCC ≤ 3.6V,
VSDA and VSCL < 0.4V or > VCC – 0.4, TA ≤ +55°C
—
—
2
µA
When device is in Sleep mode.
Over full VCC and temperature range.
Idle Power Supply
Current
Sleep Current
2.4.1
Sym.
Output Low Voltage
VOL
—
—
0.4
V
When device is in Active mode,
VCC = 2.5 to 5.5V
Output Low Current
IOL
—
—
4
mA
When device is in Active mode,
VCC = 2.5 to 5.5V, VOL = 0.4V
Theta JA
ƟJA
—
166
—
°C/W SOIC (SSH)
—
173
—
°C/W UDFN (MAH)
—
146
—
°C/W RBH
VIH and VIL Specifications
The input levels of the device will vary dependent on the mode and voltage of the device. The input voltage
thresholds when in Sleep or Idle mode are dependent on the VCC level as shown in Figure 2-4. When in Sleep or Idle
mode the TTLenable bit has no effect.
Table 2-6. VIL, VIH on All I/O Interfaces (TTLenable = 0)
Parameter
Sym.
Min.
Typ.
Max.
Units
Conditions
Input Low Voltage
VIL
-0.5
—
0.5
V
When device is active and TTLenable bit in Configuration
memory is zero; otherwise, see above.
Input High Voltage
VIH
1.5
—
VCC + 0.5
V
When device is active and TTLenable bit in Configuration
memory is zero; otherwise, see above.
© 2020 Microchip Technology Inc.
Summary Datasheet
DS40002239A-page 10
ATECC608B
Electrical Characteristics
Figure 2-4. VIH and VIL in Sleep and Idle Mode
© 2020 Microchip Technology Inc.
Summary Datasheet
DS40002239A-page 11
ATECC608B
Compatibility
3.
Compatibility
3.1
Microchip ATECC608A
The ATECC608B is designed to provide an enhanced security profile over that of the ATECC608A while maintaining
backwards compatibility. The following details the changes and enhancements to the device. No configuration bit
fields have changed. Configurations defined for the ATECC608A will be functionally identical with the ATECC608B
device.
Corrections, Enhancements
The following items have been corrected or enhanced in the ATECC608B device:
• Two temperature ranges are now available:
– Standard Industrial Temperature Range: -40℃ to +85℃
– Standard Industrial Temperature Range: -40℃ to +100℃
• Operating at a low I2C Frequency with multiple devices on the bus will no longer create a bus contention issue.
• Modifications to Command Timings for Verify, SecureBoot, Lock and Read commands.
•
3.2
New Packaging Options: 3-Lead Contact Package and WLCSP for qualified customers. (Contact Microchip
Sales for the WLCSP Option.)
Microchip ATECC508A
The ATECC608B is designed to be fully compatible with the ATECC508A devices with the limited exception of the
functions listed below. If the ATECC608B is properly configured, software written for the ATECC508A will work with
the ATECC608B without any required changes, again with the exception of the functions listed below.
Note: Most elements of the configuration zone in the ATECC608B are identical in both location and value with the
ATECC508A. However, the initial values that had been stored in the LastKeyUse field may need to be changed to
conform to the new definition of those bytes which can be found in this document. That field contained the initial
count for the Slot 15 limited use function which is supported in the ATECC608B via the monotonic counters.
CAUTION
The execution times of commands have changed between the ATECC608B and the ATECC508A. These
changes will not cause an issue if polling has been implemented. If fixed timing has been used, this must
be evaluated and updated as required.
New Features in ATECC608B vs. ATECC508A
• Secure boot function with IO encryption and authentication
• KDF command, supporting PRF, HKDF, AES
•
AES command, including encrypt/decrypt
•
•
•
GFM calculation function for GCM AEAD mode of AES
Updated NIST SP800-90 A/B/C Random Number Generator
Flexible SHA/HMAC command with context save/restore
•
SHA command execution time significantly reduced
•
•
•
•
•
Volatile Key Permitting to prevent device transfer
Transport Key Locking to protect programmed devices during delivery
Counter Limit Match function
Ephemeral key generation in SRAM, also supported with ECDH and KDF
Verify command output can be validated with a MAC
•
Encrypted output for ECDH
© 2020 Microchip Technology Inc.
Summary Datasheet
DS40002239A-page 12
ATECC608B
Compatibility
•
•
•
•
Added self test command, optional automatic power-on self test
Unaligned public key for built-in X.509 cert key validation
Optional power reduction at increased execution time
Programmable I2C address after data (secret) zone lock
Features Eliminated in ATECC608B vs. ATECC508A
• HMAC command removed, replaced via new more powerful SHA command
•
•
•
•
3.3
OTP consumption mode eliminated, now read only
Pause command eliminated along with related Selector function in UpdateExtra
Slot 15 special limited use eliminated, replaced with standard monotonic counter limited use
SHA command no longer uses TempKey during the digest calculation and the result in TempKey is unchanged
throughout the SHA operation. TempKey can however still be used to initialize the SHA for the HMAC_Start or to
store the final digest.
Microchip ATSHA204A, ATECC108A
The ATECC608B is generally compatible with all ATSHA204/A and ATECC108/A devices. If properly configured, it
can be used in most situations where these devices are currently employed. For ATSHA204A and ATECC108A
compatibility restrictions, see the ATECC508A data sheet.
© 2020 Microchip Technology Inc.
Summary Datasheet
DS40002239A-page 13
ATECC608B
Package Marking Information
4.
Package Marking Information
As part of Microchip’s overall security features, the part marking for all crypto devices is intentionally vague. The
marking on the top of the package does not provide any information as to the actual device type or the manufacturer
of the device. The alphanumeric code on the package provides manufacturing information and will vary with
assembly lot. The packaging mark should not be used as part of any incoming inspection procedure.
© 2020 Microchip Technology Inc.
Summary Datasheet
DS40002239A-page 14
ATECC608B
Package Drawings
R
5.
Package Drawings
5.1
8-lead SOIC
8-Lead Plastic Small Outline - Narrow, 3.90 mm (.150 In.) Body [SOIC]
Atmel Legacy Global Package Code SWB
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2X
0.10 C A–B
D
A
D
NOTE 5
N
E
2
E1
2
E1
E
NOTE 1
2
1
e
B
NOTE 5
NX b
0.25
C A–B D
TOP VIEW
0.10 C
C
A A2
SEATING
PLANE
8X
A1
SIDE VIEW
0.10 C
h
R0.13
h
R0.13
H
0.23
L
SEE VIEW C
(L1)
VIEW A–A
VIEW C
Microchip Technology Drawing No. C04-057-SWB Rev E Sheet 1 of 2
© 2017
Microchip
Technology
© 2020
Microchip
Technology
Inc.Inc.
Summary Datasheet
DS40002239A-page 15
ATECC608B
Package Drawings
8-Lead Plastic Small Outline - Narrow, 3.90 mm (.150 In.) Body [SOIC]
Atmel Legacy Global Package Code SWB
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
Number of Pins
N
e
Pitch
Overall Height
A
Molded Package Thickness
A2
§
Standoff
A1
Overall Width
E
Molded Package Width
E1
Overall Length
D
Chamfer (Optional)
h
Foot Length
L
L1
Footprint
Foot Angle
c
Lead Thickness
b
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
MIN
1.25
0.10
0.25
0.40
0°
0.17
0.31
5°
5°
MILLIMETERS
NOM
8
1.27 BSC
6.00 BSC
3.90 BSC
4.90 BSC
1.04 REF
-
MAX
1.75
0.25
0.50
1.27
8°
0.25
0.51
15°
15°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed 0.15mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
5. Datums A & B to be determined at Datum H.
Microchip Technology Drawing No. C04-057-SWB Rev E Sheet 2 of 2
© 2017 Microchip Technology Inc.
© 2020 Microchip Technology Inc.
Summary Datasheet
DS40002239A-page 16
ATECC608B
Package Drawings
8-Lead Plastic Small Outline - Narrow, 3.90 mm (.150 In.) Body [SOIC]
Atmel Legacy Global Package Code SWB
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
SILK SCREEN
C
Y1
X1
E
RECOMMENDED LAND PATTERN
Units
Dimension Limits
E
Contact Pitch
Contact Pad Spacing
C
Contact Pad Width (X8)
X1
Contact Pad Length (X8)
Y1
MIN
MILLIMETERS
NOM
1.27 BSC
5.40
MAX
0.60
1.55
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-2057-SWB Rev E
© 2017 Microchip Technology Inc.
© 2020 Microchip Technology Inc.
Summary Datasheet
DS40002239A-page 17
ATECC608B
Package Drawings
5.2
8-pad UDFN
8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (Q4B) - 2x3 mm Body [UDFN]
Atmel Legacy Global Package Code YNZ
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
N
(DATUM A)
E
(DATUM B)
NOTE 1
2X
0.10 C
1
2
2X
0.10 C
TOP VIEW
A1
0.10 C
C
SEATING
PLANE
A
8X
(A3)
0.08 C
SIDE VIEW
0.10
C A B
D2
e
2
1 2
0.10
E2
C A B
K
N
L
8X b
e
0.10
0.05
C A B
C
BOTTOM VIEW
Microchip Technology Drawing C04-21355-Q4B Rev B Sheet 1 of 2
© 2017 Microchip Technology Inc.
© 2020 Microchip Technology Inc.
Summary Datasheet
DS40002239A-page 18
ATECC608B
Package Drawings
8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (Q4B) - 2x3 mm Body [UDFN]
Atmel Legacy Global Package Code YNZ
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
Number of Terminals
N
e
Pitch
Overall Height
A
Standoff
A1
Terminal Thickness
A3
Overall Length
D
Exposed Pad Length
D2
Overall Width
E
Exposed Pad Width
E2
Terminal Width
b
Terminal Length
L
Terminal-to-Exposed-Pad
K
MIN
0.50
0.00
1.40
1.20
0.18
0.35
0.20
MILLIMETERS
NOM
8
0.50 BSC
0.55
0.02
0.152 REF
2.00 BSC
1.50
3.00 BSC
1.30
0.25
0.40
-
MAX
0.60
0.05
1.60
1.40
0.30
0.45
-
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-21355-Q4B Rev B Sheet 2 of 2
© 2017 Microchip Technology Inc.
© 2020 Microchip Technology Inc.
Summary Datasheet
DS40002239A-page 19
ATECC608B
Package Drawings
8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (Q4B) - 2x3 mm Body [UDFN]
Atmel Legacy Global Package Code YNZ
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
X2
EV
G2
8
ØV
C
Y2
G1
Y1
1
2
SILK SCREEN
X1
E
RECOMMENDED LAND PATTERN
Units
Dimension Limits
Contact Pitch
E
Optional Center Pad Width
X2
Optional Center Pad Length
Y2
Contact Pad Spacing
C
Contact Pad Width (X8)
X1
Contact Pad Length (X8)
Y1
Contact Pad to Center Pad (X8)
G1
Contact Pad to Contact Pad (X6)
G2
Thermal Via Diameter
V
Thermal Via Pitch
EV
MIN
MILLIMETERS
NOM
0.50 BSC
MAX
1.60
1.40
2.90
0.30
0.85
0.33
0.20
0.30
1.00
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
Microchip Technology Drawing C04-23355-Q4B Rev B
© 2017 Microchip Technology Inc.
© 2020 Microchip Technology Inc.
Summary Datasheet
DS40002239A-page 20
ATECC608B
Package Drawings
5.3
3 Lead Contact
3-Lead Contact Package (LAB) - 6.54x2.5 mm Body [Contact]
Atmel Legacy Global Package Code RHB
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
(DATUM A)
(DATUM B)
E
NOTE 1
2X
0.10 C
2X
0.10 C
TOP VIEW
0.10 C
C
A1
A
SEATING
PLANE
3X
0.08 C
SIDE VIEW
f
(K)
(K)
NOTE 1
3X L
1
2
3
g
3X b
0.10
e
C A B
BOTTOM VIEW
Microchip Technology Drawing C04-21303 Rev A Sheet 1 of 2
© 2017 Microchip Technology Inc.
© 2020 Microchip Technology Inc.
Summary Datasheet
DS40002239A-page 21
ATECC608B
Package Drawings
3-Lead Contact Package (LAB) - 6.54x2.5 mm Body [Contact]
Atmel Legacy Global Package Code RHB
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
Number of Terminals
N
e
Pitch
Overall Height
A
Standoff
A1
Overall Length
D
Overall Width
E
b
Terminal Width
Terminal Length
L
Terminal-to-Terminal Spacing
K
Package Edge to Terminal Edge
f
g
Package Edge to Terminal Edge
MIN
0.45
0.00
1.60
2.10
0.30
0.05
MILLIMETERS
NOM
3
2.00 BSC
0.50
0.02
6.50 BSC
2.50 BSC
1.70
2.20
0.30 REF
0.40
0.15
MAX
0.55
0.05
1.80
2.30
0.50
0.25
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-21303 Rev A Sheet 2 of 2
© 2017 Microchip Technology Inc.
© 2020 Microchip Technology Inc.
Summary Datasheet
DS40002239A-page 22
ATECC608B
Revision History
6.
Revision History
Revision
A
Date
Description
July 2020
Original Release. Based on ATECC608A Summary Data Sheet Rev B. DS40001977B
© 2020 Microchip Technology Inc.
Summary Datasheet
DS40002239A-page 23
ATECC608B
The Microchip Website
Microchip provides online support via our website at www.microchip.com/. This website is used to make files and
information easily available to customers. Some of the content available includes:
•
•
•
Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s
guides and hardware support documents, latest software releases and archived software
General Technical Support – Frequently Asked Questions (FAQs), technical support requests, online
discussion groups, Microchip design partner program member listing
Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of
seminars and events, listings of Microchip sales offices, distributors and factory representatives
Product Change Notification Service
Microchip’s product change notification service helps keep customers current on Microchip products. Subscribers will
receive email notification whenever there are changes, updates, revisions or errata related to a specified product
family or development tool of interest.
To register, go to www.microchip.com/pcn and follow the registration instructions.
Customer Support
Users of Microchip products can receive assistance through several channels:
•
•
•
•
Distributor or Representative
Local Sales Office
Embedded Solutions Engineer (ESE)
Technical Support
Customers should contact their distributor, representative or ESE for support. Local sales offices are also available to
help customers. A listing of sales offices and locations is included in this document.
Technical support is available through the website at: www.microchip.com/support
© 2020 Microchip Technology Inc.
Summary Datasheet
DS40002239A-page 24
ATECC608B
Product Identification System
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
-XX
X
XX
-X
Device
Package
Temp Range
I/O Type
Tape and Reel
Device:
ATECC608B: Cryptographic Co-processor with Secure Hardware-based Key Storage
Package Options(3)
SS 8-Lead (0.150” Wide Body), Plastic Gull Wing Small Outline (JEDEC SOIC)
MA 8-Pad 2 x 3 x 0.6 mm Body, Thermally Enhanced Plastic Ultra Thin Dual Flat NoLead Package
(UDFN)
RB 3RB, 3-Lead 2x5 x 6.5mm Body, 2.0mm pin pitch, Contact Package (Sawn)
Temperature Range
I/O Type
H
Standard Industrial Temperature Range: -40 ℃ to 85 ℃
V
Extended Industrial Temperature Range: -40 ℃ to 100 ℃
CZ Single Wire Interface
DA I2C Interface
Tape and Reel Options B
Tube
T
Large Reel (Size varies by package type)
S
Small Reel (Only available for MA Package Type)
Device Ordering Codes
Temperature Range
Description
Standard Industrial
Extended Industrial
ATECC608B-SSHCZ-T
ATECC608B-SSVCZ-T
8-Lead (0.150” Wide Body), Plastic Gull Wing Small Outline (JEDEC SOIC), Single-Wire,
Tape and Reel, 4,000 per Reel
ATECC608B-SSHCZ-B
ATECC608B-SSVCZ-B
8-Lead (0.150” Wide Body), Plastic Gull Wing Small Outline (JEDEC SOIC), Single-Wire,
Tube, 100 per Tube
ATECC608B-SSHDA-T
ATECC608B-SSVDA-T
8-Lead (0.150” Wide Body), Plastic Gull Wing Small Outline (JEDEC SOIC), I2C, Tape and
Reel, 4,000 per Reel
ATECC608B-SSHDA-B
ATECC608B-SSVDA-B 8-Lead (0.150” Wide Body), Plastic Gull Wing Small Outline (JEDEC SOIC), I2C, Tube, 100
per Tube
ATECC608B-MAHCZ-T
ATECC608B-MAVCZ-T
8-Pad 2 x 3 x 0.6 mm Body, Thermally Enhanced Plastic Ultra Thin Dual Flat NoLead
Package (UDFN), Single-Wire, Tape and Reel, 15,000 per Reel
ATECC608B-MAHDA-T ATECC608B-MAVDA-T 8-Pad 2 x 3 x 0.6 mm Body, Thermally Enhanced Plastic Ultra Thin Dual Flat NoLead
Package (UDFN), I2C, Tape and Reel, 15,000 per Reel
ATECC608B-MAHCZ-S ATECC608B-MAVCZ-S Pad 2 x 3 x 0.6 mm Body, Thermally Enhanced Plastic Ultra Thin Dual Flat NoLead Package
(UDFN), Single-Wire, Tape and Reel, 3,000 per Reel
ATECC608B-MAHDA-S ATECC608B-MAVDA-S 8-Pad 2 x 3 x 0.6 mm Body, Thermally Enhanced Plastic Ultra Thin Dual Flat NoLead
Package (UDFN), I2C, Tape and Reel, 3,000 per Reel
ATECC608B-RBHCZ-T
ATECC608B-RBVCZ-T
ATECC608B-RBHCZ-B
ATECC608B-RBVCZ-B Single-Wire, Tube, 56 per Tube, 3-Lead Contact Package
© 2020 Microchip Technology Inc.
Single-Wire, Tape and Reel, 5,000 per Reel, 3-Lead Contact Package
Summary Datasheet
DS40002239A-page 25
ATECC608B
Notes:
1. Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering
purposes and is not printed on the device package. Check with your Microchip Sales Office for package
availability with the Tape and Reel option.
2. Small form-factor packaging options may be available. Please check www.microchip.com/packaging for smallform factor package availability, or contact your local Sales Office.
3. Die-on-Tape and Reel and WLCSP packages are available for qualified customers. Ordering codes for these
packages are not shown in this table. Please contact Microchip sales for more information on these package
options.
Microchip Devices Code Protection Feature
Note the following details of the code protection feature on Microchip devices:
•
•
•
•
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today,
when used in the intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these
methods, to our knowledge, require using the Microchip products in a manner outside the operating
specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of
intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code
protection does not mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection
features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital
Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you
may have a right to sue for relief under that Act.
Legal Notice
Information contained in this publication regarding device applications and the like is provided only for your
convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with
your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER
EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend,
indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such
use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless
otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, Adaptec, AnyRate, AVR, AVR logo, AVR Freaks, BesTime,
BitCloud, chipKIT, chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, HELDO, IGLOO, JukeBlox,
KeeLoq, Kleer, LANCheck, LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi, Microsemi logo, MOST,
MOST logo, MPLAB, OptoLyzer, PackeTime, PIC, picoPower, PICSTART, PIC32 logo, PolarFire, Prochip Designer,
QTouch, SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon,
TempTrackr, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
APT, ClockWorks, The Embedded Control Solutions Company, EtherSynch, FlashTec, Hyper Speed Control,
HyperLight Load, IntelliMOS, Libero, motorBench, mTouch, Powermite 3, Precision Edge, ProASIC, ProASIC Plus,
ProASIC Plus logo, Quiet-Wire, SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub, TimePictra, TimeProvider,
Vite, WinPath, and ZL are registered trademarks of Microchip Technology Incorporated in the U.S.A.
© 2020 Microchip Technology Inc.
Summary Datasheet
DS40002239A-page 26
ATECC608B
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BlueSky, BodyCom,
CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM,
dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP,
INICnet, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi, MPASM, MPF,
MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM,
PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad
I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense,
ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A.
and other countries.
SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.
The Adaptec logo, Frequency on Demand, Silicon Storage Technology, and Symmcom are registered trademarks of
Microchip Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their respective companies.
©
2020, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.
ISBN: 978-1-5224-6314-6
Quality Management System
For information regarding Microchip’s Quality Management Systems, please visit www.microchip.com/quality.
© 2020 Microchip Technology Inc.
Summary Datasheet
DS40002239A-page 27
Worldwide Sales and Service
AMERICAS
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© 2020 Microchip Technology Inc.
Summary Datasheet
DS40002239A-page 28
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